CN201812838U - Packaging back board for amorphous silicon solar battery component - Google Patents
Packaging back board for amorphous silicon solar battery component Download PDFInfo
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- CN201812838U CN201812838U CN 201020560416 CN201020560416U CN201812838U CN 201812838 U CN201812838 U CN 201812838U CN 201020560416 CN201020560416 CN 201020560416 CN 201020560416 U CN201020560416 U CN 201020560416U CN 201812838 U CN201812838 U CN 201812838U
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- amorphous silicon
- weathering layer
- silicon solar
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model discloses a packaging back board for an amorphous silicon solar battery component, which has simple structure and good water vapor obstructing performance, thereby improving the stability of the solar battery component, prolonging the service life of the solar battery component, and solving the technical problems that the water vapor obstructing performance of the back board in the prior art is poor, so that the solar battery component has poor use performance, reduction of service life and the like. The back board in the utility model comprises a substrate, a first weatherproof layer and a second weatherproof layer, wherein the first weatherproof layer is arranged on the upper surface of the substrate; the second weatherproof layer is arranged at the lower surface of the substrate; and an aluminum foil layer is sandwiched between the second weatherproof layer and the substrate; a bonding layer is arranged on the surface of the aluminum foil layer corresponding to the substrate side; and the aluminum foil layer is stuck fixedly on the surface of the substrate through the bonding layer.
Description
Technical field
The utility model relates to a kind of backboard of solar module, relates in particular to the good encapsulation backboard that is used for amorphous silicon solar cell module of a kind of water vapor rejection performance.
Background technology
Existing solar module structure is generally: ultra-clear glasses, EVA glued membrane, battery sheet, EVA glued membrane and backboard; its dorsulum is located at the outermost layer of solar module; play a part protection battery sheet; its one side is bonding with the EVA glued membrane; another side contacts with air; in order to guarantee the performance of solar module, backboard must have performances such as good insulation performance, weatherability, water vapor barrier property.And the interior most of back board structure of industry generally comprises base material and weathering layer at present, weathering layer generally is to contain fluorine film, base material is generally the PET film, weathering layer is by the compound substrate surface that is arranged on of interlayer, but the barrier of this kind structure steam is relatively poor, and when being particularly useful for amorphous silicon solar cell module, steam can see through backboard gradually and enter in the battery component, not only influence the performance of battery component, and shortened the useful life of battery component.
Chinese patent discloses a kind of solar cell module back veneer (CN201438471U), it comprises that toughened glass layer, EVA, solar cell layer, EVA, high temperature cohere polyester layer and backsheet layer, toughened glass layer, EVA, solar cell layer, EVA, high temperature cohere polyester layer and backsheet layer by down and down successively lamination arrange, and by lamination encapsulation formation one, high temperature coheres polyester layer and is made of pet film coating and the fire retarding epoxide resin glue that is coated in its one or both sides.This structure is to cohere polyester layer by set up high temperature between backsheet layer and EVA, high temperature coheres polyester layer increases the cohesion of backboard and EVA, can prevent the backboard delamination thus, but still exist water vapor barrier property poor in the structure, cause the serviceability of battery component poor thus, problems such as life-span reduction.
Summary of the invention
The utility model has mainly provided a kind of simple in structure, the water vapor rejection performance is good, thereby can improve the stability of solar module, prolong the solar module encapsulation backboard that is used for amorphous silicon solar cell module in useful life, it is poor to have solved the backboard water vapor barrier property that exists in the prior art, cause the serviceability of solar module poor thus, technical problems such as life-span reduction.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of encapsulation backboard that is used for amorphous silicon solar cell module, comprise base material and be located at first weathering layer of base material upper surface and be located at second weathering layer of base material lower surface, between described second weathering layer and base material, be folded with aluminium foil layer, be provided with adhesive linkage on the aluminium foil layer surface corresponding to the base material side, described aluminium foil layer is pasted and fixed on the substrate surface by adhesive linkage.Establish aluminium foil layer by folder between second weathering layer and base material, can cut off steam by aluminium foil layer, make steam can not see through backboard and enter into battery component, thereby the performance of guaranteeing solar module is able to normal performance, has prolonged the useful life of solar module; By on aluminium foil layer, adhesive linkage being set and substrate surface is bonding, guarantee that aluminium foil layer and base material are connected firmly, simple in structure, the reliability height.
As preferably, on base material upper surface, be provided with several scraggly minor grooves corresponding to the first weathering layer side, described minor groove evenly distributes at substrate surface.Can carry out corona treatment at substrate surface corresponding to the first weathering layer side, make substrate surface form several scraggly minor grooves, increased the roughness of substrate surface thus, improved surface free energy, the wetability and the tack of first weathering layer have been improved, thereby improved the stability of solar module, prolonged its useful life.
Adhesive linkage can be acrylic adhesive, and as preferably, described adhesive linkage is the polyurethanes bonding agent; Described first weathering layer and second weathering layer are teflon coating.Polyurethanes bonding agent adhesive effect is good, low price; Polytetrafluoroethylene provides good weatherability for backboard, and the relative fluorine film of fluorine layer paint-on technique complex technique is drawn materials conveniently, production cost is low.
As preferably, the thickness of described adhesive linkage is 0.005mm to 0.3mm; The thickness of described first weathering layer and second weathering layer is 0.02mm to 0.05mm; The thickness of described aluminium foil layer is 0.002mm to 0.25mm.The thickness of adhesive linkage, weathering layer and aluminium foil layer can guarantee the adhesive strength of adhesive linkage in reasonable range, the weathering layer tack is good, and cost is low, the reliability height.
Therefore, a kind of encapsulation backboard that is used for amorphous silicon solar cell module of the present utility model has following advantage: establish aluminium foil layer to cut off steam by folder between second weathering layer and base material, making steam can not see through backboard enters in the battery component, thereby guaranteed the stability in use of solar module, prolonged useful life; After tested, its steam transmitance＜0.05; At 60 ℃, under the 550W/m condition, through 2000 hours ultraviolet resistance (UVA340) exposure experiments, backboard did not have xanthochromia, no embrittlement, no delamination; Behind the EVA lamination, the adhesive strength between backboard and the EVA is greater than 40N/cm, and performance meets the requirement of solar module fully, can guarantee the useful life in 25 years of assembly.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
Embodiment:
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
As shown in Figure 1, a kind of encapsulation backboard that is used for amorphous silicon solar cell module of the present utility model, comprise base material 1 and be coated in first weathering layer 2 of base material 1 upper surface, and form several scraggly minor grooves after the base material 1 surface process corona treatment corresponding to first weathering layer, 2 sides, minor groove evenly distributes on base material 1 surface, on the lower surface of base material 1, be bonded with aluminium foil layer 4 by adhesive linkage 5, lower surface at aluminium foil layer 4 is coated with second weathering layer 3, wherein base material 1 is a 0.15mm PET film for thickness, first weathering layer 2 is the modified Teflon of 0.03mm for thickness, adhesive linkage 5 is the polyurethanes bonding agent of 0.1mm for thickness, and second weathering layer 3 is the modified Teflon of 0.05mm for thickness.
Manufacturing process is: at first be coated with adhesive linkage 5 on base material 1, afterwards aluminium foil layer 4 be compound on the adhesive linkage 5, the opposite side at aluminium foil layer 4 applies second weathering layer 3 then, and the another side at base material 1 applies first weathering layer 2 at last.
Specific embodiment described herein only is that design of the present utility model is illustrated.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Claims (5)
1. encapsulation backboard that is used for amorphous silicon solar cell module, comprise base material (1) and be located at first weathering layer (2) of base material (1) upper surface and be located at second weathering layer (3) of base material (1) lower surface, it is characterized in that: between described second weathering layer (3) and base material (1), be folded with aluminium foil layer (4), be provided with adhesive linkage (5) on aluminium foil layer (4) surface corresponding to base material (1) side, described aluminium foil layer (4) is pasted and fixed on base material (1) surface by adhesive linkage (5).
2. a kind of encapsulation backboard that is used for amorphous silicon solar cell module according to claim 1, it is characterized in that: be provided with several scraggly minor grooves on base material (1) upper surface corresponding to first weathering layer (2) side, described minor groove evenly distributes at substrate surface.
3. a kind of encapsulation backboard that is used for amorphous silicon solar cell module according to claim 1 and 2 is characterized in that: described adhesive linkage (5) is the polyurethanes bonding agent; Described first weathering layer (2) and second weathering layer (3) are teflon coating.
4. a kind of encapsulation backboard that is used for amorphous silicon solar cell module according to claim 1 and 2, it is characterized in that: the thickness of described adhesive linkage (5) is 0.005mm to 0.3mm; The thickness of described first weathering layer (2) and second weathering layer (3) is 0.02mm to 0.05mm; The thickness of described aluminium foil layer (4) is 0.002mm to 0.25mm.
5. a kind of encapsulation backboard that is used for amorphous silicon solar cell module according to claim 3, it is characterized in that: the thickness of described adhesive linkage (5) is 0.005mm to 0.3mm; The thickness of described first weathering layer (2) and second weathering layer (3) is 0.02mm to 0.05mm; The thickness of described aluminium foil layer (4) is 0.002mm to 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020560416 CN201812838U (en) | 2010-10-13 | 2010-10-13 | Packaging back board for amorphous silicon solar battery component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020560416 CN201812838U (en) | 2010-10-13 | 2010-10-13 | Packaging back board for amorphous silicon solar battery component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201812838U true CN201812838U (en) | 2011-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201020560416 Expired - Fee Related CN201812838U (en) | 2010-10-13 | 2010-10-13 | Packaging back board for amorphous silicon solar battery component |
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| Country | Link |
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| CN (1) | CN201812838U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306671A (en) * | 2011-09-30 | 2012-01-04 | 深圳华加日铝业有限公司 | Integrated solar thin film battery component, backboard and modification method thereof |
| CN102522451A (en) * | 2011-12-08 | 2012-06-27 | 常州天合光能有限公司 | Low-resistance high-power connection method |
-
2010
- 2010-10-13 CN CN 201020560416 patent/CN201812838U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306671A (en) * | 2011-09-30 | 2012-01-04 | 深圳华加日铝业有限公司 | Integrated solar thin film battery component, backboard and modification method thereof |
| CN102522451A (en) * | 2011-12-08 | 2012-06-27 | 常州天合光能有限公司 | Low-resistance high-power connection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG VENTURA PHOTOVOLTAIC MATERIALS CO., LTD. Free format text: FORMER OWNER: SHENGZHOU XINHUA TECHNOLOGY CO., LTD. Effective date: 20121206 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 312452 SHAOXING, ZHEJIANG PROVINCE TO: 312455 SHAOXING, ZHEJIANG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121206 Address after: 312455 Zhejiang city in Shengzhou Province town of private gathering area (Shen Jiawan) Patentee after: Zhejiang Ventura Photovoltaic Materials Co., Ltd. Address before: 312452 Zhejiang city of Shaoxing province Shengzhou city town a private gathering area (Shen Jiawan) Patentee before: Chengzhou City Xinhua Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110427 Termination date: 20131013 |