CN204991676U - Device and base plate vacuum chamber device for supporting substrate - Google Patents

Abstract

The utility model relates to a device and base plate vacuum chamber device for supporting substrate. The embodiment of this paper description relates to the base plate strutting arrangement who is arranged in supporting the large tracts of land base plate at the vacuum chamber roughly. Base plate support piece is including having the magnet setting at wherein shell subassembly, and is coupled to the supporting member of shell subassembly. Magnetism post component can be coupled to regularly the main part of vacuum chamber. The size of shell subassembly can design with the post component holds in the shell subassembly. In operation, the shell subassembly can configure into with the post component is accomodate in the shell subassembly. Shell subassembly and post component can keep magnetism to be coupled, will until providing sufficient power the shell subassembly is followed the separation of post component.

Description

Device for supporting substrate and substrate vacuum chamber device

technical field

Embodiments of the present disclosure generally relate to substrate supports for supporting large area substrates in vacuum chambers. More specifically, embodiments described herein relate to substrate supports having magnetic pinch assemblies.

Background technique

Thin film transistors (TFTs) are commonly used in active matrix displays, such as computer and television monitors, cell phone displays, personal digital assistants (PDAs), and an increasing number of other devices. Typically, a flat panel includes two glass plates with a layer of liquid crystal material sandwiched between them. At least one of the glass sheets includes a conductive film disposed on the glass sheet, the conductive film being coupled to a power source. Power supplied to the conductive film from a power source changes the orientation of the crystal material, thereby forming a graphic display.

As the market accepts flat panel technology, the need for larger displays, increased yields, and lower production costs has driven equipment manufacturers to develop new systems that accommodate larger sized glass substrates for use in flat panel display manufacturing plants. Additionally, the ability to efficiently and cost-effectively clean and replace dirty or worn parts helps further reduce cost of ownership. However, with such large equipment to process large area substrates, access to the various elements of the system becomes time consuming and difficult.

Accordingly, there is a need for processing system components that are easily accessible and removable to provide improved maintenance performance of large area substrate processing systems.

Utility model content

In one embodiment, an apparatus for supporting a substrate is provided. The device includes a housing assembly that may have a first groove and a second groove formed therein. The first groove and the second groove may be separated by a partition. A column member slidably disposed in the second groove may be configured. A magnet may be disposed within the first groove adjacent to the partition. A spacer may be disposed within the first groove adjacent to the magnet. A support member may be disposed within the first groove adjacent to the spacer. At least a portion of the support member may extend out of the first groove.

In another embodiment, a substrate vacuum chamber apparatus is provided. The apparatus includes a vacuum chamber body that can be sized to accommodate large area substrates. A substrate support may be provided within the vacuum chamber body. The substrate support includes a housing assembly that may have a first groove and a second groove formed therein. The first groove and the second groove may be separated by a partition. A column member may be threadably coupled to the vacuum chamber body. The post member may also be configured to be slidably disposed within the second groove. A magnet may be disposed within the first groove adjacent to the partition. A spacer may be disposed within the first groove adjacent to the magnet. A support member may be disposed within the first groove adjacent to the spacer. At least a portion of the support member may extend out of the first groove.

In another embodiment, a method of removing a substrate support from a vacuum chamber is provided. The method includes contacting a bottom surface of the housing assembly. The first groove of the housing assembly may have a magnet disposed in the first groove. The second recess of the housing assembly may have a martensitic stainless steel post member disposed in the second recess. A lift force may be generated substantially parallel to a pulling force generated between the magnet and the post member. The lifting force may be greater than the pulling force. The housing assembly may be lifted until there is no post member in the second recess of the housing assembly.

Description of drawings

So that the manner in which the above recited characterizing features of the present disclosure can be understood in detail, a more particular description of the disclosure briefly summarized above may have reference to embodiments, some of which are illustrated in the accompanying drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the disclosure, for the disclosure may admit to other equally effective embodiments.

Figure 1 shows a top view of a processing system for processing large area substrates according to one embodiment described herein.

Figure 2 shows a side cross-sectional view of a multi-chamber load lock chamber according to one embodiment described herein.

Figure 3A shows a side view of a substrate support according to one embodiment described herein.

Figure 3B shows a cross-sectional view of the substrate support of Figure 3A along section line 3B-3B.

Figure 3C shows an enlarged view of a portion of the substrate support of Figure 3A.

Figure 3D shows an enlarged portion of the substrate support of Figure 3A.

To facilitate understanding, identical element symbols have been used where possible to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

detailed description

Embodiments described herein generally relate to high capacity/high throughput load lock chambers having substrate supports for positioning and supporting substrates within the load lock chamber. Embodiments of the present disclosure, as illustratively described below, may be used in load lock chambers such as those available from AKT, a wholly owned subsidiary of Applied Materials, Inc., Santa Clara, Calif. earned those. It should be understood, however, that embodiments of the present disclosure find application in other system configurations, including those sold by other manufacturers, regardless of the need for high throughput substrate transfer of large area substrates through load lock chambers. Where is it.

Other embodiments relate to substrate support apparatus for supporting large area substrates in vacuum or load lock chambers. The substrate support includes a housing assembly having a magnet disposed therein, and a support member coupled to the housing assembly. A magnetic post member may be fixedly coupled to the body of the vacuum chamber. The housing assembly may be dimensioned to receive the post member within the housing assembly. In operation, the housing assembly may be configured to receive the column member within the housing assembly. The housing assembly and post member may remain magnetically coupled until sufficient force is provided to separate the housing assembly from the post member.

1 is a top view of one embodiment of a processing system 150 suitable for processing large area substrates (eg, substrates having a planar area greater than about 2.7 square meters). The process system 150 generally includes a transfer chamber 108 coupled to the factory interface 112 through a load lock chamber 100 having a plurality of single substrate transfer chambers. The transfer chamber 108 may include at least one dual-blade vacuum robot 134 disposed in the transfer chamber 108 , the dual-blade vacuum robot 134 adapted to move between the plurality of surrounding process chambers 132 and the load lock chamber 100 transfer substrates. Typically, the transfer chamber 108 is maintained at a vacuum to remove the need to adjust the pressure between the transfer chamber 108 and the individual process chamber 132 after each substrate transfer.

The factory interface 112 generally includes a plurality of substrate storage boxes 138 and a dual blade atmospheric robot 136 . The cassettes 138 are generally removably disposed in a plurality of compartments 140 formed on one side of the factory interface 112 . The atmospheric robot 136 is adapted to transfer substrates 110 between the cassette 138 and the load lock chamber 100 . Typically, the plant interface 112 is maintained at or slightly above atmospheric pressure.

FIG. 2 is a cross-sectional view of one embodiment of the multi-chamber load lock chamber 100 of FIG. 1 . The load lock chamber 100 has a chamber body 212 that includes a plurality of vertically stacked, environmentally isolated substrate transfer chambers that are vacuum-sealed with horizontal inner walls 214 separated. Although two single substrate transfer chambers 220, 222 are shown in the embodiment depicted in FIG. 2, it is contemplated that the chamber body 212 of the load lock chamber 100 may include one single substrate transfer or more vertically stacked substrate transfer chambers.

The substrate transfer chambers 220, 222 are each configured to accommodate a large area single substrate 110 such that the volume of each chamber can be minimized to facilitate rapid pumping and pumping cycles. In the embodiment depicted in FIG. 2, each substrate transfer chamber 220, 222 has an internal volume equal to or less than about 1000 liters to accommodate a substrate having a planar surface area of about 2.7 square meters. It is contemplated that substrate transfer chambers described herein having greater width and/or length and equivalent height may be configured to accommodate even larger substrates.

The chamber body 212 includes a first sidewall 202 , a second sidewall 204 , a third sidewall 206 , a bottom 208 , and a top 210 . Although not shown in this view, a fourth side wall is provided opposite said third side wall 206 . The body 212 may be made of a rigid material suitable for use under vacuum conditions. In one embodiment, the chamber body 212 is fabricated from a solid block (eg, a single piece) of aluminum. Alternatively, the chamber body 212 may be fabricated from a plurality of modular sections, each generally comprising a portion of one of the substrate transfer chambers 220, 222, and the chamber body 212 may be adapted to maintain Vacuum integrity is provided by means such as continuous welding as indicated by reference numeral 218 .

Each of the substrate transfer chambers 220 , 222 defined in the chamber body 212 includes two substrate access ports. The access is configured to help the large-area substrate 110 enter and exit the load lock chamber 100 . In the embodiment depicted in FIG. 2 , the first substrate transfer chamber 220 disposed at the bottom 208 of the chamber body 212 includes a first substrate access port 230 and a second substrate access port 232 having a diameter greater than about 2000mm width. The first substrate access port 230 is formed through the first sidewall 202 of the chamber body 212 and couples the first substrate transfer chamber 220 to the central transfer chamber 108 of the processing system 150 . The second substrate access port 232 is formed through the second wall 204 of the chamber body 212 and couples the first substrate transfer chamber 220 to the factory interface 112 . In the embodiment depicted in FIG. 2 , the substrate access ports 230 , 232 are provided on opposite sides of the chamber body 212 , however the access ports 230 , 232 may alternatively be located on adjacent walls of the body 212 .

Each of the substrate access ports 230, 232 is selectively sealed with a respective slit valve 226, 228 adapted to connect the first substrate transfer chamber 220 to the transfer chamber The environments of 108 and factory interface 112 are selectively isolated. The slit valves 226, 228 are positioned between open and closed positions with an actuator 242 (one actuator 242 shown in partial cross-section in FIG. 2 is normally positioned outside the chamber body 212). move. In the embodiment depicted in FIG. 2 , each of the slit valves 226 , 228 is pivotally coupled to the chamber body 212 along a first edge, and the slit valves 226 , 228 are actuated with an actuator 242 . 228 rotates between open and closed positions.

The first slit valve 226 seals the first substrate access port 230 from the inner side of the first side wall 202, and thus the first slit valve 226 is positioned in the first substrate transfer chamber 220 such that in The vacuum (eg, pressure) differential between the first substrate transfer chamber 220 and the vacuum environment of the central transfer chamber 108 helps load and seal the slit valve 226 against the first sidewall 202 , Thereby enhancing the vacuum tightness. Accordingly, the second slit valve 228 is disposed on the exterior of the second side wall 204 and is thus positioned such that the pressure between the ambient environment of the factory interface 112 and the vacuum environment of the first substrate transfer chamber 220 The difference helps to seal the second substrate access port 232 .

The second substrate transfer chamber 222 is similarly configured with access ports 238 , 240 and slit valves 226 , 228 . The substrate 110 is supported above the bottom 208 of the first substrate transfer chamber 220 and the substrate 110 is supported above the inner wall 214 bordering the bottom of the second substrate transfer chamber 222 with a plurality of substrate supports 244 . The substrate support 244 is configured and spatially positioned to support the substrate 110 at a height above the bottom 208 (or wall 214 ) to prevent the substrate from contacting the chamber body 212 . The substrate support 244 is configured to minimize scratching and contamination of the substrate 110 and to reduce the possibility of particle generation within the transfer chambers 220 , 222 . A detailed description of the substrate support 244 with reference to FIGS. 3A-3C is provided below.

FIG. 3A shows a side view of the substrate support 244 . The substrate support 244 includes a housing assembly 302 , post members 304 , and support members 306 . The housing assembly 302 is configured to be detachable from the post member 304 . For example, the housing assembly 302 and the post member 304 may be sized to slide and translate relative to each other. It is contemplated that any particles generated during insertion of post member 304 into housing assembly 302 may remain within the housing assembly 302 until the housing assembly 302 is detached from the post member 304 . During separation, particles generated during the insertion can break free of the housing assembly 302 where they can be pumped out of the vacuum chamber.

The housing assembly can be fabricated from various materials suitable for use in a vacuum chamber, such as polyetherketone (PEEK), polytetrafluoroethylene (PTFE), or aluminum. The post member 304 can be made of metal material such as martensitic stainless steel or the like. It is contemplated that the material selected for fabrication of the post member 304 may exhibit magnetic properties. Additionally, the materials used to form the housing assembly 302 and the post member 304 may be selected to reduce particle generation due to physical contact between the housing assembly 302 and the post member 304 .

Referring now to FIG. 3D , the housing assembly 302 is shown having a first groove 340 and a second groove 342 . As depicted, the first groove 340 and the second groove 342 are shown in partial cross-section. The first groove 340 can extend into the housing assembly 302 from the first end 334 of the housing assembly 302 , and the second groove 342 can extend into the housing assembly 302 from the second end 332 . The first end 334 and the second end 332 are disposed relative to each other, and the housing assembly 302 may be substantially rod-shaped or tubular.

FIG. 3B shows a cross-sectional view of the substrate support 244 of FIG. 3A along section line 3B-3B. The housing assembly 302 also includes a magnet 308 and a spacer 310 . The partition 316 of the housing assembly 302 is disposed between the first groove 340 and the second groove 342 such that the first groove 340 and the second groove 342 are separate and discontinuous. The magnet 308 may be disposed within the first groove 340 adjacent to the partition 316 and may contact the partition 316 . The magnet 308 may be fabricated from a magnetic material, such as neodymium, and may have a pulling force of between about 1 pound and about 10 pounds, such as between about 3 pounds and about 4 pounds.

The spacer 310 may be disposed within the first groove 340 adjacent to the magnet 308 and may contact the magnet 308 . The spacer 310 can be made of materials suitable for use in a vacuum chamber environment, such as PEEK, PTFE, or various types of plastics. The first portion 352 of the support member 306 can be disposed within the first groove 340 and the second portion 350 of the support member 306 can extend out of the first groove 340 . The first portion 352 may be disposed adjacent to the spacer 310 and may be threadably coupled to the threaded sidewall 314 of the first groove 340 . Alternatively, the first portion 352 of the support member 306 may be press fit into the first groove 340 . The first portion 352 may be configured to contact the spacer 310 and position the spacer 310 and the magnet 308 in a fixed position within the first groove 340 .

The second portion 350 of the support member 306 may be disposed adjacent the first end 334 of the housing assembly 302 and include the support member 312 . The first region 338 of the second portion 350 can have a diameter similar to the diameter of the housing assembly 302 , and the first region 338 can be configured to contact the first end 334 . The second region 336 of the second portion 350 may have a diameter greater than the diameter of the first region 338 , and the second region 336 may contain the support member 312 . As depicted in FIG. 3B , the support member 312 may comprise a roller ball or spherical support configured to contact a large area substrate. In this embodiment, the spherical support is freely rotatable on a ball bearing seat (not shown) disposed within the second region 336 of the support member 306 . Alternatively, the support member 312 may comprise pins or pads configured to contact a large area substrate. In these embodiments, the pin/pad may be a separate piece coupled to the support member 306, or the pin/pad may be incorporated into the support member as a whole. The support member 306 may be fabricated from a metallic material, such as aluminum or stainless steel, and may be formed from a single piece of material or multiple pieces of material.

The post member 304 may be dimensioned such that the post member 304 can be inserted into the second groove 342 . The post member 304 includes a first portion 322 and a second portion 320 . The first portion 322 may have a larger diameter than the second portion 320 . A first bevel 326 may be formed between the first portion 322 and the second portion 320 . The first bevel 326 may extend from the diameter of the first portion 322 to the diameter of the second portion 320 . A second bevel 324 may be formed between the second portion 320 and the top surface 330 of the post member 304 . The top surface 330 of the post member 304 may be configured to abut the bulkhead 316 when the post member 304 is disposed within the second recess 342 . It is contemplated that when the post member 304 is fully inserted into the second groove 342 , the magnetic force generated between the magnet 308 and the post member 304 may retain the post member 304 within the housing assembly 302 .

The base region 354 may extend from the first portion 322 and may have a diameter greater than that of the first portion 322 . Accordingly, the base region 354 may be disposed adjacent to the second end 332 of the housing assembly when the post member 304 is fully inserted into the second recess 342 . The threaded portion 318 of the post member 304 may extend from the base region 354 and have a diameter similar to the diameter of the first portion 322 . The threaded portion 318 may have threads formed therein and may be configured to couple to the bottom 208 of the vacuum chamber 220 , 222 . Bottom surface 356 of base region 354 may be adapted to contact bottom 208 when threaded portion 318 is fully inserted into bottom 208 .

FIG. 3C shows an enlarged view of base region 354 . The base region 354 includes a chamfered surface 328 extending from the bottom surface 356 to the first portion 322 . The chamfered surface 328 creates a gap between the surface of the base 208 and the second end 332 of the housing assembly 302 . The gap allows a tool to be inserted below second end 332 to separate housing assembly 302 from post member 304 .

In operation, a tool or other suitable device may contact the second end 332 and may apply a lifting force to the housing assembly 302 . The lift force may be substantially parallel to the pull force of the magnet 308 . In order to break the pulling force of the magnet 308 , the lifting force may be greater than the pulling force of the magnet 308 . Once the pull of the magnet 308 has been reduced or eliminated by separating the magnet 308 a sufficient distance from the post member 304, the housing assembly 302 can be further lifted until the top surface 330 of the post member 304 is no longer disposed on in the second groove 342 .

Embodiments described herein provide for efficient removal of substrate supports from large area substrate vacuum chambers. It is expected that the use of columnar substrate supports, rather than support rails or the like, reduces or eliminates areas of reduced fluid flow during pumping operations. The reduction in the area of reduced flow prevents or reduces the accumulation of particles around the substrate support.

While the foregoing is for embodiments of the disclosure, other and further embodiments of the disclosure can be devised without departing from the essential scope of the disclosure, which is determined by the following claims of.

Claims (19)

1., for a device for supporting substrate, described device comprises:

Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;

Post component, described post component is configured to be mounted slidably in described second groove;

Magnet, described magnet is arranged on contiguous described dividing plate in described first groove;

Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And

Supporting member, described supporting member is arranged on contiguous described distance piece in described first groove, wherein said supporting member extend described first groove at least partially.

2. device as claimed in claim 1, wherein said supporting member screw thread is couple to the described casing assembly in described first groove.

3. device as claimed in claim 1, wherein said second groove comprises the first area with the first diameter and the second area with the Second bobbin diameter being different from described first diameter.

4. device as claimed in claim 3, wherein said post component comprises the 3rd diameter and the 4th diameter, the size of described 3rd diameter is designed to relative to the translation slidably of described first area, and the size of described 4th diameter is designed to relative to the translation slidably of described second area.

5. device as claimed in claim 4, wherein said 3rd diameter and described 4th diameter are different.

6. device as claimed in claim 1, wherein said supporting member comprises ball, pin or pad, and described ball, pin or pad are configured to contact substrate.

7. device as claimed in claim 1, wherein chamfering gap is formed between the bottom of described casing assembly and a part for described post component, and when described post component fully inserts described second groove, described chamfering gap remains on described second groove outside.

8. device as claimed in claim 1, wherein said magnet comprises neodymium.

9. device as claimed in claim 8, wherein said post component comprises martensitic stain less steel.

10. device as claimed in claim 8, the pulling force of wherein said magnet is between 3 pounds to 4 pounds.

11. devices as claimed in claim 1, wherein said distance piece comprises the material being selected from the group be made up of following material: PEEK, PTFE, and aluminium.

12. devices as claimed in claim 10, wherein said distance piece comprises solid-state rod-shaped body.

13. devices as claimed in claim 10, wherein said distance piece comprises tubular body.

14. 1 kinds of substrate vacuum chamber devices, described device comprises:

Vacuum chamber body, described vacuum chamber body be dimensioned to accommodation large-area substrates; And

Substrate support, described substrate support is arranged in described vacuum chamber body, and described substrate support comprises:

Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;

Post component, described post component screw thread is couple to described vacuum chamber body and is configured to be mounted slidably in described second groove;

Magnet, described magnet is arranged on contiguous described dividing plate in described first groove;

Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And

Supporting member, described supporting member is arranged on contiguous described distance piece in described first groove, wherein

Described supporting member extend described first groove at least partially.

15. devices as claimed in claim 14, wherein said magnet comprises neodymium.

16. devices as claimed in claim 15, wherein said post component comprises martensitic stain less steel.

17. devices as claimed in claim 15, the pulling force of wherein said magnet is between 3 pounds to 4 pounds.

18. devices as claimed in claim 14, wherein arrange the substrate support between 20 and 40 in described vacuum chamber body.

19. 1 kinds of devices for supporting substrate, described device comprises:

Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;

Martensitic stain less steel post component, described martensitic stain less steel post component is configured to be mounted slidably in described second groove;

Neodymium magnet, described neodymium magnet is arranged on contiguous described dividing plate in described first groove;

Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And

Supporting member, described supporting member contiguous described distance piece place screw thread in described first groove is couple to described casing assembly, wherein said supporting member extend described first groove at least partially.