CN204668329U - A kind of insulation film of high bonding force - Google Patents
A kind of insulation film of high bonding force Download PDFInfo
- Publication number
- CN204668329U CN204668329U CN201520438447.7U CN201520438447U CN204668329U CN 204668329 U CN204668329 U CN 204668329U CN 201520438447 U CN201520438447 U CN 201520438447U CN 204668329 U CN204668329 U CN 204668329U
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- layer
- insulation film
- bonding force
- high bonding
- substrate layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model discloses a kind of insulation film of high bonding force, comprise substrate layer, the both sides of described substrate layer are provided with plasma treatment layer, weathering layer, high bonding priming coat and EVA adhesive linkage respectively from the inside to the outside successively, and above-mentioned each layer is through the insulation film of the integrally formed one-tenth multi-layer compound structure of high-temperature laminating.The insulation film of the utility model height bonding force has that bonding force is high, good weatherability, contraction is low, insulating properties is lasting advantage, effectively improves cementability and the weatherability of dielectric film in solar module.
Description
Technical field
The utility model relates to solar energy encapsulation technology, specifically refers to a kind of insulation film of high bonding force.
Background technology
When preventing the circuit of cell panel from converging in solar module, with one deck dielectric film, each circuit in cell panel must be separated, separate and also will ensure that shim and connection line can not move simultaneously, also respectively will put one deck photovoltaic EVA or PE up and down so separate.At present, conventional insulator film is all placed with EVA or PE coating up and down, and this kind, in the structure of upper and lower coated EVA or PE of dielectric film and mode, in assembling components process, exists many weak points.Concrete weak point is as follows: 1, EVA or PE coating utilance is low, adds manufacturing cost; 2, the EVA adhesive film percent thermal shrinkage increased is high, easily causes silicon chip shadow to split the increase of defective products; 3, assembling inconvenience, needs insulation strip of aliging in an assembling process, consumes manpower, man-hour; 4, cementability is poor, and bonding force is low, easily occurs the situation that EVA and insulation strip do not bond in an assembling process, and then causes generation displacement in mobile transportation thus cause assembly bad; At the bottom of the weather resistance of 5, conventional insulator film, broken the changing of assembly easily starts to cause from here.
Utility model content
The purpose of this utility model does not need assembling when being to provide a kind of use, and cementability is good, weather resisteant is good, shrinkage is low and the insulation film of the high bonding force of good insulating.
The utility model can be achieved through the following technical solutions:
A kind of insulation film of high bonding force, comprise substrate layer, the both sides of described substrate layer are provided with plasma treatment layer, weathering layer, high bonding priming coat and EVA adhesive linkage respectively from the inside to the outside successively, and above-mentioned each layer is through the insulation film of the integrally formed one-tenth multi-layer compound structure of high-temperature laminating.The insulation film of the utility model height bonding force does not need assembling when using, and puts between photovoltaic back outside terminal box and EVA adhesive film and can use, assemble EVA film again during use on insulation film, easy to use; Insulation film adopts pressing mode that pressing between each layer of EVA cementability and other is connected, and EVA thickness of adhibited layer is thicker, and it is reaching more than 90N/CM with peeling force when solar cell backboard and component lamination, and bonding force is high, and cementability is good; Between substrate layer and EVA adhesive linkage, be provided with weathering layer, effectively increase the weather resistance of insulation film, good weatherability; Each layer is reducing the shrinkage of film under high temperature production process conditions, effectively prevent the appearance that the silicon chip shadow caused because EVA adhesive film percent thermal shrinkage is high splits defective products, increases the yields of product; All arrange plasma treatment layer, weathering layer, high adhesiveness bottom and EVA adhesive linkage in the both sides of substrate layer, effectively increase the insulating properties of insulation film, dielectric film Hygrothermal Aging can reach more than 2000 hours, good insulating, lastingly.
Further, described substrate layer is the polyethylene terephtalate substrate layer of high temperature resistant, high insulation.
Further, described substrate layer thickness is 150 μm ~ 250 μm, and its fracture rate is greater than 90%, and percentage elongation is greater than 100%, good as base material steadiness.
Further, described plasma treatment layer is the plasma treatment layer of high bonding force, and its bonding force is good, effectively promotes the cementability of insulation film.
Further, described weathering layer is the weathering layer adopting chlorotrifluoroethylene to make, and thickness range is 3 μm ~ 8 μm.
Further, the bonding bottom of described height is the bottom of EVA adhesive linkage, and thickness range is 6 μm ~ 15 μm.
Further, the thickness of described EVA adhesive linkage is 20 μm ~ 50 μm, and the thickness of adhesive linkage is thicker, and bonding force is high, effectively improves the cementability of adhesive linkage.
