CN205050992U - Three -dimensional domain topology framework of C wave band high -gain directional aerial microstrip - Google Patents
Three -dimensional domain topology framework of C wave band high -gain directional aerial microstrip Download PDFInfo
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- CN205050992U CN205050992U CN201520779257.1U CN201520779257U CN205050992U CN 205050992 U CN205050992 U CN 205050992U CN 201520779257 U CN201520779257 U CN 201520779257U CN 205050992 U CN205050992 U CN 205050992U
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Abstract
The utility model relates to a three -dimensional domain topology framework of C wave band high -gain directional aerial microstrip, frame (2), 1 feed layer PCB double sided board (3) and 1 metal underframe (4) on 1 radiating layer PCB double sided board (1), 1 metal are through being provided with installation locating hole h1, installation locating hole h2, installation locating hole h3 and installation locating hole h4 to closely link up through rivet (5), rivet (6), it constitutes a stromatolite formula modular structure wholly to combine together, wherein: radiating layer PCB double sided board (1) is again including last radiating surface (11) under, radiating surface (12) and medium base plate (13), feed layer PCB double sided board (3) are again including last feed layer (31) under, feed layer (32) and medium base plate (33), go up radiating surface (11), radiate disk array (111) on setting above -mentioned has again and apply copper strips (112) on and, down radiating surface (12) are radiated disk array (121) and are applied copper strips (122) under and under setting above -mentioned has again, the C wave band high -gain directional aerial who produces has characteristics such as the gain is high, return loss is little, circular polarization is functional.
Description
Technical field
The utility model relates to a kind of antenna frame for communication technical field, the three-dimensional domain topological structure of the micro-band of especially a kind of C-band gain directional antenna.
Background technology
Antenna is that one can radiation or receive electromagnetic device effectively.Directional antenna is that one has than other directions more effectively being launched or receiving electromagnetic antenna on the specific direction of space.
Current, in military communication field, the environment that wireless communication system faces becomes increasingly complex, more and more higher to the requirement of communication system, particularly jamproof ability.Gain directional antenna can form high-gain narrow beam in useful signal direction, and the secondary lobe or zero forming low gain in other directions falls into.In communication applications, directional antenna main beam is aimed at useful signal, thus certain inhibitory action can be played to the interference from other directions.In addition, compared with linear polarized antenna, circular polarized antenna can overcome the antenna polarization mismatch problems because communications carrier climbing etc. brings better.
By adopting different feeding classifications, cavity body structure, wire laying mode and band linear dimension, can be made into the directional antenna of different performance.Current development C-band there is the circular-polarization high gain directional antenna that size is little, gain is high, axial ratio is low, be problem demanding prompt solution.
Utility model content
The purpose of this utility model is the deficiency solving above-mentioned prior art, provides reasonable in design, the three-dimensional domain topological structure of the micro-band of a kind of C-band gain directional antenna of dependable performance.
In order to achieve the above object, the technical scheme that the utility model adopts is:
The three-dimensional domain topological structure of a kind of micro-band of C-band gain directional antenna, include 1 radiating layer PCB double sided board, 1,1 upper metallic frame, 2,1 feed layer PCB double sided board 3 and 1 metal underframe 4, by being provided with mounting-positioning holes h1, mounting-positioning holes h2, mounting-positioning holes h3 and mounting-positioning holes h4, and be closely connected through rivet 5, rivet 6, the formation that combines laminated type modular construction is overall, it is characterized in that:
Described radiating layer PCB double sided board 1, includes again radiating surface 11, lower radiating surface 12 and medium substrate 13, in order to make radiofrequency signal and Space Coupling.
Described feed layer PCB double sided board 3, includes again feed layer 31, lower feed layer 32 and medium substrate 33, is coupled with radiating layer PCB double sided board 1 in order to make radiofrequency signal.
Described upper radiating surface 11, arranges above and has upper radiation disk array 111 and upper deposited copper strips 112; Upper radiation disk array 111, in order to improve the gain of directional antenna; Upper deposited copper strips 112, in order to radio frequency ground connection.
Described lower radiating surface 12, arranges above and has lower radiation disk array 121 and lower deposited copper strips 122; Lower radiation disk array 121, in order to improve the gain of directional antenna; Lower deposited copper strips 122, in order to radio frequency ground connection.
The disk of described upper radiation disk array 111 and lower radiation disk array 121 varies in size, in order to improve the relative impedances bandwidth of directional antenna.
Described upper feed layer 31, is provided with again M shape microstrip line gap 311, circular patch 312 and deposited copper strips 313 above.
Described lower feed layer (32), be provided with again micro-band above and wait point power splitter (321), micro-band not decile power splitter (322), micro-band not decile power splitter (323), micro-band not decile power splitter (324) and micro-band not decile power splitter (325) and annular coupler (326), annular coupler (327), phase shifter (328), phase shifter (329), in order to be combined into the feeding network of directional antenna.
Described annular coupler (326), relative to annular coupler (327) 90-degree rotation, in order to improve the circular polarization performance of directional antenna.
Described annular coupler (326) and annular coupler (327), be connected, in order to improve impedance matching performance with the circular patch (312) of upper feed layer (31) by metallization via hole m2.
Described decile power splitter (321), includes again impedance transformation microstrip line (3211), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (322) not, include again impedance transformation microstrip line (3221), second level impedance transformation microstrip line (3222) and impedance transformation microstrip line (3223), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (323) not, include again impedance transformation microstrip line (3231), impedance transformation microstrip line (3232) and second level impedance transformation microstrip line (3233), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (324) not, include again impedance transformation microstrip line (3241), second level impedance transformation microstrip line (3242) and impedance transformation microstrip line (3243), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (325) not, include again impedance transformation microstrip line (3251), impedance transformation microstrip line (3252) and second level impedance transformation microstrip line (3253), in order to improve the performance of impedance matching.
Described upper metallic frame (2), in order to fixing radiating layer PCB double sided board (1) and feed layer PCB double sided board (3); The lower deposited copper strips (122) of lower radiating surface (12), is connected with the deposited copper strips (313) of upper feed layer (31) by upper metallic frame (2), in order to radio frequency altogether.
Accompanying drawing illustrates:
Fig. 1 is the utility model overall architecture schematic diagram;
Fig. 2 is the upper radiating surface schematic diagram of the utility model radiating layer PCB double sided board 1;
Fig. 3 is the lower radiating surface schematic diagram of the utility model radiating layer PCB double sided board 1;
Fig. 4 is the upper feed layer schematic diagram of the utility model feed layer PCB double sided board 3;
Fig. 5 is the lower feed layer schematic diagram of the utility model feed layer PCB double sided board 3;
Fig. 6 is the test result figure of the utility model return loss;
Fig. 7 is the test result figure of the utility model gain;
Fig. 8 is the test result figure of the utility model axial ratio;
Symbol description in figure:
1 is radiating layer PCB double sided board;
2 is upper metallic frame;
3 is feed layer PCB double sided boards;
4 is metal underframes;
5 is install rivet;
6 is install rivet;
11 is upper radiating surfaces of radiating layer PCB double sided board 1;
12 is lower radiating surfaces of radiating layer PCB double sided board 1;
13 is medium substrates of radiating layer PCB double sided board 1;
31 is upper feed layer of feed layer PCB double sided board 3;
32 is lower feed layer of feed layer PCB double sided board 3;
33 is medium substrates of feed layer PCB double sided board 3;
111 is upper radiation disk arrays of upper radiating surface 11;
112 is upper deposited copper strips of upper radiating surface 11;
121 is lower radiation disk arrays of lower radiating surface 12;
122 is lower deposited copper strips of lower radiating surface 12;
311 is M shape microstrip line gaps of upper feed layer 31;
312 is circular patches of upper feed layer 31;
313 is deposited copper strips of upper feed layer 31;
321 is point power splitters such as micro-band of lower feed layer 32;
322 is micro-band not decile power splitters of lower feed layer 32;
323 is micro-band not decile power splitters of lower feed layer 32;
324 is micro-band not decile power splitters of lower feed layer 32;
325 is micro-band not decile power splitters of lower feed layer 32;
326 is annular couplers of lower feed layer 32;
327 is annular couplers of lower feed layer 32;
328 is phase shifters of lower feed layer 32;
329 is phase shifters of lower feed layer 32;
3221 is impedance transformation microstrip lines of micro-band not decile power splitter 322;
3222 is second level impedance transformation microstrip lines of micro-band not decile power splitter 322;
3223 is impedance transformation microstrip lines of micro-band not decile power splitter 322;
3231 is impedance transformation microstrip lines of micro-band not decile power splitter 323;
3232 is impedance transformation microstrip lines of micro-band not decile power splitter 323;
3233 is second level impedance transformation microstrip lines of micro-band not decile power splitter 323;
3241 is impedance transformation microstrip lines of micro-band not decile power splitter 324;
3242 is second level impedance transformation microstrip lines of micro-band not decile power splitter 324;
3243 is impedance transformation microstrip lines of micro-band not decile power splitter 324;
3251 is impedance transformation microstrip lines of micro-band not decile power splitter 325;
3252 is impedance transformation microstrip lines of micro-band not decile power splitter 325;
3253 is second level impedance transformation microstrip lines of micro-band not decile power splitter 325;
H1 is the mounting-positioning holes of radiating layer PCB double sided board 1;
H2, h3 are the mounting-positioning holes of upper metallic frame 2;
H4 is the mounting-positioning holes of metal underframe 4;
M1 is the metallization via hole of radiating layer PCB double sided board 1;
M2 is the metallization via hole of feed layer PCB double sided board 3;
Embodiment
Referring to shown in Fig. 1 to Fig. 8, is the utility model specific embodiment.
1 to accompanying drawing 5 can be found out by reference to the accompanying drawings:
The utility model includes 1 radiating layer PCB double sided board, 1,1 upper metallic frame, 2,1 feed layer PCB double sided board 3 and 1 metal underframe 4, by being provided with mounting-positioning holes h1, mounting-positioning holes h2, mounting-positioning holes h3 and mounting-positioning holes h4, and be closely connected through rivet 5, rivet 6, the formation that combines laminated type modular construction is overall, wherein:
Described radiating layer PCB double sided board 1, includes again radiating surface 11, lower radiating surface 12 and medium substrate 13, in order to make radiofrequency signal and Space Coupling.
Described feed layer PCB double sided board 3, includes again feed layer 31, lower feed layer 32 and medium substrate 33, is coupled with radiating layer PCB double sided board 1 in order to make radiofrequency signal.
Described upper radiating surface 11, arranges above and has upper radiation disk array 111 and upper deposited copper strips 112; Upper radiation disk array 111, in order to improve the gain of directional antenna; Upper deposited copper strips 112, in order to radio frequency ground connection.
Described lower radiating surface 12, arranges above and has lower radiation disk array 121 and lower deposited copper strips 122; Lower radiation disk array 121, in order to improve the gain of directional antenna; Lower deposited copper strips 122, in order to radio frequency ground connection.
Described upper feed layer 31, is provided with again M shape microstrip line gap 311, circular patch 312 and deposited copper strips 313 above.
Described lower feed layer (32), be provided with again micro-band above and wait point power splitter (321), micro-band not decile power splitter (322), micro-band not decile power splitter (323), micro-band not decile power splitter (324) and micro-band not decile power splitter (325) and annular coupler (326), annular coupler (327), phase shifter (328), phase shifter (329), in order to be combined into the feeding network of directional antenna.
Described micro-band is decile power splitter (322) not, include again impedance transformation microstrip line (3221), second level impedance transformation microstrip line (3222) and impedance transformation microstrip line (3223), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (323) not, include again impedance transformation microstrip line (3231), impedance transformation microstrip line (3232) and second level impedance transformation microstrip line (3233), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (324) not, include again impedance transformation microstrip line (3241), second level impedance transformation microstrip line (3242) and impedance transformation microstrip line (3243), in order to improve the performance of impedance matching.
Described micro-band is decile power splitter (325) not, include again impedance transformation microstrip line (3251), impedance transformation microstrip line (3252) and second level impedance transformation microstrip line (3253), in order to improve the performance of impedance matching.
Described upper metallic frame (2), in order to fixing radiating layer PCB double sided board (1) and feed layer PCB double sided board (3); The lower deposited copper strips (122) of lower radiating surface (12), is connected with the deposited copper strips (313) of upper feed layer (31) by upper metallic frame (2), in order to radio frequency altogether.
It can also be seen that from Fig. 6, Fig. 7 and Fig. 8:
The test result of the utility model embodiment input return loss s11, gain G ain and axial ratio performance, as shown in FIG., the return loss performance s11 of directional antenna is less than-14dB, and gain G ain is greater than 14.5dBi, and axial ratio is less than 3dB.
As can be seen here, under the condition ensureing module reduced size, the demand of C-band broadband radio to Miniaturization high-gain circular polarization directional antenna can be met.
What deserves to be explained is:
The disk diameter of described upper radiation disk array 111 and lower radiation disk array 121 and spacing, point power splitter 321 such as M shape gap 311, micro-band, micro-band not decile power splitter 322, micro-band not decile power splitter 323, micro-band not decile power splitter 324, micro-band not the parameter such as the live width of decile power splitter 325, annular coupler 326, annular coupler 327, phase shifter 328 and phase shifter 329, line length and baseplate material to choose suitable, otherwise the demand of C-band broadband radio to high-gain circular polarization directional antenna cannot be met.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; do not departing from the prerequisite that the utility model discloses; some improvement and retouching can also be made; these amendments, equivalent replacement and improvement etc., all should be included in protection range of the present utility model.
Claims (10)
1. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna, include 1 radiating layer PCB double sided board (1), 1 upper metallic frame (2), 1 feed layer PCB double sided board (3) and 1 metal underframe (4), by being provided with mounting-positioning holes h1, mounting-positioning holes h2, mounting-positioning holes h3 and mounting-positioning holes h4, and be closely connected through rivet (5), rivet (6), the formation that combines laminated type modular construction is overall, it is characterized in that:
A. described radiating layer PCB double sided board (1), includes again radiating surface (11), lower radiating surface (12) and medium substrate (13), in order to make radiofrequency signal and Space Coupling;
B. described feed layer PCB double sided board (3), includes again feed layer (31), lower feed layer (32) and medium substrate (33), is coupled with radiating layer PCB double sided board (1) in order to make radiofrequency signal.
2. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described upper radiating surface (11), arranges above and has upper radiation disk array (111) and upper deposited copper strips (112); Upper radiation disk array (111), in order to improve the gain of directional antenna; Upper deposited copper strips (112), in order to radio frequency ground connection.
3. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described lower radiating surface (12), arranges above and has lower radiation disk array (121) and lower deposited copper strips (122); Lower radiation disk array (121), in order to improve the gain of directional antenna; Lower deposited copper strips (122), in order to radio frequency ground connection.
4. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described upper feed layer (31), is provided with again M shape microstrip line gap (311), circular patch (312) and deposited copper strips (313) above, in order to improve the circular polarization performance of directional antenna.
5. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described lower feed layer (32), be provided with again micro-band above and wait point power splitter (321), micro-band not decile power splitter (322), micro-band not decile power splitter (323), micro-band not decile power splitter (324) and micro-band not decile power splitter (325) and annular coupler (326), annular coupler (327), phase shifter (328), phase shifter (329), in order to be combined into the feeding network of directional antenna.
6. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described micro-band is decile power splitter (322) not, include again impedance transformation microstrip line (3221), second level impedance transformation microstrip line (3222) and impedance transformation microstrip line (3223), in order to improve the performance of impedance matching.
7. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described micro-band is decile power splitter (323) not, include again impedance transformation microstrip line (3231), impedance transformation microstrip line (3232) and second level impedance transformation microstrip line (3233), in order to improve the performance of impedance matching.
8. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described micro-band is decile power splitter (324) not, include again impedance transformation microstrip line (3241), second level impedance transformation microstrip line (3242) and impedance transformation microstrip line (3243), in order to improve the performance of impedance matching.
9. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described micro-band is decile power splitter (325) not, include again impedance transformation microstrip line (3251), impedance transformation microstrip line (3252) and second level impedance transformation microstrip line (3253), in order to improve the performance of impedance matching.
10. the three-dimensional domain topological structure of the micro-band of C-band gain directional antenna as claimed in claim 1, is characterized in that:
Described upper metallic frame (2), in order to fixing radiating layer PCB double sided board (1) and feed layer PCB double sided board (3); The lower deposited copper strips (122) of lower radiating surface (12), by deposited copper strips (313) close proximity of upper metallic frame (2) with upper feed layer (31), in order to radio frequency altogether.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520779257.1U CN205050992U (en) | 2015-10-09 | 2015-10-09 | Three -dimensional domain topology framework of C wave band high -gain directional aerial microstrip |
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| CN201520779257.1U CN205050992U (en) | 2015-10-09 | 2015-10-09 | Three -dimensional domain topology framework of C wave band high -gain directional aerial microstrip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226385A (en) * | 2015-10-09 | 2016-01-06 | 武汉中元通信股份有限公司 | The three-dimensional domain topological structure of a kind of micro-band of C-band gain directional antenna |
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2015
- 2015-10-09 CN CN201520779257.1U patent/CN205050992U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226385A (en) * | 2015-10-09 | 2016-01-06 | 武汉中元通信股份有限公司 | The three-dimensional domain topological structure of a kind of micro-band of C-band gain directional antenna |
| CN105226385B (en) * | 2015-10-09 | 2018-12-25 | 武汉中元通信股份有限公司 | A kind of C-band gain directional antenna micro-strip three-dimensional domain topological structure |
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