CN204652320U - A kind of miniaturized multilayer bluetooth band pass filter - Google Patents
A kind of miniaturized multilayer bluetooth band pass filter Download PDFInfo
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- CN204652320U CN204652320U CN201520246744.1U CN201520246744U CN204652320U CN 204652320 U CN204652320 U CN 204652320U CN 201520246744 U CN201520246744 U CN 201520246744U CN 204652320 U CN204652320 U CN 204652320U
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- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 230000001939 inductive effect Effects 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 230000001629 suppression Effects 0.000 abstract description 5
- 230000002146 bilateral effect Effects 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The utility model relates to a kind of miniaturized multilayer bluetooth band pass filter, this LC filter is duplexer, its surface of duplexer is provided with outside input and output electrode and external ground electrode, duplexer comprises two resonators, ground shield and cross capacitance sheet, two resonators are connected with described external ground electrode respectively, and two resonator connections parallel with one another, the inductive part of two resonators forms electromagnetic coupled, form a cascade inductance coupling high, outside input and output electrode is arranged respectively capacitive coupling and export interior electrode, in cross capacitance sheet and described two pieces of capacitive coupling export, electrode forms the vertical cross capacitance that is coupled, ground shield is connected with external ground electrode.Miniaturized multilayer bluetooth band pass filter of the present utility model, effectively achieves bilateral suppression, and the inductance crossing hole pattern is relatively loose to technological requirement, allows certain off normal amplitude.
Description
Technical field
The utility model relates to a kind of microwave communication system, especially relates to a kind of miniaturized multilayer bluetooth band pass filter.
Background technology
Existing multi-layer ceramics band pass filter structurally adopts planar design mostly, and certain electrical length strip line and load capacitance form the resonator of filter, and number of resonators is 2 rank or 3 rank (application number 01142905.; Publication number CN 1356741A), each resonator be coupled in same plane, processing is without via hole, and employing multilayer build-up technology, Design and manufacture goes out high performance band pass filter.But the multilayer ceramic filter of this structure is often more responsive, if there is larger off normal in lamination, its resonance frequency will offset very large, and cause this filter to lose efficacy, and this kind of structure only has a humorous wave point, device is also relatively large, and Bluetooth system suppresses at low side and high-end all needs usually, and also more and more less to the dimensional requirement of device.
Summary of the invention
Only comprise the problem of monolateral suppression for solving above-mentioned plane coupling multilayer ceramic filter and reduce technique to the susceptibility of device, the purpose of this utility model proposes a kind of miniaturized multilayer bluetooth band pass filter, thus effectively realize bilateral suppression, and the inductance crossing hole pattern is relatively loose to technological requirement, allows certain off normal amplitude.
In order to realize above-mentioned object, the utility model have employed following technical scheme:
A kind of miniaturized multilayer bluetooth band pass filter, this LC filter is duplexer, its surface of described duplexer is provided with outside input and output electrode and external ground electrode, described duplexer comprises two resonators, ground shield and cross capacitance sheet, two described resonators are connected with described external ground electrode respectively, and described two resonator connections parallel with one another, the inductive part of two described resonators forms electromagnetic coupled, form a cascade inductance coupling high, described outside input and output electrode is arranged respectively capacitive coupling and export interior electrode, in described cross capacitance sheet and described two pieces of capacitive coupling export, electrode forms the vertical cross capacitance that is coupled, described ground shield is connected with external ground electrode.
As further improvement, described duplexer is made up of 8 layers of insulating medium layer, be respectively the first insulating medium layer from the bottom to top, second insulating medium layer, 3rd insulating medium layer, 4th insulating medium layer, 5th insulating medium layer, 6th insulating medium layer, 7th insulating medium layer and the 8th insulating medium layer, two described resonators comprise the first conductive pattern respectively, second conductive pattern, 3rd conductive pattern and the 4th conductive pattern, the first described conductive pattern, second conductive pattern, 3rd conductive pattern and the 4th conductive pattern respectively correspondence are arranged on the first insulating medium layer, second insulating medium layer, one end of 3rd insulating medium layer and the 5th insulating medium layer, and the first described conductive pattern, second conductive pattern, 3rd conductive pattern is connected respectively by arranging the first via hole post with the 4th conductive pattern, first described conductive pattern one end is connected with external ground electrode.
As further improvement, in two pieces of described capacitive coupling export, electrode comprises the 5th conductive pattern and the 6th conductive pattern respectively, the 5th described conductive pattern and the 6th conductive pattern are separately positioned on the 6th insulating medium layer and the 7th insulating medium layer, and the 5th described conductive pattern is connected respectively by arranging the second via hole post with the 6th conductive pattern, the 5th described conductive pattern and the 6th conductive pattern form a vertical coupled electric capacity with the 4th conductive pattern of two resonators respectively.
As further improvement, described ground shield is arranged on the 4th insulating medium layer.
As further improvement, described conductive pattern is Ag, Cu, Au or other metal compound material, is formed by the technology of printing, evaporation coating.
The utility model solves plane coupling multilayer ceramic filter and only comprises the problem of monolateral suppression and reduce technique to the susceptibility of device, the 2 rank via hole type LC resonance filters that a kind of plurality of layers of double suppresses zero point are proposed, a transmission zero is produced respectively at the low-frequency range of band connection frequency, high band, thus effectively realize bilateral suppression, and the inductance crossing hole pattern is relatively loose to technological requirement, allows certain off normal amplitude.
Accompanying drawing explanation
Fig. 1 is the decomposition diagram of a kind of miniaturized multilayer bluetooth band pass filter of the utility model;
Fig. 2 is the outer surface structure schematic diagram of a kind of miniaturized multilayer bluetooth band pass filter of the utility model;
Fig. 3 is the frequency characteristic curve diagram of a kind of miniaturized multilayer bluetooth band pass filter of Fig. 1;
Fig. 4 is the equivalent electrical schematic diagram of a kind of miniaturized multilayer bluetooth band pass filter implemented according to the utility model.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
A kind of miniaturized multilayer bluetooth band pass filter as shown in Figure 2, this LC filter is duplexer 201, described its surface of duplexer 201 is provided with outside input and output electrode 202, 203 and external ground electrode 204, 205, described duplexer 201 comprises two resonators, ground shield 1041 and cross capacitance sheet 1073, two described resonators respectively with described external ground electrode 204, 205 are connected, and described two resonator connections parallel with one another, the inductive part of two described resonators forms electromagnetic coupled, form a cascade inductance coupling high, described outside input and output electrode 202, capacitive coupling is set on 203 respectively and exports interior electrode, in described cross capacitance sheet 1073 and described two pieces of capacitive coupling export, electrode forms the vertical cross capacitance that is coupled, described ground shield 1041 and external ground electrode 204, 205 are connected.
Duplexer 201 described is as shown in Figure 1 made up of 8 layers of insulating medium layer, is respectively the first insulating medium layer 101 from the bottom to top, second insulating medium layer 102, 3rd insulating medium layer 103, 4th insulating medium layer 104, 5th insulating medium layer 105, 6th insulating medium layer 106, 7th insulating medium layer 107 and the 8th insulating medium layer 108, two described resonators comprise the first conductive pattern 1012,1011 respectively, second conductive pattern 1022,1021, 3rd conductive pattern 1032,1031 and the four conductive pattern 1052,1051, the first described conductive pattern 1012,1011, second conductive pattern 1022,1021, 3rd conductive pattern 1032,1031 and the four conductive pattern 1052,1051 respectively correspondence is arranged on the first insulating medium layer 101, second insulating medium layer 102, one end of 3rd insulating medium layer 103 and the 5th insulating medium layer 105, and the first described conductive pattern 1012,1011, second conductive pattern 1022,1021, 3rd conductive pattern 1032,1031 and the four conductive pattern 1052,1051 is respectively by arranging the first via hole post H1, and H2, H3, H4 are connected, and the first described conductive pattern 1012,1011 one end and external ground electrode 204,205 are connected.
In two pieces of described capacitive coupling export, electrode comprises the 5th conductive pattern 1062 respectively, 1061 and the 6th conductive pattern 1072, 1071, the 5th described conductive pattern 1062, 1061 and the 6th conductive pattern 1072, 1071 are separately positioned on the 6th insulating medium layer 106 and the 7th insulating medium layer 107, and the 5th described conductive pattern 1062, 1061 and the 6th conductive pattern 1072, 1071 are connected respectively by arranging the second via hole post H5, the 5th described conductive pattern 1062, 1061 and the 6th conductive pattern 1072, 1071 respectively with the 4th conductive pattern 1052 of two resonators, 1051 form a vertical coupled electric capacity.
Described ground shield 1041 is arranged on the 4th insulating medium layer 104.
Described conductive pattern is Ag, Cu, Au or other metal compound material, is formed by the technology of printing, evaporation coating.
Claims (5)
1. a miniaturized multilayer bluetooth band pass filter, it is characterized in that: this filter is duplexer (201), described duplexer (201) its surface is provided with outside input and output electrode (202, 203) and external ground electrode (204, 205), described duplexer (201) comprises two resonators, ground shield (1041) and cross capacitance sheet (1073), two described resonators respectively with described external ground electrode (204, 205) be connected, and described two resonator connections parallel with one another, the inductive part of two described resonators forms electromagnetic coupled, form a cascade inductance coupling high, described outside input and output electrode (202, 203) capacitive coupling is set on respectively and exports interior electrode, in described cross capacitance sheet (1073) and described two pieces of capacitive coupling export, electrode forms the vertical cross capacitance that is coupled, described ground shield (1041) and outside connect
Ground electrode (204,205) is connected.
2. according to the miniaturized multilayer bluetooth of the one described in claim 1 band pass filter, it is characterized in that: described duplexer (201) is made up of 8 layers of insulating medium layer, be respectively the first insulating medium layer (101) from the bottom to top, second insulating medium layer (102), 3rd insulating medium layer (103), 4th insulating medium layer (104), 5th insulating medium layer (105), 6th insulating medium layer (106), 7th insulating medium layer (107) and the 8th insulating medium layer (108), two described resonators comprise the first conductive pattern (1012 respectively, 1011), second conductive pattern (1022, 1021), 3rd conductive pattern (1032, 1031) the and four conductive pattern (1052, 1051), the first described conductive pattern (1012, 1011), second conductive pattern (1022, 1021), 3rd conductive pattern (1032, 1031) the and four conductive pattern (1052, 1051) correspondence is arranged on the first insulating medium layer (101) respectively, second insulating medium layer (102), one end of 3rd insulating medium layer (103) and the 5th insulating medium layer (105), and the first described conductive pattern (1012, 1011), second conductive pattern (1022, 1021), 3rd conductive pattern (1032, 1031) the and four conductive pattern (1052, 1051) respectively by arranging the first via hole post (H1, H2, H3, H4) be connected, the first described conductive pattern (1012, 1011) one end and external ground electrode (204, 205) be connected.
3. according to the miniaturized multilayer bluetooth of the one described in claim 2 band pass filter, it is characterized in that: in two pieces of described capacitive coupling export, electrode comprises the 5th conductive pattern (1062 respectively, 1061) the and six conductive pattern (1072, 1071), the 5th described conductive pattern (1062, 1061) the and six conductive pattern (1072, 1071) be separately positioned on the 6th insulating medium layer (106) and the 7th insulating medium layer (107), and the 5th described conductive pattern (1062, 1061) the and six conductive pattern (1072, 1071) be connected respectively by arranging the second via hole post (H5), the 5th described conductive pattern (1062, 1061) the and six conductive pattern (1072, 1071) respectively with the 4th conductive pattern (1052 of two resonators, 1051) a vertical coupled electric capacity is formed.
4., according to the miniaturized multilayer bluetooth of the one described in claim 2 band pass filter, it is characterized in that: described ground shield (1041) is arranged on the 4th insulating medium layer (104).
5. the miniaturized multilayer bluetooth of the one according to claim 2-4 any one claim band pass filter, is characterized in that: described conductive pattern is Ag, Cu, Au or other metal compound material, is formed by the technology of printing, evaporation coating.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520246744.1U CN204652320U (en) | 2015-04-22 | 2015-04-22 | A kind of miniaturized multilayer bluetooth band pass filter |
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| CN201520246744.1U CN204652320U (en) | 2015-04-22 | 2015-04-22 | A kind of miniaturized multilayer bluetooth band pass filter |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450630A (en) * | 2016-10-31 | 2017-02-22 | 嘉兴佳利电子有限公司 | Miniaturized high-restrain multilayer balun |
| CN107465396A (en) * | 2017-09-06 | 2017-12-12 | 嘉兴佳利电子有限公司 | A kind of multilayer non-planar coiling resonance filter |
| CN108141190A (en) * | 2015-12-24 | 2018-06-08 | 株式会社村田制作所 | Circuit board, filter circuit and capacity cell |
-
2015
- 2015-04-22 CN CN201520246744.1U patent/CN204652320U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108141190A (en) * | 2015-12-24 | 2018-06-08 | 株式会社村田制作所 | Circuit board, filter circuit and capacity cell |
| CN106450630A (en) * | 2016-10-31 | 2017-02-22 | 嘉兴佳利电子有限公司 | Miniaturized high-restrain multilayer balun |
| CN107465396A (en) * | 2017-09-06 | 2017-12-12 | 嘉兴佳利电子有限公司 | A kind of multilayer non-planar coiling resonance filter |
| CN107465396B (en) * | 2017-09-06 | 2023-05-30 | 嘉兴佳利电子有限公司 | Multilayer non-planar wound resonance filter |
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Granted publication date: 20150916 |