CN204761686U - Cold -proof earphone of intelligence bluetooth - Google Patents

Cold -proof earphone of intelligence bluetooth Download PDF

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Publication number
CN204761686U
CN204761686U CN201520361396.2U CN201520361396U CN204761686U CN 204761686 U CN204761686 U CN 204761686U CN 201520361396 U CN201520361396 U CN 201520361396U CN 204761686 U CN204761686 U CN 204761686U
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China
Prior art keywords
bluetooth
module
mcu microprocessor
detection module
heat
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Expired - Fee Related
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CN201520361396.2U
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Chinese (zh)
Inventor
傅汉元
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Anysonic Electronics Co ltd
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Individual
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Priority to CN201520361396.2U priority Critical patent/CN204761686U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model relates to a cold -proof earphone of intelligence bluetooth, including controlling temperature detection module, voice input module, MCU microprocessor, bluetooth module and temperature heating and voltage testing, the output signal who controls temperature detection module transmits MCU microprocessor to, MCU microprocessor respectively with voice input module, the two -way data communication of bluetooth module, MCU microprocessor's output signal sends to temperature heating and voltage testing, the utility model discloses a controlling heating of temperature detection module and temperature and voltage testing and installing at the earphone overcoat, can pass through interface connection with MCU microprocessor, make things convenient for installation in winter and summer to dismantle, it has simple structure, strong, the intelligent characteristics of practicality.

Description

Smart bluetooth heat-insulation earphone
Technical field
The utility model relates to the technical field of earphone, particularly be a kind of smart bluetooth heat-insulation earphone.
Background technology
Bluetooth is a kind of wireless communication technique of short distance, and electronic installation can couple together through bluetooth each other, eliminates traditional electric wire.Through the wireless receiver on chip, the electronic product being furnished with Bluetooth technology can communicate with each other in the distance of ten meters, and transmission speed can reach Mbytes each second 1.The transmission technology of infrared interface needed electronic installation distance in sight in the past, and had had now Bluetooth technology, and such trouble also can eliminate the nerve endings of blue teeth wireless access technology as backbone network and the communication technology is penetrated into all trades and professions.It has following characteristics: (1) bluetooth applications be low-power, so can not have any injury to human body, bluetooth headphone, to benefit (2) the interactive meeting of also unsoundness, is connected to each participant and does Real Data Exchangs.In a meeting, you can immediately with other participant's shared in common information, also can operate projector wirelessly, this is just than traditional minutes flexible network internet bridge joint more.(3) mode considering to connect is not needed during Hegirascope network, anywhere, when you use your mobile computer roaming Internet, you do not need to consider that you will link through the mode wireless with mobile phone or link in wired mode (similarly being PSTN, ISDN, LAN).
Utility model content
The purpose of this utility model is the smart bluetooth heat-insulation earphone providing a kind of Bluetooth technology to apply.
The utility model solves the technical scheme that its technical problem adopts: smart bluetooth heat-insulation earphone, include left and right temperature detecting module, voice input module, MCU microprocessor, bluetooth module and heating temperatures and voltage detection module, the output signal of described left and right temperature detecting module is transferred to MCU microprocessor, described MCU microprocessor respectively with voice input module, bluetooth module bidirectional data communication, the output signal of described MCU microprocessor is sent to heating temperatures and voltage detection module.
Further, described heating temperatures and voltage detection module are detachable apparatus, and it is connected by interface line with MCU microprocessor.
Further, described heating temperatures and voltage detection module adopt 2 pieces of DS18B20 digital temperature sensor IC2 chip collecting temperature signals.
Further, described heating temperatures and voltage detection module adopt heating tape D1 to heat, and described heating tape D1 output is connected to the bleeder circuit be made up of resistance R5 ~ R10.
Further, the resistance R11 that described voice input module is connected successively by microphone J1 output, R12 and M7702 coding chip IC6, D6571E Compress softwares chip IC 5 is formed.
Further, described bluetooth module is by CC2564 Bluetooth chip IC3, crystal oscillator IC4, and resistance R1, R3, R4, electric capacity C2 ~ C5 and antenna E1 is formed.
By adopting above-mentioned technical scheme, the beneficial effects of the utility model are: left and right of the present utility model temperature detecting module and heating temperatures and voltage detection module are arranged on headphone jacket, can be connected by interface with MCU microprocessor, facilitate install winter and dismounting in summer, it has simple, practical, the intelligentized feature of structure.
Accompanying drawing explanation
Fig. 1 is frame assumption diagram of the present utility model;
Fig. 2 is circuit theory diagrams of the present utility model.
Embodiment
The utility model is further illustrated below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, smart bluetooth heat-insulation earphone of the present utility model, include left and right temperature detecting module, voice input module, MCU microprocessor, bluetooth module and heating temperatures and voltage detection module, the output signal of described left and right temperature detecting module is transferred to MCU microprocessor, described MCU microprocessor respectively with voice input module, bluetooth module bidirectional data communication, the output signal of described MCU microprocessor is sent to heating temperatures and voltage detection module.
Described heating temperatures and voltage detection module are detachable apparatus, and it is connected by interface line with MCU microprocessor.Facilitate install winter and dismounting in summer.Its operation principle is as follows: (1) temperature adjusts, and detects temperature in ear muff, if too low, starts heating tape heating, if too high, stops heating.(2) phonetic entry and Bluetooth transmission, MCU microprocessor is entered in phonetic entry, is undertaken transmitting or receiving after MCU microprocessor processes data by bluetooth.
As shown in Figure 2, described heating temperatures and voltage detection module adopt 2 pieces of DS18B20 digital temperature sensor IC2 chip collecting temperature signals, DS18B20 digital temperature sensor IC2 volume is little, hardware peripheral connects few, interference performance is strong, and precision is high, digital temperature transition and output, the highest 12 bit resolutions, precision can reach ± and 0.5 degree Celsius.Advanced single bus data communication.DS18B20 digital temperature sensor IC2 is directly connected with MCU microprocessor IC1 by monobus, monobus transmitting step: initialization → EOM order (following transmission data) → command function (following transmission data), data are admitted to MCU microprocessor IC1.
Described heating temperatures and voltage detection module adopt heating tape D1 to heat, and described heating tape D1 output is connected to the bleeder circuit be made up of resistance R5 ~ R10.When the 15th pin of MCU microprocessor IC1 or the 26th pin export a low level, heating tape D1 works heating.Magnitude of voltage is sent into MCU microprocessor IC1 and is also carried out comparing, if power cut-off or under-voltage time remind charging.
The resistance R11 that described voice input module is connected successively by microphone J1 output; R12 and M7702 coding chip IC6, D6571E Compress softwares chip IC 5 is formed; voice signal gathers pin voltage by M7702 coding chip IC6 voltage analog, and the analog voice signal of input is PCM code by code conversion by M7702 coding chip IC6; Also the voice signal of pcm encoder can be converted to continuous print voice signal by decoding to export simultaneously.Then exported by the coding output PCMOUT of this chip, and deliver to the DR0 end of D6571E Compress softwares chip IC 5, finally compressed by the compressed encoding speed of D6571E Compress softwares chip IC 5 by setting in advance again.The voice data segment of input will compress by D6571E Compress softwares chip IC 5, and the data word joint number of every section is fixing, and the data segment of this regular length is called a Frame.Speech data after the compression of D6571E Compress softwares chip IC 5 also will export in the form of frames.The length of every frame is also fixing, and its length is no more than 48 bytes.D6571E Compress softwares chip IC 5, after frame data have compressed, can produce a signal to notify MCU microprocessor IC1 by ACK port.And then read these frame data compressed from D6571E Compress softwares chip IC 5 by interface protocol instruction by MCU microprocessor IC1, and among the designated memory cell being write flash memory.This process constantly circulates and just can continuously record.
Described bluetooth module is by CC2564 Bluetooth chip IC3, crystal oscillator IC4, resistance R1, R3, R4, electric capacity C2 ~ C5 and antenna E1 is formed, crystal oscillator IC4 provides system clock for wireless module, CC2564 Bluetooth chip IC3 integrated with Bluetooth basic rate of exchange (BR)/enhancing data rate (EDR)/low-yield (LE) characteristic meets the HCILayerBR/ functional characteristic of bluetooth 4.0 specification completely. and it is by carrying out exchanges data with MCU microprocessor IC1, the 11st pin output signal of CC2564 Bluetooth chip IC3.
Above-describedly be only a preferred embodiment of the present utility model, the scope that the utility model is implemented can not be limited, every equalization change of doing according to the utility model claim and decoration, all should still belong in scope that the utility model contains.

Claims (6)

1. smart bluetooth heat-insulation earphone, it is characterized in that: include left and right temperature detecting module, voice input module, MCU microprocessor, bluetooth module and heating temperatures and voltage detection module, the output signal of described left and right temperature detecting module is transferred to MCU microprocessor, described MCU microprocessor respectively with voice input module, bluetooth module bidirectional data communication, the output signal of described MCU microprocessor is sent to heating temperatures and voltage detection module.
2. smart bluetooth heat-insulation earphone according to claim 1, its feature exists: described heating temperatures and voltage detection module are detachable apparatus, and it is connected by interface line with MCU microprocessor.
3. smart bluetooth heat-insulation earphone according to claim 2, its feature exists: described heating temperatures and voltage detection module adopt 2 pieces of DS18B20 digital temperature sensor IC2 chip collecting temperature signals.
4. the smart bluetooth heat-insulation earphone according to Claims 2 or 3, its feature exists: described heating temperatures and voltage detection module adopt heating tape D1 to heat, and described heating tape D1 output is connected to the bleeder circuit be made up of resistance R5 ~ R10.
5. smart bluetooth heat-insulation earphone according to claim 1, its feature exists: the resistance R11 that described voice input module is connected successively by microphone J1 output, R12 and M7702 coding chip IC6, D6571E Compress softwares chip IC 5 is formed.
6. smart bluetooth heat-insulation earphone according to claim 1, its feature exists: described bluetooth module is by CC2564 Bluetooth chip IC3, crystal oscillator IC4, and resistance R1, R3, R4, electric capacity C2 ~ C5 and antenna E1 is formed.
CN201520361396.2U 2015-05-31 2015-05-31 Cold -proof earphone of intelligence bluetooth Expired - Fee Related CN204761686U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520361396.2U CN204761686U (en) 2015-05-31 2015-05-31 Cold -proof earphone of intelligence bluetooth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520361396.2U CN204761686U (en) 2015-05-31 2015-05-31 Cold -proof earphone of intelligence bluetooth

Publications (1)

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CN204761686U true CN204761686U (en) 2015-11-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109788424A (en) * 2017-11-15 2019-05-21 深圳市冠旭电子股份有限公司 Ear muff configuration control device and earphone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109788424A (en) * 2017-11-15 2019-05-21 深圳市冠旭电子股份有限公司 Ear muff configuration control device and earphone
CN109788424B (en) * 2017-11-15 2023-12-15 深圳市冠旭电子股份有限公司 Ear muff shaping control device and earphone

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160801

Address after: 523000, Xin'an Road, Humen Town, Guangdong, Dongguan Province, No. 72

Patentee after: ANYSONIC ELECTRONICS Co.,Ltd.

Address before: 362302 No. 2 Xishan village, rosy Town, Quanzhou City, Fujian, Nanan

Patentee before: Fu Hanyuan

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151111