CN204965395U - Touch panel - Google Patents
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- CN204965395U CN204965395U CN201520749142.8U CN201520749142U CN204965395U CN 204965395 U CN204965395 U CN 204965395U CN 201520749142 U CN201520749142 U CN 201520749142U CN 204965395 U CN204965395 U CN 204965395U
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Abstract
The utility model provides a touch panel, including the transparency carrier, be located on the base plate and the frame layer that forms by white or colored printing ink, obtain the BM layer by the preparation of black photoresist on surrounding the visible area that forms and be located the frame layer by the frame layer, and on the extending direction of the visible area in the middle of the frame course around from, the width on BM layer all than the 0.1 wide-3.0mm of width on frame layer. The utility model discloses the weak point that can promote touch panel's coating film performance and thoroughly the solve touch panel risk that opens circuit, the utility model discloses the thickness on white or colored printing ink frame layer can also be reduced and the new face touch panel of appearance can be provided.
Description
Technical field
The utility model belongs to electron device preparing technical field, is specifically related to a kind of contact panel.
Background technology
See Fig. 1, the frame layer 2 of monobasal formula capacitive touch screen is arranged on the surrounding of the visible area 3 of substrate 1, because the solid content particle of ink material is larger, can present on microcosmic in ink pellet surface after using the solidification of the frame layer of ink material uneven whole, this is uneven whole when causing utilizing magnetic control sputtering plating technology to carry out plated film (plating ITO layer) in subsequent step, because plated film rete is nanoscale, and ink thickness is micron order, thus film plating layer cannot fill the uneven whole place of ink completely, such meeting forms the risk causing short open circuit in the lithographic process etching process of electrode at subsequent conductive film.
Disclose the preparation method of white frame in a kind of white OGS touch screen in utility application CN201510114819.5, comprise the following steps: a) cleaning touch-screen glass plate; B) at the frame region serigraphy first white ink layer of touch-screen glass plate; C) at the upper surface serigraphy second white ink layer of the first white ink layer; D) solidify; E) cleaning touch-screen glass plate; F) painting black photoresistance; G) precuring process is carried out to black photoresistance; H) expose; I) develop, form the black light resistance layer of frame shape; J) process is cured to black light resistance layer, completes the making of white frame; Adopt untouchable coating process spray black photoresistance, and form the black light resistance layer being positioned at the superiors eventually through exposure imaging, avoid impurity to be brought in product; Black photoresistance is not substantially exitted under high temperature plated film, greatly improves plated film film quality; In addition, black light antiplastering degree is low, can improve the smooth finish of product surface; Inkjet prints energy selective dump black photoresistance, saves production cost.In brief, above-mentioned patented claim is the black light resistance layer forming one deck and white frame ink layer commensurateiy wide at the coated thereon of frame layer, for the out-of-flatness problem that solution silk-screen black ink layer brings.
On white frame, form black light resistance layer to solve the out-of-flatness problem of ink for screen printing although relate in above-mentioned patented claim, the program is only reduction of the probability causing the short-and-medium open circuit risk of subsequent process, and cannot avoid this problem completely.
Utility model content
Present inventor finds in R&D process, although the contact panel that such scheme is formed can reduce the short-and-medium open circuit risk of subsequent manufacturing steps to a certain extent, still cannot avoid this risk completely.Thus, the structure of inventor to this contact panel is further furtherd investigate, and pinpointing the problems may be on the vertical side that the frame layer that still can adjoin with white ink frame layer is close with visible area.Therefore, inventor of the present utility model specially arranges a kind of BM layer larger than the width of white ink frame layer, to cover upper surface and the side of white ink frame layer completely.
Therefore, the utility model provides a kind of contact panel, comprise transparency carrier, be positioned on substrate and the frame layer formed by white or colored ink, surrounded the visible area that formed by frame layer and be positioned at frame layer prepares BM layer by black photoresist, and at the frame layer from surrounding on the bearing of trend of the visible area of centre, all wide than the width of the described frame layer 0.1 ~ 3.0mm of width of described BM layer.
In a kind of concrete embodiment, insulation impedance>=10 of described black photoresist
12Ω, and described photoresist is one or more in polymethylmethacrylate, phenolics and polysilane.
In a kind of concrete embodiment, the thickness of described frame layer 2 is 12 ~ 40 μm, and be preferably 15 ~ 25 μm, the thickness of described BM layer 4 is 0.8 ~ 3 μm, is preferably 1.5 ~ 2.5 μm.
In a kind of concrete embodiment, from the frame layer of surrounding to the bearing of trend of the visible area of centre, all wide than the width of the described frame layer 0.2 ~ 1.5mm of width of described BM layer.Preferably, at the frame layer from surrounding on the bearing of trend of the visible area of centre, all wide than the width of the described frame layer 0.4 ~ 1.0mm of width of described BM layer.
In a kind of concrete embodiment, described contact panel also comprises the conducting film wiring layer 5 be positioned on BM layer 4 and the conducting film trace layer 6 be positioned on conducting film wiring layer 5.
In a kind of concrete embodiment, described conducting film wiring layer 5 is integrally formed at rim area and the visible area of contact panel, and described conducting film wiring layer 5 comprises ITO1 layer, OC1 layer and ITO2 layer successively at thickness direction from being close to BM layer 4, wherein ITO1 layer and ITO2 layer are conductive layer, and OC1 layer is insulation course.
In a kind of concrete embodiment, described conducting film trace layer 6 is metallic circuit layer and it is positioned at the rim area of contact panel.
In a kind of concrete embodiment, also comprise the OC2 layer for conducting film trace layer 6 and conducting film wiring layer 5 described in covering protection in described contact panel, described OC2 layer is integrally formed at rim area and the visible area of contact panel, and is insulating protective layer.
The utility model is the corresponding preparation method providing a kind of contact panel described above also, comprise white that first silk-screen is two-layer or more on the glass substrate or colored ink forms frame layer 2, then on frame layer 2 painting black photoresist adopt photoetching micro-shadow technology to form described BM layer 4.
In a kind of concrete embodiment, described method also comprises and on BM layer 4, directly arranges conducting film wiring layer 5 and conducting film trace layer 6 by magnetic control sputtering plating technology and the micro-shadow technology of photoetching.In a kind of concrete embodiment, form the coating of described BM layer 4 and photoetching micro-shadow technology and specifically comprise coating, pre-baked, exposure, development, solid roasting and high heat baking step.
Particularly, the utility model provides a kind of method adopting BM (BlackMatrix black matrix") layer to prepare touch screen, comprises a, on plain glass substrate, utilizes the white ink that half tone silk-screen technology silk-screen gross thickness is δ 1 to form frame pattern; B, employing clearance type coating technique white ink layer are coated with the BM coating that a layer thickness is δ 2 in step a; C, the micro-shadow technology of employing photoetching, be portrayed as the frame pattern of the protective cover sheet of setting, the frame large 0.1 ~ 3.0mm more monolateral than the white ink frame formed in step a that BM is formed by the BM coating in step b; D, on the glass substrate of completing steps c, magnetic control sputtering plating technology and the micro-shadow technology of photoetching is utilized to complete touch-control sensor structure (touch-control sensor structure is divided into ITO1 layer, OC1 layer, ITO2 layer, metallic circuit layer and OC2 layer).
The technical scheme that the utility model provides is except promoting the coating performance also thorough problem solving above-mentioned short open circuit risk of contact panel.The utility model at least can also bring following several benefit.
1) in the utility model, the use of BM layer can make the thickness of the frame layer that white or colored ink are formed in the utility model less, such as, be reduced to 15 ~ 25 μm by 25 ~ 40 μm, even at 15 ~ 20 μm; Thickness because of BM layer is inevitable within 3 μm, but this makes to provide the overall thinner control panel meeting OD value needs completely of a kind of frame layer in the utility model, and the scheme that the utility model provides makes the optical characteristics of control panel be improved.
Particularly, frame layer of the prior art is mostly pure white or color border layer, because white and optical density (OD) OD (OpticalDensity) value of colored ink are at about 0.5-2.0; Optical density (OD) OD value is lower, white or color border layer printing opacity larger; And the optical characteristics of OD >=4 of product frame layer will be reached, then whole white and color border layer thickness must up to the thickness of 25-40 μm.For solving white and the too small easy printing opacity problem of colored ink optical density (OD) OD value; first above frame layer 2 and visible area 3, the BM layer 4 that one deck black photosensitive material shaped material forms whole protection is coated with in the utility model; to fill out burnishing surface region; again by the micro-shadow technology of photoetching, BM layer is portrayed as the frame pattern of the protective cover sheet of setting.
2) the utility model provides the control panel (as shown in Figure 5 a) being close to a narrow limit dark border layer inside a kind of white or colored Wide frame layer, this is obviously different from pure white of the prior art or colored Wide frame layer control panel, for provides the art a kind of more attractive in appearance and control panel of practicality.
3) described contact panel also comprises when being integrally formed at conducting film wiring layer 5 on BM layer 4 and conducting film trace layer 6, and described contact panel is monobasal contact panel, and this can give as user bring lighter and thinner experience.
Accompanying drawing explanation
Fig. 1 is the thickness direction schematic diagram that prior art comprises the contact panel substrate of frame layer,
Fig. 2 is the front schematic view that prior art comprises the contact panel substrate of frame layer,
Fig. 3 is structural representation when being coated with BM layer in the utility model and not developing,
Fig. 4 is the thickness direction structural representation of a kind of contact panel product in the utility model,
Fig. 5 is the schematic diagram of the front and back of product in Fig. 4, and wherein a is front, and b is the back side,
Fig. 6 is the thickness direction structural representation of a kind of contact panel product containing touch-control structure in the utility model.
Wherein, 1, substrate, 2, frame layer, 3, visible area, 4, BM layer, 5, conducting film wiring layer, 6, conducting film trace layer.
Embodiment
Below in conjunction with accompanying drawing, further describe embodiment of the present utility model.
A kind of contact panel is provided in Fig. 4 and Fig. 5 of the present utility model, comprise transparency carrier 1, be positioned on substrate 1 and the frame layer 2 formed by white or colored ink, surrounded the visible area 3 that formed by frame layer and be positioned at frame layer 2 prepares BM layer 4 by black photoresist, and at the frame layer 2 from surrounding on the bearing of trend of the visible area 3 of centre, all wide than the width of the described frame layer 2 0.1 ~ 3.0mm of width of described BM layer 4.
In the utility model, the ink that described white or colored ink refer to certain region on substrate is white or colored, is namely homogeneous white or colour in the color of the thickness direction curing ink of ink layer.It will be appreciated by those skilled in the art that ground, the ink of whole frame layer can comprise white and colour simultaneously, and the upper of such as frame layer is white below, and limit, left and right is red.Those skilled in the art can understand ground, in contact panel of the present utility model, with in the plane of substrate-parallel, the periphery of the width of described frame layer 2 is concordant with the periphery of the width of described BM layer 4, and the inner side of the width of BM layer 4 is all wider than the inner side of the width of frame layer 2.
The situation of to be substrate the be rectangular slab shown in the utility model Fig. 5, above the frame layer on its four limit, wider all than described frame layer 2 of the width of described BM layer 4.Those skilled in the art can understand ground, and described substrate can be circular or other shape, and frame layer now and BM layer can be circular or other shape equally, and the width of BM layer is now also all wider than described frame layer towards side, center.
Generally directly touch-control sensor structure can not be completed on frame layer 2 by magnetic control sputtering plating technology and the micro-shadow technology of photoetching in prior art, but the touch-control structure containing conducting film wiring layer 5, conducting film trace layer 6 and second substrate is fastened on frame layer 2, interfix and form the contact panel being with touch controllable function.Similarly, also the touch-control structure containing conducting film wiring layer 5, conducting film trace layer 6 and second substrate can be fastened on BM layer 4 in the utility model.Altogether containing two plate bases in such contact panel, thus the reliability of this contact panel is higher, but product is thicker.In another kind of mode, the utility model directly can arrange conducting film wiring layer 5 and conducting film trace layer 6 on BM layer 4, in this fashion, because flatness is micron-sized frame layer 2 is that nano level BM layer 4 is coarse than flatness, when thus the width of BM layer 4 being arranged wider than the width of frame layer 2, namely frame layer covers and conducting film wiring layer 5 also can not contact with coarse frame layer 2 in the side of visible area by BM layer completely, and experiment finds obvious like this yield and the reliability being beneficial to contact panel.A kind ofly directly be arranged in the mode on BM layer 4 by conducting film wiring layer 5 and conducting film trace layer 6 rear, altogether containing a plate base in such contact panel, thus this contact panel is thinner, and Consumer's Experience is better.In the utility model, described BM layer width is set to can also bring another benefit than the wide 0.1 ~ 3.0mm of the width of frame layer 2, it can make to contain black surround effect around the visible area of final contact panel, as the BM layer 4 in Fig. 5 a demonstrates black surround effect in product front, such product is more attractive in appearance, can be subject to liking of user.
In the utility model, insulation impedance>=10 of described black photoresist
12Ω, such BM layer makes it possible to be wholely set the touch-control structure such as conducting film wiring layer 5 and conducting film trace layer 6 thereon easily.
The thickness of described frame layer is preferably 15 ~ 25 μm, and the thickness of described BM layer is preferably 1.5 ~ 2.5 μm.Those skilled in the art understand ground, and the silk-screen number of plies of silk-screen frame layer is generally more than 2 layers, and the thickness of every layer is such as 6 ~ 9 μm.Coating BM layer cross thin may cause cover bad, be coated with blocked up, may cause ill-exposed.The utility model, by arranging certain thickness BM layer, makes the white of silk-screen or color border layer can accomplish thinner compared to existing technology, and the OD value of the rim area of the contact panel so formed can meet the requirement being more than or equal to 4.
As shown in Figure 6, contact panel described in the utility model also comprises the conducting film wiring layer 5 be positioned on BM layer 4 and the conducting film trace layer 6 be positioned on conducting film wiring layer 5.Particularly, described conducting film wiring layer 5 is integrally formed at rim area and the visible area of contact panel, and described conducting film wiring layer 5 comprises ITO1 layer, OC1 layer and ITO2 layer successively at thickness direction from being close to BM layer 4, wherein ITO1 layer and ITO2 layer are conductive layer, and OC1 layer is insulation course.Described conducting film trace layer 6 is metallic circuit layer and it is positioned at the rim area of contact panel; the OC2 layer for conducting film trace layer 6 and conducting film wiring layer 5 described in covering protection is also comprised in described contact panel; described OC2 layer is integrally formed at rim area and the visible area of contact panel, and is insulating protective layer.
A kind of preparation method of contact panel described above, comprise white that first silk-screen is two-layer or more on the glass substrate or colored ink forms frame layer 2 (as depicted in figs. 1 and 2), then on frame layer 2 painting black photoresist (as shown in Figure 3) adopt photoetching micro-shadow technology to form described BM layer 4.
In the utility model, described coating is such as clearance type coating, adopts coating machine to be coated with.Micron-sized ink material compared by photoresist in the utility model, and it is evenly fine and smooth, can reach nanoscale flatness like a cork.Described white or colored ink are such as photoresist well known to those skilled in the art.In the utility model, the character of described BM layer determines that it needs to use the mode of coating to be attached on frame layer, and silk-screen or alternate manner can not be adopted to complete.Described coating is formed in the process of BM layer, comprises and first uses coating machine on frame layer, be coated with the photoresist of one deck exact thickness, re-use the light shield of specific pattern, and make to be left by the position of illumination, the position be not irradiated by light is developed.Also can take contrary mode, be namely finally developed by the position of illumination, and the position be blocked leave formation target pattern.Particularly, the coating technique related in the utility model and photoetching micro-shadow technology all can use mode well known in the prior art.
In a kind of concrete embodiment, described method also comprises and on BM layer 4, directly arranges conducting film wiring layer 5 and conducting film trace layer 6 by magnetic control sputtering plating technology and the micro-shadow technology of photoetching.Particularly, form the coating of described BM layer 4 and photoetching micro-shadow technology and comprise coating, pre-baked, exposure, development, solid roasting and high heat baking step.
Particularly, described method comprises the steps:
Step one, utilize half tone silk-screen technology to use on plain glass substrate as depicted in figs. 1 and 2 white ink collocation half tone tension force is 20-26N, emulsion thickness 6-10 μm, order number are 140T screen painting, obtained ink total film thickness at 10-25 μm, optical density (OD) OD value >=2, adhesion grade are the window border of 5B.
Step 2, as shown in Fig. 3 ~ Fig. 5, clearance type coating technique is adopted in step one, viscosity to be by plain glass substrate 2.6CPS, insulation impedance > 10
12the BM black photoresist of Ω through coating, pre-baked, exposure, development, solid roasting, frame that high-temperature baking forms setting, the frame that BM is formed large 0.1-3.0mm more monolateral than the white ink frame formed in step one; BM frame covers white ink frame completely.Adhesion grade is the thickness of 5, BM coating is 1.0-2.0 μm.
Step 3, (touch-control sensor structure is divided into ITO1 layer, OC1 layer, ITO2 layer on the glass substrate of completing steps two, to utilize magnetic control sputtering plating technology and the micro-shadow technology of photoetching to complete touch-control sensor structure as shown in Figure 6, metallic circuit layer and OC2 layer) foundation, formed OGS.Also substrate step 2 can produced is as protective cover sheet, and extra increase external hanging type touch-control sensor (touch-control sensor containing conducting film wiring layer 5, conducting film trace layer 6 and second substrate), laminating assembling forms touch-screen with it.
The utility model arranges one deck BM protective seam with side coating on ink frame layer; covered the design of ink frame layer with BM protective seam by the application; can, former sags and crests planarization, make to cause causing in lithographic process etching process below the risk of short open circuit because ink pellet surface sags and crests affects coating effects when adopting magnetic control sputtering plating technology to carry out plated film.
And, in the utility model, the BM frame protective seam be on ink frame layer adopts the photosensitive material of black, the optical density (OD) OD value ratio of black-colored photosensitive material is white and colored ink is higher, the thickness of BM frame protective seam can reach the optical characteristics of OD=4 between 0.8 μm-3 μm, and the optical density (OD) OD value of white ink is very low, reach the optical characteristics of OD=4, then whole frame layer thickness must up to 25-40 μm, adopt BM frame layer can reduce the print thickness of white and colored ink while keeping product optical density (OD) OD value in standard specification.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (8)
1. a contact panel, comprise transparency carrier (1), be positioned at the upper and frame layer (2) that is that formed by white or colored ink of substrate (1), surrounded the visible area (3) that formed by frame layer and be positioned at frame layer (2) prepares BM layer (4) by black photoresist, and at the frame layer (2) from surrounding on the bearing of trend of the visible area (3) of centre, all wide than the width of described frame layer (2) 0.1 ~ 3.0mm of width of described BM layer (4).
2. contact panel according to claim 1, is characterized in that, insulation impedance>=10 of described black photoresist
12Ω, and described photoresist is one or more in polymethylmethacrylate, phenolics and polysilane.
3. contact panel according to claim 1, it is characterized in that, at the frame layer (2) from surrounding on the bearing of trend of the visible area (3) of centre, all wide than the width of described frame layer (2) 0.2 ~ 1.5mm of width of described BM layer (4).
4. contact panel according to claim 3, it is characterized in that, at the frame layer (2) from surrounding on the bearing of trend of the visible area (3) of centre, all wide than the width of described frame layer (2) 0.4 ~ 1.0mm of width of described BM layer (4).
5. according to contact panel described in any one in Claims 1 to 4, it is characterized in that, described contact panel also comprises the conducting film wiring layer (5) be positioned on BM layer (4) and the conducting film trace layer (6) be positioned on conducting film wiring layer (5).
6. contact panel according to claim 5, it is characterized in that, described conducting film wiring layer (5) is integrally formed at rim area and the visible area of contact panel, and described conducting film wiring layer (5) comprises ITO1 layer, OC1 layer and ITO2 layer successively at thickness direction from being close to BM layer (4), wherein ITO1 layer and ITO2 layer are conductive layer, and OC1 layer is insulation course.
7. contact panel according to claim 6, it is characterized in that, described conducting film trace layer (6) is for metallic circuit layer and it is positioned at the rim area of contact panel.
8. contact panel according to claim 7; it is characterized in that; the OC2 layer for conducting film trace layer (6) and conducting film wiring layer (5) described in covering protection is also comprised in described contact panel; described OC2 layer is integrally formed at rim area and the visible area of contact panel, and is insulating protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749142.8U CN204965395U (en) | 2015-09-24 | 2015-09-24 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749142.8U CN204965395U (en) | 2015-09-24 | 2015-09-24 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN204965395U true CN204965395U (en) | 2016-01-13 |
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ID=55060447
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|---|---|---|---|
| CN201520749142.8U Active CN204965395U (en) | 2015-09-24 | 2015-09-24 | Touch panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106739588A (en) * | 2016-12-12 | 2017-05-31 | 晟光科技股份有限公司 | A kind of white OGS solves the screen printing method on VA areas black surround size side |
| CN108664159A (en) * | 2017-03-31 | 2018-10-16 | 蓝思科技（长沙）有限公司 | Flexible touch-control panel and preparation method thereof and touch control device |
-
2015
- 2015-09-24 CN CN201520749142.8U patent/CN204965395U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106739588A (en) * | 2016-12-12 | 2017-05-31 | 晟光科技股份有限公司 | A kind of white OGS solves the screen printing method on VA areas black surround size side |
| CN108664159A (en) * | 2017-03-31 | 2018-10-16 | 蓝思科技（长沙）有限公司 | Flexible touch-control panel and preparation method thereof and touch control device |
| CN108664159B (en) * | 2017-03-31 | 2021-06-04 | 蓝思科技（长沙）有限公司 | Flexible touch panel, preparation method thereof and touch equipment |
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