CN204667314U - A kind of heat sink arrangement and PCI-E card being applicable to PCI-E card - Google Patents
A kind of heat sink arrangement and PCI-E card being applicable to PCI-E card Download PDFInfo
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- CN204667314U CN204667314U CN201520201148.1U CN201520201148U CN204667314U CN 204667314 U CN204667314 U CN 204667314U CN 201520201148 U CN201520201148 U CN 201520201148U CN 204667314 U CN204667314 U CN 204667314U
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- pci
- card
- heat sink
- sink arrangement
- radiator body
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Abstract
The utility model discloses a kind of heat sink arrangement and the PCI-E card that are applicable to PCI-E card, the wherein said heat sink arrangement being applicable to PCI-E card, comprise the radiator body be fixedly installed on feature board, described radiator body middle position is provided with a mounting groove, described mounting groove inside is provided with fan module by fan fixing rack, described radiator body is provided with and organizes heat radiator more, radiator body top is provided with stainless steel upper cover.This kind is applicable to the heat sink arrangement of PCI-E card and PCI-E jig has structure simple, highly versatile, uses flexibly, convenient, good heat dissipation effect, the advantages not available for prior art such as production cost is low.
Description
Technical field
The utility model relates to PCI-E card application, particularly a kind of heat sink arrangement and PCI-E card being applicable to PCI-E card.
Background technology
PCI-Express is up-to-date bus and interface standard, belong to the point-to-point binary channels high bandwidth transmission of high speed serialization, the equipment distribution connected exclusively enjoys channel bandwidth, not shared bus bandwidth, main support active power management, error reporting, end-to-end reliability transmission, the functions such as hot plug and service quality (QOS).PCI-E provides the dimensional structure of standard, specification requirement.Enter choosing of hardware and layout according to the specification of PCI-E and structure, due to each block PCI-E card function and require it is different, so the hardware that will exist selected by each PCI-E card is all not identical with layout.By the actual result emulating out designed by Hardware Engineer and Thermal Engineer, the structure that we must design applicable each block PCI-E card itself carries out dispelling the heat and assembling.And all independently version can be there is in each block PCI-E card.Existing heat abstractor ubiquity poor universality, apply the shortcomings such as dumb, complex structure, production cost are high.
In view of this, the purpose of this utility model is to provide a kind of new technical scheme to solve existing technical matters.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of heat sink arrangement and the PCI-E card that are applicable to PCI-E card, solves prior art poor universality, complex structure, high in cost of production technological deficiency.
The utility model solves the technical scheme that its technical matters adopts:
A kind of heat sink arrangement being applicable to PCI-E card, comprise the radiator body be fixedly installed on feature board, described radiator body middle position is provided with a mounting groove, described mounting groove inside is provided with fan module by fan fixing rack, described radiator body is provided with and organizes heat radiator more, radiator body top is provided with stainless steel upper cover.
As the improvement of technique scheme, described radiator body is fixed on feature board by spring plastic cement pin.
As the further improvement of technique scheme, described fan fixing rack, fan module and stainless steel upper cover are fixedly mounted on radiator body by fixing gib screw.
As the further improvement of technique scheme, described radiator body is provided with the bottom through-hole being matched with fan module bottom its mounting groove.
As the further improvement of technique scheme, described fan module comprises radiator fan and fixes the fan Fixture of this radiator fan, described stainless steel upper cover offers the fan air holes of location matches radiator fan on fan module.
There is a PCI-E card for heat sink arrangement, comprise above-mentioned a kind of heat sink arrangement being applicable to PCI-E card, also comprise the feature board coordinated with heat sink arrangement.
As the improvement of technique scheme, described feature board is the pcb board being provided with chip, the chip top on described pcb board and the bottom of radiator body mutually against.
As the further improvement of technique scheme, between the chip top on described pcb board and the bottom of radiator body, be provided with heat conductive silica gel.
As the further improvement of technique scheme, described feature board sidepiece is provided with panel.
As the further improvement of technique scheme, described panel is the sheet metal component of surface through electroplating processes.
As the further improvement of technique scheme, described panel is screwed in feature board sidepiece.
The beneficial effects of the utility model are: the utility model provides a kind of heat sink arrangement and the PCI-E card that are applicable to PCI-E card, the heat sink arrangement being wherein applicable to PCI-E card is independently cooling system, its version is adapted to any PCIE card, highly versatile, applying flexible, convenience, its structure is simple, and production cost is low; Because this kind of heat sink arrangement can chip all on covering function plate be provided with blower module, therefore it can effectively promote its radiating effect when applying, and heat-sinking capability greatly promotes.The heat sink arrangement of this all PCI-E of being applicable to card and PCI-E card solve prior art poor universality, complex structure, high in cost of production technological deficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structural representation of the heat sink arrangement being applicable to PCI-E card in the utility model;
Fig. 2 is the structure broken away view of the heat sink arrangement being applicable to PCI-E card in the utility model;
Fig. 3 is the structural representation of the PCI-E card in the utility model with heat sink arrangement;
Fig. 4 is the structure broken away view of the PCI-E card in the utility model with heat sink arrangement;
Fig. 5 is the structural representation of radiator body in the utility model;
Fig. 6 is the structural representation of the utility model fan module;
Fig. 7 has the PCI-E of heat sink arrangement to be stuck in the structural representation after removing stainless steel upper cover in the utility model.
Embodiment
Be clearly and completely described below with reference to embodiment and the accompanying drawing technique effect to design of the present utility model, concrete structure and generation, to understand the purpose of this utility model, characteristic sum effect fully.Obviously; described embodiment is a part of embodiment of the present utility model, instead of whole embodiment, based on embodiment of the present utility model; other embodiments that those skilled in the art obtains under the prerequisite not paying creative work, all belong to the scope of the utility model protection.In addition, all connection/annexations related in patent, not singly refer to that component directly connects, and refer to and according to concrete performance, can connect auxiliary by adding or reducing, and form more excellent draw bail.The utility model create in each technical characteristic, can combination of interactions under the prerequisite of not conflicting conflict, with reference to Fig. 1-7.
A kind of heat sink arrangement being applicable to PCI-E card, comprise the radiator body 2 be fixedly installed on feature board 1, described radiator body 2 middle position is provided with a mounting groove 21, described mounting groove 21 inside is provided with fan module 4 by fan fixing rack 3, described radiator body 2 is provided with many group heat radiator 22, radiator body 2 top is provided with stainless steel upper cover 5.
Preferably, described radiator body 2 is fixed on feature board 1 by spring plastic cement pin 6.
Preferably, described fan fixing rack 3, fan module 4 and stainless steel upper cover 5 is fixedly mounted on radiator body 2 by fixing gib screw 7.
Preferably, described radiator body 2 is provided with the bottom through-hole 23 being matched with fan module 4 bottom its mounting groove 21.
Preferably, described fan module 4 comprises radiator fan 41 and fixes the fan Fixture 42 of this radiator fan 41, described stainless steel upper cover 5 offers the fan air holes 51 of location matches radiator fan 41 on fan module 4.
Based on above-mentioned a kind of heat sink arrangement being applicable to PCI-E card, the utility model also provides a kind of PCI-E card with heat sink arrangement, comprises above-mentioned a kind of heat sink arrangement being applicable to PCI-E card, also comprises the feature board 1 coordinated with heat sink arrangement.
Preferably, described feature board 1 for being provided with the pcb board of chip, the chip top on described pcb board and the bottom of radiator body 2 mutually against.
Preferably, heat conductive silica gel is provided with between the chip top on described pcb board and the bottom of radiator body 2.
Preferably, described feature board 1 sidepiece is provided with panel 8.
Preferably, described panel 8 is the sheet metal component of surface through electroplating processes.
Preferably, described panel 8 is fixed on feature board 1 sidepiece by screw 9.
When assembling, first feature board 1 is positioned on platform; Panel 8 is directly snapped in feature board 1 assigned address, use screw 9 to be fixed on feature board 1; Secondly radiator body 2 and fan fixing rack 3 being assembled as a whole by gib screw 7, in four holes of radiator body 2 surrounding, inserting ready spring plastic cement pin 6, in order to using in subsequent step; Again fan module 4 is fixed on radiator body 2 by gib screw 7; Ready two parts assembly is combined by spring plastic cement pin 6, before combination, coats heat-conducting glue at feature board 1 chip place.
Difference and the advantage of other similar patent of contrast of the present utility model are: the utility model adopts independently cooling system, its version is adapted to any PCIE card: because the feature board 1 of PCIE card can be divided into total length overall height by size, total length half is high, half long overall height, half long half high type, its PCB layout will be able to set according to hardware and functional requirement, and the design of this heat spreader structures covers whole PCB comprehensively, can carry out contact heat radiation according to the position of its main element; Spring plastic cement pin 6 fixed form is more convenient and practical, and cost is more cheap: in large-scale board, the fixed form of heating radiator can select screw to add the form of support locking usually, the utility model fully takes into account the layout optimization of hardware and the complexity of assembling and cost, have employed the fixed form of spring plastic cement pin 6, the firm of structure can be ensured, occupy little plate space of planes simultaneously, greatly reduce accessory cost and decrease assembly process; The perforation structure of radiator body 2 can increase the flow of heat radiation: in heating radiator, the effect of radiator fan 41 is the flowing promoting air, the heat on radiator body 2 is walked by airstrip, the discharge relation of air is to the effect of dispelling the heat, the utility model can make air enter radiator body 2 from bottom by perforation in the punch format of design, first the flow of air is added, secondly also can take away the heat of surrounding component itself in the process that air upwards flows in bottom, reach double effect; The existence of stainless steel upper cover 5 ensure that the overall appearance of heating radiator, also play simultaneously control flow check to effect.
More than that better enforcement of the present utility model is illustrated, but the utility model is created and is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit, and these equivalent distortion or replacement are all included in the application's claim limited range.
Claims (10)
1. one kind is applicable to the heat sink arrangement of PCI-E card, it is characterized in that: comprise the radiator body (2) be fixedly installed on feature board (1), described radiator body (2) middle position is provided with a mounting groove (21), described mounting groove (21) inside is provided with fan module (4) by fan fixing rack (3), described radiator body (2) is provided with and organizes heat radiator (22) more, radiator body (2) top is provided with stainless steel upper cover (5).
2. a kind of heat sink arrangement being applicable to PCI-E card according to claim 1, is characterized in that: described radiator body (2) is fixed on feature board (1) by spring plastic cement pin (6).
3. a kind of heat sink arrangement being applicable to PCI-E card according to claim 1 and 2, is characterized in that: described fan fixing rack (3), fan module (4) and stainless steel upper cover (5) are fixedly mounted on radiator body (2) by fixing gib screw (7).
4. a kind of heat sink arrangement being applicable to PCI-E card according to claim 3, is characterized in that: described radiator body (2) is provided with in its mounting groove (21) bottom the bottom through-hole (23) being matched with fan module (4).
5. a kind of heat sink arrangement being applicable to PCI-E card according to claim 4, it is characterized in that: described fan module (4) comprises radiator fan (41) and fixes the fan Fixture (42) of this radiator fan (41), described stainless steel upper cover (5) offers location matches in the fan air holes (51) of the upper radiator fan (41) of fan module (4).
6. there is a PCI-E card for heat sink arrangement, it is characterized in that: comprise a kind of heat sink arrangement being applicable to PCI-E card described in any one of claim 1-4, also comprise the feature board (1) coordinated with heat sink arrangement.
7. a kind of PCI-E card with heat sink arrangement according to claim 6, is characterized in that: described feature board (1) for being provided with the pcb board of chip, the bottom of the chip top on described pcb board and radiator body (2) mutually against.
8. a kind of PCI-E card with heat sink arrangement according to claim 7, is characterized in that: be provided with heat conductive silica gel between the bottom of the chip top on described pcb board and radiator body (2).
9. a kind of PCI-E card with heat sink arrangement according to any one of claim 6-8, is characterized in that: described feature board (1) sidepiece is provided with panel (8).
10. a kind of PCI-E card with heat sink arrangement according to claim 9, is characterized in that: described panel (8) is the sheet metal component of surface through electroplating processes, and described panel (8) is fixed on feature board (1) sidepiece by screw (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201148.1U CN204667314U (en) | 2015-04-03 | 2015-04-03 | A kind of heat sink arrangement and PCI-E card being applicable to PCI-E card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201148.1U CN204667314U (en) | 2015-04-03 | 2015-04-03 | A kind of heat sink arrangement and PCI-E card being applicable to PCI-E card |
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| Publication Number | Publication Date |
|---|---|
| CN204667314U true CN204667314U (en) | 2015-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520201148.1U Active CN204667314U (en) | 2015-04-03 | 2015-04-03 | A kind of heat sink arrangement and PCI-E card being applicable to PCI-E card |
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| CN (1) | CN204667314U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109799869A (en) * | 2019-01-24 | 2019-05-24 | 中国人民解放军火箭军工程大学 | 2 channel 5.0Gsps 12bit PCI ExpressGen3FPGA of one kind |
-
2015
- 2015-04-03 CN CN201520201148.1U patent/CN204667314U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109799869A (en) * | 2019-01-24 | 2019-05-24 | 中国人民解放军火箭军工程大学 | 2 channel 5.0Gsps 12bit PCI ExpressGen3FPGA of one kind |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |