CN204604910U - A kind of 3D printing equipment of semiconductor two-stage refrigeration - Google Patents
A kind of 3D printing equipment of semiconductor two-stage refrigeration Download PDFInfo
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- CN204604910U CN204604910U CN201520058870.4U CN201520058870U CN204604910U CN 204604910 U CN204604910 U CN 204604910U CN 201520058870 U CN201520058870 U CN 201520058870U CN 204604910 U CN204604910 U CN 204604910U
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- conduction cooling
- fin
- airduct
- semiconductor
- refrigeration
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Abstract
The utility model discloses a kind of 3D printing equipment of semiconductor two-stage refrigeration, is the treating apparatus when increasing material and printing, extruded material being carried out to fast-refrigerating for 3D printer.Comprise: semiconductor chilling plate, fin, conduction cooling wire, conduction cooling airduct, fan, it is characterized in that: jointly surround thermal insulation cavity by fan and plastic shell, surround the refrigeration end at semiconductor chilling plate, and connect conduction cooling airduct, in fin and conduction cooling airduct, arrange conduction cooling wire.Utilize the cold air that the fin in the refrigeration end of electronic semi-conductor's cooling piece produces, squeeze into again to be covered with in conduction cooling conduction cooling airduct wiry and carry out deep refrigerating, strengthen cold heat conducting metal contact area, the temperature of air outlet cold air is reduced greatly, produce better refrigeration, achieve the quick cold solid function of the hot melt material that 3D printhead is extruded.
Description
Technical field
The present invention relates to a kind of field of 3D printing technique, more particularly, relates to a kind of 3D printer processes device utilizing electronic semi-conductor's refrigeration end refrigeration.
Background technology
Current 3D printer, when increasing material and manufacturing, after heat hot melt material or laser sintered material, general tree material installs cooling device additional, or simple handy fan is dried to target object, because in 3D printer casing, heat own is higher, especially FDM increases material mode type, the target item printed is caused to cool in a long time, make target item before not cooling completely, the fluid behaviour be easy to because of high-temperature material produces distortion and dimensional discrepancy, and causes the accurate-size not reaching setting of target item.
Summary of the invention
the technical problem that invention will solve
The 3D printing equipment of a kind of semiconductor two-stage refrigeration of the present invention, utilize the cold air that the refrigeration end of electronic semi-conductor's cooling piece produces, and by being covered with conduction cooling conduction cooling airduct wiry, strengthen cold and hot conductive contacts area, produce better refrigeration, carry out quick cold solid to the hot melt material that printhead is extruded, solve current 3D printer when increasing material and printing, because the fluid behaviour of high-temperature material produces distortion and dimensional discrepancy, the problem not reaching the accurate-size of setting of target item.
technical scheme
For achieving the above object, the invention provides following technical scheme.
A kind of 3D printing equipment of semiconductor two-stage refrigeration, comprise: semiconductor chilling plate, fin, conduction cooling wire, conduction cooling airduct, fan, it is characterized in that: jointly surround thermal insulation cavity by fan and plastic shell, surround the refrigeration end at semiconductor chilling plate, and connect conduction cooling airduct, in fin and conduction cooling airduct, arrange conduction cooling wire.
Described semiconductor chilling plate is that the cold air using one end of its refrigeration to produce carrys out cooling refrigeration.
Described fin, be metal fin, fin againsts semiconductor chilling plate, establishes one direction many conduits in fin, the unidirectional cold wind of convenient derivation, and is fixedly connected with many conduction cooling wires.
Described conduction cooling wire is many conduction cooling wire compositions.
Described conduction cooling airduct, for loading many conduction cooling airducts wiry, one wiry of conduction cooling is fixed on a heat sink, and conduction cooling wire remainder is all attached to conduction cooling airduct inwall, is uniformly distributed, and reserves middle cavity.
Utilize the cold air that the refrigeration end of electronic semi-conductor's cooling piece produces, and adopt the design extending and strengthen cold and hot conductive contacts area, produce better refrigeration, carry out quick cold solid to the hot melt material that printhead is extruded.The refrigeration end of semiconductor chilling plate is after energising refrigeration, produce the temperature of less than 0 °, make rapidly fin also be in less than 0 ° temperature, conduction cooling wire is because connecting fin simultaneously, makes the conduction cooling wire of conduction cooling airduct inwall cooled equally in lower temperature from the beginning to the end.The air of fan extruding, tentatively cold air is freezed into through fin, cold air through fin refrigeration is not easy by deep refrigerating, when cold air is pressed into after in conduction cooling airduct again, extend and increase cold heat conducting contact area, by conduction cooling wire deep refrigerating more further, until air outlet, target item is cooled.Increase conduction cooling density of wires and length, refrigeration can be strengthened again.
beneficial effect
Adopt technical scheme provided by the invention, compared with existing known technology, there is following remarkable result.
Jointly surround thermal insulation cavity by fan, case, effectively ensure inner cold air not conduct by the hot gas in the external world.
After cooled of air tentatively freezes, enter after in conduction cooling airduct through fan extruding again, cooled and deep refrigerating more further by conduction cooling wire, thus extend the cold and hot conductive contacts area of increasing, the temperature of air outlet cold air is reduced greatly, the article refrigeration to 3D prints is improved greatly.
Accompanying drawing explanation
Fig. 1 is the 3D printing equipment structure chart of a kind of semiconductor two-stage refrigeration of the present invention.
1-semiconductor chilling plate, 2-fin, 3-conduction cooling wire, 4-conduction cooling airduct, 5-fan, 6-plastic shell, 7-air outlet.
Detailed description of the invention
For understanding content of the present invention further, the present invention is described in detail by reference to the accompanying drawings.
A kind of 3D printing equipment of semiconductor two-stage refrigeration, comprise semiconductor chilling plate 1, fin 2, conduction cooling wire 3, conduction cooling airduct 4, fan 5, it is characterized in that: jointly surround thermal insulation cavity by fan 5 and plastic shell 6, surround the refrigeration end at semiconductor chilling plate 1, and connect conduction cooling airduct 4, in fin 2 and conduction cooling airduct 4, arrange conduction cooling wire 3.
Described semiconductor chilling plate 1 is that the cold air using one end of its refrigeration to produce carrys out cooling refrigeration.
Described fin 2, be metal fin, fin 2 againsts semiconductor chilling plate 1, establishes one direction many conduits in fin 2, the unidirectional cold wind of convenient derivation, and is fixedly connected with many conduction cooling wires 3.
Described conduction cooling wire 3, is made up of many conduction cooling wires.
Described conduction cooling airduct 4, for loading the airduct of many conduction cooling wires 3, one of conduction cooling wire 3 is fixed on fin 2, and conduction cooling wire 3 remainder is all attached to conduction cooling airduct 4 inwall, is uniformly distributed, and reserves middle cavity.
Below in conjunction with embodiment, the invention will be further described.
Utilize the cold air that the refrigeration end of electronic semi-conductor's cooling piece 1 produces, and adopt the design extending and strengthen cold and hot conductive contacts area, produce better refrigeration, carry out quick cold solid to the hot melt material that printhead is extruded.
The refrigeration end of semiconductor chilling plate 1 is after energising refrigeration, produce the temperature of less than 0 °, make rapidly fin 2 also be in less than 0 ° temperature, conduction cooling wire 3 is because connecting fin 2 simultaneously, makes the conduction cooling wire 3 of conduction cooling airduct inwall cooled equally in lower temperature from the beginning to the end.The air that fan 5 extrudes, tentatively cold air is freezed into through fin 2, the cold air freezed through fin 2 is not easy by deep refrigerating, when cold air is pressed into after in conduction cooling airduct again, extend and increase cold heat conducting contact area, by conduction cooling wire 3 deep refrigerating more further, until air outlet 7, target item is cooled.
Below be schematically described the present invention and embodiment thereof, this description does not have restricted, and shown in accompanying drawing is also one of embodiments of the present invention, and actual structure and application are not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, without creatively designing the frame mode similar to this technical scheme and embodiment, all should protection scope of the present invention be belonged to.
Claims (3)
1. the 3D printing equipment of a semiconductor two-stage refrigeration, comprise: semiconductor chilling plate, fin, conduction cooling wire, conduction cooling airduct, fan, it is characterized in that: jointly surround thermal insulation cavity by fan and plastic shell, surround the refrigeration end at semiconductor chilling plate, and connect conduction cooling airduct, in fin and conduction cooling airduct, arrange conduction cooling wire.
2. the 3D printing equipment of a kind of semiconductor two-stage refrigeration according to claim 1, it is characterized in that: described fin, for metal fin, fin againsts semiconductor chilling plate, one direction many conduits are established in fin, the unidirectional cold wind of convenient derivation, and be fixedly connected with many conduction cooling wires.
3. the 3D printing equipment of a kind of semiconductor two-stage refrigeration according to claim 1, it is characterized in that: described conduction cooling airduct, for loading many conduction cooling airducts wiry, one wiry of conduction cooling is fixed on a heat sink, conduction cooling wire remainder is all attached to conduction cooling airduct inwall, be uniformly distributed, and reserve middle cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520058870.4U CN204604910U (en) | 2015-01-27 | 2015-01-27 | A kind of 3D printing equipment of semiconductor two-stage refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520058870.4U CN204604910U (en) | 2015-01-27 | 2015-01-27 | A kind of 3D printing equipment of semiconductor two-stage refrigeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204604910U true CN204604910U (en) | 2015-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520058870.4U Expired - Fee Related CN204604910U (en) | 2015-01-27 | 2015-01-27 | A kind of 3D printing equipment of semiconductor two-stage refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204604910U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109382991A (en) * | 2018-11-02 | 2019-02-26 | 山东科技大学 | A kind of 3D printing silk material extrusion molding apparatus |
-
2015
- 2015-01-27 CN CN201520058870.4U patent/CN204604910U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109382991A (en) * | 2018-11-02 | 2019-02-26 | 山东科技大学 | A kind of 3D printing silk material extrusion molding apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20180127 |
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| CF01 | Termination of patent right due to non-payment of annual fee |