CN204925070U - Packaged type gas sensor - Google Patents
Packaged type gas sensor Download PDFInfo
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- CN204925070U CN204925070U CN201520604763.7U CN201520604763U CN204925070U CN 204925070 U CN204925070 U CN 204925070U CN 201520604763 U CN201520604763 U CN 201520604763U CN 204925070 U CN204925070 U CN 204925070U
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Abstract
The utility model provides a packaged type gas sensor which constitutes as follows: sensing element (1), shell, circuit board (4), pin (6), wherein: the constitution of sensing element (1) as follows: polymer part (11), metallization superficial layer upper surface (12), metallization superficial layer lower surface (13), wherein: fixed setting is fixed as an organic whole the upper and lower surface and the three of polymer part (11) respectively for the latter two, the top layer apron of shell forms the electrical contact with the metallization superficial layer upper surface (12) of sensing element (1), and metallization superficial layer lower surface (13) is connected with pin (6) constitution electricity on the circuit board (4). The utility model discloses process operation is simple in the encapsulation, can encapsulate in batches, and packaged type efficiency is higher, avoided the in -process temperature to cause performance to sensing element, more the accessible circuit changes and once only realizes the sophisticated functions.
Description
Technical field
The utility model relates to structural design and the applied technical field of gas sensor, specifically provides a kind of packaged type gas sensor.
Background technology
Gas sensor refers to the device or device that certain tested gas and concentration thereof in environment are converted to and become certain connection-related electricity use signal to export with it, electric signal according to exporting can obtain and the tested gas information that existence is relevant in the environment, electric signal entered process, thus can detect, monitor and report to the police tested gas; More can be formed by interface and computing machine and automatically detect, control and warning system.Gas sensor packing forms has usually: TO base packing forms, plastic cylinder type packing forms etc.
Although TO base packing forms structure is simple, overall use metal material, and the mode that electrode is connected with pin, the encapsulation of shell all will adopt welding, cost is higher; And plastic cylinder shaped material cost is low, but inside configuration is complicated, and electrode and pin connect same needs and weld.These packaged types determine that every sensor all will encapsulate separately, even if use automation equipment in some processes process, production efficiency is also very low.It is the product of component level after more having sensor package, and follow-up use also will install circuit additional, can not provide the total solution exported from gasmetry to standard electric signal, therefore topmost technical matters to be solved is: people expect to obtain the product of a kind of technology is simpler and easy, efficiency is higher encapsulation gas sensor method and correspondence: packaged type gas sensor.
In prior art: the packaged type inside of other packaged types as TO base, plastic cylinder type is connected with external terminal by wire electrode, complete together with this electrical connection needs use wire electrode spots weld with external terminal by spot welder.The utility model does not need to use spot welder to carry out spot welding, and by using prefabricated component, carry out simple mechanical pretension squeeze flow when assembling, this mode more once can complete the encapsulation of multiple sensor, instead of single operation.
This packaged type, betal can use the materials such as stainless steel, the size of top blind flange is determined according to the size of sensor, the size of top blind flange and sensing element upper surface contact portion is determined according to the area of sensing element upper surface, the gap of an overbending direction is set at betal can top blind flange bending part, convenient bending.Bending process uses mechanical arm by top blind flange bending lid on sensing element, and make betal can and sensing element upper surface complete electrical contact, after bending, top blind flange keeps horizontality.
The utility model bending top blind flange is last procedure of encapsulation, pick-up unit can be connected on circuit boards, once complete electrical connection in the process of bending betal can top blind flange, can detect the performance of sensor in real time, encapsulation and detection once complete.Other packaged types complete after electrode is connected with external terminal also needs installation miscellaneous part just can be assembled into complete sensor, thus realizes the function of sensor, at this moment could detect for each sensor again.
Described packaged type gas sensor, is characterized in that:
Near being also provided with for filling gap and form one of following several structure of electrical connection therebetween between the top layer cover plate of shell and metalized surface layer upper surface 12 of metalized surface layer upper surface 12 side: sponge like polymer, gasket construction, spring; It is specially and can be used for guaranteeing the structure that continuous extrusion upper and lower surface and sensitive material form electricity and be connected.
Can the top blind flange of shell have stretch out basis from elasticity of flexure structure to inner chamber on re-use the electric connection structures such as sponge like polymer, gasket construction, spring; Also can not the top blind flange of shell have stretch out basis from elasticity of flexure structure to inner chamber on directly inside conventional ophthalmic top blind flange, use the electric connection structures such as sponge like polymer, gasket construction, spring to be combined into corresponding functional module.
Described packaged type gas sensor, it is characterized in that: the metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13 are particular by plating, and the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C obtain.
The technical solution adopted in the utility model: the gas sensor sensing element be made up of polymer elements, metalized surface layer upper surface and lower surface is fixed in the cavity that betal can or metal pipe cap and circuit board form by the mode of mechanical connection, the electric signal that sensing element produces when measuring tested gas is by outputting on circuit board with the pin of its electrical connection, and the electric signal processing circuit on circuit board completes Electric signal processing;
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap, sensing element is fixed in cavity, between use the structure in sustainable squeeze flow face to ensure sensing element and external circuit complete electrical connection.
The utility model beneficial effect is compared with prior art: encapsulation process is simple to operate, can encapsulate in batches, compares independent packaged type efficiency higher; Owing to using circuit board in encapsulation process, according to target requirement, sensing element can be encapsulated after first Reflow Soldering Electric signal processing element, avoids temperature in process and performance impact is caused to sensing element, more realize Premium Features by circuit variation is disposable.
Utility model content
The purpose of this utility model is to provide the excellent packaged type gas sensor of a kind of technique effect.Its technical matters mainly solved is: make that correlation technique is simpler and easy, that encapsulation process manufactures efficiency is higher.
The utility model provides a kind of packaged type gas sensor, it is characterized in that: it is constructed as follows: sensing element 1, shell, circuit board 4, pin 6; Wherein: shell is the cylinder structure of one end open; Sensing element 1 is encapsulated in its internal cavities by shell; Circuit board 4 is that shell inner cavity is contained into a closed chamber in shell aperture place with shell wall by the structural arrangement of one end open end jointly as shutoff shell;
In described packaged type gas sensor, being constructed as follows of sensing element 1: polymer elements 11, metalized surface layer upper surface 12, metalized surface layer lower surface 13; Wherein: the latter two are fixedly installed on the upper and lower surface of polymer elements 11 respectively and three is fixed as one;
A part for pin 6 is arranged in the inside of shell and is connected with metalized surface layer lower surface 13 and circuit board 4, and another part of pin 6 reaches the exterior thereto that circuit board 4 is wrapped with shell;
The top layer cover plate of shell near metalized surface layer upper surface 12 side and the metalized surface layer upper surface 12 of sensing element 1 form electrical contact.
Described packaged type gas sensor, is characterized in that:
Shell is specially betal can 3 or metal pipe cap 5; Wherein:
The top blind flange of shell stretches out elasticity of flexure structure to inner chamber, and it forms electrical contact with the metalized surface layer upper surface 12 that elastically-deformable mode and sensing element 1 occur that suffer oppression; The top blind flange of betal can 3 is integral structure with the elasticity of flexure structure of stretching out to inner chamber.
Accompanying drawing explanation
Below in conjunction with drawings and the embodiments, the utility model is described in further detail:
Fig. 1 is the board structure of circuit figure using betal can packing forms;
Fig. 2 is the gas sensor configuration figure using betal can encapsulation;
Fig. 3 is the board structure of circuit figure using metal pipe cap packing forms;
Fig. 4 is the gas sensor configuration figure using metal pipe cap encapsulation.
Embodiment
Reference numeral and accompanying drawing related description: sensing element 1, spring structure 2, betal can 3, circuit board 4, metal pipe cap 5, pin 6, Electric signal processing element 7; Polymer elements 11, metalized surface layer upper surface 12, metalized surface layer lower surface 13; Top blind flange 31.
Note: " spring " in spring structure 2 and " near being also provided with for filling gap therebetween and forming one of following several structure of electrical connection between the top layer cover plate of shell and metalized surface layer upper surface 12 of metalized surface layer upper surface 12 side: sponge like polymer, gasket construction, spring " is not same structure.
Embodiment 1
A kind of packaged type gas sensor, it is constructed as follows: sensing element 1, shell, circuit board 4, pin 6; Wherein: sensing element 1, circuit board 4 are all encapsulated in its internal cavities by shell; A part for pin 6 is arranged in the inside of shell and is connected with circuit board 4, and another part of pin 6 reaches the outside of shell, and sensing element 1 is connected with circuit board 4;
In described packaged type gas sensor, being constructed as follows of sensing element 1: polymer elements 11, metalized surface layer upper surface 12, metalized surface layer lower surface 13; Wherein: the latter two are fixedly installed on the upper and lower surface of polymer elements 11 respectively and three is fixed as one;
The top layer cover plate of shell and the metalized surface layer upper surface 12 of sensing element 1 form electrical contact, and metalized surface layer lower surface 13 forms with the pin 6 on circuit board 4 and be electrically connected.
Shell is specially betal can 3 or metal pipe cap 5; Wherein: the top blind flange specifically flexural spring structure of betal can 3, it forms electrical contact with the metalized surface layer upper surface 12 that elastically-deformable mode and sensing element 1 occur that suffer oppression;
As the betal can 3 of shell or top layer cover plate specifically one of following several structure of metal pipe cap 5: sponge like polymer, gasket construction, filament structure; It is specially and can be used for guaranteeing the structure that continuous extrusion upper and lower surface and sensitive material form electricity and be connected.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13 particular by plating, the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C and other metal or alloy be obtained.
The technical scheme that the present embodiment adopts: gas sensor sensing element be made up of polymer elements, metalized surface layer upper surface and lower surface is fixed in the cavity that betal can or metal pipe cap and circuit board form by the mode be mechanically connected, the electric signal that sensing element produces when measuring tested gas is by outputting on circuit board with the pin of its electrical connection, and the electric signal processing circuit on circuit board completes Electric signal processing;
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap, sensing element is fixed in cavity, between use the structure in sustainable squeeze flow face to ensure sensing element and external circuit complete electrical connection.
The present embodiment beneficial effect is compared with prior art: encapsulation process is simple to operate, can encapsulate in batches, compares independent packaged type efficiency higher; Owing to using circuit board in encapsulation process, according to target requirement, sensing element can be encapsulated after first Reflow Soldering Electric signal processing element, avoids temperature in process and performance impact is caused to sensing element, more realize Premium Features by circuit variation is disposable.
Embodiment 2
A kind of packaged type gas sensor, it is constructed as follows: sensing element 1, shell, circuit board 4, pin 6; Wherein: shell is the cylinder structure of one end open; Sensing element 1 is encapsulated in its internal cavities by shell; Circuit board 4 is that shell inner cavity is contained into a closed chamber in shell aperture place with shell wall by the structural arrangement of one end open end jointly as shutoff shell;
In described packaged type gas sensor, being constructed as follows of sensing element 1: polymer elements 11, metalized surface layer upper surface 12, metalized surface layer lower surface 13; Wherein: the latter two are fixedly installed on the upper and lower surface of polymer elements 11 respectively and three is fixed as one;
A part for pin 6 is arranged in the inside of shell and is connected with metalized surface layer lower surface 13 and circuit board 4, and another part of pin 6 reaches the exterior thereto that circuit board 4 is wrapped with shell;
The top layer cover plate of shell near metalized surface layer upper surface 12 side and the metalized surface layer upper surface 12 of sensing element 1 form electrical contact.
Shell is specially betal can 3 or metal pipe cap 5; Wherein: the top blind flange of shell stretches out elasticity of flexure structure to inner chamber, it forms electrical contact with the metalized surface layer upper surface 12 that elastically-deformable mode and sensing element 1 occur that suffer oppression; The top blind flange of betal can 3 is integral structure with the elasticity of flexure structure of stretching out to inner chamber.
Near being also provided with for filling gap and form one of following several structure of electrical connection therebetween between the top layer cover plate of shell and metalized surface layer upper surface 12 of metalized surface layer upper surface 12 side: sponge like polymer, gasket construction, spring; It is specially and can be used for guaranteeing the structure that continuous extrusion upper and lower surface and sensitive material form electricity and be connected.Have in the top blind flange of shell and the basis of stretching out elasticity of flexure structure to inner chamber re-uses the electric connection structures such as sponge like polymer, gasket construction, spring be combined into corresponding functional module.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13 are particular by plating, and the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C obtain.
The technical scheme that the present embodiment adopts: gas sensor sensing element be made up of polymer elements, metalized surface layer upper surface and lower surface is fixed in the cavity that betal can or metal pipe cap and circuit board form by the mode be mechanically connected, the electric signal that sensing element produces when measuring tested gas is by outputting on circuit board with the pin of its electrical connection, and the electric signal processing circuit on circuit board completes Electric signal processing;
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap, sensing element is fixed in cavity, between use the structure in sustainable squeeze flow face to ensure sensing element and external circuit complete electrical connection.
The present embodiment beneficial effect is compared with prior art: encapsulation process is simple to operate, can encapsulate in batches, compares independent packaged type efficiency higher; Owing to using circuit board in encapsulation process, according to target requirement, sensing element can be encapsulated after first Reflow Soldering Electric signal processing element, avoids temperature in process and performance impact is caused to sensing element, more realize Premium Features by circuit variation is disposable.
Embodiment 3
A kind of packaged type gas sensor, it is constructed as follows: sensing element 1, shell, circuit board 4, pin 6; Wherein: shell is the cylinder structure of one end open; Sensing element 1 is encapsulated in its internal cavities by shell; Circuit board 4 is that shell inner cavity is contained into a closed chamber in shell aperture place with shell wall by the structural arrangement of one end open end jointly as shutoff shell;
In described packaged type gas sensor, being constructed as follows of sensing element 1: polymer elements 11, metalized surface layer upper surface 12, metalized surface layer lower surface 13; Wherein: the latter two are fixedly installed on the upper and lower surface of polymer elements 11 respectively and three is fixed as one;
A part for pin 6 is arranged in the inside of shell and is connected with metalized surface layer lower surface 13 and circuit board 4, and another part of pin 6 reaches the exterior thereto that circuit board 4 is wrapped with shell;
The top layer cover plate of shell near metalized surface layer upper surface 12 side and the metalized surface layer upper surface 12 of sensing element 1 form electrical contact.
In described packaged type gas sensor, near being also provided with for filling gap and form one of following several structure of electrical connection therebetween between the top layer cover plate of shell and metalized surface layer upper surface 12 of metalized surface layer upper surface 12 side: sponge like polymer, gasket construction, spring; It is specially and can be used for guaranteeing the structure that continuous extrusion upper and lower surface and sensitive material form electricity and be connected.That is: directly inside conventional ophthalmic top blind flange, the electric connection structures such as sponge like polymer, gasket construction, spring are used to be combined into corresponding functional module.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13 are particular by plating, and the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C obtain.
Embodiment 4
Gas sensor comprises the cavity that betal can 3 or metal pipe cap 5 form with circuit board 4, and inside cavity is equipped with sensing element 1, the pin 6 that circuit board 4 is electrically connected with sensing element 1 and sensing element 1 is outputed signal to the Electric signal processing element 7 processed.
Wherein sensing element 1 is made up of polymer elements 11, metalized surface layer upper surface 12 and metalized surface layer lower surface 13.
Embodiment 1,4 packaging technology is realized by following steps:
1, if Fig. 1 is by betal can 3, pin 6, Electric signal processing element 7 reflow soldering and circuit board 4 correspondence position;
2, as sensing element 1 is put into betal can 3 cavity by Fig. 1 respectively, corresponding sensing element 1 metalized surface layer lower surface 13 is electrically connected with pin 6;
3, as Fig. 2 folds each betal can 3 top blind flange 31, it is made to be electrically connected with corresponding sensing element 1 metalized surface layer upper surface 12;
4, mark also calibration sensor.
Embodiment 5
Packaging technology difference from Example 4 is: be first placed on the correspondence position of circuit board 4 by pin 6, Electric signal processing element 7 simultaneously, reflow soldering is fixed, then sensing element 1 metal pipe cap 5 is encapsulated on circuit board 4, and ensureing that corresponding sensing element 1 metalized surface layer upper surface 12 is electrically connected with metal pipe cap 5, metalized surface layer lower surface 13 is electrically connected with pin 6 simultaneously.
In embodiment 5, the top blind flange 31 of betal can 3 is flexural spring structure, and it is pressed on sensing element 1 metalized surface layer upper surface 12 and forms electrical connection.
In embodiment 2,3,4,5, betal can 3 or metal pipe cap 5 and sensing element 1 metalized surface layer upper surface 12 syndeton are to be used for guaranteeing that continuous extrusion betal can 3 or metal pipe cap 5 keep with sensing element 1 metalized surface layer upper surface 12 structure that is electrically connected, are following one of several: sponge like polymer, gasket construction, filament structure, spring structure.
In embodiment 2,3, the metalized surface layer upper surface 12 of sensing element 1 and metalized surface layer lower surface 13 are particular by plating, and the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C and other metal or alloy are obtained.
Above-described embodiment, just preferred embodiment of the present utility model, is not used for limiting practical range of the present utility model, therefore all with the equivalence of content described in the utility model claim change, all should be included in right of the present utility model.
Claims (3)
1. a packaged type gas sensor, is characterized in that: it is constructed as follows: sensing element (1), shell, circuit board (4), pin (6); Wherein: shell is the cylinder structure of one end open; Sensing element (1) is encapsulated in its internal cavities by shell; Circuit board (4) is that shell inner cavity is contained into a closed chamber in shell aperture place with shell wall by the structural arrangement of one end open end jointly as shutoff shell;
In described packaged type gas sensor, being constructed as follows of sensing element (1): polymer elements (11), metalized surface layer upper surface (12), metalized surface layer lower surface (13); Wherein: the latter two are fixedly installed on the upper and lower surface of polymer elements (11) respectively and three is fixed as one;
A part for pin (6) is arranged in the inside of shell and is connected with metalized surface layer lower surface (13) and circuit board (4), and another part of pin (6) reaches the exterior thereto that circuit board (4) is wrapped with shell;
The top layer cover plate of shell near metalized surface layer upper surface (12) side and the metalized surface layer upper surface (12) of sensing element (1) form electrical contact.
2., according to packaged type gas sensor described in claim 1, it is characterized in that:
Shell is specially betal can (3) or metal pipe cap (5); Wherein:
The top blind flange of shell stretches out elasticity of flexure structure to inner chamber, and the metalized surface layer upper surface (12) of itself and sensing element (1) forms electrical contact; The top blind flange of betal can (3) is integral structure with the elasticity of flexure structure of stretching out to inner chamber.
3., according to packaged type gas sensor described in claim 1 or 2, it is characterized in that:
Near being also provided with for filling gap and form one of following several structure of electrical connection therebetween between the top layer cover plate of shell and metalized surface layer upper surface (12) of metalized surface layer upper surface (12) side: sponge like polymer, gasket construction, spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520604763.7U CN204925070U (en) | 2015-08-12 | 2015-08-12 | Packaged type gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520604763.7U CN204925070U (en) | 2015-08-12 | 2015-08-12 | Packaged type gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204925070U true CN204925070U (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520604763.7U Active CN204925070U (en) | 2015-08-12 | 2015-08-12 | Packaged type gas sensor |
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|---|---|
| CN (1) | CN204925070U (en) |
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2015
- 2015-08-12 CN CN201520604763.7U patent/CN204925070U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Packaged type gas sensor Effective date of registration: 20180426 Granted publication date: 20151230 Pledgee: Finance and finance of Fushun Company limited by guarantee Pledgor: Microelectronics (Liaoning) Co., Ltd. Hanking Registration number: 2018210000011 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190424 Granted publication date: 20151230 Pledgee: Finance and finance of Fushun Company limited by guarantee Pledgor: Microelectronics (Liaoning) Co., Ltd. Hanking Registration number: 2018210000011 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |