CN205082116U - Novel pad pasting is led to height - Google Patents
Novel pad pasting is led to height Download PDFInfo
- Publication number
- CN205082116U CN205082116U CN201520797185.3U CN201520797185U CN205082116U CN 205082116 U CN205082116 U CN 205082116U CN 201520797185 U CN201520797185 U CN 201520797185U CN 205082116 U CN205082116 U CN 205082116U
- Authority
- CN
- China
- Prior art keywords
- decorative layer
- adhesive phase
- pad pasting
- graphene film
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
- -1 graphite alkene Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model provides a novel pad pasting is led to height, by constituteing in decorative layer (2), graphene film piece (3), adhesive phase (4), adhere in proper order and form an organic whole, its characterized in that together in decorative layer (2), graphene film (3) and adhesive phase (4): external coating (1) paste on decorative layer (2), paste on adhesive phase (4) adhesive protection film (5). The utility model discloses, adopt graphite alkene as raw and other materials, have fabulous heat transfer ability, can be tailor into any shape as required when using for original heat altered that looses becomes the face heat dissipation, has protected that the user's is healthy.
Description
Technical field
The utility model relates to a kind of a kind of pad pasting using the high high-termal conductivity leading material to make, and is suitable for various electronic product and uses.
Background technology
Present electronic product is along with the raising of intelligence degree, and the operand of product itself strengthens, and this uprises with regard to making the integrated level of electronic product control circuit board.And the integrated level of circuit board is higher, can be higher to its cooling requirements.Present electronic product such as mobile phone is all generally as heat dissipation vehicle by the shell of body.And most people is in use in order to improve the aesthetics of mobile phone; layer protecting film is pasted in capital on the shell of mobile phone; this layer of diaphragm is generally have plastics or glass to make; they are not the good conductors of heat; after sticking diaphragm, the heat dispersion of mobile phone can decline, and causes some mobile phones can occur crashing owing to dispelling the heat bad in summer.
Summary of the invention
For above deficiency, the purpose of this utility model there are provided a kind of novel height and leads pad pasting, this pad pasting adopts Graphene as raw material, there is fabulous thermal heat transfer capability, the form that the heat of the shell of mobile phone is dispelled the heat with face is distributed, the shell of mobile phone is improved greatly than original heat dispersion.
The technical solution of the utility model is achieved in the following ways: a kind of novel height leads pad pasting; be made up of external protection, decorative layer, Graphene diaphragm, adhesive phase, adhesive diaphragm; decorative layer, graphene film and adhesive phase are bonded together successively and form one; it is characterized in that: post external protection above described decorative layer, below adhesive phase, post adhesive diaphragm.
The thickness of described graphene film is 0.25 millimeter.
The utility model, adopts Graphene as raw material, has good thermal heat transfer capability, the form that the heat of the shell of mobile phone is dispelled the heat with face distributed, make the shell of mobile phone also better than original heat dispersion, but have the ability of screening electron radiation.The shape that can be cut into any shape and product as required in use carries out docile, makes the heat radiation of original point become face heat radiation, protects the healthy of user.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is that the utility model uses step 1 schematic diagram.
Fig. 3 is that the utility model uses step 2 schematic diagram.
Fig. 4 is the utility model heat sinking function schematic diagram.
Fig. 5 is the utility model radiation-screening functional schematic.
Embodiment
Known by Fig. 1; a kind of novel height leads pad pasting; be made up of external protection 1, decorative layer 2, Graphene diaphragm 3, adhesive phase 4, adhesive diaphragm 5, decorative layer 2, graphene film 3 and adhesive phase 4 are made into one, and adhesive diaphragm 5 is attached to above adhesive phase 4.External protection 1 is fitted in above decorative layer 2, is to protect decorative layer 2 and adhesive phase 4 can not be destroyed before use.
Being known by Fig. 2, Fig. 3, is that the utility model uses step schematic diagram.Decorative layer 2, graphene film 3 and adhesive phase 4 are made into one, tear adhesive diaphragm 5, are fitted in the place that adhesive phase 4 and electronic product will dispel the heat, then tear external protection 1.
Known by Fig. 4, after being fitted in the place that adhesive phase 4 and electronic product will dispel the heat, graphene film 3 by the shape docile according to electronic product on electronic product, because the height of graphene film 3 leads thermal property, graphene film 3 is rapidly by the heat absorption on electronic product casing or circuit board, then distribute, heat radiation is initiatively carried out to electronic product.
Known by Fig. 5, graphene film 3 has the ability of electromagnetic radiation shielding due to Graphene, and after graphene film 3 is by electronic product in docile, the divergence of the electromagnetic radiation in its region covered can reduce greatly.The thickness of described graphene film 3 only has 0.25 millimeter, and its weight is lighter relative to common pad pasting, can not have a huge impact the weight of product when large area docile.
Claims (2)
1. a novel height leads pad pasting; be made up of decorative layer (2), Graphene diaphragm (3), adhesive phase (4); decorative layer (2), graphene film (3) and adhesive phase (4) are bonded together successively and form one; it is characterized in that: described external protection (1) is attached to above decorative layer (2), and adhesive diaphragm (5) is attached to above adhesive phase (4).
2. the novel height of one according to claim 1 leads pad pasting, it is characterized in that: the thickness of described graphene film (3) is 0.25 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520797185.3U CN205082116U (en) | 2015-03-16 | 2015-10-16 | Novel pad pasting is led to height |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015201476142 | 2015-03-16 | ||
| CN201520147614 | 2015-03-16 | ||
| CN201520797185.3U CN205082116U (en) | 2015-03-16 | 2015-10-16 | Novel pad pasting is led to height |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205082116U true CN205082116U (en) | 2016-03-09 |
Family
ID=55434484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520797185.3U Expired - Fee Related CN205082116U (en) | 2015-03-16 | 2015-10-16 | Novel pad pasting is led to height |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205082116U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684365A (en) * | 2015-03-16 | 2015-06-03 | 镇江博昊科技有限公司 | Novel high-conductivity sticking film |
-
2015
- 2015-10-16 CN CN201520797185.3U patent/CN205082116U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684365A (en) * | 2015-03-16 | 2015-06-03 | 镇江博昊科技有限公司 | Novel high-conductivity sticking film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20171212 Granted publication date: 20160309 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20211212 Granted publication date: 20160309 |
|
| PD01 | Discharge of preservation of patent | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220311 Address after: 212000 No.99, Yiqing Road, Gaozi street, economic development zone, Dantu District, Zhenjiang City, Jiangsu Province Patentee after: SINO-FOUNDRY REFRACTORY (JIANGSU) Co.,Ltd. Address before: 212300 E52, science and Technology Park, No. 99, dingmaojing 15th Road, new area, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG BROWAH TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |