CN205212374U - Bus duct omnirange convection structure - Google Patents

Bus duct omnirange convection structure Download PDF

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Publication number
CN205212374U
CN205212374U CN201521082610.7U CN201521082610U CN205212374U CN 205212374 U CN205212374 U CN 205212374U CN 201521082610 U CN201521082610 U CN 201521082610U CN 205212374 U CN205212374 U CN 205212374U
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China
Prior art keywords
shell
body shell
bus duct
cell body
middle slot
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Active
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CN201521082610.7U
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Chinese (zh)
Inventor
王署斌
钟彬成
陆永生
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GUANGDONG JOYA ELECTRIC INDUSTRIES Co Ltd
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GUANGDONG JOYA ELECTRIC INDUSTRIES Co Ltd
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Abstract

The utility model discloses a bus duct omnirange convection structure for press from both sides tightly the conductor by insulating material layer parcel, including last cell body shell, the external shell of sinus and the lower cell body shell that is equipped with the interval between the opposite face respectively, the cavity that is enclosed separately by last cell body shell, the external shell of sinus and lower cell body shell, insulating material layer and cavity inner wall laminating are arranged respectively in to the conductor, still including two connecting pieces, go up the both ends of cell body shell, the external shell of sinus and lower cell body shell and connect respectively on this connecting piece, go up cell body shell, the external shell of sinus, down the cell body shell each other between the opposite face, enclose between the connecting piece opposite face and become to have the heat dissipation space. The efficiency of the whole heat dissipation of bus duct is improved, especially, separating a plurality of heat dissipation spaces of formation with a plurality of conductors in centre, having reduced the temperature rise of bus duct, make the performance of bus duct more reliable, life can obtain guaranteeing.

Description

A kind of bus duct omnirange convection heat dissipation structure
Technical field
The utility model relates to transmission facility, especially a kind of bus duct structure.
Background technology
Existing common compact bus bar groove organization plan is as Fig. 1, and from schematic diagram direction, left and right two shell A is connected by the mode such as bolt or riveted joint with upper and lower two shell B, clamps the conductor 2 wrapped up by insulation material layer 1.As shown in Figure 2, the compact bus bar shell of this organization plan and the direct contact surface of conductor only have two, easily cause the heat radiation of bus duct entirety poor, especially two phase conductors in the middle of, owing to there is no heat-dissipating space, temperature rise meeting can be caused higher, directly reduce the useful life of bus duct.
Utility model content
The purpose of this utility model is to overcome prior art bus duct overall structure and dispels the heat poor technical problem, provides one can increase conductor and bus duct housing contacts area, increases the bus duct omnirange convection heat dissipation structure of heat-dissipating space.
For realizing above object, the utility model takes following technical scheme: a kind of bus duct omnirange convection heat dissipation structure, for clamping the conductor wrapped up by insulation material layer, comprise the upper groove body shell, middle slot body case and the lower groove shell that are respectively equipped with spacing between opposite face, described conductor is placed in the cavity surrounded separately by upper groove body shell, middle slot body case and lower groove shell respectively, and insulation material layer and cavity inner wall are fitted; Also include two connectors, the two ends of upper groove body shell, middle slot body case and lower groove shell are connected on this connector, and described upper groove body shell, middle slot body case, lower groove shell are surrounded by heat-dissipating space between face, between connector opposite face toward each other.
This structure can form six direct radiating surfaces on bus duct surface, is upper groove body upper surface of outer cover respectively, two faces that upper groove body shell is relative with middle slot body case, two faces that middle slot body case is relative with lower groove shell, and lower groove shell lower surface.Cause to improve dense conductor in bus duct difficult problem of dispelling the heat, improve radiating efficiency.
Described connector comprises bolt and cushion block, the two ends of described upper groove body shell and lower groove shell are connected on bolt, and the position that described cushion block is arranged is: on the vertical direction at bolt place, between upper groove body shell and middle slot body case, between middle slot body case and lower groove shell; Described heat-dissipating space is respectively the region surrounded between upper groove body shell lower surface, the upper surface of middle slot body case and two cushion block opposite faces, and, the region surrounded between the lower surface of middle slot body case, the upper surface of lower groove shell and two cushion block opposite faces.
The utility model compared with prior art, tool has the following advantages: be compared to existing compact bus bar groove organization plan, the compact bus bar groove of the utility model structure, the radiating surface that conductor and shell directly contact is six, substantially increase the integral heat sink efficiency of bus duct, especially some for centre conductors are separated and form multiple heat-dissipating space, reduce the temperature rise of bus duct, make the serviceability of bus duct more reliable, useful life can be guaranteed.
Accompanying drawing explanation
Fig. 1 is prior art bus duct structural representation;
Fig. 2 is the radiating state schematic diagram of Fig. 2;
Fig. 3 is the utility model bus duct structural representation;
Fig. 4 is the radiating state schematic diagram of Fig. 3;
Fig. 5 is another viewing angle constructions schematic diagram of Fig. 3.
Embodiment
Below in conjunction with the drawings and specific embodiments, content of the present utility model is described in further details.
Embodiment one:
Refer to shown in Fig. 3 to Fig. 5, a kind of bus duct omnirange convection heat dissipation structure, for clamping the conductor 2 wrapped up by insulation material layer 1, comprise the upper groove body shell 3, middle slot body case 4 and the lower groove shell 5 that are respectively equipped with spacing between opposite face, conductor 2 is placed in the cavity surrounded separately by upper groove body shell 3, middle slot body case 4 and lower groove shell 5 respectively, insulation material layer 1 and cavity inner wall are fitted, and particularly fit with the inner surface up and down of corresponding shell respectively; Also include two connectors, the two ends of upper groove body shell 3, middle slot body case 4 and lower groove shell 5 are connected on this connector, upper groove body shell 3, middle slot body case 4, lower groove shell 5 are surrounded by heat-dissipating space between face, between connector opposite face toward each other, this structure can form six direct radiating surfaces on bus duct surface, upper groove body upper surface of outer cover respectively, two faces that upper groove body shell is relative with middle slot body case, two faces that middle slot body case is relative with lower groove shell, and lower groove shell lower surface.
In the present embodiment, connector comprises bolt 6 and cushion block 7, the two ends of upper groove body shell 3 and lower groove shell 4 are connected on bolt 6, and the position that cushion block 7 is arranged is: on the vertical direction at bolt 6 place, between upper groove body shell 3 and middle slot body case 4, between middle slot body case 4 and lower groove shell 5; Heat-dissipating space is respectively the region surrounded between upper groove body shell bottom surface, the upper surface of middle slot body case and two cushion block 7 opposite faces, and, the region surrounded between the lower surface of middle slot body case, the upper surface of lower groove shell and two cushion block 7 opposite faces.
The cavity that the present embodiment surrounds separately by conductor 2 being placed in respectively upper groove body shell 3, middle slot body case 4 and lower groove shell 5, make conductor 2 can be divided into three independently conductor structures, and linked into an integrated entity by connector, form the structure of novel compact bus bar groove.
Above-listed detailed description is illustrating for the utility model possible embodiments, and this embodiment is also not used to limit the scope of the claims of the present utility model, does not allly depart from the equivalence that the utility model type does and implements or change, and all should be contained in the scope of the claims of this case.

Claims (2)

1. a bus duct omnirange convection heat dissipation structure, for clamping the conductor (2) wrapped up by insulation material layer (1), it is characterized in that: comprise the upper groove body shell, middle slot body case and the lower groove shell that are respectively equipped with spacing between opposite face, described conductor (2) is placed in the cavity surrounded separately by upper groove body shell, middle slot body case and lower groove shell respectively, and insulation material layer (1) and cavity inner wall are fitted; Also include two connectors, the two ends of upper groove body shell, middle slot body case and lower groove shell are connected on this connector, and described upper groove body shell, middle slot body case, lower groove shell are surrounded by heat-dissipating space between face, between connector opposite face toward each other.
2. bus duct omnirange convection heat dissipation structure as claimed in claim 1, it is characterized in that: described connector comprises bolt and cushion block, the two ends of described upper groove body shell and lower groove shell are connected on bolt, and the position that described cushion block is arranged is: on the vertical direction at bolt place, between upper groove body shell and middle slot body case, between middle slot body case and lower groove shell; Described heat-dissipating space is respectively the region surrounded between upper groove body shell bottom surface, the upper surface of middle slot body case and two cushion block opposite faces, and, the region surrounded between the lower surface of middle slot body case, the upper surface of lower groove shell and two cushion block opposite faces.
CN201521082610.7U 2015-12-21 2015-12-21 Bus duct omnirange convection structure Active CN205212374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521082610.7U CN205212374U (en) 2015-12-21 2015-12-21 Bus duct omnirange convection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521082610.7U CN205212374U (en) 2015-12-21 2015-12-21 Bus duct omnirange convection structure

Publications (1)

Publication Number Publication Date
CN205212374U true CN205212374U (en) 2016-05-04

Family

ID=55850066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521082610.7U Active CN205212374U (en) 2015-12-21 2015-12-21 Bus duct omnirange convection structure

Country Status (1)

Country Link
CN (1) CN205212374U (en)

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