CN204887670U - Structure on integrated circuit board's board - Google Patents
Structure on integrated circuit board's board Download PDFInfo
- Publication number
- CN204887670U CN204887670U CN201520436117.4U CN201520436117U CN204887670U CN 204887670 U CN204887670 U CN 204887670U CN 201520436117 U CN201520436117 U CN 201520436117U CN 204887670 U CN204887670 U CN 204887670U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- windowing
- mounted integrated
- paster
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a structure on integrated circuit board's board is equipped with first the windowing that is used for sign paster device pad regional to and the second that is used for the first pin position of sign paster device is windowed, wherein, first windowing including the at least three windowing that does not communicate each other. Through the utility model discloses the scheme, through seting up corresponding windowing, by the window function of substituting silk screen printing need not to print specially the process of silk screen printing during production, be favorable to improving integrated circuit board's production efficiency, and, because itself not height of windowing, avoid appearing elevating the paster device, result in the circumstances of paster device PIN1 foot rosin joint, can reduce integrated circuit board's paster defective rate.
Description
Technical field
The utility model relates to surface-mounted integrated circuit technical field, structure on the plate particularly relating to a kind of surface-mounted integrated circuit.
Background technology
Along with the integrated level of surface-mounted integrated circuit improves, the size of surface-mounted integrated circuit is done fewer and fewer, and this present situation all brings certain puzzlement to the production of surface-mounted integrated circuit and paster.
As shown in Figure 1; existing surface-mounted integrated circuit 1 is when producing; in order to better embody the welding position of surface-mounted device welding disking area and surface-mounted device PIN1 pin, usually corresponding silk-screen 2 can be printed in surface-mounted device welding disking area surrounding, surface-mounted device PIN1 pin welding position.In surface-mounted integrated circuit production process, these silk-screens 2 need one special operation to print, and cause the time of manufacturing of surface-mounted integrated circuit longer.In addition, because these silk-screens itself have certain height, when easily there is paster, silk-screen is by situation that is high to chip carrier and surface-mounted device PIN1 pin rosin joint, causes paster fraction defective to increase.
Therefore, on the plate of existing surface-mounted integrated circuit, structure need to improve.
Utility model content
Structure on the plate that the purpose of this utility model is to propose a kind of surface-mounted integrated circuit, can improve the production efficiency of surface-mounted integrated circuit, and reduce the paster fraction defective of surface-mounted integrated circuit.
For reaching this object, the utility model by the following technical solutions:
A structure on the plate of surface-mounted integrated circuit, comprising: be provided with for first windowing of identifying paster device bonding pad region, and second to window for identifying surface-mounted device first Pin locations; Wherein, described first window and comprise at least three disconnected windowings each other.
Wherein, the surface-mounted device welding disking area of described surface-mounted integrated circuit is rectangular area, and described first windows comprises four windowings, lays respectively at the corner of described rectangular area, and described four windowings are not communicated with each other.
Wherein, described second to window be an annulus windowing.
Wherein, described surface-mounted integrated circuit is also provided with the three-way window of the polarity for identifying polarity device.
Wherein, described three-way window comprises positive pole polarity sign windowing and/or negative pole polarity sign windowing.
Implement the utility model embodiment, there is following beneficial effect:
The utility model embodiment by arranging for first windowing of identifying paster device bonding pad region on surface-mounted integrated circuit, and second to window for identifying surface-mounted device PIN1 Pin locations; Wherein, described first window and comprise at least three disconnected windowings each other.By this programme, corresponding windowing is offered in the position originally arranging silk-screen at surface-mounted integrated circuit, by the function of described alternative silk-screen of windowing, without the need to printing the operation of silk-screen specially during production, is conducive to the production efficiency improving surface-mounted integrated circuit; Further, due to itself not height of windowing, when avoiding occurring paster, the situation of frame height surface-mounted device, surface-mounted device PIN1 pin rosin joint, can reduce the paster fraction defective of surface-mounted integrated circuit.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing described below is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 be the surface-mounted integrated circuit of existing band silk-screen plate on structural representation.
Fig. 2 be a kind of surface-mounted integrated circuit of the utility model first embodiment plate on structural representation.
Fig. 3 be a kind of surface-mounted integrated circuit 1 of the utility model second embodiment plate on structural representation.
Embodiment
Carry out clear, complete description below in conjunction with accompanying drawing of the present utility model to the technical scheme in the utility model embodiment, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
First embodiment
As shown in Figure 2, the surface-mounted integrated circuit 1 of the present embodiment is provided with first windows 3 for what identify paster device bonding pad region, and second windows 4 for identifying surface-mounted device first pin (PIN1) position; Wherein, described first window and 3 comprise at least three disconnected windowings each other.In first embodiment, described first windows 3 is mainly used in determining on ejecting plate for the basic configuration of the welding disking area of welding chip or other surface-mounted devices and size.As shown in Figure 2, if the surface-mounted device welding disking area of surface-mounted integrated circuit 1 is rectangular area, then described first window and 3 can comprise four windowings, lay respectively at the corner of described rectangular area, can be identified the shape and size of surface-mounted device welding disking area on ejecting plate by these four windowings, described four windowings are not communicated with each other, have both ensured the intensity of surface-mounted integrated circuit, prevent from damaging, do not affect again the arrangement of plate upward wiring.It should be noted that, the windowing process of the utility model to circuit board is not construed as limiting.
As a preferred implementation, described first windows 3 (is considered as main windowing except above-mentioned four windowings being positioned at rectangle corner, for determining basic configuration and the size of surface-mounted device welding disking area), also time windowing can be set on each bar limit of rectangle according to actual conditions, especially for comprising compared with large bonding pad region or the surface-mounted integrated circuit comprising multiple different welding disking area, each welding disking area can be identified more clearly by arranging time windowing, make structure on the plate of surface-mounted integrated circuit very clear, be convenient to user's paster.
Preferably, in the present embodiment, above-mentioned second to window 4 be an annulus windowing, and certainly according to actual conditions, above-mentioned second windows 4 windowings that also can be set to other shapes, such as rectangle windowing, triangle windowing, oval windowing etc.
It should be noted that, except the silk-screen that the above-mentioned form of windowing can be adopted to substitute surface-mounted device welding disking area, for other device paster regions on surface-mounted integrated circuit, also similar windowing can be set, with in surface-mounted integrated circuit production process, save the operation printing silk-screen, improve the production efficiency of circuit board.
Second embodiment
Usual surface-mounted integrated circuit plate also has the paster region of polarity device, existing processing mode is around the paster region of polarity device, print corresponding silk-screen, in like manner, there is mount height device part during paster, causes the situation of device pin rosin joint.Second embodiment and the first embodiment difference are mainly, are also provided with the three-way window 5 of the polarity for identifying polarity device, to reduce the paster fraction defective of polarity device.
As shown in Figure 3, in the second embodiment, if surface-mounted integrated circuit 1 plate has the paster region of polarity device, then described surface-mounted integrated circuit 1 is also provided with the three-way window 5 of the polarity for identifying polarity device.The present embodiment Semi-polarity device can be polar capacitor, unidirectional transistor etc.Described three-way window 5 is specifically as follows positive pole polarity sign windowing (windowing of+shape) and/or negative pole polarity sign windows (windowing of-shape).It should be noted that, for other polarity device, the windowing of correspondingly-shaped also can be set, so that user operates the paster of polarity device.
Above disclosedly be only the utility model preferred embodiment, certainly the right of the utility model can not be limited with this, therefore, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., still belong to the scope that the utility model is contained.
Claims (5)
1. a structure on the plate of surface-mounted integrated circuit, is characterized in that, comprising: be provided with for first windowing (3) of identifying paster device bonding pad region, and second windows (4) for identifying surface-mounted device first Pin locations; Wherein, described first window (3) comprise at least three disconnected windowings each other.
2. structure on the plate of surface-mounted integrated circuit as claimed in claim 1, it is characterized in that, the surface-mounted device welding disking area of described surface-mounted integrated circuit is rectangular area, described first window (3) comprise four windowings, lay respectively at the corner of described rectangular area, described four windowings are not communicated with each other.
3. structure on the plate of surface-mounted integrated circuit as claimed in claim 1, is characterized in that, described second window (4) be an annulus windowing.
4. structure on the plate of surface-mounted integrated circuit as claimed in claim 1, it is characterized in that, described surface-mounted integrated circuit is also provided with the three-way window (5) of the polarity for identifying polarity device.
5. structure on the plate of surface-mounted integrated circuit as claimed in claim 4, it is characterized in that, described three-way window (5) comprises positive pole polarity sign windowing and/or negative pole polarity sign windowing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520436117.4U CN204887670U (en) | 2015-06-23 | 2015-06-23 | Structure on integrated circuit board's board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520436117.4U CN204887670U (en) | 2015-06-23 | 2015-06-23 | Structure on integrated circuit board's board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204887670U true CN204887670U (en) | 2015-12-16 |
Family
ID=54831987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520436117.4U Expired - Fee Related CN204887670U (en) | 2015-06-23 | 2015-06-23 | Structure on integrated circuit board's board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204887670U (en) |
-
2015
- 2015-06-23 CN CN201520436117.4U patent/CN204887670U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20180623 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |