CN109788424B - Ear muff shaping control device and earphone - Google Patents
Ear muff shaping control device and earphone Download PDFInfo
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- CN109788424B CN109788424B CN201711129235.0A CN201711129235A CN109788424B CN 109788424 B CN109788424 B CN 109788424B CN 201711129235 A CN201711129235 A CN 201711129235A CN 109788424 B CN109788424 B CN 109788424B
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- 238000007493 shaping process Methods 0.000 title claims abstract description 43
- 101001010782 Drosophila melanogaster Fez family zinc finger protein erm Proteins 0.000 title description 61
- 238000012545 processing Methods 0.000 claims abstract description 80
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000741 silica gel Substances 0.000 claims description 17
- 229910002027 silica gel Inorganic materials 0.000 claims description 17
- 238000013461 design Methods 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 210000000613 ear canal Anatomy 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 210000000959 ear middle Anatomy 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The application belongs to the field of intelligent hearing-wearing equipment, and particularly relates to an earmuff shaping control device and an earphone. The device comprises: the key control module is connected with the Bluetooth processing module and used for controlling the Bluetooth processing module to be connected with the power supply device according to user input; the power supply device is used for providing power supply for the Bluetooth processing module; the Bluetooth processing module is connected with the boosting module and outputs a first voltage to the boosting module; the boosting module is suitable for being connected with the earmuffs, boosting the first voltage into the second voltage, and heating and shaping the earmuffs according to the second voltage. Above-mentioned earmuff design controlling means and earphone heats the earmuff through the module that steps up, realizes that the shape of earmuff design coincides with user's auricle shape, can be more comfortable when making the user wear the earphone and be difficult to drop down when the motion.
Description
Technical Field
The application belongs to the technical field of intelligent hearing-wearing equipment, and particularly relates to an earmuff shaping control device and an earphone.
Background
With the development of society, the quality of life pursued by people is also improving. Headphones are seen everywhere as consumer products in life. The types of the earphones in the market are endless, and the earphone types are common wired earphones, noise reduction earphones which are popular recently, heart rate earphones and step counting earphones, and are various in form.
At present, in order to improve the comfort level of wearing the earphone by users, the ear muffs on the earphone in the market are various in shape, and the earphone has round ear muffs, oval ear muffs and concave ear muffs containing the whole ears, but most of the ear muffs are not matched with the auricle shape of the users, so that the users are uncomfortable to wear, and the users are easy to fall down when doing some exercises, so that a lot of inconvenience is brought to the users.
Disclosure of Invention
In view of the above, the embodiment of the application provides an earmuff shaping control device and an earphone, so as to solve the problem that the common earphone in the prior art is uncomfortable to wear and easy to fall off.
A first aspect of an embodiment of the present application provides an ear muff shaping control device, including: the Bluetooth device comprises a key control module, a Bluetooth processing module and a boosting module;
the key control module is connected with the Bluetooth processing module and used for controlling the Bluetooth processing module to be connected with a power supply device according to user input; the power supply device is used for providing power supply for the Bluetooth processing module;
the Bluetooth processing module is connected with the boosting module and outputs a first voltage to the boosting module;
the boosting module is suitable for being connected with the earmuffs, boosting the first voltage into the second voltage, and heating and shaping the earmuffs according to the second voltage.
Optionally, the bluetooth processing module includes a CSR8670 chip;
the PIO1 pin, the PIO2 pin and the first power supply pin of the CSR8670 chip are all connected with the key control module;
the first output pin, the second output pin and the second power pin of the CSR8670 chip are all connected with the boosting module.
Optionally, the first output pin of the CSR8670 chip includes: PIO7 pin;
the second output pin of the CSR8670 chip includes: PIO22 pin;
the second power pin of the CSR8670 chip includes: VCHG pin; the VCHG pin is used for outputting the first voltage to the boost module.
Optionally, the key control module includes: a first control element and a second control element;
the first end of the first control element is connected with the PIO2 pin, and the second end of the first control element is connected with the first power supply pin;
the first end of the second control element is connected with the PIO1 pin, and the second end of the second control element is connected with the second end of the first control element.