The insulation film of the utility model height bonding force, compared with prior art, has following beneficial effect:
Do not need assembling when the first, using, put between photovoltaic back outside terminal box and EVA adhesive film and can use, during use, on insulation film, assemble EVA film again, easy to use;
The second, cementability is good, bonding force is high, the conventional insulator film equal coated one deck of lower surface EVA or PE thereon in use, it is due to the restriction of coating process and mode, the finite thickness of coating, general below 20 μm, its cementability power is low, cementability is poor, the insulation film of the utility model height bonding force adopts pressing mode that pressing between each layer of EVA cementability and other is connected, and EVA thickness of adhibited layer is 20 μm ~ 50 μm, and it is reaching more than 90N/CM with peeling force when solar cell backboard and component lamination, bonding force is high, and cementability is good;
Three, good weatherability, is provided with chlorotrifluoroethylene weathering layer between substrate layer and EVA adhesive linkage, effectively increases the weather resistance of insulation film, good weatherability;
Four, shrinkage is low, and each layer of the utility model insulation film is reducing the shrinkage of film under high temperature production process conditions, effectively prevent the appearance that the silicon chip shadow caused because EVA adhesive film percent thermal shrinkage is high splits defective products, increases the yields of product;
Five, good insulating, all arrange plasma treatment layer, weathering layer, high adhesiveness bottom and EVA adhesive linkage in the both sides of substrate layer, effectively increase the insulating properties of insulation film, dielectric film Hygrothermal Aging can reach more than 2000 hours, good insulating, lastingly.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of the insulation film of the utility model height bonding force;
Reference numeral is: 1, substrate layer, 2, plasma treatment layer, 3, weathering layer, 4, high adhesiveness bottom, 5, EVA adhesive linkage.
Embodiment
In order to make those skilled in the art person understand the technical solution of the utility model better, below in conjunction with embodiment and accompanying drawing, the utility model product is described in further detail.
As shown in Figure 1, a kind of insulation film of high bonding force, comprises substrate layer, and described substrate layer 1 is the polyethylene terephtalate substrate layer of high temperature resistant, high insulation, and described substrate layer 1 thickness is 150 μm ~ 250 μm.The both sides of described substrate layer 1 are provided with plasma treatment layer 2, weathering layer 3, high bonding priming coat 4 and EVA adhesive linkage 5 respectively from the inside to the outside successively, described plasma treatment layer 2 is the plasma treatment layer of high bonding force, described weathering layer 3 is the weathering layer adopting chlorotrifluoroethylene to make, thickness range is 3 μm ~ 8 μm, the bonding bottom 4 of described height is the bottom of EVA adhesive linkage 5, thickness range is 6 μm ~ 15 μm, and the thickness of described EVA adhesive linkage 5 is 20 μm ~ 50 μm.Above-mentioned each layer under the high temperature conditions, through the insulation film of the integrally formed one-tenth multi-layer compound structure of process for pressing high-temperature laminating, between each layer of this insulation film, pressing connects, pressing stable connection is firm on the one hand, difficult drop-off, there will not be shifting phenomena, EVA adhesive linkage 5 thickness is greater than conventional films coating thickness on the other hand, effectively improves the bonding force of insulation film; Under high temperature production process conditions, reducing the shrinkage of film, effectively prevent the appearance that the silicon chip shadow caused because EVA adhesive film percent thermal shrinkage is high splits defective products, add the yields of product.
The above, be only preferred embodiment of the present utility model, not does any pro forma restriction to the utility model; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the utility model swimmingly; But all those skilled in the art are not departing within the scope of technical solutions of the utility model, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present utility model; Meanwhile, all according to substantial technological of the present utility model to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to the technical solution of the utility model.
Claims (7)
1. the insulation film of a high bonding force, comprise substrate layer, it is characterized in that: the both sides of described substrate layer (1) are provided with plasma treatment layer (2), weathering layer (3), high bonding priming coat (4) and EVA adhesive linkage (5) respectively from the inside to the outside successively, and above-mentioned each layer is through the insulation film of the integrally formed one-tenth multi-layer compound structure of high-temperature laminating.
2. the insulation film of high bonding force according to claim 1, is characterized in that: described substrate layer (1) is the polyethylene terephtalate substrate layer of high temperature resistant, high insulation.
3. the insulation film of high bonding force according to claim 1 and 2, is characterized in that: described substrate layer (1) thickness is 150 μm ~ 250 μm.
4. the insulation film of high bonding force according to claim 1, is characterized in that: the plasma treatment layer that described plasma treatment layer (2) is high bonding force.
5. the insulation film of high bonding force according to claim 1, is characterized in that: described weathering layer (3) is the weathering layer adopting chlorotrifluoroethylene to make, and thickness range is 3 μm ~ 8 μm.
6. the insulation film of high bonding force according to claim 1, is characterized in that: the bottom that the bonding bottom of described height (4) is EVA adhesive linkage (5), and thickness range is 6 μm ~ 15 μm.
7. the insulation film of high bonding force according to claim 1, is characterized in that: the thickness of described EVA adhesive linkage (5) is 20 μm ~ 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520438447.7U CN204668329U (en) | 2015-06-25 | 2015-06-25 | A kind of insulation film of high bonding force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520438447.7U CN204668329U (en) | 2015-06-25 | 2015-06-25 | A kind of insulation film of high bonding force |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204668329U true CN204668329U (en) | 2015-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520438447.7U Expired - Fee Related CN204668329U (en) | 2015-06-25 | 2015-06-25 | A kind of insulation film of high bonding force |
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| Country | Link |
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| CN (1) | CN204668329U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873043A (en) * | 2019-02-28 | 2019-06-11 | 无锡尚德太阳能电力有限公司 | The manufacture craft of solar photovoltaic assembly insulation strip |
-
2015
- 2015-06-25 CN CN201520438447.7U patent/CN204668329U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873043A (en) * | 2019-02-28 | 2019-06-11 | 无锡尚德太阳能电力有限公司 | The manufacture craft of solar photovoltaic assembly insulation strip |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 516008 Guangdong city of Huizhou province Chen Chen Town Village of Baiyun District Patentee after: Guangdong shengpa new materials Limited by Share Ltd Address before: 516008 Guangdong city of Huizhou province Chen Chen Town Village of Baiyun District Patentee before: Huizhou Sinpo New Material Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20200625 |
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| CF01 | Termination of patent right due to non-payment of annual fee |