CN104684365A - Novel high-conductivity sticking film - Google Patents
Novel high-conductivity sticking film Download PDFInfo
- Publication number
- CN104684365A CN104684365A CN201510113552.8A CN201510113552A CN104684365A CN 104684365 A CN104684365 A CN 104684365A CN 201510113552 A CN201510113552 A CN 201510113552A CN 104684365 A CN104684365 A CN 104684365A
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- China
- Prior art keywords
- conductivity
- novel high
- sticking film
- decorative layer
- graphene
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Abstract
The invention relates to a novel high-conductivity sticking film. The novel high-conductivity sticking film consists of a decorative layer (2), a graphene film plate (3) and an adhesive layer (4) which are adhered together to form one body in sequence. The novel high-conductivity sticking film is characterized in that an external protection layer (1) is adhered on the decorative layer (2); an adhesive protective film (5) is adhered on the adhesive layer (4). Graphene is taken as a raw material, the novel high-conductivity sticking film has excellent heat transfer capacity and can be cut into any shape according to requirements when in use, so that original point heat dissipation becomes surface heat dissipation, and good health of a user is protected.
Description
Technical field
The present invention relates to a kind of a kind of pad pasting using the high high-termal conductivity leading material to make, be suitable for various electronic product and use.
Background technology
present electronic product is along with the raising of intelligence degree, and the operand of product itself strengthens, and this uprises with regard to making the integrated level of electronic product control circuit board.And the integrated level of circuit board is higher, can be higher to its cooling requirements.Present electronic product such as mobile phone is all generally as heat dissipation vehicle by the shell of body.And most people is in use in order to improve the aesthetics of mobile phone; layer protecting film is pasted in capital on the shell of mobile phone; this layer of diaphragm is generally have plastics or glass to make; they are not the good conductors of heat; after sticking diaphragm, the heat dispersion of mobile phone can decline, and causes some mobile phones can occur crashing owing to dispelling the heat bad in summer.
Summary of the invention
For above deficiency, the object of the present invention is to provide a kind of novel height to lead pad pasting, this pad pasting adopts Graphene as raw material, has fabulous thermal heat transfer capability, the form that the heat of the shell of mobile phone is dispelled the heat with face is distributed, the shell of mobile phone is improved greatly than original heat dispersion.
Technical scheme of the present invention is achieved in the following ways: a kind of novel height leads pad pasting; be made up of external protection, decorative layer, Graphene diaphragm, adhesive phase, adhesive diaphragm; decorative layer, graphene film and adhesive phase are bonded together successively and form one; it is characterized in that: post external protection above described decorative layer, below adhesive phase, post adhesive diaphragm.
The thickness of described graphene film is 0.25 millimeter.
The present invention, adopts Graphene as raw material, has good thermal heat transfer capability, the form that the heat of the shell of mobile phone is dispelled the heat with face distributed, make the shell of mobile phone also better than original heat dispersion, but have the ability of screening electron radiation.The shape that can be cut into any shape and product as required in use carries out docile, makes the heat radiation of original point become face heat radiation, protects the healthy of user.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is that the present invention uses step 1 schematic diagram.
Fig. 3 is that the present invention uses step 2 schematic diagram.
Fig. 4 is heat sinking function schematic diagram of the present invention.
Fig. 5 is radiation-screening functional schematic of the present invention.
Embodiment
Known by Fig. 1; a kind of novel height leads pad pasting; be made up of external protection 1, decorative layer 2, Graphene diaphragm 3, adhesive phase 4, adhesive diaphragm 5, decorative layer 2, graphene film 3 and adhesive phase 4 are made into one, and adhesive diaphragm 5 is attached to above adhesive phase 4.External protection 1 is fitted in above decorative layer 2, is to protect decorative layer 2 and adhesive phase 4 can not be destroyed before use.
Being known by Fig. 2, Fig. 3, is that the present invention uses step schematic diagram.Decorative layer 2, graphene film 3 and adhesive phase 4 are made into one, tear adhesive diaphragm 5, are fitted in the place that adhesive phase 4 and electronic product will dispel the heat, then tear external protection 1.
Known by Fig. 4, after being fitted in the place that adhesive phase 4 and electronic product will dispel the heat, graphene film 3 by the shape docile according to electronic product on electronic product, because the height of graphene film 3 leads thermal property, graphene film 3 is rapidly by the heat absorption on electronic product casing or circuit board, then distribute, heat radiation is initiatively carried out to electronic product.
Known by Fig. 5, graphene film 3 has the ability of electromagnetic radiation shielding due to Graphene, and after graphene film 3 is by electronic product in docile, the divergence of the electromagnetic radiation in its region covered can reduce greatly.The thickness of described graphene film 3 only has 0.25 millimeter, and its weight is lighter relative to common pad pasting, can not have a huge impact the weight of product when large area docile.
Claims (2)
1. a novel height leads pad pasting; be made up of decorative layer (2), Graphene diaphragm (3), adhesive phase (4); decorative layer (2), graphene film (3) and adhesive phase (4) are bonded together successively and form one; it is characterized in that: described external protection (1) is attached to above decorative layer (2), and adhesive diaphragm (5) is attached to above adhesive phase (4).
2. the novel height of one according to claim 1 leads pad pasting, it is characterized in that: the thickness of described graphene film (3) is 0.25 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510113552.8A CN104684365A (en) | 2015-03-16 | 2015-03-16 | Novel high-conductivity sticking film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510113552.8A CN104684365A (en) | 2015-03-16 | 2015-03-16 | Novel high-conductivity sticking film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104684365A true CN104684365A (en) | 2015-06-03 |
Family
ID=53318748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510113552.8A Pending CN104684365A (en) | 2015-03-16 | 2015-03-16 | Novel high-conductivity sticking film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104684365A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172269A (en) * | 2015-09-08 | 2015-12-23 | 深圳市富群印刷有限公司 | Protective film with frosted surface and technique thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555314A (en) * | 2011-12-30 | 2012-07-11 | 深圳市爱诺菲科技有限公司 | SMD (surface mounted device) with cooling and electromagnetic wave absorption functions and preparation method and application thereof |
| US20120298345A1 (en) * | 2010-02-17 | 2012-11-29 | Green Star Co., Ltd. | Heat sink sheet including an adhesive having good heat conductivity |
| CN205082116U (en) * | 2015-03-16 | 2016-03-09 | 镇江博昊科技有限公司 | Novel pad pasting is led to height |
-
2015
- 2015-03-16 CN CN201510113552.8A patent/CN104684365A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120298345A1 (en) * | 2010-02-17 | 2012-11-29 | Green Star Co., Ltd. | Heat sink sheet including an adhesive having good heat conductivity |
| CN102555314A (en) * | 2011-12-30 | 2012-07-11 | 深圳市爱诺菲科技有限公司 | SMD (surface mounted device) with cooling and electromagnetic wave absorption functions and preparation method and application thereof |
| CN205082116U (en) * | 2015-03-16 | 2016-03-09 | 镇江博昊科技有限公司 | Novel pad pasting is led to height |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172269A (en) * | 2015-09-08 | 2015-12-23 | 深圳市富群印刷有限公司 | Protective film with frosted surface and technique thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150603 |
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| WD01 | Invention patent application deemed withdrawn after publication |