Optionally, the key control module further includes:
a first ESD (Electro-Static discharge) electrostatic tube, one end of which is connected with the first end of the first control element, and the other end of which is grounded;
and one end of the second ESD electrostatic tube is connected with the first end of the second control element, and the other end of the second ESD electrostatic tube is grounded.
Optionally, the boosting module includes: a first boosting unit and a second boosting unit;
the power input end of the first boosting unit and the power input end of the second boosting unit are connected with a second power pin of the Bluetooth processing module;
the signal input end of the first boosting unit is connected with a first output end pin of the CSR8670 chip; and the signal input end of the second boosting unit is connected with a second output end pin of the CSR8670 chip.
Optionally, the first boost unit includes: a first TPS61165 chip and a first light emitting element; the second boosting unit includes: a second TPS61165 chip and a second light emitting element;
the first VIN pin of the first TPS61165 chip and the second VIN pin of the second TPS61165 chip are connected with the VCHG pin of the CSR8670 chip;
a first CTRL pin of the first TPS61165 chip is connected with the PIO7 pin, a first SW pin of the first TPS61165 chip is connected with an LED_RP pin of the first light-emitting element, a first FB pin is connected with an LED_RN pin of the first light-emitting element, and a first COMP pin and a first GND pin of the first TPS61165 chip are both grounded;
the second CTRL pin of the second TPS61165 chip is connected with the PIO22 pin, the second SW pin of the second TPS61165 chip is connected with the LED_LP pin of the second light-emitting element, the second FB pin is connected with the LED_LN pin of the second light-emitting element, and the second COMP pin and the second GND pin of the second TPS61165 chip are both grounded.
Optionally, the first boost unit further includes: a first inductor and a first schottky diode;
the first end of the first inductor is connected with the first VIN pin, and the second end of the first inductor is connected with the first SW pin; the anode of the first Schottky diode is connected with the second end of the first inductor, and the cathode of the first Schottky diode is connected with the LED_RP pin of the first light-emitting element;
the second boosting unit further includes: a second inductor and a second schottky diode;
the first end of the second inductor is connected with the second VIN pin, and the second end of the second inductor is connected with the second SW pin; the positive pole of the second Schottky diode is connected with the second end of the second inductor, and the negative pole of the second Schottky diode is connected with the LED_LP pin of the second light-emitting element.
Optionally, the key control module further includes: the third control element is suitable for being connected with an external power supply and used for starting the Bluetooth processing module according to user input;
one end of the third control element is connected with the external power supply, and the other end of the third control element is connected with a VREGEN pin of the CSR8670 chip.
A second aspect of an embodiment of the present application provides an earphone comprising an ear shell and an ear shell shaping control device as set forth in any one of the first aspects of the above embodiments connected to the ear shell;
the earmuffs are of a closed cavity structure;
the earphone also comprises silica gel, wherein the silica gel is distributed in the closed cavity structure;
the earmuff shaping control device is used for heating and shaping the silica gel in the earmuff.
Compared with the prior art, the middle ear muff shaping control device and the earphone have the beneficial effects that: in this embodiment, the key control module controls the bluetooth processing module to connect to the power supply device according to the user input to charge, the bluetooth processing module outputs the first voltage to the boosting module, and the boosting module boosts the first voltage to the second voltage and carries out heating shaping on the earmuff according to the second voltage, so that the shaped earmuff is matched with the auricle of the user, and the user wearing the headset is more comfortable and is not easy to fall down during exercise.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an ear muff shaping control device according to an embodiment of the present application;
fig. 2 is a schematic circuit diagram of an ear muff shaping control device according to an embodiment of the present application;
fig. 3 is a schematic circuit diagram of a bluetooth processing module according to an embodiment of the present application;
fig. 4 is a schematic circuit diagram of a first boost unit according to an embodiment of the present application;
fig. 5 is a schematic circuit diagram of a second boost unit according to an embodiment of the present application;
fig. 6 is a schematic diagram of an implementation flow of heating an ear shell by the ear shell shaping control device according to the embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
In order to illustrate the technical scheme of the application, the following description is made by specific examples.
Example 1
Referring to fig. 1, an ear muff shaping control device provided by an embodiment of the application includes a key control module 100, a bluetooth processing module 200 and a boost module 300.
The key control module 100 is connected with the Bluetooth processing module 200, and controls the Bluetooth processing module 200 to be connected with a power supply device according to user input; the power supply device is used for supplying power to the bluetooth processing module 200.
The bluetooth processing module 200 is connected to the boosting module 300, and outputs a first voltage to the boosting module 300.
The boosting module 300 is adapted to be connected to an ear shell, boost the first voltage to a second voltage, and heat-fix the ear shell according to the second voltage.
According to the earmuff shaping control device, the earmuff is heated and shaped through the boosting module 300, so that the shape of the earmuff shaping is matched with the shape of the auricle of a user, and the user can feel more comfortable when wearing the earphone and is not easy to fall off during exercise.
Wherein, above-mentioned earmuff includes right earmuff and left earmuff.
Further, referring to fig. 2 and 3, in one embodiment, the bluetooth processing module 200 includes a CSR8670 chip, and when the bluetooth processing module 200 performs charging, the CSR8670 chip receives the charging signal and outputs the first voltage to the boost module 300.
The PIO1 pin, the PIO2 pin and the first power supply pin of the CSR8670 chip are all connected with the key control module 300; the first output pin, the second output pin and the second power pin of the CSR8670 chip are all connected with the boost module 300.
Specifically, referring to fig. 3, the first output pin of the CSR8670 chip includes a PIO7 pin.
The second output pin of the CSR8670 chip includes a PIO22 pin.
The second power pin of the CSR8670 chip includes a VCHG pin. The VCHG pin is configured to output the first voltage to the boost module 300.
The first power pin of the CSR8670 chip may include a VDD pin.
Optionally, the CSR8670 chip may further include a first sound output pin and a second sound output pin. The first sound output pin comprises an SPKR_RN pin and an SPKR_RP pin, and is used for being connected with the right horn. The second sound output pin includes a SPKR_LN pin and a SPKR_LP pin for connection with a left horn.
Optionally, the bluetooth processing module 200 further includes a storage unit. The storage unit is used for storing an operation program of the bluetooth processing module 200; the running program is used to control the bluetooth processing module 200 to output the first voltage to the boost module 300, and may also be used to convert a sound signal into a sound for transmitting to a user, and may also implement other functions of the bluetooth processing module 200, such as a call function, etc.
The memory cells may include SST26WF080B chips.
The VDD pin of the SST26WF080B chip is connected with the VDD pin of the CSR8670 chip, the CE pin of the SST26WF080B chip is connected with the PIO23 pin of the CSR8670 chip, the SO pin of the SST26WF080B chip is connected with the PIO26 pin of the CSR8670 chip, the WP pin of the SST26WF080B chip is connected with the PIO27 pin of the CSR8670 chip, the HOLD pin of the SST26WF080B chip is connected with the PIO28 pin of the CSR8670 chip, the SCK pin of the SST26WF080B chip is connected with the PIO21 pin of the CSR8670 chip, the SI pin of the SST26WF080B chip is connected with the PIO25 pin of the CSR8670 chip, and the VSS pin of the SST26WF080B chip is grounded.
Optionally, the bluetooth processing module 200 may further include a signal receiving unit. The signal receiving unit is configured to receive a connection signal sent by the mobile terminal to the bluetooth processing module 200, or may be configured to receive a control signal sent by the mobile terminal to the bluetooth processing module 200.
The signal receiving unit may be connected to a bt_rf pin of the CSR8670 chip.
Optionally, the bluetooth processing module 200 may further include a software burning unit. The software programming unit is configured to program a software program to the bluetooth processing module 200; the software program may be used to control the bluetooth processing module 200 to output the first voltage to the boost module 300, or may be used to convert a sound signal into a sound for transmitting to a user, or may implement a call function, etc.
The software burning unit can be respectively connected with an SD_OUT pin, an SD_IN pin, a WS pin, an SCK pin and an SPI_PCM# pin of the CSR8670 chip.
Optionally, the bluetooth processing module 200 may further include an LED (Light Emitting Diode ) reminding unit. When the user operates the key control module 100, the LED lamps of the LED reminding unit remind the user that the operation is successful or is being performed, the reminding status of the LED lamps included in the LED reminding unit may be changed to be bright or flash, preferably, the number of the LED lamps is three, which are used for reminding the operation of the first control element and the second control element of the key control module 100, and also may be used for reminding the operation of the third control element of the key control module 100. In this embodiment, the reminding state of the LED lamps is not limited, and the number of the LED lamps is not limited.
The LED reminding unit can be respectively connected with an LED_0 pin, an LED_1 pin and an LED_2 pin of the CSR8670 chip.
Optionally, the bluetooth processing module 200 may further include a voice call unit. The voice call unit is used for realizing the voice call function of a user and the mobile terminal through the earphone. The voice call unit is further adapted to be connected to a microphone.
The power input end of the voice call unit is connected with the PIO6 pin of the CSR8670 chip, the clock input end of the voice call unit is connected with the PIO14 pin of the CSR8670 chip, and the data input end of the voice call unit is connected with the PIO5 pin of the CSR8670 chip. One end of the microphone is respectively connected with the clock input end and the data input end of the voice call unit, and the other end of the microphone is connected with the power input end of the voice call unit.
Optionally, the bluetooth processing module 200 may further include a power supply unit. The power supply unit is used for providing power for the storage unit, the software burning unit, the LED reminding unit, the voice call unit and the like, and can provide different voltages according to different voltages required by each unit.
The power supply unit may be connected to vdd_audio_drv pin, vdd_aux_1v8 pin, vdd_eflash_1v8 pin, and lx_1v8 pin of the CSR8670 chip, respectively. The vdd_audio_drv pin, the vdd_aux_1v8 pin, the vdd_efash_1v8 pin, and the lx_1v8 pin may be used as the first power supply pin of the CSR8670 chip.
Further, in one embodiment, the key control module 100 includes: a first control element S2 and a second control element S4.
The first end of the first control element S2 is connected to the PIO2 pin, and the second end of the first control element S2 is connected to the first power pin.
The first end of the second control element S4 is connected to the PIO1 pin, and the second end of the second control element S4 is connected to the second end of the first control element S2.
The control element can be a key switch and is mainly used for controlling the Bluetooth processing module to be connected with the power supply device according to user input, and can also be used for controlling the volume of sound according to the user input.
Optionally, the key control module 100 further includes: a first ESD electrostatic tube D2 and a second ESD electrostatic tube D4. The first ESD electrostatic tube D2 is configured to eliminate static electricity existing in the first control element S2; the second ESD electrostatic tube D4 is used for eliminating static electricity existing in the second control element S4.
One end of the first ESD electrostatic tube D2 is connected to the first end of the first control element S2, and the other end of the first ESD electrostatic tube D2 is grounded. One end of the second ESD electrostatic tube D4 is connected to the first end of the second control element S4, and the other end of the second ESD electrostatic tube D4 is grounded.
Optionally, the key control module 100 further includes: a first resistor R4 and a second resistor R6. The first resistor R4 is used for dividing the voltage output by the bluetooth processing module 200, and the second resistor R6 is used for dividing the voltage output by the key control module 100.
One end of the first resistor R4 is connected to the first end of the first control element S2, and the other end of the first resistor R4 is connected to a PIO2 pin of the CSR8670 chip.
One end of the second resistor R6 is connected to the first end of the second control element S4, and the other end of the second resistor R6 is connected to the PIO1 pin of the CSR8670 chip.
Further, in one embodiment, the key control module 100 further includes a third control element S1. The third control element S1 is adapted to be connected to an external power source, and is used for turning on the bluetooth processing module 200 according to a user input, i.e. is used as a power-on control element of the bluetooth processing module 200, and is also used for turning on a voice call of the mobile terminal when the bluetooth processing module 200 is connected to the mobile terminal.
One end of the third control element S1 is connected to the external power supply, and the other end of the third control element S1 is connected to the VREGEN pin of the CSR8670 chip.
Optionally, the key control module 100 further includes an ESD electrostatic tube D6 and a resistor R13.
One end of the ESD electrostatic tube D6 is connected with the external power supply, and the other end of the ESD electrostatic tube D6 is grounded. One end of the resistor R13 is connected to the external power supply, the other end is connected to one end of the third control element S1, and the third control element S1 is connected to the external power supply through the resistor R13.
Preferably, in this embodiment, the resistances of the first resistor R4, the second resistor R6, and the resistor R13 are 10kΩ.
Further, referring to fig. 4 and 5, in one embodiment, the boost module 300 includes a first boost unit 301 and a second boost unit 302, the first boost unit 301 is used to heat the right ear canal, and the second boost unit 302 is used to heat the left ear canal.
The power input end of the first voltage boosting unit 301 and the power input end of the second voltage boosting unit 302 are connected with the second power pin of the CSR8670 chip.
The signal input end of the first boost unit 301 is connected with a first output end pin of the CSR8670 chip; the signal input end of the second boost unit 302 is connected to the second output end pin of the CSR8670 chip.
Optionally, the first boost unit 301 includes: a first TPS61165 chip and a first light emitting element; the second boosting unit 302 includes: a second TPS61165 chip and a second light emitting element.
The right earmuff and the left earmuff are of a closed cavity structure, and silica gel is fully distributed in the closed cavity structure. The first light-emitting element is arranged inside the closed cavity structure of the right earcap and is used for heating and shaping the silica gel in the right earcap according to the second voltage. The second light-emitting element is arranged inside the closed cavity structure of the left earmuff and is used for heating and shaping the silica gel in the left earmuff according to the second voltage.
Specifically, a first VIN pin of the first TPS61165 chip is connected to a VCHG pin of the CSR8670 chip, and a second VIN pin of the second TPS61165 chip is connected to a VCHG pin of the CSR8670 chip. The first VIN pin of the first TPS61165 chip is the power input terminal of the first booster unit 301, and the second VIN pin of the second TPS61165 chip is the power input terminal of the second booster unit 302.
The first CTRL pin of the first TPS61165 chip is connected with the PIO7 pin, the first SW pin of the first TPS61165 chip is connected with the LED_RP pin of the first light-emitting element, the first FB pin of the first TPS61165 chip is connected with the LED_RN pin of the first light-emitting element, and the first COMP pin and the first GND pin of the first TPS61165 chip are both grounded.
The second CTRL pin of the second TPS61165 chip is connected to the PIO22 pin, the second SW pin of the second TPS61165 chip is connected to the led_lp pin of the second light emitting element, the second FB pin of the second TPS61165 chip is connected to the led_ln pin of the second light emitting element, and the second COMP pin and the second GND pin of the second TPS61165 chip are both grounded.
Further, the first boosting unit 301 may further include a first inductor L1 and a first schottky diode D0.
A first end of the first inductor L1 is connected with a first VIN pin of the first TPS61165 chip, and a second end of the first inductor L1 is connected with a first SW pin of the first TPS61165 chip; the positive pole of the first schottky diode D0 is connected to the second end of the first inductor L1, and the negative pole of the first schottky diode D0 is connected to the led_rp pin of the first light emitting element.
The second boosting unit 302 may further include a second inductor L2 and a second schottky diode D1.
The first end of the second inductor L2 is connected with the second VIN pin of the second TPS61165 chip, and the second end of the second inductor L2 is connected with the second SW pin of the second TPS61165 chip; the positive electrode of the second schottky diode D1 is connected to the second end of the second inductor L2, and the negative electrode of the second schottky diode D1 is connected to the led_lp pin of the second light emitting element.
Alternatively, the first boosting unit 301 may further include a first protection capacitor C1, a second protection capacitor C2, a third protection capacitor C3, and a first protection resistor R1.
The first VIN pin is grounded through the first protection capacitor C1, the first COMP pin is grounded through the second protection capacitor C2, the first SW pin is grounded through the third protection capacitor C3, and the first FB pin is grounded through the first protection resistor R1.
Optionally, the second boost unit 302 may further include a fourth protection capacitor C4, a fifth protection capacitor C5, a sixth protection capacitor C6, and a second protection resistor R2.
The second VIN pin is grounded through the fourth protection capacitor C4, the second COMP pin is grounded through the fifth protection capacitor C5, the second SW pin is grounded through the sixth protection capacitor C6, and the second FB pin is grounded through the second protection resistor R2.
Referring to fig. 6, a specific process of implementing the ear muff shaping is described in conjunction with the ear muff shaping control device, which is described in detail as follows:
s601, the bluetooth processing module 200 is controlled to be connected to a power supply device according to the key control module 100 input by the user, and the power supply device is used for charging the bluetooth processing module 200.
Specifically, the user types in the first control element S2 and the second control element S4 at the same time, wherein the time of simultaneously typing in the first control element S2 and the second control element S4 reaches the first preset time, and the bluetooth processing module 200 is connected to a power supply device, and the power supply device is used for charging the bluetooth processing module 200. The power supply device may be a charging power supply such as a charger or a charger directly connected to the bluetooth processing module 200, or may be a mobile terminal. For example, the bluetooth processing module 200 is connected to a mobile terminal, the mobile terminal stores electric energy, and the stored electric energy is transmitted to the bluetooth processing module 200 for charging. The mobile terminal can comprise a tablet personal computer, a mobile phone and other terminals.
Preferably, the first preset time is 10S, and when the user types in the first control element S2 and the second control element S4 at the same time for a time greater than or equal to 10S, the bluetooth processing module 200 is connected to a power supply device, and the power supply device charges the bluetooth processing module 200. It should be understood that the first preset time of 10S in this embodiment is merely illustrative of the first preset time, and the first preset time is not limited to 10S.
Alternatively, the first control element S2 and the second control element S4 may also be configured to increase or decrease the sound volume output by the bluetooth processing module 200.
Optionally, before controlling the bluetooth processing module 200 to connect to the power supply device according to the user input key control module 100 further includes:
the control module 100 controls the key control module 100 to turn on the bluetooth processing module 200 according to user input.
Specifically, when the user types in the third control element S1, the bluetooth processing module 200 is powered on, i.e. enters a working state, i.e. the third control element S1 may be used as a power on key of the bluetooth processing module 200.
S602, the bluetooth processing module 200 outputs a first voltage to the boosting module 300.
Specifically, when the power supply device charges the bluetooth processing module 200, the bluetooth processing module 200 obtains the voltage of the charging device, the bluetooth processing module 200 controls the first CTRL pin of the first TPS61165 chip to be at a high level through the PIO7 pin of the CSR8670 chip, and the bluetooth processing module 200 controls the second CTRL pin of the second TPS61165 chip to be at a high level through the PIO22 pin of the CSR8670 chip.
After the first CTRL pin and the second CTRL pin are both at the high level, the bluetooth processing module 200 provides the first voltage to the first VIN pin of the first TPS61165 chip, that is, the first voltage to the first boosting unit 301, through the VCHG pin of the CSR8670 chip; the bluetooth processing module 200 provides the first voltage to the second VIN pin of the second TPS61165 chip, that is, the first voltage to the second boosting unit 302, through the VCHG pin of the CSR8670 chip. Preferably, the first voltage is 5V.
And S603, the boosting module 300 boosts the first voltage to a second voltage, and carries out heating shaping on the earmuff according to the second voltage.
Specifically, after the bluetooth processing module 200 outputs the first voltage to the voltage boosting module 300, the first voltage boosting unit 301 boosts the first voltage to the second voltage, that is, the voltages at the two ends of the first SW pin and the first FB pin of the first TPS61165 chip are the second voltage; the second step-up unit 302 steps up the first voltage to the second voltage, that is, the voltages at the two ends of the second SW pin and the second FB pin of the second TPS61165 chip are the second voltage.
The second voltage is used for heating and shaping the earmuffs connected with the boost module 300, that is, the first SW pin and the two ends of the first FB pin of the first TPS61165 chip input the second voltage to the two ends of the first light emitting element, the first light emitting element heats and shapes the right earmuffs according to the second voltage, the second SW pin and the two ends of the second FB pin of the second TPS61165 chip input the second voltage to the two ends of the second light emitting element, and the second light emitting element heats and shapes the left earmuffs according to the second voltage.
Optionally, the boosting module 300 boosts the first voltage to a second voltage, and after performing heat setting on the ear sleeve according to the second voltage, the method further includes:
the time for the boost module 300 to heat the ear socket is a second preset time, when the time for the boost module 300 to heat the ear socket reaches the second preset time, the bluetooth processing module 200 controls the first CTRL pin to be at a low level through the PIO7 pin of the CSR8670 chip, controls the second CTRL pin to be at a low level through the PIO22 pin of the CSR8670 chip, and the bluetooth processing module 200 stops providing the first voltage to the boost module 300. Preferably, the second preset time may be 60S, and when the time for heating the earmuff by the boost module 300 reaches 60S, the first CTRL pin and the second CTRL pin are at low level. It should be understood that the second preset time of 60S in this embodiment is merely illustrative of the second preset time, and the second preset time is not limited to 60S.
After the bluetooth processing module 200 stops providing the first voltage to the voltage boosting module 300, the first light emitting element and the second light emitting element will not emit light and heat, the ear muff will not continue to be heated, and the ear muff gradually becomes a fixed shape due to the decrease of the temperature, i.e. the ear muff is shaped.
Alternatively, the user may wear the ear cap before controlling the bluetooth processing module 200 to connect with the power supply device through the key control module 100, where the ear cap does not conform to the shape of the auricle of the user, and after the first control element S2 and the second control element S4 of the key control module 100 are simultaneously keyed in to reach the first preset time, the bluetooth processing module 200 is connected with the power supply device, and provides the first voltage to the boosting module 300, and the boosting module 300 boosts the first voltage to the second voltage, and performs heat setting on the ear cap according to the second voltage. At this time, the ear muff becomes soft gradually due to heating, and as the shape of the auricle of the user changes, after the boost module 300 heats the ear muff for the second preset time, the bluetooth processing module 200 controls the first CTRL pin and the second CTRL pin to be at a low level through the PIO7 pin of the CSR8670 chip. The boosting module 300 stops heating the earmuff, and the earmuff gradually becomes solid as the temperature decreases, and at this time, the shape of the earmuff is consistent with the shape of the auricle of the user, i.e. the earmuff is shaped.
Alternatively, the user may also wear the ear muff after the ear muff has been softened by the boost module 300.
In this embodiment, the key control module 100 controls the bluetooth processing module 200 to connect to the power supply device according to the user input to charge, the bluetooth processing module 200 outputs the first voltage to the boost module 300, and the boost module 300 boosts the first voltage to the second voltage and heats the ear shell according to the second voltage, so that the shape of the shaped ear shell is matched with the shape of the auricle of the user, and the user wearing the earphone is more comfortable and is not easy to fall down during exercise.
Example two
The embodiment provides an earphone, which comprises an earmuff and the earmuff shaping control device connected with the earmuff, wherein the earmuff shaping control device is provided in any one of the first embodiment, and has the beneficial effects of the earmuff shaping control device.
The earmuff is of a closed cavity structure, and the first light-emitting element and the second light-emitting element which are included in the boosting module are arranged in the closed cavity structure. The earphone also comprises silica gel, and the silica gel is distributed in the closed cavity structure.
The earmuff shaping control device is used for heating and shaping the silica gel in the earmuff.
Specifically, the earmuff comprises a left earmuff and a right earmuff, the first light-emitting element is arranged in a closed cavity of the right earmuff, and the first light-emitting element is used for heating and shaping silica gel in the right earmuff according to the second voltage; the second light-emitting element is arranged in the closed cavity of the left earmuff and is used for heating and shaping the silica gel in the left earmuff according to the second voltage.
The silica gel is solid under the condition of room temperature, and becomes liquid when the temperature after being heated is higher than the room temperature. Namely, when the earmuff shaping device in the first embodiment heats and shapes the earmuff, the silica gel in the earmuff becomes soft gradually due to the temperature rise and becomes liquid gradually, and as the shape of the auricle of the user changes, after the earmuff shaping device stops heating the earmuff, the temperature of the earmuff gradually drops to room temperature, and the silica gel in the earmuff becomes solid gradually, and at the moment, the shape of the earmuff is consistent with the shape of the auricle of the user.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (6)
1. An earmuff shaping control device, comprising: the Bluetooth device comprises a key control module, a Bluetooth processing module and a boosting module;
the key control module is connected with the Bluetooth processing module and used for controlling the Bluetooth processing module to be connected with a power supply device according to user input; the power supply device is used for providing power supply for the Bluetooth processing module;
the Bluetooth processing module is connected with the boosting module and outputs a first voltage to the boosting module;
the boosting module is suitable for being connected with the earmuffs, boosting the first voltage into the second voltage and heating and shaping the earmuffs according to the second voltage;
the Bluetooth processing module comprises a CSR8670 chip;
the PIO1 pin, the PIO2 pin and the first power supply pin of the CSR8670 chip are all connected with the key control module;
the first output pin, the second output pin and the second power supply pin of the CSR8670 chip are all connected with the boosting module;
the first output pin of the CSR8670 chip comprises: PIO7 pin;
the second output pin of the CSR8670 chip includes: PIO22 pin;
the second power pin of the CSR8670 chip includes: VCHG pin; the VCHG pin is used for outputting the first voltage to the boosting module;
the boost module includes: a first boosting unit and a second boosting unit;
the power input end of the first boosting unit and the power input end of the second boosting unit are connected with a second power pin of the Bluetooth processing module;
the signal input end of the first boosting unit is connected with a first output end pin of the CSR8670 chip; the signal input end of the second boosting unit is connected with a second output end pin of the CSR8670 chip;
the first boosting unit includes: a first TPS61165 chip and a first light emitting element; the second boosting unit includes: a second TPS61165 chip and a second light emitting element;
the first VIN pin of the first TPS61165 chip and the second VIN pin of the second TPS61165 chip are connected with the VCHG pin of the CSR8670 chip;
a first CTRL pin of the first TPS61165 chip is connected with the PIO7 pin, a first SW pin of the first TPS61165 chip is connected with an LED_RP pin of the first light-emitting element, a first FB pin is connected with an LED_RN pin of the first light-emitting element, and a first COMP pin and a first GND pin of the first TPS61165 chip are both grounded;
the second CTRL pin of the second TPS61165 chip is connected with the PIO22 pin, the second SW pin of the second TPS61165 chip is connected with the LED_LP pin of the second light-emitting element, the second FB pin is connected with the LED_LN pin of the second light-emitting element, and the second COMP pin and the second GND pin of the second TPS61165 chip are both grounded.
2. The earmuff shaping control device of claim 1 wherein the key control module comprises: a first control element and a second control element;
the first end of the first control element is connected with the PIO2 pin, and the second end of the first control element is connected with the first power supply pin;
the first end of the second control element is connected with the PIO1 pin, and the second end of the second control element is connected with the second end of the first control element.
3. The earmuff shaping control device of claim 2 wherein the key control module further comprises:
a first ESD electrostatic tube, one end of which is connected with the first end of the first control element, and the other end of which is grounded;
and one end of the second ESD electrostatic tube is connected with the first end of the second control element, and the other end of the second ESD electrostatic tube is grounded.
4. The earmuff shaping control device of claim 1 wherein the first boost unit further comprises: a first inductor and a first schottky diode;
the first end of the first inductor is connected with the first VIN pin, and the second end of the first inductor is connected with the first SW pin; the anode of the first Schottky diode is connected with the second end of the first inductor, and the cathode of the first Schottky diode is connected with the LED_RP pin of the first light-emitting element;
the second boosting unit further includes: a second inductor and a second schottky diode;
the first end of the second inductor is connected with the second VIN pin, and the second end of the second inductor is connected with the second SW pin; the positive pole of the second Schottky diode is connected with the second end of the second inductor, and the negative pole of the second Schottky diode is connected with the LED_LP pin of the second light-emitting element.
5. The earmuff shaping control device of claim 1 wherein the key control module further comprises: the third control element is suitable for being connected with an external power supply and used for starting the Bluetooth processing module according to user input;
one end of the third control element is connected with the external power supply, and the other end of the third control element is connected with a VREGEN pin of the CSR8670 chip.
6. An earphone comprising an ear shell and the ear shell shaping control device according to any one of claims 1 to 5 connected to the ear shell;
the earmuffs are of a closed cavity structure;
the earphone also comprises silica gel, wherein the silica gel is distributed in the closed cavity structure;
the earmuff shaping control device is used for heating and shaping the silica gel in the earmuff.
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| CN201711129235.0A CN109788424B (en) | 2017-11-15 | 2017-11-15 | Ear muff shaping control device and earphone |
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| CN201711129235.0A CN109788424B (en) | 2017-11-15 | 2017-11-15 | Ear muff shaping control device and earphone |
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