CN204598315U - A kind of silicon capacitor microphone of application flexibility backplane - Google Patents
A kind of silicon capacitor microphone of application flexibility backplane Download PDFInfo
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- CN204598315U CN204598315U CN201520308645.1U CN201520308645U CN204598315U CN 204598315 U CN204598315 U CN 204598315U CN 201520308645 U CN201520308645 U CN 201520308645U CN 204598315 U CN204598315 U CN 204598315U
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Abstract
The utility model relates to a kind of silicon capacitor microphone of application flexibility backplane, comprise substrate, vibrating diaphragm and flexible backplane, described flexible backplane and described vibrating diaphragm form variable capacitance, wherein, described flexible backplane is less than or equal to 20 microns because of the warpage that residual stress causes, described flexible backplane is provided with ripple or reinforcement, and described flexible backplane is also provided with perforate or fluting.Under existing technological level, performance index and the Product environment adaptability such as sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response of silicon capacitor microphone, be improved owing to applying design means of the present utility model.
Description
Technical field
The utility model relates to the design and manufaction field of silicon microphone, particularly a kind of silicon capacitor microphone of application flexibility backplane.
Background technology
Micro electronmechanical (MEMS micro-electro-mechanical system) microphone or claim silicon microphone because its volume is little, be suitable for the advantages such as surface mount and be widely used in the sound collection of tablet electronic device, such as: mobile phone, MP3, recording pen and monitoring equipment etc.In correlation technique, silicon capacitor microphone comprises substrate, backplane and vibrating diaphragm.Wherein, vibrating diaphragm and backplane are one of core components of silicon capacitor microphone, both needed responsive sound pressure signal it is converted into the signal of telecommunication delicately, need again to blow at extraneous blast hit, retention normally works substantially unchangeably after the stress of dropping shock and inner processing technology release effect of stress.
After backplane and vibrating diaphragm form movable structure in opposite directions, both relative motion situations under acoustic signal and external interference, directly relevant to the index such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response of silicon capacitor microphone, also determine the environmental suitability of product.
Traditional silicon micro-microphone is generally limited to construct multiple relative motion mode between vibrating diaphragm and fixing rigid substrates and the static rigidity backplane of opposing substrate, this the way of restraint is due to substrate and rigidity backplane geo-stationary in sensitivity motion, design comparatively easy, but flexibility is also limited.
The utility model is by arranging to obtain the lower structure introducing vibrating diaphragm and flexible backplane collaborative work by the rigidity of backplane, make backplane and vibrating diaphragm formed in opposite directions can dynamic condenser, the parameter of backplane and vibrating diaphragm is set simultaneously, expands degree of freedom when silicon capacitor microphone structural parameters are set.Thus make with existing technological level can be implemented in polysilicon vibrating diaphragm and and its just right flexible backplane between responsive mode of moving is set neatly, evade the even defective workmanship such as Appropriate application warping of membrane, further to improve the indexs such as sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response, and strengthen the environmental suitability of product.In other words, make silicon capacitor microphone improve performance and environmental suitability under the substantially constant prerequisite even decreased of cost, thus optimizing product cost performance, widen products application scope.
Summary of the invention
The utility model provides the silicon capacitor microphone of application flexibility backplane, the vibrating diaphragm vibration shape can be improved under existing technological level, evade the warping of membrane in technique, the unfavorable factors such as diaphragm is frangible, thus optimize the indexs such as sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response, improve the environmental suitability of product.
For solving the problem, the technical solution adopted in the utility model is:
A kind of silicon capacitor microphone for application flexibility backplane, comprise substrate, vibrating diaphragm and backplane, described backplane and vibrating diaphragm form movable structure in opposite directions, i.e. variable capacitance, the natural frequency of vibration of wherein said backplane, lower than the natural frequency of vibration of vibrating diaphragm, also can be equal to or greater than the natural frequency of vibration of a certain diaphragm element, but be no more than 5 times of the natural frequency of vibration maximum of each diaphragm element.The natural frequency of vibration of backplane is decided by the rigidity of backplane, if its natural frequency of vibration is lower than microphone works frequency range (being generally audiorange 20 ~ 20kHz), then can make silicon microphone cannot with correct phase response input signal when input audio signal frequency is higher, and during 5 times of natural frequency of vibration maximum of the backplane natural frequency of vibration higher than each diaphragm element, just with the concept of rigidity backplane closely, the backplane of such setting is when using technical solutions of the utility model, there is the process sex chromosome mosaicism that backplane is more crisp and frangible, because the thickness of backplane is relevant to technology difficulty and cost, and under the prerequisite of the chip size decision backplane flat shape size of design, improving backplane rigidity only way is increase its tensile stress, although and the excessive raising that can bring backplane rigidity of tensile stress, also the risk that backplane is more crisp and frangible can be brought.
Preferred silicon capacitor microphone, it is affecting by processing technology, when having residual stress to cause the warpage of vibrating diaphragm and backplane, by arranging the method for technological parameter, the warpage reducing vibrating diaphragm and backplane is on the impact of frequency response curve and microphone electrical model, on backplane, smooth place peak and minimum point difference in height are at 0.2 ~ 20 micron, and namely described flexible backplane is less than or equal to 20 microns because of the warpage that residual stress causes.In rigid back electrode structure, at vibrating diaphragm due to the residual stress release in technique during warpage, because backplane rigidity is large, the cause substantially without warpage in Stress Release process, backplane can be subject to more obviously disturbing relative to the capacitance profile of vibrating diaphragm and responsive motion mode.When using flexible backplane, because backplane is similar to the parameter such as rigidity, thickness, stress of vibrating diaphragm, the warpage degree that vibrating diaphragm and backplane can be made to occur is close, thus make its relative warpage reduce after cancelling out each other, thus the imperfection of warpage on frequency response curve and microphone electrical model reducing vibrating diaphragm and backplane affects.
Preferred silicon capacitor microphone, backplane arranges ripple or reinforcement.In prior art, common ripple or the reinforcement of arranging on vibrating diaphragm is to optimize the scheme of the responsive motion vibration shape and stiffness distribution.For rigidity backplane, because its rigidity is very high, the ripple arranged or reinforcement almost do not affect backplane rigidity, and ripple or reinforcement are set on flexible backplane, can together determine the stiffness distribution of backplane with structures such as its perforate, fluting and projections, thus reach the technique effect optimizing the responsive motion vibration shape.
Preferred silicon capacitor microphone, backplane arranges multiple projection, and described multiple projection has different height.Because the rdativery sensitive motion vibration shape between vibrating diaphragm and flexible backplane had not only affected by the vibrating diaphragm vibration shape but also by the flexible backplane vibration shape, relative motion is uneven, therefore optimized height required for the multiple projections arranged on backplane inconsistent, multiple projections that can arrange on backplane according to the needs of sensitivity motion, its rising height is greater than one.
Preferred silicon capacitor microphone, wherein caves in or fluting by arranging above vibrating diaphragm edge, and divides the mode in main region and non-principal region, be set to the backplane material of the different relative altitudes in vibrating diaphragm edge and crashproof intensity on backplane.For flexible backplane, can go out be positioned at by the model split arranging fluting on backplane the main region above vibrating diaphragm and non-principal region, the relative capacity that sensitive structure moves is formed between the backplane of main region and vibrating diaphragm, but not the backplane of main region then can play booster action, by being set to the backplane material of the different relative altitudes in vibrating diaphragm edge and crashproof intensity, thus make microphone run into extraneous blast blow hit, not damaged after the stress of dropping shock and inner processing technology release effect of stress, and retention normally works substantially unchangeably.
Preferred silicon capacitor microphone, wherein multiple hole or groove are set on backplane, and on described backplane, at least there is a belt-like zone, the area ratio in each hole or groove that are arranged in described belt-like zone to be positioned on backplane the maximum hole in other regions or the area of groove little by more than 5%.Usually, less hole and groove are set, the neighbouring strength of materials can be made to increase.Less hole or groove are set in a ribbon region, the technique effect similar with a reinforcement can be formed.Such hole or groove are set in backplane, structure existence when backplane is subject to greater impact can be contributed to, especially, by arranging such hole or groove in flexible backplane, be equivalent to change the structural strength in belt-like zone and Stress Release condition, so the technique effect of the backplane warpage degree after controlling and adjustment Stress Release can also be reached.
Owing to adopting technique scheme, application flexibility backplane is in silicon capacitor microphone product, the beneficial effects of the utility model are: can under existing technological level, improve the index such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response of silicon capacitor microphone, improve the environmental suitability of product, thus keeping enhancing product performance in the substantially constant basis of production efficiency, reliability, yield and cost, widen the application scenario of product, increase product competitiveness.
Accompanying drawing explanation
Fig. 1 is the vibrating diaphragm of silicon capacitor microphone of the present utility model and flexible backplane and responsive cross-sectional schematic of being out of shape;
Fig. 2 is the schematic top plan view arranging ripple and reinforcement on flexible backplane of the utility model embodiment;
Fig. 3 is the cross-sectional schematic arranging differing heights projection on flexible backplane of another embodiment of the utility model;
Fig. 4 is the schematic top plan view being set to the backplane material of the different relative altitudes in vibrating diaphragm edge and crashproof intensity of the another embodiment of the utility model;
Fig. 5 is the schematic top plan view arranging aperture belt-like zone on flexible backplane of the utility model embodiment again.
Embodiment
The utility model provides the silicon capacitor microphone of application flexibility backplane, the vibrating diaphragm vibration shape can be improved under existing technological level, thus optimize the indexs such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response, improve the environmental suitability of product simultaneously.Below in conjunction with concrete drawings and Examples, the utility model is described in further detail.
Traditional silicon micro-microphone is generally limited to construct multiple relative motion mode between vibrating diaphragm and fixing rigid substrates and the static rigidity backplane of opposing substrate, this the way of restraint is due to substrate and rigidity backplane geo-stationary in sensitivity motion, design comparatively easy, but flexibility is also limited.
For this reason, the utility model proposes a kind of silicon capacitor microphone for application flexibility backplane, comprise substrate, vibrating diaphragm and backplane, described backplane and vibrating diaphragm form movable structure in opposite directions, i.e. variable capacitance, the natural frequency of vibration of wherein said backplane, can lower than the natural frequency of vibration of vibrating diaphragm, also can be equal to or greater than the natural frequency of vibration of a certain diaphragm element, but be no more than 5 times of the natural frequency of vibration maximum of each diaphragm element.The natural frequency of vibration of backplane is decided by the rigidity of backplane, if its natural frequency of vibration is lower than microphone works frequency range (being generally audiorange 20 ~ 20kHz), then can make silicon microphone cannot with correct phase response input signal when input audio signal frequency is higher, and during 5 times of natural frequency of vibration maximum of the backplane natural frequency of vibration higher than each diaphragm element, just with the concept of rigidity backplane closely, the backplane of such setting is when using technical solutions of the utility model, there is the process sex chromosome mosaicism that backplane is more crisp and frangible, because the thickness of backplane is relevant to technology difficulty and cost, and under the prerequisite of the chip size decision backplane flat shape size of design, improving backplane rigidity only way is increase its tensile stress, although and the excessive raising that can bring backplane rigidity of tensile stress, also the security risk that backplane is more crisp and frangible can be brought.
Please refer to Fig. 1, the thickness of backplane 2051 is arranged thinner, and make its rigidity and the natural frequency of vibration closer to after vibrating diaphragm 2031, the sensitive structure of silicon capacitor microphone can be made to affect by processing technology, occur that residual stress causes the warpage of vibrating diaphragm 2051 and backplane 2031.Although remove the capacitance gap defined between vibrating diaphragm 2051 and backplane 2031 in the prior part by sacrifice layer 2042, but after structure release, because both parameters such as rigidity, thickness, stress are similar, the warpage degree that vibrating diaphragm and backplane can be made to occur is close, after cancelling out each other, its relative warpage is less, and relative gap is closer to the preset gap of sacrifice layer 2042.By contrast, in traditional rigid back electrode structure, due to only have vibrating diaphragm 2031 due to the residual stress release in technique warpage, but backplane be rigidity substantially without warpage, backplane can be subject to more imperfection relative to the capacitance profile of vibrating diaphragm and responsive motion mode to be affected.On the other hand, due to electrostatic clamper effect, after being subject to sensitive signal excitation, not only vibrating diaphragm 2031 can change to 2032 positions, flexible backplane 2051 also can change to 2052 positions, the unconverted backplane scheme of such capacitance variations relative stiffness, adds the sensitization capacitance intensity of variation of microphone, namely improves sensitivity.
Fig. 2 is the schematic top plan view arranging ripple and reinforcement on flexible backplane of an embodiment of the present utility model.In prior art, common ripple or the reinforcement of arranging on vibrating diaphragm is to optimize the scheme of the responsive motion vibration shape and stiffness distribution.For rigidity backplane, because its rigidity is very high, the ripple arranged or reinforcement almost do not affect backplane rigidity, and ripple or reinforcement are set on flexible backplane, can together determine the stiffness distribution of backplane with structures such as its perforate, fluting and projections, thus reach the technique effect optimizing the responsive motion vibration shape.
Fig. 3 is the cross-sectional schematic arranging differing heights projection on flexible backplane of another embodiment of the utility model.Because the rdativery sensitive motion vibration shape between vibrating diaphragm and flexible backplane had not only affected by the vibrating diaphragm vibration shape but also by the flexible backplane vibration shape, relative motion is uneven, therefore optimized height required for the multiple projections arranged on backplane inconsistent, multiple projections that can arrange on backplane according to the needs of sensitivity motion, its rising height is greater than one.If the present embodiment is namely according to the needs of the maximum sound pressure level of silicon microphone product work, according to the principle as far as possible increasing malformation space, be provided with 251 from low to high, 252, the projection of 253 3 kind of height.
Fig. 4 is the schematic top plan view being set to the backplane material of the different relative altitudes in vibrating diaphragm edge and crashproof intensity of the another embodiment of the utility model.As mentioned before, owing to employing flexible backplane and there is the warpage due to processing technology introducing, by the difference due to constraint, size, shape, under close Stress Release condition, warpage is in various degree there is in flexible backplane main region 205 and non-principal region 225 at the edge of movable diaphragm 203.In conjunction with the technological means arranging depression, the backplane material of the different relative altitudes in vibrating diaphragm edge and crashproof intensity can be set to.Make vibrating diaphragm 203 blow at extraneous blast like this to hit, can survive after the stress of dropping shock and inner processing technology release effect of stress and not rupture, and retention continues normally to work substantially unchangeably.In addition, as shown in Figure 4, in the present embodiment, after being impacted for preventing flexible backplane, planar there is comparatively large deformation so that damage, in fluting, being provided with narrower region to play a position-limiting action.
Fig. 5 is the schematic top plan view arranging aperture belt-like zone on flexible backplane of the utility model embodiment again.Usually, less perforate and fluting are set, the neighbouring strength of materials can be made to increase.Less perforate or fluting are set in a ribbon region, the technique effect similar with a reinforcement can be formed.Such perforate or fluting are set in backplane, structure existence when backplane is subject to greater impact can be contributed to, especially, by arranging such perforate or fluting in flexible backplane, be equivalent to change the structural strength in belt-like zone and Stress Release condition, so the technique effect of the backplane warpage degree after controlling and adjustment Stress Release can also be reached.In preferred technical scheme, the edge due to hole is more convenient for avoiding stress to concentrate, can setting area is less in corresponding belt-like zone perforate to arrange in technical scheme that reinforcement is target; And be more convenient for calculating due to the impact of the size shape counter stress release rigidity of groove, can the less fluting of setting area to arrange in technical scheme that warpage degree is target.By arranging the mode of aperture on 8 belt-like zones (comprising the rice font that belt-like zone 501-504 is formed and the belt-like zone 505-508 being positioned at meter font four limit) in the present embodiment, for flexible backplane introduces reinforcement, add backplane intensity.
Visible, owing to adopting technological means of the present utility model, can under existing technological level, by arranging the technological means of flexible backplane, under existing technological level, improve the vibrating diaphragm vibration shape, thus optimize the indexs such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response, improve the environmental suitability of product simultaneously, even reduce product cost by reducing backplane thickness, thus widen the application scenario of silicon capacitor microphone product, increase its market competitiveness.
In addition, the term " top " in specification and claims, " end ", " on ", D score, " left side ", " right side " etc. (if existence) is for illustration of property object and not necessarily for describing permanent relative position.Be understandable that the term so used can exchange in the appropriate case, make embodiment of the present utility model as herein described can at the enterprising line operate in other directions being such as different from above-mentioned or described direction herein.Rigidity such as due to vibrating diaphragm in the utility model and backplane is close with the natural frequency of vibration, and the definition of the two can exchange mutually where necessary.
Illustrative to description of the present utility model above; and it is nonrestrictive; those skilled in the art is understood, and can carry out many amendments, change or equivalence, but they all will fall in protection range of the present utility model within the spirit and scope of claim restriction to it.
Claims (4)
1. the silicon capacitor microphone for application flexibility backplane, comprise substrate, vibrating diaphragm and flexible backplane, described flexible backplane and described vibrating diaphragm form variable capacitance, it is characterized in that, described flexible backplane is less than or equal to 20 microns because of the warpage that residual stress causes, described flexible backplane is provided with ripple or reinforcement, and described flexible backplane is also provided with perforate or fluting.
2. silicon capacitor microphone according to claim 1, is characterized in that, described flexible backplane is provided with multiple projection, and described multiple projection has different height.
3. silicon capacitor microphone according to claim 1, it is characterized in that, described backplane is main region and non-principal region by arranging the model split of depression or fluting, at the backplane material of described main region with have different relative altitudes and different crashproof intensity between the backplane material in described non-principal region.
4. silicon capacitor microphone according to claim 1, it is characterized in that, described flexible backplane is provided with multiple hole or groove, and on described backplane, at least there is a belt-like zone, the area that the area ratio in each hole or groove that are positioned at described belt-like zone is positioned at the maximum hole in described flexible other region of backplane or groove is little by more than 5%.
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| CN201520308645.1U CN204598315U (en) | 2015-05-13 | 2015-05-13 | A kind of silicon capacitor microphone of application flexibility backplane |
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| CN201520308645.1U CN204598315U (en) | 2015-05-13 | 2015-05-13 | A kind of silicon capacitor microphone of application flexibility backplane |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853300A (en) * | 2015-05-13 | 2015-08-19 | 北京卓锐微技术有限公司 | Silicon capacitance microphone with application of flexible back electrode |
| CN111834601A (en) * | 2020-08-27 | 2020-10-27 | 中航锂电技术研究院有限公司 | Tab and battery comprising same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853300A (en) * | 2015-05-13 | 2015-08-19 | 北京卓锐微技术有限公司 | Silicon capacitance microphone with application of flexible back electrode |
| CN104853300B (en) * | 2015-05-13 | 2021-05-28 | 共达电声股份有限公司 | Silicon capacitor microphone applying flexible back electrode |
| CN111834601A (en) * | 2020-08-27 | 2020-10-27 | 中航锂电技术研究院有限公司 | Tab and battery comprising same |
| US11705606B2 (en) | 2020-08-27 | 2023-07-18 | Calb Technology Co., Ltd. | Tab and battery including the tab |
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Effective date of registration: 20180723 Address after: 261206 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100191 Beijing Haidian District Zhichun Road 23 quantum Ginza 1002 room Patentee before: Beijing Acuti Microsystems Co., Ltd. |