CN205193316U - Photoelectric conversion modular structure - Google Patents
Photoelectric conversion modular structure Download PDFInfo
- Publication number
- CN205193316U CN205193316U CN201520924037.3U CN201520924037U CN205193316U CN 205193316 U CN205193316 U CN 205193316U CN 201520924037 U CN201520924037 U CN 201520924037U CN 205193316 U CN205193316 U CN 205193316U
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- photoelectric conversion
- glass capillary
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- chip
- module structure
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Abstract
The utility model provides a photoelectric conversion modular structure, relates to the photoelectric conversion's of broadcasting and TV and communication trade light receiving and sending product application module. Photoelectric conversion modular structure, including leading -in optic fibre (1), photoelectric conversion chip (2), set up one glass capillary (3), the glass capillary sets up a through -hole (31), the front end that the glass capillary is run through in through -hole (31) is with terminal, leading -in optic fibre inserts the through -hole and extends the terminal end of glass capillary and fixed, the terminal end of glass capillary sets up an inclined plane (35), the end of leading -in optic fibre the terminal end department of glass capillary and set up one with glass capillary end inclined plane the same end inclined plane of angle, the dress is pasted in chip portion circuit board (4) in photoelectric conversion chip (2), chip portion circuit board (4) erects installs on circuit substrate (6), the end of leading -in optic fibre is just to photoelectric conversion chip's (2) light sense mouth. The utility model discloses save TO tube socket, pipe cap, metalwork, ceramic lock pin and laser spot welding machine, reduced manufacturing cost.
Description
Technical field
The utility model relates to the application module of the opto-electronic conversion of broadcasting and TV and communications industry light-receiving and transmission product.
Background technology
Existing optical communication industry is receiving and is launching the detector (reception) of link application coaxial packaging and laser instrument (transmission) has come reception and transmission work, needs the accuracy requirement that the TO base of precise measure, pipe cap, metalwork, ceramic insertion core and inflated with nitrogen seal weld, laser spot welder, manual coupling table etc. ensure optically-coupled.Because parts size precision requires high, relevant device expensive, also needs a large amount of manual operationss, causes product rejection rate high, and then cost of products is increased.
Summary of the invention
The purpose of this utility model is the photoelectric conversion module structure providing a kind of low cost.
The utility model for the technical scheme achieving the above object adopted is: a kind of photoelectric conversion module structure, comprise importing optical fiber, photoelectric conversion chip, one glass capillary is set, glass capillary arranges a through hole, through hole runs through front end and the end of glass capillary, import optical fiber insertion through hole extend glass capillary end termination and fix, glass capillary end termination arranges an inclined-plane, importing the termination of optical fiber in glass capillary end end arranges a termination inclined-plane identical with glass capillary end termination bevel angle, photoelectric conversion chip is mounted on chip section circuit board, chip section circuit board is erect and is installed on circuit boards, import the termination of optical fiber just to the light sensation mouth of photoelectric conversion chip.
Further, described through hole is arranged on the axle center district of glass capillary.
Further, described through hole arranges insertion in insertion end and leads mouth.
Preferably, insert and lead mouth and through hole junction is provided with transition chamfering.
Further, the angle on described inclined-plane is 0 ° ~ 15 °.
Further, UV glue point of fixity is set between glass capillary and circuit substrate.
Further, the inclined-plane that adhesive layer closes photoelectric conversion chip and glass capillary is set.
Further, the latter end that encapsulating compound closes chip section circuit board and glass capillary is set.
Photoelectric conversion chip is mounted on the little circuit board of setting installation by the utility model, eliminates TO base, pipe cap; The glass capillary of custom-designed grinding angle adopts UV glue to be filled between kapillary and chip after coupling completes, and eliminates metalwork, ceramic insertion core and laser spot welder; Reduce production cost.The use of encapsulating compound eliminates the technique of inflated with nitrogen seal weld, achieves the protection to device.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model preferred embodiment;
Fig. 2 is the schematic diagram of the glass capillary of the utility model preferred embodiment.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
As depicted in figs. 1 and 2, a kind of photoelectric conversion module structure, comprise and import optical fiber 1, photoelectric conversion chip 2, one glass capillary 3 is set, glass capillary arranges a through hole 31, through hole 31 runs through front end and the end of glass capillary, import optical fiber insertion through hole extend glass capillary end termination and fix, glass capillary end termination arranges an inclined-plane 35, importing the termination of optical fiber in glass capillary end end arranges a termination inclined-plane identical with glass capillary end termination bevel angle, photoelectric conversion chip 2 is mounted on chip section circuit board 4, chip section circuit board 4 is erect and is arranged on circuit board 6, import the termination of optical fiber 1 just to the light sensation mouth of photoelectric conversion chip 2.
Described through hole 31 is arranged on the axle center district of glass capillary 3, is convenient to be convenient to by glass capillary 3 position adjustments importing optical fiber when drilling through hole and coupling.
Described through hole 31 arranges insertion in insertion end and leads mouth 37, and insertion is led mouth 37 and is provided with transition chamfering with through hole 31 junction.Insertion is led arranging of mouth 37 and is facilitated lead-in light fibre 1 to be inserted in through hole 31.
The angle a on described inclined-plane is 0 ° ~ 15 °.Preferably, the angle a on inclined-plane is 6 ° ~ 10 °.
UV glue point of fixity 8 is set between glass capillary 3 and circuit substrate 6.Glass capillary 3 can be fixed on circuit substrate 6 by UV glue fast, and UV glue is that several seconds set time of ultraviolet light was by tens seconds.UV glue is a kind of ultraviolet fast curing adhesive, has epoxy and non-epoxy.
The inclined-plane 35 that adhesive layer 7 closes photoelectric conversion chip 2 and glass capillary 3 is set, adhesive layer 7 adopts the binding material that shrinkage factor is little, high temperature resistant, light transmission is good, the materials such as such as heat-curable epoxy resin, can 200 DEG C of continuous workings, also the high temperature of a few hours 300-400 DEG C can be born and performance is constant, transmittance is good, the dissolving of the anti-multi-solvents of energy and chemicals and etch.In the present embodiment, adhesive layer 7 adopts heat-curable epoxy resin.
The latter end that encapsulating compound 5 closes chip section circuit board 4 and glass capillary 3 is set.Encapsulating compound 5 pairs of totals are encapsulated, fixing, waterproof, shading.In the present embodiment, encapsulating compound 5 adopts that shrinkage factor is little, hardness is high, bonding strength is high, the epoxy resin of high-temp resisting high-humidity resisting.Except epoxy resin, as long as parameter meets, shrinkage factor is little, hardness is high, bonding strength is high, the glue of high-temp resisting high-humidity resisting requirement can use.
Meet the bonding agent of parameter request, UV glue, encapsulating compound all have commercially available.
The effect of glass capillary 3 has 2 points: 1, solve a grinding difficult problem.Because optical fiber is very soft, the fibre core peelling off protective seam is glass material, very crisp, and diameter only has 125 microns, easily broken.Bare fibre technique will solve the clamping problem of soft and crisp optical fiber, and cost intensive and consumptive material are not environmentally.Adopting after kapillary can clamping ends, and solve the problem that optical fiber is soft and crisp, customization grinding clamp can be produced in batches.2, a coupling table clamping difficult problem is solved.Bare fibre when being coupled because of optical fiber from circuit board very close to, cannot clamping ends position, circuit board outer position can only be clamped in, but now optical fiber is extended with 3 ~ 4 centimetres, the optical fiber being in free state can be arbitrary shape, need sextuple above coupling table just can complete coupling, but efficiency is extremely low.Optical fiber can be shifted because of the surface tension of glue again when rear glue is fixed even if be coupled.Adopting after glass capillary can clamping ends, only needs the three-dimensional platform of X, Y, Z just can complete coupling, substantially increases efficiency, and can not be shifted when putting glue.
During work, photoelectric conversion chip 2 is mounted on chip section circuit board 4, and chip section circuit board 4 is erect and is welded on circuit board 6.Light signal enters and imports optical fiber 1, be radiated in photoelectric conversion chip 2 through the end inclined-plane of glass capillary 3, by the adjustment of three-dimensional coupling table, make light beam accurately be radiated at the photosensitive area of photoelectric conversion chip 2, photoelectric conversion chip 2 exports electric signal and completes opto-electronic conversion.
Photoelectric conversion chip 2 is mounted on that erect installation, little chip section circuit board 4 by the utility model, eliminates TO base, pipe cap; The glass capillary of custom-designed grinding angle adopts UV glue to be filled between kapillary and chip after coupling completes, and eliminates metalwork, ceramic insertion core and laser spot welder; The use of encapsulating compound eliminates the technique of inflated with nitrogen seal weld, achieves the protection to device.
Claims (8)
1. a photoelectric conversion module structure, comprise and import optical fiber (1), photoelectric conversion chip (2), it is characterized in that: a glass capillary (3) is set, glass capillary arranges a through hole (31), through hole (31) runs through front end and the end of glass capillary, import optical fiber insertion through hole extend glass capillary end termination and fix, glass capillary end termination arranges an inclined-plane (35), importing the termination of optical fiber in glass capillary end end arranges a termination inclined-plane identical with glass capillary end termination bevel angle, photoelectric conversion chip (2) is mounted on chip section circuit board (4), chip section circuit board (4) is erect and is arranged on circuit substrate (6), import the termination of optical fiber just to the light sensation mouth of photoelectric conversion chip (2).
2. photoelectric conversion module structure according to claim 1, is characterized in that: described through hole (31) is arranged on the axle center district of glass capillary (3).
3. photoelectric conversion module structure according to claim 1, is characterized in that: described through hole (31) arranges insertion in insertion end and leads mouth (37).
4. photoelectric conversion module structure according to claim 3, is characterized in that: insertion is led mouth (37) and is provided with transition chamfering with through hole (31) junction.
5. photoelectric conversion module structure according to claim 1, is characterized in that: the angle on described inclined-plane is 0 ° ~ 15 °.
6. photoelectric conversion module structure according to claim 1, is characterized in that: arrange UV glue point of fixity (8) between glass capillary (3) and circuit substrate (6).
7. photoelectric conversion module structure according to claim 1, is characterized in that: arrange the inclined-plane (35) that adhesive layer (7) closes photoelectric conversion chip (2) and glass capillary (3).
8. photoelectric conversion module structure according to claim 1, is characterized in that: arrange the latter end that encapsulating compound (5) closes chip section circuit board (4) and glass capillary (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520924037.3U CN205193316U (en) | 2015-11-18 | 2015-11-18 | Photoelectric conversion modular structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520924037.3U CN205193316U (en) | 2015-11-18 | 2015-11-18 | Photoelectric conversion modular structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205193316U true CN205193316U (en) | 2016-04-27 |
Family
ID=55786295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520924037.3U Active CN205193316U (en) | 2015-11-18 | 2015-11-18 | Photoelectric conversion modular structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205193316U (en) |
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2015
- 2015-11-18 CN CN201520924037.3U patent/CN205193316U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |