CN204991676U - Device and base plate vacuum chamber device for supporting substrate - Google Patents
Device and base plate vacuum chamber device for supporting substrate Download PDFInfo
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- CN204991676U CN204991676U CN201520368783.9U CN201520368783U CN204991676U CN 204991676 U CN204991676 U CN 204991676U CN 201520368783 U CN201520368783 U CN 201520368783U CN 204991676 U CN204991676 U CN 204991676U
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- groove
- magnet
- post component
- supporting member
- casing assembly
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- 239000000758 substrate Substances 0.000 title claims abstract description 90
- 239000000463 material Substances 0.000 claims description 12
- 229910001105 martensitic stainless steel Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 claims 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 1
- 229920002530 polyetherether ketone Polymers 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 2
- 230000005389 magnetism Effects 0.000 abstract 2
- 238000012546 transfer Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 241000734468 Listera Species 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 210000002186 septum of brain Anatomy 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a device and base plate vacuum chamber device for supporting substrate. The embodiment of this paper description relates to the base plate strutting arrangement who is arranged in supporting the large tracts of land base plate at the vacuum chamber roughly. Base plate support piece is including having the magnet setting at wherein shell subassembly, and is coupled to the supporting member of shell subassembly. Magnetism post component can be coupled to regularly the main part of vacuum chamber. The size of shell subassembly can design with the post component holds in the shell subassembly. In operation, the shell subassembly can configure into with the post component is accomodate in the shell subassembly. Shell subassembly and post component can keep magnetism to be coupled, will until providing sufficient power the shell subassembly is followed the separation of post component.
Description
Technical field
The execution mode of disclosure case relates generally to the substrate support for supporting large-area substrates in vacuum chamber.More particularly, execution mode described herein relates to the substrate support with magnetic latch assembly.
Background technology
Thin-film transistor (TFT) is usually used in Active Matrix Display, such as computer and televimonitor, mobile telephone display, personal digital assistant (PDA), and other devices of day by day accelerating.Usually, flat board comprises two glass plates, and these two glass plates have folder liquid crystal material layer between which.At least one in described glass plate comprises a setting conducting film on the glass plates, and described conducting film is coupled to power source.Be fed to the orientation of the power change crystalline material of conducting film from power source, thus form figure display.
Along with market is to the accreditation of plate technique, the new system of the output of larger display, increase and the demand of lower production cost having been ordered about to equipment manufacturers' exploitation accommodation large-size glass substrate uses for flat-panel monitor manufactory.In addition, efficient and cost effectively ability that the is clean and part of replacing dirty or wearing and tearing contribute to reducing further having cost.But along with this Large-Scale Equipment of employing processes large-area substrates, the various elements contacting described system become consuming time and difficult.
Thus, the treatment system element that can contact easily and remove is needed, the performance of the maintaining large area substrate processing system improved to provide tool.
Utility model content
In one embodiment, a kind of device for support substrate is provided.Described device comprises casing assembly, and described casing assembly can have the first groove and the second groove that are formed in wherein.Described first groove and described second groove can use baffle for separating.The configurable post component be slidably disposed in described second groove.Described dividing plate place can be close in described first groove and magnet is set.Described magnet place can be close in described first groove and distance piece is set.Described distance piece place can be close in described first groove and supporting member is set.Described supporting member can be extended out described first groove at least partially.
In another embodiment, a kind of substrate vacuum chamber device is provided.Described device comprises vacuum chamber body, and the size of described vacuum chamber body can be designed to hold large-area substrates.Substrate support can be set in described vacuum chamber body.Described substrate support comprises casing assembly, and described casing assembly can have the first groove and the second groove that are formed in wherein.Described first groove and described second groove can use baffle for separating.Post component can be coupled to described vacuum chamber body by screw thread.Described post component also can be configured to be slidably disposed in described second groove.Described dividing plate place can be close in described first groove and magnet is set.Described magnet place can be close in described first groove and distance piece is set.Described distance piece place can be close in described first groove and supporting member is set.Described supporting member can be extended out described first groove at least partially.
In another embodiment, a kind of method removing substrate support from vacuum chamber is provided.Described method comprises the basal surface of contact casing assembly.First groove of described casing assembly can have the magnet be arranged in the first groove.Second groove of described casing assembly can have the martensitic stain less steel post component be arranged in the second groove.Lifting force can be produced substantially parallel to the pulling force produced between magnet and post component.Described lifting force can be greater than described pulling force.Can casing assembly described in lifting, until there is no post component in the second groove of described casing assembly.
Accompanying drawing explanation
Therefore, can understand the mode of the above-mentioned feature structure of book publication in detail, the more specifically description of the disclosure case namely summarized above can refer to execution mode and carries out, and some execution modes are illustrated in the drawings.But, it should be noted that accompanying drawing only illustrative exemplary execution mode, and therefore should not be regarded as the restriction of the scope of disclosure case, because disclosure case can allow the execution mode of other equivalences.
Fig. 1 shows according to the vertical view of an execution mode described herein for the treatment of the treatment system of large-area substrates.
Fig. 2 shows the side cut away view of the multi-chamber load lock chamber according to an execution mode described herein.
Fig. 3 A shows the end view of the substrate support according to an execution mode described herein.
Fig. 3 B shows the profile of substrate support along hatching 3B-3B of Fig. 3 A.
Fig. 3 C shows the enlarged drawing of a part for the substrate support of Fig. 3 A.
Fig. 3 D shows the amplifier section of the substrate support of Fig. 3 A.
In order to promote understanding, similar elements symbol has been used to be appointed as the common similar elements of all figure in the conceived case.The element of an expection execution mode and feature structure can advantageously be incorporated in other execution modes without the need to describing further.
Embodiment
Execution mode described herein relates generally to the load lock chamber of high power capacity/high yield, and described load lock chamber has substrate support at described load lock chambers indoor positioning and supporting substrate.The execution mode of disclosure case that property describes as explained below can use in load lock chamber, and described load lock chamber is such as can from California, Santa Clara, the wholly-owned subsidiary AKT of company of Applied Materials buy those.But, should be understood that, the execution mode of disclosure case, in other system configuration, comprises in those system configuration of being sold by other manufacturers and also applying to some extent, no matter what need large-area substrates to pass the high yield board transport of load lock chamber is where.
Other execution mode relates to the baseplate support device for supporting large-area substrates in vacuum or load lock chamber.Described substrate support comprises and has magnet and be arranged on casing assembly wherein, and is coupled to the supporting member of described casing assembly.Magnetic posts component can be coupled to the main body of described vacuum chamber regularly.The size of described casing assembly can be designed to described post members contain in casing assembly.In operation, described casing assembly can be configured to described post component to be accommodated in casing assembly.Described casing assembly and post component can keep magnetic to couple, until provide enough power to be separated from described post component by described casing assembly.
Fig. 1 is the vertical view of an execution mode of the process system 150 being applicable to process large-area substrates (such as, having the substrate of the area of plane being greater than about 2.7 square metres).Described process system 150 generally includes transfer chamber 108, and described transfer chamber 108 is coupled to factory interface 112 by load lock chamber 100, and described load lock chamber 100 has multiple monobasal transfer chamber.Described transfer chamber 108 can comprise at least one the twayblade vacuum mechanical-arm 134 be arranged in transfer chamber 108, described twayblade vacuum mechanical-arm 134 through adjust with multiple around processing chamber 132 and load lock chamber 100 between transmit substrate.Usually, described transfer chamber 108 is maintained at vacuum state, to remove the needs adjusting the pressure between transfer chamber 108 and other processing chamber 132 individual after each substrate transmits.
Described factory interface 112 generally includes multiple substrate storage cassette 138 and twayblade atmospheric mechanical hand 136.Described box 138 is normally removably arranged in multiple septal area 140, and described septal area 140 is formed on the side of described factory interface 112.Described atmospheric mechanical hand 136 is through adjusting to transmit substrate 110 between described box 138 and described load lock chamber 100.Usually, described factory interface 112 is maintained atmospheric pressure or a little more than atmospheric pressure.
Fig. 2 is the profile of an execution mode of the multi-chamber load lock chamber 100 of Fig. 1.Described load lock chamber 100 has chamber body 212, and substrate transfer cavities that described chamber body 212 comprises multiple vertical stacking, that environmentally isolate, the vacuum-tight horizontal interior walls 214 of described multiple substrate transfer cavities is separated.Although illustrated two monobasal transfer chamber 220,222 in the execution mode described in fig. 2, but should expect that the chamber body 212 of load lock chamber 100 can comprise a monobasal transfer chamber, or the substrate transfer cavities of three or more vertical stacking.
Described substrate transfer cavities 220,222 is configured to hold large area monobasal 110 separately, to make the volume of each chamber to minimize, thus improves quick pumping and exhaust cycle.In the execution mode that Fig. 2 describes, each substrate transfer cavities 220,222 has the internal volume being equal to or less than about 1000 liters, to hold the substrate of the planar surface area with about 2.7 square metres.Should expect that the substrate transfer cavities with larger width and/or length and equal height described herein can be configured to hold even larger substrate.
Described chamber body 212 comprises the first side wall 202, second sidewall 204, the 3rd sidewall 206, bottom 208, and top 210.Although look not shown at this, relatively described 3rd sidewall 206 is provided with the 4th sidewall.Described main body 212 can be uses the rigid material being applicable to using under vacuum to make.In one embodiment, described chamber body 212 manufactures with monoblock (such as, monolithic) aluminium.Or, described chamber body 212 can be and manufactures from multiple modular part, each modular part generally comprises a part for the one of substrate transfer cavities 220,222, and described chamber body 212 can be suitable for maintaining the mode of vacuum integrity and equips, described mode is such as with the continuous welding shown in reference number 218.
The each being limited to the substrate transfer cavities 220,222 in described chamber body 212 comprises two substrate gateways.Described gateway is configured for and helps large-area substrates 110 to come in and go out load lock chamber 100.In the execution mode that Fig. 2 describes, the first substrate transfer chamber 220 being arranged on bottom 208 place of chamber body 212 comprises first substrate gateway 230 and second substrate gateway 232, and described substrate gateway 230 and 232 has the width being greater than about 2000mm.Described first substrate gateway 230 is through the first side wall 202 formation of chamber body 212, and the central authorities described first substrate transfer chamber 220 being couple to described treatment system 150 transmit chamber 108.Described second substrate gateway 232 is through the second wall 204 formation of chamber body 212, and described first substrate transfer chamber 220 is couple to described factory interface 112.In the execution mode that Fig. 2 describes, described substrate gateway 230,232 is arranged on the opposite side of chamber body 212, but described gateway 230,232 is alternately positioned in the adjacent wall of described main body 212.
Other slit valve 226, the 228 selectivity sealing of each of described substrate gateway 230,232, described slit valve 226,228 is applicable to the environmental selection of described first substrate transfer chamber 220 and transfer chamber 108 and factory interface 112 to isolate.With actuator 242 (actuator of shown in phantom in fig. 2 242 is the outsides being normally positioned at chamber body 212), described slit valve 226,228 is moved between open and closed positions.In the execution mode that Fig. 2 describes, each of slit valve 226,228 is couple to chamber body 212 pivotly along the first edge, and with actuator 242, described slit valve 226,228 is rotated between open and closed positions.
First slit valve 226 seals first substrate gateway 230 to completely cut off with the inner side of the first side wall 202, and described first slit valve 226 is positioned in described first substrate transfer chamber 220 thus, with make described first substrate transfer chamber 220 and described central authorities transmit chamber 108 vacuum environment between vacuum (such as, pressure) difference helps to load and seal described slit valve 226 against described the first side wall 202, thus enhancing vacuum tightness.Correspondingly, described second slit valve 228 is arranged on the outside of the second sidewall 204, and is located so that the pressure differential between the surrounding environment and the vacuum environment of first substrate transfer chamber 220 of factory interface 112 helps the described second substrate gateway 232 of sealing thus.
Described second substrate transfer chamber 222 is configured with gateway 238,240 and slit valve 226,228 similarly.Substrate 110 is supported on above the bottom 208 of described first substrate transfer chamber 220, and described substrate 110 is supported on multiple substrate support 244 above the inwall 214 of bordering on the bottom of second substrate transfer chamber 222.Described substrate support 244 be configuration to become with space orientation by substrate 110 with certain height stand above bottom 208 (or wall 214), to avoid described substrate contacts chamber body 212.Described substrate support 244 is the scratch and the pollution that are configured to minimize described substrate 110, and reduces the possibility producing particle in transfer chamber 220,222.Provided hereinafter the detailed description to substrate support 244 that can refer to Fig. 3 A-3C.
Fig. 3 A shows the end view of substrate support 244.Described substrate support 244 comprises casing assembly 302, post component 304, and supporting member 306.Described casing assembly 302 is configured to be separated from post component 304.Such as, the size of described casing assembly 302 and described post component 304 can be designed to relative to each other slidably translation.Should it is anticipated that any particle produced during post component 304 is inserted casing assembly 302 can maintain in described casing assembly 302, until described casing assembly 302 is separated from described post component 304.Between separation period, the particle produced during described insertion can depart from described casing assembly 302 in the place that can be pumped out described vacuum chamber.
Described casing assembly can with the various material manufactures being applicable to vacuum chamber, and described material is such as poly-diether ketone (PEEK), polytetrafluoroethylene (PTFE), or aluminium.Described post component 304 available metal material manufactures, and described metal material is such as martensitic stain less steel etc.The material for the manufacture of described post component 304 should be it is contemplated that selected to show magnetic.In addition, the material for the formation of described casing assembly 302 and described post component 304 may be selected to be the particle generation reduced because the physical contact between casing assembly 302 and post component 304 causes.
Now referring to Fig. 3 D, described casing assembly 302 is shown as has the first groove 340 and the second groove 342.As depicted, described first groove 340 and described second groove 342 illustrate with partial cross.Described first groove 340 can extend into described casing assembly 302 from the first end 334 of described casing assembly 302, and described second groove 342 can extend into described casing assembly 302 from the second end 332.Described first end 334 and described second end 332 are relative to each other arranged, and described casing assembly 302 can be bar-shaped in fact or tubulose.
Fig. 3 B shows the profile of substrate support 244 along hatching 3B-3B of Fig. 3 A.Described casing assembly 302 also comprises magnet 308 and distance piece 310.The dividing plate 316 of described casing assembly 302 is arranged between the first groove 340 and the second groove 342, so as described first groove 340 and described second groove 342 be separate and discontinuous.Described magnet 308 can be arranged on contiguous described dividing plate 316 place in described first groove 340, and can contact described dividing plate 316.Described magnet 308 can be manufacture with magnetic material (such as, neodymium), and can have the pulling force between about 1 pound and about 10 pounds, such as between about 3 pounds and about 4 pounds.
Described distance piece 310 can be arranged on contiguous described magnet 308 place in described first groove 340, and can contact described magnet 308.Described distance piece 310 can with the material manufacture being adapted at using in vacuum chamber environment, and described material is such as PEEK, PTFE, or various types of plastic cement.The Part I 352 of described supporting member 306 can be arranged in the first groove 340, and the Part II 350 of described supporting member 306 can be extended out described first groove 340.Described Part I 352 can be arranged to be adjacent to described distance piece 310, and can be couple to the threaded side wall 314 of described first groove 340 by screw thread.Or the Part I 352 of described supporting member 306 can be press-fit in the first groove 340.Described Part I 352 can be configured to contact described distance piece 310, and described distance piece 310 and described magnet 308 is positioned in the fixed position in the first groove 340.
The Part II 350 of described supporting member 306 can be arranged to the first end 334 of contiguous described casing assembly 302, and comprises supporting member 312.The first area 338 of described Part II 350 can have the diameter similar with the diameter of casing assembly 302, and first area 338 can be configured to contact described first end 334.The diameter that the second area 336 of described Part II 350 can have is greater than the diameter of described first area 338, and described second area 336 can comprise supporting member 312.As Fig. 3 B describe, described supporting member 312 can comprise roller ball or spherical strutting piece, and described support arrangement becomes contact large-area substrates.In the present embodiment, described spherical strutting piece freely can rotate on the base (not shown) of ball bearing, and described base is arranged in the second area 336 of described supporting member 306.Or described supporting member 312 can comprise pin or pad, described pin or pad are configured to contact large-area substrates.In these embodiments, pin/pad can be the spacing block being couple to supporting member 306, or described pin/pad can be incorporated to described supporting member as a whole.Described supporting member 306 available metal material (such as, aluminium or stainless steel) manufactures, and can be formed by single piece of material or more sheets.
The size of described post component 304 can be designed so that described post component 304 can be inserted in the second groove 342.Described post component 304 comprises Part I 322 and Part II 320.The diameter that described Part I 322 has can be greater than the diameter of Part II 320.The first beveled edge 326 can be formed between described Part I 322 and described Part II 320.Described first beveled edge 326 can extend to the diameter of described Part II 320 from the diameter of described Part I 322.The second beveled edge 324 can be formed between described Part II 320 and the top surface 330 of described post component 304.The top surface 330 of described post component 304 can be configured to the comes in abutment on spacer 316 when described post component 304 is arranged in described second groove 342.Should it is anticipated that when described post component 304 insert described second groove 342 completely, post component 304 can remain in described casing assembly 302 by the magnetic force produced between magnet 308 and post component 304.
Base 354 can extend from Part I 322, and the diameter had can be greater than the diameter of described Part I 322.Therefore, the second end 332 being adjacent to described casing assembly when described post component 304 inserts described second groove 342 completely can be arranged in described base 354.The threaded portion 318 of described post component 304 can extend from base 354, and the diameter had is similar to the diameter of described Part I 322.Described threaded portion 318 can have the screw thread formed in threaded portion 318, and can be configured to the bottom 208 being couple to vacuum chamber 220,222.The basal surface 356 of base 354 can through being adapted to the contact bottom 208 when threaded portion 318 inserts bottom 208 completely.
Fig. 3 C shows the enlarged drawing of base 354.Base 354 comprises chamfer surface 328, and described chamfer surface 328 extends to described Part I 322 from described basal surface 356.Described chamfer surface 328 causes the gap between the surface and the second end 332 of casing assembly 302 of bottom 208.Described gap allows the below of instrument being inserted the second end 332, so that from post component 304 separate housings assembly 302.
In operation, instrument or other suitable devices can contact described second end 332, and can apply lifting force to described casing assembly 302.Described lifting force can substantially parallel to the pulling force of magnet 308.In order to interrupt the pulling force of magnet 308, described lifting force can be greater than the pulling force of described magnet 308.Once by magnet 308 being separated enough distances from described post component 304 and reducing or eliminate the pulling force of magnet 308, casing assembly 302 just can by lifting further, until the top surface 330 of described post component 304 is no longer arranged in the second groove 342.
Execution mode described herein is provided for effectively removing substrate support from large-area substrates vacuum chamber.Should expect and utilize column substrate support, instead of supporting track etc., reduce or fluid flowing reduces during eliminating pumping operation region.The minimizing reducing the region of flowing can prevent or reduce particle gathering around substrate support.
Although foregoing is the execution mode for disclosure case, other and further execution mode of disclosure case can be designed when not departing from the base region of disclosure case, and the scope of disclosure case is determined by above claims.
Claims (19)
1., for a device for supporting substrate, described device comprises:
Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;
Post component, described post component is configured to be mounted slidably in described second groove;
Magnet, described magnet is arranged on contiguous described dividing plate in described first groove;
Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And
Supporting member, described supporting member is arranged on contiguous described distance piece in described first groove, wherein said supporting member extend described first groove at least partially.
2. device as claimed in claim 1, wherein said supporting member screw thread is couple to the described casing assembly in described first groove.
3. device as claimed in claim 1, wherein said second groove comprises the first area with the first diameter and the second area with the Second bobbin diameter being different from described first diameter.
4. device as claimed in claim 3, wherein said post component comprises the 3rd diameter and the 4th diameter, the size of described 3rd diameter is designed to relative to the translation slidably of described first area, and the size of described 4th diameter is designed to relative to the translation slidably of described second area.
5. device as claimed in claim 4, wherein said 3rd diameter and described 4th diameter are different.
6. device as claimed in claim 1, wherein said supporting member comprises ball, pin or pad, and described ball, pin or pad are configured to contact substrate.
7. device as claimed in claim 1, wherein chamfering gap is formed between the bottom of described casing assembly and a part for described post component, and when described post component fully inserts described second groove, described chamfering gap remains on described second groove outside.
8. device as claimed in claim 1, wherein said magnet comprises neodymium.
9. device as claimed in claim 8, wherein said post component comprises martensitic stain less steel.
10. device as claimed in claim 8, the pulling force of wherein said magnet is between 3 pounds to 4 pounds.
11. devices as claimed in claim 1, wherein said distance piece comprises the material being selected from the group be made up of following material: PEEK, PTFE, and aluminium.
12. devices as claimed in claim 10, wherein said distance piece comprises solid-state rod-shaped body.
13. devices as claimed in claim 10, wherein said distance piece comprises tubular body.
14. 1 kinds of substrate vacuum chamber devices, described device comprises:
Vacuum chamber body, described vacuum chamber body be dimensioned to accommodation large-area substrates; And
Substrate support, described substrate support is arranged in described vacuum chamber body, and described substrate support comprises:
Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;
Post component, described post component screw thread is couple to described vacuum chamber body and is configured to be mounted slidably in described second groove;
Magnet, described magnet is arranged on contiguous described dividing plate in described first groove;
Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And
Supporting member, described supporting member is arranged on contiguous described distance piece in described first groove, wherein
Described supporting member extend described first groove at least partially.
15. devices as claimed in claim 14, wherein said magnet comprises neodymium.
16. devices as claimed in claim 15, wherein said post component comprises martensitic stain less steel.
17. devices as claimed in claim 15, the pulling force of wherein said magnet is between 3 pounds to 4 pounds.
18. devices as claimed in claim 14, wherein arrange the substrate support between 20 and 40 in described vacuum chamber body.
19. 1 kinds of devices for supporting substrate, described device comprises:
Casing assembly, described casing assembly has the first groove and the second groove and is formed outside in shell component, described first groove and described second groove baffle for separating;
Martensitic stain less steel post component, described martensitic stain less steel post component is configured to be mounted slidably in described second groove;
Neodymium magnet, described neodymium magnet is arranged on contiguous described dividing plate in described first groove;
Distance piece, described distance piece is arranged on contiguous described magnet in described first groove; And
Supporting member, described supporting member contiguous described distance piece place screw thread in described first groove is couple to described casing assembly, wherein said supporting member extend described first groove at least partially.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462006821P | 2014-06-02 | 2014-06-02 | |
| US62/006,821 | 2014-06-02 |
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| Publication Number | Publication Date |
|---|---|
| CN204991676U true CN204991676U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520368783.9U Expired - Fee Related CN204991676U (en) | 2014-06-02 | 2015-06-01 | Device and base plate vacuum chamber device for supporting substrate |
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| CN (1) | CN204991676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648958A (en) * | 2019-09-26 | 2020-01-03 | 京东方科技集团股份有限公司 | Substrate support table and substrate preparation device |
-
2015
- 2015-06-01 CN CN201520368783.9U patent/CN204991676U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648958A (en) * | 2019-09-26 | 2020-01-03 | 京东方科技集团股份有限公司 | Substrate support table and substrate preparation device |
| CN110648958B (en) * | 2019-09-26 | 2022-04-08 | 京东方科技集团股份有限公司 | Substrate support table and substrate preparation device |
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Granted publication date: 20160120 Termination date: 20200601 |