CN205177873U - LED device based on CSP technique - Google Patents
LED device based on CSP technique Download PDFInfo
- Publication number
- CN205177873U CN205177873U CN201520611254.7U CN201520611254U CN205177873U CN 205177873 U CN205177873 U CN 205177873U CN 201520611254 U CN201520611254 U CN 201520611254U CN 205177873 U CN205177873 U CN 205177873U
- Authority
- CN
- China
- Prior art keywords
- led
- fluorescent coating
- light source
- source module
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a LED field of throwing light on especially relates to a LED device based on CSP technique, and mainly include the base plate, set up LED light source module and electrode on the base plate, LED light source module is supreme including LED chip, fluorescent coating and lens from down, fluorescent coating sets up at LED chip upper surface, lens cover fluorescent coating and LED chip. The utility model discloses mainly improving product light extraction yield and control light -emitting angle through set up fluorescent coating and lens on the LED chip, combining CSP technique encapsulation LED device, the light that makes the LED device launch more accords with lighting needs.
Description
Technical field
The utility model relates to field of LED illumination, particularly relates to a kind of LED component based on CSP technology.
Background technology
CSP (ChipScalePackage), means wafer-level package.CSP is up-to-date chip encapsulation technology, and compared with conventional package mode, CSP tool has the following advantages: (1) little light-emitting area, and high light intensity, is easy to optical design; (2) balanced electrode current distribution, is applicable to more big current and uses, realize high light flux; (3) hot interface is reduced, low thermal resistance, and perfect heat-dissipating, exempts from gold thread, high reliability; (3) Droop effect slows down, and reduces light absorption simultaneously; (4) volume is little, and cost is low.
The LED component raising product light extraction yield of current employing CSP technology and the fresh approach of control rising angle arrange reflecting bowl structure around LED chip.This structure no doubt can improve product light extraction yield and control rising angle, but this structural manufacturing process is complicated, and cost is higher, is unfavorable for the popularization of CSP technology.
Utility model content
For the deficiency that prior art exists, the purpose of this utility model is to provide a kind of LED component based on CSP technology improving product light extraction yield and control rising angle.
For achieving the above object, the utility model can be achieved by the following technical programs:
A kind of LED component based on CSP technology, comprise substrate, be arranged on LED light source module on substrate and electrode, described LED light source module comprises LED chip, fluorescent coating and lens from bottom to up, described fluorescent coating is arranged on LED chip upper surface, and described lens cover fluorescent coating and LED chip.
Further, described substrate is provided with location hole, is convenient to LED component and installs, and replaceable original LED component.
Further, the material of described substrate is the aluminium nitride ceramics with welding material similar thermal expansion coefficient, effectively can improve the reliability of device, and is distributed by heat fast.
Further, described LED light source module is multiple, and described multiple LED light source modular arrangements is distributed on substrate.
The utility model mainly through arranging fluorescent coating and lens to improve product light extraction yield and to control rising angle on LED chip, and in conjunction with CSP technology packaged LED device, the light that LED component is launched more meets lighting demand.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED light source module of the present utility model;
Fig. 2 is the structural representation of the utility model embodiment 1;
Fig. 3 is the structural representation of the utility model embodiment 2;
Fig. 4 is the structural representation of the utility model embodiment 3;
In figure: 1-LED light source module, 101-LED chip, 102-fluorescent coating, 103-lens, 2-substrate, 3-electrode, 4-location hole.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is further described:
LED component based on CSP technology described in the utility model, mainly comprises substrate 2, LED light source module 1 and electrode 3, and LED light source module 1 and electrode 3 are arranged on a substrate 2.LED light source module 1 comprises LED chip 101, fluorescent coating 102 and lens 103 from bottom to up, as shown in Figure 1, fluorescent coating 102 is arranged on LED chip 101 upper surface, and lens 103 are arranged on fluorescent coating 102 above and cover fluorescent coating 102 and LED chip 101.
Embodiment 1
As shown in Figure 2, a kind of LED component based on CSP technology, mainly comprise substrate 2, LED light source module 1 and electrode 3, the both sides in electrode 3 apportion face on a substrate 2, the quantity of LED light source module 1 is seven, wherein six are arranged in substrate 2 surface as orthohexagonal six summits, and the surplus next one is arranged on orthohexagonal center.Substrate 2 is quadrangle, four angles of quadrangle is respectively provided with a location hole 4, four location holes 4 and forms foursquare four summits.The material of substrate 2 is the aluminium nitride ceramicss with welding material similar thermal expansion coefficient.
As shown in Figure 1, LED light source module 1 comprises LED chip 101, fluorescent coating 102 and lens 103 from bottom to up, fluorescent coating 102 is arranged on LED chip 101 upper surface, and lens 103 are arranged on fluorescent coating 102 above and cover fluorescent coating 102 and LED chip 101.
Embodiment 2
As shown in Figure 3, as different from Example 1, the quantity of LED light source module 1 is nine, forms 3 × 3 matrix arranged distribution faces on a substrate 2.
Embodiment 3
As shown in Figure 4, as different from Example 1, substrate 2 is circular, and the quantity of location hole 4 is three, forms three summits of equilateral triangle.The quantity of LED light source module 1 is nine, forms 3 × 3 matrix arranged distribution faces on a substrate 2.
In like manner, because LED light source module 1 and location hole 4 can also have the change of other numbers and spread pattern, here just do not enumerate, these are all within protection range of the present utility model.
For a person skilled in the art, according to above technical scheme and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the utility model claim.
Claims (4)
1. the LED component based on CSP technology, it is characterized in that: comprise substrate, be arranged on LED light source module on substrate and electrode, described LED light source module comprises LED chip, fluorescent coating and lens from bottom to up, described fluorescent coating is arranged on LED chip upper surface, and described lens cover fluorescent coating and LED chip.
2. the LED component based on CSP technology according to claim 1, is characterized in that: described substrate is provided with location hole.
3. the LED component based on CSP technology according to claim 1, is characterized in that: the material of described substrate is aluminium nitride ceramics.
4. the LED component based on CSP technology according to claim 1, is characterized in that: described LED light source module is multiple, and described multiple LED light source modular arrangements is distributed on substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520611254.7U CN205177873U (en) | 2015-08-14 | 2015-08-14 | LED device based on CSP technique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520611254.7U CN205177873U (en) | 2015-08-14 | 2015-08-14 | LED device based on CSP technique |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205177873U true CN205177873U (en) | 2016-04-20 |
Family
ID=55741819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520611254.7U Expired - Fee Related CN205177873U (en) | 2015-08-14 | 2015-08-14 | LED device based on CSP technique |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205177873U (en) |
-
2015
- 2015-08-14 CN CN201520611254.7U patent/CN205177873U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103759145A (en) | LED (Light-Emitting Diode) lamp with fluorescent lamp cover | |
CN201751679U (en) | High-power LED packaging single lamp with batwing light distribution function | |
CN102434803A (en) | Novel common illumination light emitting diode (LED) lamp | |
CN203071136U (en) | Wafer level LED packaging structure | |
CN202598261U (en) | High-light high color rendering index (CRI) warm white light light-emitting diode (LED) lamp and LED module | |
CN103712182B (en) | Utilize the colour temperature selective distribution method of LED light source polychrome degree and high directivity | |
CN209471995U (en) | High photosynthetic efficiency White-light LED chip | |
CN205177873U (en) | LED device based on CSP technique | |
CN202549930U (en) | LED (light emitting diode) module structure with fluorescence sheet | |
CN109524393A (en) | A kind of double-colored COB of tunable optical Tai Ji moulding | |
CN204857774U (en) | White light LED packaging structure | |
CN203757405U (en) | Large-emitting-angle bulb lamp | |
CN102506336A (en) | Double-face light emergent slice type light emitting diode (LED) lamp | |
CN202469577U (en) | Two-surface light emergent thin-sheet type light emitting diode (LED) lamp | |
CN203836670U (en) | Color temperature and color rendering index adjustable LED (Light Emitting Diode) panel light | |
CN202434573U (en) | Large-power white light LED | |
CN202678310U (en) | A large-power LED integrated array lighting source based on COB technology | |
CN204885156U (en) | LED light source module | |
CN206274525U (en) | A kind of LED encapsulation | |
CN205609561U (en) | High -power LED multicore sheet laser module with structure of falling trapezoid table | |
CN203690299U (en) | Plugging type LED fluorescent crystal sheet and LED lamp | |
CN204289529U (en) | High-temperature-resistant light-gathering LED support structure | |
CN205609570U (en) | High -power LED multicore sheet laser module with back taper platform structure | |
CN205026455U (en) | LED lamps and lanterns and photovoltaic module thereof | |
CN104518067A (en) | Long-life LED light-emitting module and processing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20180814 |
|
CF01 | Termination of patent right due to non-payment of annual fee |