CN204773220U - Integrated circuit package overflows and glues equipment of cleaing away - Google Patents
Integrated circuit package overflows and glues equipment of cleaing away Download PDFInfo
- Publication number
- CN204773220U CN204773220U CN201520469814.XU CN201520469814U CN204773220U CN 204773220 U CN204773220 U CN 204773220U CN 201520469814 U CN201520469814 U CN 201520469814U CN 204773220 U CN204773220 U CN 204773220U
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- Prior art keywords
- glue
- integrated antenna
- antenna package
- overflows
- remove
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Abstract
The utility model relates to an integrated circuit package overflows and glues equipment of cleaing away. According to the utility model discloses an embodiment, an integrated circuit package overflows and glues equipment of cleaing away includes: overflowing and gluing preprocessor, its excessive lipid of getting rid of integrated circuit package's terminal surface is overflow and is glued, the locator, remaining on its detection and the integrated circuit package of location after the preliminary treatment the terminal surface is overflow glueyly, overflowing and gluing the treater, the excessive glue of remaining on the integrated circuit package's of location terminal surface is clear away to its use laser, controller, its control overflow to be glued the treater and are clear away to remain to overflow on integrated circuit package's the terminal surface and glue, the back detector is clear away to excessive glue, and whether its terminal surface that detects the integrated circuit package after gluey processing of overflowing is clear away to laser is clean. This integrated circuit package overflows and glues equipment of cleaing away has that the effect is clear away to better excessive glue and the cost is more cheap, more accords with the integrated circuit package terminal surface and overflows and glue the demand of cleaing away.
Description
Technical field
The utility model relates generally to semiconductor applications, more specifically, relate to integrated antenna package overflow glue remove equipment.
Background technology
In integrated antenna package process, usually there is encapsulation end face and to overflow the problem of glue.The reason producing the glue that overflows has a lot, as lead frame distortion causes excessive glue and frame strip projection to cause excessive glue etc.The overflow existence of glue of encapsulation end face can affect the normal use of integrated antenna package, serious may directly scrapping and reduce the output of integrated antenna package.
The overflow method of glue of at present conventional removing has multiple, such as, adopt wet type liquid medicine to soak to increase blow wash to remove to remove excessive glue or to adopt plating electrolysis to increase blow wash the glue that overflows.Wherein adopt wet type liquid medicine to soak to increase blow wash and remove the glue that overflows, because the effect removing excessive glue is inadequate, thoroughly cannot solve all integrated antenna packages and to overflow the problem of glue.In addition, the puzzlement facing the aspects such as artificial heavy industry and operation cost is also needed.And adopt plating electrolysis to increase blow wash to remove integrated antenna package to overflow the mode of glue, its heavy current and high pressure may make integrated antenna package produce crack, thus cause integrated antenna package cannot wrap chip completely.Serious, the situations such as the blast of integrated antenna package may be caused.In addition, due to factors such as integrated antenna package size and integrated antenna package product quality grades, plating electrolysis is increased setting-out backwashing manner and cannot be applied to all integrated antenna package products.That is, this technical scheme also exists limitation in range of application.
Thus, the existing integrated antenna package glue clearance technique that overflows still needs further improvement.
Utility model content
One of the purpose of this utility model is to provide the integrated antenna package end face glue that overflows to remove equipment, and it can widely use and can not produce harmful effect to product quality while guarantee elimination effect.
According to the utility model one embodiment, an integrated antenna package overflow glue remove equipment comprise excessive glue preprocessor, locator and excessive glue remover.The end face that the glue preprocessor that overflows is configured to this integrated antenna package of pretreatment to overflow glue at least to remove excessive lipid.Locator is configured to detect and locates the residual glue that overflows on the end face of this integrated antenna package after pretreatment.The glue remover that overflows is configured to the described residual glue that overflows used on the end face of laser removing this integrated antenna package after positioning.
According to another embodiment of the present utility model, this excessive glue preprocessor is configured to use the mode of polishing to carry out pretreatment to the described excessive lipid glue that overflows.This integrated antenna package glue that overflows is removed equipment and can be comprised a controller further, and it is configured to the location according to locator and controls this excessive glue remover and remove the described residual glue that overflows.This excessive glue remover also can comprise the laser instrument of a power between 10w-35w.This integrated antenna package glue that overflows is removed equipment and can be comprised further: the glue that overflows remove after detector, this excessive glue remove after detector be configured to detect whether remove the end face of this integrated antenna package after described residual glue process of overflowing through laser clean.
Compared with prior art, equipment use wide ranges removed by the integrated antenna package end face that the utility model embodiment the provides glue that overflows, and has the glue elimination effect and cost is more cheap of better overflowing, and more meets integrated antenna package end face and to overflow the demand that glue removes.
Accompanying drawing explanation
Fig. 1 be according to the integrated antenna package end face of the utility model one embodiment overflow glue remove equipment apply time system architecture schematic diagram.
Fig. 2 is the flow chart of glue sweep-out method of overflowing according to the integrated antenna package end face of the utility model one embodiment.
Detailed description of the invention
For better understanding spirit of the present utility model, below in conjunction with part preferred embodiment of the present utility model, it is described further.
Fig. 1 be according to the integrated antenna package end face of the utility model one embodiment overflow glue remove equipment apply time system architecture schematic diagram.
As shown in Figure 1, comprise feed mechanism 12 according to the excessive glue scavenge system 10 of the utility model one embodiment, integrated antenna package overflows glue removing equipment 14, transmission device 16 and cutting agency 18.This integrated antenna package overflows, and glue removing equipment 14 comprises further, rear detector 148 removed by the glue preprocessor 142 that overflows, locator 144, excessive glue remover 146 and excessive glue.It should be noted that in other embodiments, this integrated antenna package overflow glue remove equipment 14 also can not comprise excessive glue remove after detector 148.According to the utility model one embodiment, locator can be, but is not limited to, the vision positioning device such as video camera, video camera.
As understood by those skilled in the art, feed mechanism 12 and cutting agency 18 are mainly used in integrated antenna package 20 to upload and withdraw transmission device 16.Transmission device 16 can be common conveyer belt, processes for automatically integrated antenna package 20 being sent to the integrated antenna package relevant position of all parts that glue removes equipment 14 of overflowing.
First integrated antenna package 20 is sent to excessive glue preprocessor 142 place by transmission device 16, is removed the end face of integrated antenna package 20 by excessive glue preprocessor 142, as the excessive lipid on a pin side is overflow glue.According to the utility model one embodiment, the excessive lipid glue that overflows is the composition of packing colloid in integrated antenna package 20, and this kind of excessive glue is generally faint yellow, more serious, can be yellowish-brown.The glue preprocessor 142 that overflows can be the instrument such as cylinder or sand paper, it is polished to integrated antenna package 20 in the mode of polishing, to overflow glue to remove excessive lipid in advance, so can avoid follow-up when judging to overflow glue elimination effect, the excessive lipid that should the be removed glue that overflows is mistaken for the part of packing colloid in integrated antenna package 20, and is not removed.
Then, pretreated integrated antenna package 20 can be sent to locator 144 by transmission device 16, carries out detection and positioning by the residual excessive glue position on the end face of locator 144 pairs of integrated antenna packages 20 and/or shape.The excessive lipid of overflowing in glue because this is residual is removed, therefore this residual transparent look of glue that overflows.The information such as the excessive glue position of locator 144 persistent collection location and/or shape.
For the integrated antenna package 20 of the excessive glue location of warp that conveyer 16 sends, the glue remover 146 that overflows can remove the excessive glue on the end face of integrated antenna package 20 after positioning according to instruction use laser.For avoiding causing unnecessary impact to product quality, the laser power that the glue remover 146 that overflows uses at every turn is less, such as, can be set between 10W-35W, preferably, can be 20W.
According in another embodiment of the present utility model, this integrated antenna package overflow glue remove equipment 14 can comprise independently controller further, the excessive glue locating information that locator 144 produces can send this controller to, this controller by locator 144 collected come the locating information image qualified with acquiescence to compare its difference, then control by this controller the information that sends and use laser to remove excessive glue on the end face of integrated antenna package 20 after positioning to order this excessive glue remover 146.
Through overflow glue remover 146 process integrated antenna package 20 can be sent to by conveyer 16 excessive glue remove after detector 148.Whether this excessive glue is removed rear detector 148 and again can be detected the integrated antenna package 20 removed through glue remover 106 laser that overflows, clean to determine the excessive glue on the end face of this integrated antenna package 20.Excessive glue remove clean integrated antenna package 20 can be used as certified products directly deliver to cutting agency 18 place unloading.And to the integrated antenna package 20 that excessive glue is not removed completely, the excessive glue remover 146 that can optionally pass on back is again removed the excessive glue on end face or directly scraps.Consider based on each side such as quality, production capacity factor, can select to carry out a reprocessing.Do not remove can be considered that excessive glue is serious of excessive glue yet through reprocessing and this integrated antenna package 20 is scrapped.
Fig. 2 is the flow chart of glue sweep-out method of overflowing according to the integrated antenna package end face of the utility model one embodiment.As shown in Figure 2, in step 202., first integrated antenna package is sent on driver by feed mechanism.In step 204, carry out pretreatment to the end face of this integrated antenna package in the mode of polishing to overflow glue to remove excessive lipid.In step 206, detect and locate the residual glue that overflows on this integrated antenna package end face after pretreatment, to determine position and/or the shape of the excessive glue of this integrated antenna package end face.In a step 208, preferably, the excessive glue on the integrated antenna package end face of locating after testing is removed in the mode of laser.In step 210, the integrated antenna package that laser is removed is detected again.In the step 212, whether the excessive glue judged on the end face of this integrated antenna package is removed completely.In step 214, if the excessive glue on the end face of this integrated antenna package is removed completely, then by cutting agency, the integrated antenna package on driver is withdrawn; Otherwise, if the excessive glue on the end face of this integrated antenna package is removed not yet completely, then return step 208 and again removing process carried out to the excessive glue on integrated antenna package end face or directly scrap.
Technology contents of the present utility model and technical characterstic disclose as above, but those of ordinary skill in the art still may do all replacement and the modification that do not deviate from the utility model spirit based on teaching of the present utility model and announcement.Therefore, protection domain of the present utility model should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present utility model and modification, and is contained by present patent application claims.
Claims (8)
1. integrated antenna package overflow glue remove an equipment, it is characterized in that, it comprises:
Overflow glue preprocessor, and the end face being configured to integrated antenna package described in pretreatment to overflow glue at least to remove excessive lipid;
Locator, is configured to detect and locates the residual glue that overflows on the end face of described integrated antenna package after pretreatment; And
Overflow glue remover, is configured to the described residual glue that overflows removed on the end face of described integrated antenna package after positioning.
2. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, described excessive glue preprocessor is cylinder or sand paper.
3. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, the described integrated antenna package glue that overflows is removed equipment and is comprised controller further, and described controller is configured to the location according to described locator and controls described excessive glue remover and remove the described residual glue that overflows.
4. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, described excessive glue remover comprises a laser instrument.
5. integrated antenna package according to claim 4 overflow glue remove equipment, it is characterized in that, described laser power is between 10w-35w.
6. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, the described integrated antenna package glue that overflows is removed equipment and is comprised further: the glue that overflows remove after detector, described excessive glue remove after detector be configured to detect whether remove the end face of the described integrated antenna package after described residual glue process of overflowing through laser clean.
7. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, described locator is video camera or video camera.
8. integrated antenna package according to claim 1 overflow glue remove equipment, it is characterized in that, described integrated antenna package overflow glue remove equipment comprise transmission device further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520469814.XU CN204773220U (en) | 2015-07-03 | 2015-07-03 | Integrated circuit package overflows and glues equipment of cleaing away |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520469814.XU CN204773220U (en) | 2015-07-03 | 2015-07-03 | Integrated circuit package overflows and glues equipment of cleaing away |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204773220U true CN204773220U (en) | 2015-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520469814.XU Withdrawn - After Issue CN204773220U (en) | 2015-07-03 | 2015-07-03 | Integrated circuit package overflows and glues equipment of cleaing away |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204773220U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104960123A (en) * | 2015-07-03 | 2015-10-07 | 日月光半导体（昆山）有限公司 | Integrated circuit packaging glue overflow removing equipment and method |
-
2015
- 2015-07-03 CN CN201520469814.XU patent/CN204773220U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104960123A (en) * | 2015-07-03 | 2015-10-07 | 日月光半导体（昆山）有限公司 | Integrated circuit packaging glue overflow removing equipment and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151118 Effective date of abandoning: 20180112 |