CN205122610U - Compound photovoltaic backplate of functional multilayer - Google Patents
Compound photovoltaic backplate of functional multilayer Download PDFInfo
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- CN205122610U CN205122610U CN201520905763.0U CN201520905763U CN205122610U CN 205122610 U CN205122610 U CN 205122610U CN 201520905763 U CN201520905763 U CN 201520905763U CN 205122610 U CN205122610 U CN 205122610U
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- inlayer
- weather
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The utility model discloses a compound photovoltaic backplate of functional multilayer, by the resistant outer A of time, resistant wait outer B, middle basic unit, inlayer A and inlayer B from top to bottom in proper order the stack constitute, the resistant outer A of time, the resistant time between outer B, middle basic unit and the inlayer A all through polymer gluing agent bonding, inlayer B is surface coating under the inlayer A. The utility model discloses a structural design increases two -layer resistant time polyolefin film, obvious improvement performances such as the steam separation nature of backplate, heat conductivity, putting nature of office, backplate steam transmissivity is less than 1.0gm2 d (infrared method), coefficient of heat conductivity is greater than 400V (the IEC grade be the II level) between 3.0 -5.0WM K, relative tracking index test result, reflectivity (400 -1100nm) is greater than 85%, the use the utility model discloses the photovoltaic module of backplate encapsulation is 85 DEG C, 85% humidity, plus 1000V negative sense voltage, and behind the test 96h, the power attenuation is the most greatly no longer than 1% around the subassembly.
Description
Technical field:
The utility model relates to the encapsulation field of solar module, particularly relates to a kind of functional multi layer composite photo voltaic backboard.
Background technology:
Solar cell backboard is extremely important encapsulating material in photovoltaic module; support and protective effect are played to cell piece; its direct and external environment bump contact simultaneously; carry the important mission ensureing photovoltaic module 25 years stable electric generations, the remarkable performance such as ageing-resistant (damp and hot, xeothermic, ultraviolet), resistance to electric insulation, vapor water barriers, dimensionally stable must be possessed.
Current backboard is mainly that base material is at two sides compound weatherability macromolecule membrane (fluorine film, polyethylene film, polyamide membrane etc.) or coating fluoro coatings with PET, no matter be that compound backboard or application type backboard generally only have three floor height molecular films, thickness is between 200-400 μm, usually also exist that reflecting rate is low, the problem of poor thermal conductivity, affect the generating efficiency of cell piece, even some backboard can't meet some harsh environmental requirements, because steam, ultraviolet destruction occur that the problems such as xanthochromia, delamination, crackle directly cause component failures.
Utility model content:
In order to solve the problem, the invention provides one increases two-layer weather-proof polyolefin film by structural design, significantly improves the technical scheme of the performances such as the water vapor barrier property of backboard, thermal conductivity, putting property of office:
A kind of functional multi layer composite photo voltaic backboard, it is characterized in that: from top to bottom superposed successively by weather-proof outer A, weather-proof outer B, intermediate base layer, internal layer A and inner layer B and form, all bonding by macromolecular adhesive between described weather-proof outer A, weather-proof outer B, intermediate base layer and internal layer A, described inner layer B is internal layer A lower surface coating.
As preferably, the thickness of weather-proof outer A is 20-40 μm.
As preferably, the thickness of weather-proof outer B is 50-100 μm.
As preferably, the thickness of intermediate base layer is 100-300 μm.
As preferably, the thickness of internal layer A is 50-100 μm.
As preferably, the thickness of inner layer B is 20-40 μm.
The beneficial effects of the utility model are:
The utility model increases two-layer weather-proof polyolefin film by structural design, and significantly improve the performances such as the water vapor barrier property of backboard, thermal conductivity, putting property of office, backboard water vapor transmittance is less than 1.0g/m
2d (infrared method), conductive coefficient is between 3.0-5.0W/MK, it is II level that relative discharge tracking index test result is greater than 400V(IEC grade), reflectivity (400-1100nm) is greater than 85%, use the photovoltaic module of the utility model backboard encapsulation at 85 DEG C, 85% humidity, additional 1000V negative voltage, after test 96h, before and after assembly, power attenuation is maximum is no more than 1%.Can not only reduce the risk that backboard lost efficacy, can also realize assembly generating gain, the introducing of internal layer coating simultaneously can also strengthen backboard and the cohesive force encapsulating EVA adhesive film.
Accompanying drawing illustrates:
Fig. 1 is structural representation of the present utility model.
Embodiment:
For making goal of the invention of the present utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, execution mode of the present utility model is described in further detail.
As shown in Figure 1, the present invention devises a kind of functional multi layer composite photo voltaic backboard, by weather-proof outer A1, weather-proof outer B2, intermediate base layer 3, internal layer A4 and inner layer B 5 superpose formation from top to bottom successively, weather-proof outer A1, weather-proof outer B2, all bonding by macromolecular adhesive 6 between intermediate base layer 3 and internal layer A4, inner layer B 5 is internal layer A4 lower surface coating, the thickness of weather-proof outer A1 is 20-40 μm, the thickness of weather-proof outer B2 is 50-100 μm, the thickness of intermediate base layer 3 is 100-300 μm, the thickness of internal layer A4 is 50-100 μm, the thickness of inner layer B 5 is 20-40 μm.
Wherein weather-proof outer A1 is the one of pvf film and polyvinylidene fluoride film.Weather-proof outer B2 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Meanwhile intermediate base layer 3 is PET film.Internal layer A4 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Macromolecular adhesive is the one of adhesive for polyurethane, epoxy resin adhesive, acrylic resin adhesive.Inner layer B 5 is made up of two or more mixing in polyflon, polyvinylidene fluoride resin, daiflon, epoxy resin, acrylic resin, polyurethane resin.
Embodiment 1
A kind of functional multi layer composite photo voltaic backboard of the present invention, the thickness of weather-proof outer A1 is 22.5 μm, and the thickness of weather-proof outer B2 is 50 μm, and the thickness of intermediate base layer 3 is 150 μm, and the thickness of internal layer A4 is 50 μm, and the thickness of inner layer B 5 is 20 μm.This invention product water vapor transmittance is 0.99g/m
2d (infrared method), conductive coefficient is 3.13W/MK, it is II level that relative discharge tracking index is greater than 400V(IEC grade), reflectivity (400-1100nm) is 85.5%, use the photovoltaic module of invention backboard encapsulation at 85 DEG C, 85% humidity, additional 1000V negative voltage, after test 96h, before and after assembly, power attenuation is 0.95%.Weather-proof outer A1 is the one of pvf film and polyvinylidene fluoride film.Weather-proof outer B2 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Intermediate base layer 3 is PET film.Internal layer A4 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Macromolecular adhesive 6 is one of adhesive for polyurethane, epoxy resin adhesive, acrylic resin adhesive.Inner layer B 5 is made up of two or more mixing in polyflon, polyvinylidene fluoride resin, daiflon, epoxy resin, acrylic resin, polyurethane resin.
Embodiment 2
In a kind of functional multi layer composite photo voltaic backboard such scheme of the present invention, the thickness of weather-proof outer A1 is 22.5 μm, and the thickness of weather-proof outer B2 is 100 μm, and the thickness of intermediate base layer 3 is 150 μm, the thickness of internal layer A4 is 100 μm, and the thickness of inner layer B 5 is 20 μm.This, this invention product water vapor transmittance is 0.83g/m
2d (infrared method), conductive coefficient is 3.09W/MK, it is II level that relative discharge tracking index is greater than 400V(IEC grade), reflectivity (400-1100nm) is 85.9%, use photovoltaic module that backboard of the present invention encapsulates at 85 DEG C, 85% humidity, additional 1000V negative voltage, after test 96h, before and after assembly, power attenuation is 0.91%.Weather-proof outer A1 is the one of pvf film and polyvinylidene fluoride film.Weather-proof outer B2 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Intermediate base layer 3 is PET film.Internal layer A4 is weather resistant polyolefin film, by polyethylene, polypropylene, ethylene-octene copolymer, titanium dioxide, talcum powder, γ-(methacryloxypropyl) propyl trimethoxy silicane, tetraethoxysilane, cumyl peroxide, 3,5-di-t-butyl-4-hydroxy phenylpropionic acid octadecyl ester, 3,5-di-t-butyl-4-hydroxy-benzoic acid cetyl esters, dibutyl tin laurate, UV-531, oleamide are pressed constant weight component and are formed.Macromolecular adhesive 6 is one of adhesive for polyurethane, epoxy resin adhesive, acrylic resin adhesive.Inner layer B 5 is made up of two or more mixing in polyflon, polyvinylidene fluoride resin, daiflon, epoxy resin, acrylic resin, polyurethane resin.
Above-described embodiment is preferred embodiment of the present invention; it is not the restriction to technical solution of the present invention; as long as without the technical scheme that creative work can realize on the basis of above-described embodiment, all should be considered as falling within the scope of the rights protection of patent of the present invention.
Claims (6)
1. a functional multi layer composite photo voltaic backboard, it is characterized in that: from top to bottom superposed successively by weather-proof outer A, weather-proof outer B, intermediate base layer, internal layer A and inner layer B and form, all bonding by macromolecular adhesive between described weather-proof outer A, weather-proof outer B, intermediate base layer and internal layer A, described inner layer B is internal layer A lower surface coating.
2. a kind of functional multi layer composite photo voltaic backboard according to claim 1, is characterized in that: the thickness of described weather-proof outer A is 20-40 μm.
3. a kind of functional multi layer composite photo voltaic backboard according to claim 1, is characterized in that: the thickness of described weather-proof outer B is 50-100 μm.
4. a kind of functional multi layer composite photo voltaic backboard according to claim 1, is characterized in that: the thickness of described intermediate base layer is 100-300 μm.
5. a kind of functional multi layer composite photo voltaic backboard according to claim 1, is characterized in that: the thickness of described internal layer A is 50-100 μm.
6. a kind of functional multi layer composite photo voltaic backboard according to claim 1, is characterized in that: the thickness of described inner layer B is 20-40 μm.
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CN201520905763.0U CN205122610U (en) | 2015-11-16 | 2015-11-16 | Compound photovoltaic backplate of functional multilayer |
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CN201520905763.0U CN205122610U (en) | 2015-11-16 | 2015-11-16 | Compound photovoltaic backplate of functional multilayer |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111900221A (en) * | 2020-08-05 | 2020-11-06 | 苏州中来光伏新材股份有限公司 | Light high-strength photovoltaic module and preparation method thereof |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111900221A (en) * | 2020-08-05 | 2020-11-06 | 苏州中来光伏新材股份有限公司 | Light high-strength photovoltaic module and preparation method thereof |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160330 Termination date: 20211116 |
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CF01 | Termination of patent right due to non-payment of annual fee |