CN204651628U - The bus bar that a kind of creepage distance is little - Google Patents
The bus bar that a kind of creepage distance is little Download PDFInfo
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- CN204651628U CN204651628U CN201520329501.4U CN201520329501U CN204651628U CN 204651628 U CN204651628 U CN 204651628U CN 201520329501 U CN201520329501 U CN 201520329501U CN 204651628 U CN204651628 U CN 204651628U
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- copper coin
- bus bar
- dielectric film
- pole copper
- creepage distance
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Abstract
The utility model discloses the bus bar that a kind of creepage distance is little, comprise positive pole copper coin and the negative pole copper coin of the copper coin composition that plural layer laminates mutually, on exposed surface on the input of described positive pole copper coin and negative pole copper coin and output by heat merge technique be coated with protruding containing glue dielectric film solidification sealing, and between described positive pole copper coin and negative pole copper coin, be provided with coating thermosetting epoxy resin glue film separate, a wall is formed between positive terminal and negative terminal, the cross section of described single layer coating thermosetting epoxy resin glue film is T-shaped, form a T-shaped one side containing glue dielectric film.The projection that this utility model bus bar outer surface has dielectric film to be formed, utilizes protruding, serves to reduce and reduces bus bar creepage distance, reduce the size of bus bar.
Description
Technical field
The utility model relates to the little bus bar of a kind of creepage distance, belongs to essential electronic element field.
Background technology
Bus bar is for the short distance conveying of electric power at generating, power transformation or distribution, also for powering, the installation of distribution board and circuit; The circuit arrangement of power supply or distribution or system; For exchange with exchanges between, between interchange with direct current or conversion between direct current and direct current, and be used in the apparatus field that power supply or similar electric power system use together.
At present, divide in high voltage source and mix, adopt cable the electricity of coming from power delivery to be assigned to the unit of required electricity consumption; To industries such as uninterrupted power supplys, exposed copper bar is adopted to carry out distribution; The industry such as wind power generation, solar power generation direct current to interchange, or in the inversion unit of AC-to DC, adopt exposed copper bar or between copper bar, add epoxy resin board and carry out insulating or adopt stack bus bar carry out distribution and vertically install epoxy resin board additional to reduce creepage distance.But, due to the restriction of enclosure interior, and due to electric current very large, voltage is very high, and causing needs larger space or distance to carry out pre-anti-tracking, makes in the wiring assembling of interior of equipment cabinet very difficult, and vertically arranged epoxy resin board assembling difficulty, easily drops.
Utility model content
In order to overcome tradition, to laminate bus bar creepage distance large, poor the occurred deficiency of fail safe, the utility model provides one can reduce creepage distance bus bar, adopt and on the exposed surface on the input and output of plural layer copper coin, form projection by heat fusion technique, the outer surface of outermost copper coin is coated with one side containing glue dielectric film, the single-sided insulation film that technique superposes one deck outwardly convex on outer dielectric film is merged, to reduce its creepage distance by heat.
For achieving the above object, the technical solution of the utility model is as follows:
The bus bar that a kind of creepage distance is little, comprise positive pole copper coin and the negative pole copper coin of the copper coin composition that plural layer laminates mutually, on exposed surface on the input of described positive pole copper coin and negative pole copper coin and output by heat merge technique be coated with protruding containing glue dielectric film solidification sealing, and between described positive pole copper coin and negative pole copper coin, be provided with coating thermosetting epoxy resin glue film separate, a wall is formed between positive terminal and negative terminal, the cross section of described single layer coating thermosetting epoxy resin glue film is T-shaped, forms a T-shaped one side containing glue dielectric film.
Preferably, described bus bar is the bus bar that copper coin laminates, and the thickness of described copper coin is 0.8 ~ 10.0 millimeter, and its material is T2 fine copper and the copper bar of semi-hard, 1/4th hardness or zero hardness.
Preferably, described epoxide-resin glue film is the dielectric film that one side is coated with thermosetting epoxy resin glue, and formed between described positive pole copper coin and negative pole copper coin together can the creepage wall that climb of block current flow.
Preferably, the specification of the copper coin that described plural layer laminates mutually is different, and is bonded into integral bus bar row by two-sided containing glue dielectric film according to a definite sequence, and superposes longitudinal dielectric film on outermost two-layer dielectric film.
Wherein, described copper coin generally adopts 0.8 ~ 10.0 mm of thickness, material to be T2 fine copper and the copper bar of semi-hard, 1/4th hardness or zero hardness.
Pass through technique scheme, the utility model provide bus bar, adopt and on the exposed surface on the input and output of plural layer copper coin, form projection by heat fusion technique, the outer surface of outermost copper coin is coated with one side containing glue dielectric film, the single-sided insulation film that technique superposes one deck outwardly convex on outer dielectric film is merged by heat, be superimposed together and be contained in fixing fixture, be put in heat fused press according to process curve figure, pressurization, heating, insulation, finally cool, be laminated together, to there is the dielectric film of one-sided epoxy resin glue, as PET, Nomex, Kapton etc., according to voltage, the size of electric current and the size of bus, design and build up T-shape, navigate to and laminate bus bar surface, utilize the feature that " T " dielectric film stretches out in the projection of longitudinal direction, creepage direction is changed to longitudinal direction, make creepage distance people for a change direction, reduce the air line distance that busbar is creepage, thus reach the object reducing creepage distance.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described.
Fig. 1 is the little bus bar decomposition texture schematic diagram of a kind of creepage distance disclosed in the utility model embodiment;
Fig. 2 is the main TV structure schematic diagram of the little bus bar of a kind of creepage distance disclosed in utility model embodiment;
Fig. 3 is the perspective view of the little bus bar of a kind of creepage distance disclosed in the utility model embodiment.
Numeral in figure:
1.T type one side is containing glue dielectric film 2. positive terminal
3. negative terminal 4. positive pole copper coin
5. one side is containing glue dielectric film 6. positive pole copper coin
7. positive terminal 8.T type one side is containing glue dielectric film
9. negative terminal 10. one side is containing glue dielectric film
11. is two-sided containing glue dielectric film 12. negative pole copper coin
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
Embodiment:
With reference to figure 1, Fig. 2 and Fig. 3, the bus bar that a kind of creepage distance is little, comprise positive pole copper coin 4 and the negative pole copper coin 12 of the two-layer copper coin composition mutually laminated, the position that the size of positive pole copper coin 4 and negative pole copper coin 12, thickness are installed according to passed through size of current and other components and parts and determine, is thickness 0.8 ~ 10.0 millimeter under normal circumstances, material is T2 fine copper and the copper bar of semi-hard, 1/4th hardness or zero hardness; Positive pole copper coin 4 and negative pole copper coin 12 by die-cut, bend, stretch, deburring, pressure input/output terminal, weld flexible copper bar (also claiming to be flexible coupling) or technique such as welding input/output terminal, plating etc. guarantees that I/O and overall dimension meet the requirement of connection; Between positive terminal 2 and negative terminal 3, adopt one side T-shaped containing glue dielectric film 1, namely the film (as PET) of single layer coating thermosetting epoxy resin glue separates, a wall is formed between positive terminal 2 and negative terminal 3, the outside of positive pole copper coin 4 and negative pole copper coin 12 adopts one side containing glue dielectric film 5, namely the film (as PET) of single layer coating thermosetting epoxy resin glue covers, one side can be adopted to contain glue dielectric film 5 (as PET) seal voluntarily, epoxy resin adhesive curing also can be adopted in addition to seal.With reference to figure 2, that bilayer laminates bus bar, it to be laminated with negative pole copper coin 12 by positive pole copper coin 4 and connects together, and the positive pole of positive pole copper coin 4 is connected together by welding (as techniques such as silver soldering, supersonic welding, solderings) and positive terminal 2, the negative pole of negative pole copper coin 12 is connected together by welding (as techniques such as silver soldering, supersonic welding, solderings) and negative terminal 3, separated containing glue dielectric film 1 by T-shaped one side between positive terminal 2 and negative terminal 3, more than formed by film (as PET) the cover heating pressing of coating thermosetting epoxy resin glue.Consult Fig. 1 again, in the bus bar decomposition texture of sandwich construction, it comprises the sandwich construction set gradually, that is: T-shaped one side is containing glue dielectric film 1, one side is containing glue dielectric film 5, with positive terminal 2 and the positive pole copper coin 4 of layer welding, two-sided containing glue dielectric film 11, with negative terminal 3 and the negative pole copper coin 12 of layer welding, one side is containing glue dielectric film 5, and T-shaped one side is containing glue dielectric film 1, then by above-mentioned multilayer according to technological requirement, put into pressing mold successively, pressurized, heated in hot press, according to pressurized, heated and insulation, cooling curve, make epoxy resin adhesive curing, the little creepage distance bus bar with anti-tracking wall being similar to printed wiring board is formed at normal temperatures after cooling.
The manufacture craft of the bus bar in this example comprises the steps:
1) part drawing of copper coin described in the every one deck designing soft or hard composite bus row, cuts out the shape of copper coin according to part drawing;
2), on the input then copper tip and described flexible copper bar being welded to corresponding described copper coin and lead-out terminal, then electroplate;
3) merge on the base plate of fixture by needing the T-shaped one side reducing creepage distance to be positioned at heat containing glue dielectric film 1, then between positive pole copper coin 4 and negative pole copper coin 12, adopt the bilayer cutting into required shape containing glue dielectric film 11, described bilayer is filled out between positive pole copper coin 4 and negative pole copper coin 12 containing glue dielectric film 11, simultaneously, glue dielectric film 5 is contained at the coated individual layer of outermost of outermost positive pole copper coin 4 and negative pole copper coin 12, after accurate positioning, described individual layer is overlayed on the outermost of outermost layer positive pole copper coin 4 and negative pole copper coin 12 containing glue dielectric film 5;
4) last, again T-shaped one side being positioned at heat containing glue dielectric film 1 merges on the upper plate of fixture, close upper cover plate, adopt heat fused technique, the described copper coin of several different sizes and dielectric film are superimposed together, and are contained in fixing fixture, be put in heat fused press according to process curve figure, pressurize, heat, be incubated, finally cool, and then be laminated together the little creepage distance bus bar of formation.
Pass through technique scheme, the bus bar that a kind of creepage distance that the utility model provides is little, it can be adopted at two pieces or polylith copper coin (0.8 ~ 10.0 mm of thickness, material are T2 fine copper and the low inductance stacking voltage bus bar that the copper bar of semi-hard, 1/4th hardness or zero hardness and dielectric film are formed by stacking) by certain manufacture craft, becomes the little creepage distance bus bar of multilayer.
Pass through technique scheme, the utility model provide bus bar, comprise positive pole copper coin 4 and the negative pole copper coin 12 of the two-layer copper coin composition mutually laminated, on exposed surface on the input of described positive pole copper coin 4 and negative pole copper coin 12 and output by heat merge technique be coated with protruding containing glue dielectric film solidification sealing, and between described positive pole copper coin 4 and negative pole copper coin 12, be provided with coating thermosetting epoxy resin glue film separate, a wall is formed between positive terminal 2 and negative terminal 3, the cross section of described single layer coating thermosetting epoxy resin glue film is T-shaped, form a T-shaped one side containing glue dielectric film.Wherein, described bus bar is the bus bar that copper coin laminates, and the thickness of described copper coin is 0.8 ~ 10.0 millimeter, and its material is T2 fine copper and the copper bar of semi-hard, 1/4th hardness or zero hardness; Described epoxide-resin glue film is the dielectric film that one side is coated with thermosetting epoxy resin glue, and formed between described positive pole copper coin 4 and negative pole copper coin 12 together can the creepage wall that climb of block current flow; The specification of the copper coin that described plural layer laminates mutually is different, and is bonded into integral bus bar row by two-sided containing glue dielectric film according to a definite sequence, and superposes longitudinal dielectric film on outermost two-layer dielectric film.
This bus bar merges technique by heat on the exposed surface on the input and output of plural layer copper coin, forms projection, the outer surface of outermost copper coin is coated with one side containing glue dielectric film, the single-sided insulation film that technique superposes one deck outwardly convex on outer dielectric film is merged by heat, be superimposed together and be contained in fixing fixture, be put in heat fused press according to process curve figure, pressurization, heating, insulation, finally cool, be laminated together, to there is the dielectric film of one-sided epoxy resin glue, as PET, Nomex, Kapton etc., according to voltage, the size of electric current and the size of bus, design and build up T-shape, navigate to and laminate bus bar surface, utilize the feature that " T " dielectric film stretches out in the projection of longitudinal direction, creepage direction is changed to longitudinal direction, make creepage distance people for a change direction, reduce the air line distance that busbar is creepage, thus reach the object reducing creepage distance.
To the above-mentioned explanation of the little bus bar embodiment of disclosed a kind of creepage distance, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of above-described embodiment, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. the bus bar that a creepage distance is little, it is characterized in that, comprise positive pole copper coin and the negative pole copper coin of the copper coin composition that plural layer laminates mutually, on exposed surface on the input of described positive pole copper coin and negative pole copper coin and output by heat merge technique be coated with protruding containing glue dielectric film solidification sealing, and between described positive pole copper coin and negative pole copper coin, be provided with coating thermosetting epoxy resin glue film separate, a wall is formed between positive terminal and negative terminal, the cross section of described single layer coating thermosetting epoxy resin glue film is T-shaped, form a T-shaped one side containing glue dielectric film.
2. the bus bar that a kind of creepage distance according to claim 1 is little, it is characterized in that, described bus bar is the bus bar that copper coin laminates, and the thickness of described copper coin is 0.8 ~ 10.0 millimeter, and its material is T2 fine copper and the copper bar of semi-hard, 1/4th hardness or zero hardness.
3. the bus bar that a kind of creepage distance according to claim 2 is little, it is characterized in that, described epoxide-resin glue film is the dielectric film that one side is coated with thermosetting epoxy resin glue, and formed between described positive pole copper coin and negative pole copper coin together can the creepage wall that climb of block current flow.
4. the bus bar that a kind of creepage distance according to claim 3 is little, it is characterized in that, the specification of the copper coin that described plural layer laminates mutually is different, and is bonded into integral bus bar row by two-sided containing glue dielectric film according to a definite sequence, and superposes longitudinal dielectric film on outermost two-layer dielectric film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520329501.4U CN204651628U (en) | 2015-05-20 | 2015-05-20 | The bus bar that a kind of creepage distance is little |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520329501.4U CN204651628U (en) | 2015-05-20 | 2015-05-20 | The bus bar that a kind of creepage distance is little |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204651628U true CN204651628U (en) | 2015-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520329501.4U Active CN204651628U (en) | 2015-05-20 | 2015-05-20 | The bus bar that a kind of creepage distance is little |
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| Country | Link |
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| CN (1) | CN204651628U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109979649A (en) * | 2019-04-30 | 2019-07-05 | 阳光电源股份有限公司 | Bus and its pressing mold, bus compression method |
| CN111628370A (en) * | 2019-02-28 | 2020-09-04 | 株式会社村田制作所 | Bus bar member and method for manufacturing bus bar member |
| CN113097769A (en) * | 2021-03-23 | 2021-07-09 | 华中科技大学 | High-voltage coaxial laminated hybrid busbar |
-
2015
- 2015-05-20 CN CN201520329501.4U patent/CN204651628U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111628370A (en) * | 2019-02-28 | 2020-09-04 | 株式会社村田制作所 | Bus bar member and method for manufacturing bus bar member |
| CN109979649A (en) * | 2019-04-30 | 2019-07-05 | 阳光电源股份有限公司 | Bus and its pressing mold, bus compression method |
| CN109979649B (en) * | 2019-04-30 | 2021-06-11 | 阳光电源股份有限公司 | Bus pressing mold and bus pressing method |
| CN113097769A (en) * | 2021-03-23 | 2021-07-09 | 华中科技大学 | High-voltage coaxial laminated hybrid busbar |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: Song Ling Zhen Wujiang District of Suzhou City, Jiangsu province 215222 five road No. 377 building 4 Suzhou Power Technology Co. Ltd. Patentee after: SUZHOU CURRENT POWER TECHNOLOGY CO., LTD. Address before: Wuzhong District forest road Suzhou city Jiangsu province 215104 No. 5 Building 4 Suzhou Power Technology Co. Ltd. Patentee before: SUZHOU CURRENT POWER TECHNOLOGY CO., LTD. |