CN204905245U - Electron device - Google Patents
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- CN204905245U CN204905245U CN201520650208.8U CN201520650208U CN204905245U CN 204905245 U CN204905245 U CN 204905245U CN 201520650208 U CN201520650208 U CN 201520650208U CN 204905245 U CN204905245 U CN 204905245U
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- conductive layer
- electronic device
- pressure sensitive
- sensitive conductive
- golden finger
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Abstract
The utility model discloses an electron device, electron device's kneck is provided with at least one golden finger, the golden finger includes: conducting layer and pressure -sensitive conducting layer, the conducting layer sets up on electron device substrate base plate, pressure -sensitive conducting layer setting is in the upper surface of conducting layer. The embodiment of the utility model provides an adopt above -mentioned technical scheme, in electron device manufacturing, transportation and data send process for avoid the direct and external contact of golden finger conducting layer to produce the electrostatic discharge electric current, block external electrostatic discharge current conveyance golden finger simultaneously and flow in electron device inner line, thereby prevent that the electrostatic discharge electric current from causing the damage to electron device.
Description
Technical field
The utility model relates to electronics industry, particularly relates to a kind of electronic device with golden finger.
Background technology
In electronics industry, the assembly that static discharge causes puncture infringement be the most generally, the most serious problem.Therefore, the electrostatic discharge protective of electronic device seems particularly important.Electrostatic induced current is to being provided with one of the approach that wounds of electronic circuit of golden finger for enter electronic circuit by the golden finger that electronic device is exposed.
At present, the electrostatic discharge protective of electronic device often adopts the mode increasing protecting component for electrostatic discharge.As shown in Figure 1; when static discharge by golden finger 111 to when having a line discharge of protection; static discharge can discharge by protective element 112 (as Transient Suppression Diode) fast that be arranged on electronic device substrate substrate 110, thus the key element 120 of protection back segment.Owing to increasing protecting component for electrostatic discharge 112, only work to the electronic component 120 of protective element back segment, electronic device electronic circuit is complicated, and concrete discharge position is uncertain, increase multiple protective element 112 not only can increasing circuit design the gross area, make design cost higher simultaneously.
In addition, another common method of electrostatic discharge protective is easily designed with electrostatic discharge protection circuit by the electronic device itself that static discharge wounds.As when integrated antenna package is very little, when larger static discharge current enters circuit, inner electrostatic storage deflection (ESD) protection circuit may be caused to puncture, burn, lose the function of protection.And then cause the performance degradation of components and parts in integrated circuit or parameter index to decline, even can cause components and parts dielectric breakdown, burn or eventual failure, thus affect the functional realiey of electronic device itself.
Utility model content
The object of the utility model embodiment is to propose a kind of electronic device, to solve the electrostatic discharge protective problem of prior art in electronic device.
For reaching this object, the utility model by the following technical solutions:
A kind of electronic device, the interface of described electronic device is provided with at least one golden finger, and wherein, described golden finger comprises conductive layer and pressure sensitive conductive layer, described conductive layer is arranged on electronic device substrate substrate, and described pressure sensitive conductive layer is arranged on the upper surface of described conductive layer.
Further, the material of described pressure sensitive conductive layer is pressure-sensitive conductive rubber, new type polyimide adhesive tape or flexible pressure sensitive conductive rubber.
Further, described pressure sensitive conductive layer is by spraying, sputtering or be glued on described conductive layer.
Further, the structure of described conductive layer, from electronic device substrate substrate to described pressure sensitive conductive layer direction, is followed successively by layers of copper, nickel dam and layer gold.
Further, the thickness of described pressure sensitive conductive layer is less than the thickness of described conductive layer.
Further, the lower surface of described pressure sensitive conductive layer is parallel with the upper surface of described conductive layer.
Further, the exposed surface of the coated described conductive layer of described pressure sensitive conductive layer.
Further, the shape of described pressure sensitive conductive layer is identical with the shape of described conductive layer.
Further, the shape of described pressure sensitive conductive layer and the shape of described conductive layer comprise circle, semicircle, ellipse, rectangle, square, regular polygon, parallelogram or rhombus.
Further, described electronic device is flexible printed circuit board, for being connected with the interface pluggable mode of connector.
The utility model embodiment, by arranging pressure sensitive conductive layer at golden finger conductive layer surface, avoids golden finger conductive layer directly and extraneous contact, decreases the static discharge current produced because conductive layer and extraneous friction; Due to insulation characterisitic when pressure sensitive conductive layer does not stress, extraneous static discharging current cannot enter inside of electronic component circuit by golden finger, thus, prevent static discharge current from causing damage to electronic device, realize the electrostatic discharge protective to the electronic device being provided with golden finger.
Accompanying drawing explanation
In order to the technical scheme of the utility model exemplary embodiment is clearly described, one is done to the accompanying drawing used required for describing in embodiment below and simply introduce.Obviously, the accompanying drawing introduced is the accompanying drawing of a part of embodiment that the utility model will describe, instead of whole accompanying drawings, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
A kind of electronic device electrostatic defending schematic diagram that Fig. 1 provides for prior art;
The cutaway view of golden finger in a kind of electronic device that Fig. 2 provides for the utility model embodiment one;
Fig. 3 is the structural representation of conductive layer in the utility model embodiment;
The cutaway view of golden finger in a kind of electronic device that Fig. 4 provides for the utility model embodiment two.
Embodiment
Below in conjunction with drawings and the specific embodiments, the utility model is described in further detail.Be understandable that, specific embodiment described herein only for explaining the utility model, but not to restriction of the present utility model.It also should be noted that, for convenience of description, illustrate only the part relevant to the utility model in accompanying drawing but not entire infrastructure.
Embodiment one
The cutaway view of golden finger in a kind of electronic device that Fig. 2 provides for the utility model embodiment one.Present embodiments provide a kind of electronic device, the interface of described electronic device is provided with at least one golden finger, as shown in Figure 2, described golden finger comprises conductive layer 210 and pressure sensitive conductive layer 220, described conductive layer is arranged on electronic device substrate substrate, and described pressure sensitive conductive layer 220 is arranged on the upper surface of described conductive layer 210.Concrete, the structure of described conductive layer 210, preferably from electronic device substrate substrate extremely described pressure sensitive conductive layer direction, is followed successively by layers of copper 211, nickel dam 212 and layer gold 213, as shown in Figure 3.
Exemplary, the material of described pressure sensitive conductive layer 220 is specifically as follows pressure-sensitive conductive rubber, new type polyimide adhesive tape or flexible pressure sensitive conductive rubber etc., not only meets piezoelectric property, and corrosion-resistant, anti-oxidant.Optionally, described pressure sensitive conductive layer 220 is by spraying, sputtering or be glued on described conductive layer 210.
In technique scheme, described pressure sensitive conductive layer 220 is arranged on the upper surface of described conductive layer 210, namely, described pressure sensitive conductive layer 220 is arranged on the surface of described conductive layer 210 away from described underlay substrate, described golden finger 220 is directly used in the maximum surface of the area that is connected with other device, make relatively simple, easily realize.
Further, the shape of described pressure sensitive conductive layer 220 and the shape of described conductive layer 210 can be identical or different.Preferably both shapes are identical.The shape of described pressure sensitive conductive layer 220 is identical with the shape of described conductive layer 210, not only without the need to changing the space in described electronic device component region, and, under operating state, described pressure sensitive conductive layer 220 transfers to the uniform current of conductive layer 210, and after the described pressure sensitive conductive layer 220 of increase, ensure that described golden finger still mates with connector.Concrete, the shape of described pressure sensitive conductive layer 220 and the shape of described conductive layer 210 can comprise circle, semicircle, ellipse, rectangle, square, regular polygon, parallelogram or rhombus etc.
Adopt technique scheme, described pressure sensitive conductive layer 220 described conductive layer 210 capable of blocking directly contacts with the external world, and then avoid described golden finger in the processes such as transport, transmission, be subject to friction generation electrostatic, produce electrostatic when especially avoiding described golden finger to be connected with connector.Simultaneously because described pressure sensitive conductive layer 220 is without insulation characterisitic during pressure, extraneous static discharging current cannot reach described conductive layer 210 by the described pressure sensitive conductive layer 220 of described golden finger, described golden finger, when not being connected with connector, still can accomplish the electrostatic discharge protective to described electronic device.When described pressure sensitive conductive layer 220 insulate, even if static discharge electric charge is comparatively large, also can not be influenced, thus effectively prevent the damage of static discharge current to electronic device.
Embodiment two
The cutaway view of golden finger in a kind of electronic device that Fig. 4 provides for the utility model embodiment two.The technical scheme of the utility model embodiment is on the basis of embodiment one, described pressure sensitive conductive layer 220 is arranged on the upper surface of described conductive layer 210, preferably, the exposed surface of the coated described conductive layer 210 of described pressure sensitive conductive layer 220, block described conductive layer 210 completely directly and outer contacting, thus prevent electrostatic induced current from entering described electronic device by described golden finger, damage is caused to described electronic device.
On the basis of above-described embodiment, preferably, the thickness of described pressure sensitive conductive layer 220 is less than the thickness of described conductive layer 210.Because the per-interface space arranged with the connector etc. that described golden finger carries out being connected is limited, and during described pressure sensitive conductive layer 220 thickness increase, respective impedance also can increase, consider the electric conductivity of described golden finger, adopt the technical program, when described golden finger is connected with connector, matching degree is higher, and conductivity is better.
During due to described golden finger work, described conductive layer 210 is reached by described pressure sensitive conductive layer 220 by electric current, then operating circuit is entered, preferably, the lower surface of described pressure sensitive conductive layer 220 is parallel with the upper surface of described conductive layer 210, ensure that described pressure sensitive conductive layer 220 fully contacts with described conductive layer 210, make described golden finger present good conductivity in the course of the work.
In technique scheme, described electronic device is preferably flexible printed circuit board, for being connected with the interface pluggable mode of connector.Certainly, the golden finger structure that the utility model embodiment provides, can also be used in various electronic device, be not limited to flexible printed circuit board.
Concrete, the mode of operation of the present embodiment is: when external force does not act on the described pressure sensitive conductive layer 220 of described golden finger, the resistance value of described pressure sensitive conductive layer 220 is higher, present insulation characterisitic, described golden finger is non-conductive, and static discharge cannot enter the internal wiring of described electronic device via described golden finger; When described pressure sensitive conductive layer 220 is under pressure, such as, connector contact is subject to when extruding when the described golden finger of described electronic device and connector contact, described pressure sensitive conductive layer 220 resistance value obviously reduces, present conductive characteristic, now, electric current is by the described pressure sensitive conductive layer 220 of described golden finger, enter described conductive layer 210, and then enter the operating circuit of described electronic device.
To sum up, the electronic device that the utility model embodiment provides, by increasing described pressure sensitive conductive layer on the described conductive layer of described golden finger, in electronic device manufacture, transport and transport process, for avoiding the described conductive layer of described golden finger directly to produce static discharge current with extraneous contact, blocking extraneous static discharging current simultaneously and passing through described golden finger inflow inside of electronic component circuit; When not changing electronic circuit layout, prevent static discharge current from causing damage to electronic device.The technical scheme that the utility model embodiment provides, compared with the method in prior art shown in Fig. 1, need not increase electrostatic protection element, saves the space of the element area of electronic device, reduces the area of electronic circuit.
It should be noted that, in actual applications, because the size of flexible circuit board can be different, the golden finger quantity that it is provided with, size, size are also not quite similar, the quantity of the electronic device adjustable golden finger that the utility model embodiment provides, size, size are to meet the demand of connected interface device, and those skilled in the art can select the electronic device of dimension according to the actual requirements.
Note, above are only preferred embodiment of the present utility model.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not be departed from this and use novel protection range.Therefore, although be described in further detail the utility model by above embodiment, but the utility model is not limited only to above embodiment, when not departing from the utility model design, can also comprise other Equivalent embodiments more, and scope of the present utility model is determined by appended right.
Claims (10)
1. an electronic device, the interface of described electronic device is provided with at least one golden finger, it is characterized in that, described golden finger comprises conductive layer and pressure sensitive conductive layer, described conductive layer is arranged on electronic device substrate substrate, and described pressure sensitive conductive layer is arranged on the upper surface of described conductive layer.
2. electronic device according to claim 1, is characterized in that: the material of described pressure sensitive conductive layer is pressure-sensitive conductive rubber, new type polyimide adhesive tape or flexible pressure sensitive conductive rubber.
3. electronic device according to claim 1, is characterized in that: described pressure sensitive conductive layer is by spraying, sputtering or be glued on described conductive layer.
4. electronic device according to claim 1, is characterized in that: the structure of described conductive layer, from electronic device substrate substrate to described pressure sensitive conductive layer direction, is followed successively by layers of copper, nickel dam and layer gold.
5. electronic device according to claim 1, is characterized in that: the thickness of described pressure sensitive conductive layer is less than the thickness of described conductive layer.
6. electronic device according to claim 1, is characterized in that: the lower surface of described pressure sensitive conductive layer is parallel with the upper surface of described conductive layer.
7. electronic device according to claim 1, is characterized in that: the exposed surface of the coated described conductive layer of described pressure sensitive conductive layer.
8. electronic device according to claim 1, is characterized in that: the shape of described pressure sensitive conductive layer is identical with the shape of described conductive layer.
9. electronic device according to claim 8, is characterized in that: the shape of described pressure sensitive conductive layer and the shape of described conductive layer comprise circle, semicircle, ellipse, rectangle, regular polygon, parallelogram or rhombus.
10., according to the arbitrary described electronic device of claim 1-9, it is characterized in that: described electronic device is flexible printed circuit board, for being connected with the interface pluggable mode of connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520650208.8U CN204905245U (en) | 2015-08-26 | 2015-08-26 | Electron device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520650208.8U CN204905245U (en) | 2015-08-26 | 2015-08-26 | Electron device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204905245U true CN204905245U (en) | 2015-12-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520650208.8U Active CN204905245U (en) | 2015-08-26 | 2015-08-26 | Electron device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204905245U (en) |
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2015
- 2015-08-26 CN CN201520650208.8U patent/CN204905245U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |