CN210840233U - High-efficient towards board structure of PCB board AB mould A mould - Google Patents

High-efficient towards board structure of PCB board AB mould A mould Download PDF

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Publication number
CN210840233U
CN210840233U CN201921537824.7U CN201921537824U CN210840233U CN 210840233 U CN210840233 U CN 210840233U CN 201921537824 U CN201921537824 U CN 201921537824U CN 210840233 U CN210840233 U CN 210840233U
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China
Prior art keywords
die
holes
pcb
mould
board
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Active
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CN201921537824.7U
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Chinese (zh)
Inventor
王昌华
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SHENZHEN XIANGYU CIRCUIT CO LTD
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SHENZHEN XIANGYU CIRCUIT CO LTD
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Priority to CN201921537824.7U priority Critical patent/CN210840233U/en
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Abstract

The utility model discloses a high-efficient dash board structure of PCB board AB mould A mould, include: the die comprises a die body, wherein the die body comprises an upper die and a lower die, a plurality of punched holes are formed in a punching plate area of the lower die, 3 first through holes are formed in the lower die, guide pillars are arranged on the first through holes, the upper die corresponds to the guide pillars and is provided with guide holes, the 3 first through holes are all formed in one side of the punching plate area, 3 positioning columns are further arranged in the punching plate area and are used for positioning the processed PCB. The utility model discloses this need not to cut into the platelet with the PCB board and also can process, promoted machining efficiency.

Description

High-efficient towards board structure of PCB board AB mould A mould
Technical Field
The utility model relates to a PCB board manufacturing technology field especially relates to a high-efficient dash board structure of PCB board AB mould A mould.
Background
In the manufacturing process of the PCB at present, a mode of punching the PCB by an AB die is needed to be adopted when part of the PCB is produced, only part of slot positions are punched when a large PCB jointed board is punched by an A die, and the large PCB is completely punched into small PCBs when a B die is punched. However, in the current a mold, please refer to fig. 1, guide posts (such as 1a, 1b, and 1c in fig. 1) are arranged on two sides of the mold to position a large PCB jointed board, but when a large PCB jointed board is encountered, the PCB jointed board shown in fig. 2 is composed of six small jointed boards, 2a to 2f, and when the a mold in fig. 1 is used to carry the PCB jointed board in fig. 2, if the small jointed board 2b is punched after the small jointed board 2c is punched, the small jointed board 2b cannot be punched whether the front side or the back side of the PCB is placed due to the blocking of the guide posts 1c, and the large PCB jointed board can only be split into the small jointed boards and then be reprocessed, so that a board splitting process is added, and the processing efficiency is reduced.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art, provide a high-efficient dash board structure of PCB board AB mould A mould.
The technical scheme of the utility model as follows: the utility model provides a high-efficient dash board structure of PCB board AB mould A mould, include: the die comprises a die body, wherein the die body comprises an upper die and a lower die, a plurality of punched holes are formed in a punching plate area of the lower die, 3 first through holes are formed in the lower die, guide pillars are arranged on the first through holes, the upper die corresponds to the guide pillars and is provided with guide holes, the 3 first through holes are all formed in one side of the punching plate area, 3 positioning columns are further arranged in the punching plate area and are used for positioning the processed PCB.
Further, the punching holes are arranged at intervals.
Further, the punched holes are arranged in an array.
Further, 3 first through-holes are arranged in a straight line shape.
Further, 3 first through-holes are equidistantly arranged.
With the adoption of the scheme, the utility model discloses need not to cut into the platelet with the PCB board and also can process, promoted machining efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the prior art.
FIG. 2 is a schematic diagram of a large PCB panel.
Fig. 3 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 3, the utility model provides a high-efficient towards board structure of PCB board AB mould A mould, include: the die comprises a die body, wherein the die body comprises an upper die and a lower die, a plurality of punched holes 3 are formed in a punching plate area of the lower die, 3 first through holes 1 are formed in the lower die, guide pillars are arranged on the first through holes 1, the upper die is provided with guide holes corresponding to the guide pillars, 3 first through holes 1 are all arranged on one side of the punching plate area, 3 positioning columns 2 are further arranged in the punching plate area, and the positioning columns 2 are used for positioning the processed PCB. The punching holes 3 are arranged at intervals and are arranged in an array manner. The 3 first through holes 1 are arranged in a straight line shape and are arranged at equal intervals.
Please refer to fig. 2 and fig. 3 in combination, when the utility model discloses use, will be like the massive PCB board of fig. 2 place on the mould body, through reference column 2 counterpoint the little PCB makeup (like 2a-2f) in the massive PCB board, at every turn towards the board can dash a little PCB makeup (2a-2f), because the left and right sides does not have the guide pillar to block, therefore every little PCB makeup (2a-2f) all can be processed, need not to cut into the fritter. 3 intervals of punching a hole set up, avoid the too many position fretworks of mould, can promote the intensity and the durability of mould.
To sum up, the utility model discloses need not to cut into the platelet with the PCB board and also can process, promoted machining efficiency.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (5)

1. The utility model provides a high-efficient dash board structure of PCB board AB mould A mould which characterized in that includes: the die comprises a die body, wherein the die body comprises an upper die and a lower die, a plurality of punched holes are formed in a punching plate area of the lower die, 3 first through holes are formed in the lower die, guide pillars are arranged on the first through holes, the upper die corresponds to the guide pillars and is provided with guide holes, the 3 first through holes are all formed in one side of the punching plate area, 3 positioning columns are further arranged in the punching plate area and are used for positioning the processed PCB.
2. The PCB AB die A die high-efficiency punching structure of claim 1, wherein the punching holes are arranged at intervals.
3. The PCB AB die A-die high-efficiency punching structure of claim 2, wherein the punching holes are arranged in an array.
4. The AB die A die high-efficiency punching plate structure of the PCB as in claim 1, wherein 3 first through holes are arranged in a straight line.
5. The AB die A die high-efficiency punching plate structure of the PCB as in claim 4, wherein 3 first through holes are arranged at equal intervals.
CN201921537824.7U 2019-09-11 2019-09-11 High-efficient towards board structure of PCB board AB mould A mould Active CN210840233U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921537824.7U CN210840233U (en) 2019-09-11 2019-09-11 High-efficient towards board structure of PCB board AB mould A mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921537824.7U CN210840233U (en) 2019-09-11 2019-09-11 High-efficient towards board structure of PCB board AB mould A mould

Publications (1)

Publication Number Publication Date
CN210840233U true CN210840233U (en) 2020-06-23

Family

ID=71257788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921537824.7U Active CN210840233U (en) 2019-09-11 2019-09-11 High-efficient towards board structure of PCB board AB mould A mould

Country Status (1)

Country Link
CN (1) CN210840233U (en)

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