CN204608202U - A kind of PCB copper ball - Google Patents

A kind of PCB copper ball Download PDF

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Publication number
CN204608202U
CN204608202U CN201520285225.6U CN201520285225U CN204608202U CN 204608202 U CN204608202 U CN 204608202U CN 201520285225 U CN201520285225 U CN 201520285225U CN 204608202 U CN204608202 U CN 204608202U
Authority
CN
China
Prior art keywords
copper ball
ball body
utility
passage
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520285225.6U
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Chinese (zh)
Inventor
孔剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu kindle copper co Ltd
Original Assignee
Jiangsu kindle copper co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu kindle copper co Ltd filed Critical Jiangsu kindle copper co Ltd
Priority to CN201520285225.6U priority Critical patent/CN204608202U/en
Application granted granted Critical
Publication of CN204608202U publication Critical patent/CN204608202U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The utility model discloses a kind of PCB copper ball, described copper ball comprises copper ball body, the surface of copper ball body is provided with several grooves, some grooves are for symmetric points centrosymmetry is arranged with the centre of sphere of copper ball spheroid, the inside of copper ball body is hollow, the inside of copper ball body is provided with passage, and hollow bulb is connected by the surface of passage with copper ball body.By the way, the surface-area of the utility model copper ball increases greatly, and cupric ion can be released from groove surfaces and copper ball body surface simultaneously, thus the cupric ion of releasing under making identical conditions increases, and increases the electric current born, and reaches the object shortening electroplating time.

Description

A kind of PCB copper ball
Technical field
The utility model relates to a kind of PCB copper ball.
Background technology
Along with the develop rapidly of electronic technology, the Production requirement amount of various circuit card increases greatly, and especially high-tech multilayer circuit board is the requisite important composition parts of contemporary various electronic message unit.Copper is the important source material of board production as galvanic anode, and PCB industry manufactures precision circuit plate needs copper ball to use as anode.In recent years, the PCB industry development of China is rapid, and annual growth rate can up to more than 20%, and therefore the demand of copper ball is also year by year in increase.But the copper ball existed now is all that the smooth surface of solid shape is smooth, the amount of the cupric ion discharged under identical conditions during use is certain, thus the electric current born can be certain, makes electroplating time elongated.The Heavy Weight of solid copper ball, cost is high, uses inconvenience.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of PCB copper ball, and copper ball result of use is good.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide one to comprise copper ball body, the surface of described copper ball body is provided with several grooves, described some grooves are for symmetric points centrosymmetry is arranged with the centre of sphere of described copper ball spheroid, the inside of described copper ball body is hollow, the inside of described copper ball body is provided with passage, and described hollow bulb is connected by the surface of described passage with described copper ball body.
In the utility model preferred embodiment, the bottom land lower-most point of described groove and the difference of altitude of described copper ball body surface are 0.5-2.5mm.
In the utility model preferred embodiment, the shape of described groove is rectangular parallelepiped, and described groove is two.
In the utility model preferred embodiment, the hollow bulb of described copper ball body is spheroid, and described passage is right cylinder, and the medullary ray of described passage and the diameter of described copper ball body coincide.
In the utility model preferred embodiment, the diameter of described copper ball body is 24-29mm.
The beneficial effects of the utility model are: PCB copper ball of the present utility model, the surface-area of described copper ball increases greatly, cupric ion can be released from groove surfaces and copper ball body surface simultaneously, thus the cupric ion of releasing under making identical conditions increases, increase the electric current born, reach the object shortening electroplating time.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of PCB copper ball one of the present utility model preferred embodiment;
In accompanying drawing, the mark of each parts is as follows: 1, copper ball body, and 2, groove, 3, hollow bulb, 4, passage.
Embodiment
Be clearly and completely described to the technical scheme in the utility model embodiment below, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1, the utility model embodiment comprises:
A kind of PCB copper ball, comprises copper ball body 1.The surface of described copper ball body 1 is provided with groove 2, and these grooves 2 are for symmetric points centrosymmetry is arranged with the centre of sphere of described copper ball spheroid 1.The number of groove 2 can be two or more, and groove 2 is two in the present embodiment, is symmetricly set on the surface of copper ball spheroid 1.The bottom land lower-most point of groove 2 described in general setting and the difference of altitude on described copper ball body 1 surface are 0.5-2.5mm.The shape of described groove 2 can be different, and as rectangular parallelepiped, square, hemisphere or irregular solid are arranged, described groove 2 is rectangular parallelepiped in the present embodiment.
The inside of described copper ball body 1 is hollow, and the inside of described copper ball body 1 is provided with passage 4, and described hollow bulb 3 is connected by the surface of described passage 4 with described copper ball body 1.The shape of described hollow bulb 3 and described passage 4 can be different, and can be that irregular solid is arranged or rule is three-dimensional be arranged.In the present embodiment, the hollow bulb 3 of described copper ball body 1 is spheroid, and described passage 4 is right cylinder, and the medullary ray of described passage 4 and the diameter of described copper ball body 1 coincide.The diameter of described copper ball body 1 is 24-29mm.
A kind of working method of PCB copper ball is provided, comprising step is: dissolve at 1100 DEG C copper raw material, the copper solutions of dissolving to be injected in mould and to cool taking-up and obtain ball base, to the polishing of described ball base, cleaning drying and processing obtains PCB copper ball.
The beneficial effects of the utility model are:
One, the surface-area of described copper ball increases greatly, and cupric ion can be released from groove surfaces and copper ball body surface simultaneously;
Two, the cupric ion that described copper ball is released under making identical conditions increases, and increases the electric current born, and reaches the object shortening electroplating time;
Three, described method is simple to operate, greatly can improve the compactness of spheroid crystallization, and the copper ball quality obtained is good, time saving and energy saving, can apply on a large scale.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.

Claims (5)

1. a PCB copper ball, it is characterized in that, comprise copper ball body, the surface of described copper ball body is provided with several grooves, described some grooves are for symmetric points centrosymmetry is arranged with the centre of sphere of described copper ball spheroid, the inside of described copper ball body is hollow, and the inside of described copper ball body is provided with passage, and described hollow bulb is connected by the surface of described passage with described copper ball body.
2. PCB copper ball according to claim 1, is characterized in that, the bottom land lower-most point of described groove and the difference of altitude of described copper ball body surface are 0.5-2.5mm.
3. PCB copper ball according to claim 1, is characterized in that, the shape of described groove is rectangular parallelepiped, and described groove is two.
4. PCB copper ball according to claim 1, is characterized in that, the hollow bulb of described copper ball body is spheroid, and described passage is right cylinder, and the medullary ray of described passage and the diameter of described copper ball body coincide.
5. PCB copper ball according to claim 1, is characterized in that, the diameter of described copper ball body is 24-29mm.
CN201520285225.6U 2015-05-06 2015-05-06 A kind of PCB copper ball Expired - Fee Related CN204608202U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520285225.6U CN204608202U (en) 2015-05-06 2015-05-06 A kind of PCB copper ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520285225.6U CN204608202U (en) 2015-05-06 2015-05-06 A kind of PCB copper ball

Publications (1)

Publication Number Publication Date
CN204608202U true CN204608202U (en) 2015-09-02

Family

ID=53960769

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520285225.6U Expired - Fee Related CN204608202U (en) 2015-05-06 2015-05-06 A kind of PCB copper ball

Country Status (1)

Country Link
CN (1) CN204608202U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104790019A (en) * 2015-05-06 2015-07-22 江苏金奕达铜业股份有限公司 Copper ball for PCB and processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104790019A (en) * 2015-05-06 2015-07-22 江苏金奕达铜业股份有限公司 Copper ball for PCB and processing method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150902

Termination date: 20190506

CF01 Termination of patent right due to non-payment of annual fee