CN204589358U - A kind of electroplating clamp for SMD LED package substrate plating nickel gold - Google Patents
A kind of electroplating clamp for SMD LED package substrate plating nickel gold Download PDFInfo
- Publication number
- CN204589358U CN204589358U CN201420865120.3U CN201420865120U CN204589358U CN 204589358 U CN204589358 U CN 204589358U CN 201420865120 U CN201420865120 U CN 201420865120U CN 204589358 U CN204589358 U CN 204589358U
- Authority
- CN
- China
- Prior art keywords
- plating nickel
- nickel gold
- package substrate
- led package
- vertical supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to frock clamp, relate to a kind of electroplating clamp for SMD LED package substrate plating nickel gold specifically, comprise and being welded together by two vertical supports and two horizontal supports, form the support body of " well " word shape, described vertical supports is provided with some threaded holes, and screws in screw at each threaded hole.The utility model changes traditional dot-clipped (hook-shaped hanger) into clothes-hook, the homogeneity of electronickelling gold is improved, avoids moulding-die glue-overflow, beat the problems such as gold thread pulling force is not enough, reduce the condemnation factor of product, improve the quality of plating nickel gold product, the work-ing life of plating nickel gold product is extended.
Description
Technical field
The utility model relates to frock clamp, relates to a kind of electroplating clamp for SMD LED package substrate plating nickel gold specifically.
Background technology
Electrogilding corrosion resistance of coating is strong, good conductivity, is easy to welding, high temperature resistant, and there is certain wear resistance (as being mixed with the hard gold of other elements a small amount of), there is good anti-tarnishing ability, simultaneously au-alloy coating has multiple color tones, gold-platedly on silver prevents variable color.And the ductility of coating is good, easy polishing, therefore be commonly used for decorative coating, as plating jewellery, clock and watch part, artwork etc.; Also be widely used in precision instrumentation, printing plate, unicircuit, electronics shell, electric contact etc. and require that the part of electrical parameter performance long-term stability is electroplated.But expensive due to gold, application is subject to a definite limitation.
As the electroplating clamp schematic diagram that Fig. 1 is traditional, welded together by two vertical supports 12 and two horizontal supports 14, form into " well " word shape, vertical supports 12 is provided with some hook-shaped hangers 13, this hook-shaped hanger 13 end is pointed, two vertical supports 12 tops are provided with the knob 11 of fixing whole fixture, conventional brace plating nickel gold lack of uniformity, there will be defective products, affects the work-ing life of product, serious directly scraps, and traditional fixture condemnation factor is also not low.
The traditional surface treatment mode of SMD LED base plate for packaging is plating nickel gold, and the nickel plated thick [Ni >=5um], gold thick [Au >=0.2um] all want thick many than traditional circuit card [Ni >=2um], [Au >=0.02um].It is poorer that electroplating industry ubiquity problem is exactly the thicker homogeneity of plating, concerning tradition, even if larger thickness difference does not have substantial functional impact to the terminal client used, but for base plate for packaging, thickness difference exceedes ± 10um, all will produce fatefulue quality problem, such as moulding-die glue-overflow, to beat gold thread pulling force not enough etc.Be exactly essentially that client is very high to the flatness requirement of circuit board surface, if the thickness evenness of plating nickel gold is bad, point the thickest on plate and the thinnest some pros and cons is made to add up more than 10um, so this block plate does not just have use value, must scrap, this is that mortality is hit concerning base plate for packaging manufacturer.
Utility model content
For the deficiency in above-mentioned technology, the utility model provides a kind of nail-hanging type fixture.
For solving the problems of the technologies described above, the utility model is realized by following scheme: a kind of electroplating clamp for SMD LED package substrate plating nickel gold, comprise and being welded together by two vertical supports and two horizontal supports, form into the support body of " well " word shape, described vertical supports is provided with some threaded holes, and screws in screw at each threaded hole.
Further, described screw is at least through the threaded hole of vertical supports, and the marginal ridge of screw and vertical supports at least leave the distance of 5mm.
Further, two vertical supports tops are respectively provided with a clamping section.
Further, two vertical supports tops are provided with top cross bar, and these top cross bar two ends are enclosed between two clamping sections.
Further, front end, described clamping section is provided with a long spiro nail, and this long spiro nail is through clamping section.
Further, described long spiro nail, through behind clamping section, at least exposes the distance of 100mm.
Further, top, described clamping section is fixed by screw, and this screw is spun on the screw top hole of vertical supports, is fixed clamping section.
Further, lower end, described clamping section is located by gim peg.
The beneficial effects of the utility model are:
1. the utility model changes traditional dot-clipped (hook-shaped hanger) into clothes-hook, and the homogeneity of electronickelling gold is improved,
2. avoid moulding-die glue-overflow, beat the problems such as gold thread pulling force is not enough.
3. reduce the condemnation factor of product.
4. improve the quality of plating nickel gold product.
5. make extend the work-ing life of plating nickel gold product.
Accompanying drawing explanation
Fig. 1 is the electroplating clamp schematic diagram of traditional SMD LED package substrate plating nickel gold.
Fig. 2 is the electroplating clamp schematic diagram of the utility model SMD LED package substrate plating nickel gold.
Fig. 3 is the utility model clamping section enlarged view.
Fig. 4 is that the utility model clothes-hook is arranged on vertical supports schematic diagram.
Mark in accompanying drawing: knob 11; Vertical supports 12; Hook-shaped hanger 13; Horizontal support 14; Clothes-hook 21; Clamping section 22; Top cross bar 23; Long spiro nail 221; Screw 222; Gim peg 223.
Embodiment
Below in conjunction with accompanying drawing, the utility model is elaborated.
Please refer to accompanying drawing 2-4, a kind of electroplating clamp for SMD LED package substrate plating nickel gold of the utility model, comprise and being welded together by two vertical supports 12 and two horizontal supports 14, form into the support body of " well " word shape, it is characterized in that: described vertical supports 12 is provided with some threaded holes, and screw in screw 21 at each threaded hole.Described screw 21 is at least through the threaded hole of vertical supports 12, and the marginal ridge of screw 21 and vertical supports 12 at least leave the distance of 5mm.Two vertical supports 12 tops are respectively provided with a clamping section 22.Two vertical supports 12 tops are provided with top cross bar 23, and these top cross bar 23 two ends are enclosed between two clamping sections 22.Front end, described clamping section 22 is provided with a long spiro nail 221, and this long spiro nail 221 is through clamping section 22.Described long spiro nail 221, through behind clamping section 22, at least exposes the distance of 100mm.Top, described clamping section 22 is fixed by screw 222, and this screw 222 is spun on the screw top hole of vertical supports 12, is fixed clamping section 22, and lower end, described clamping section 22 is located by gim peg 223.
Its object of the utility model just from product quality angle, improves frock clamp, develops the homogeneity technology improving plating nickel gold.
1. by improving the folder point mode of base plate for packaging plating nickel gold hanger, by traditional some folder mode ((end of hook-shaped hanger is pointed) changes clothes-hook into, by fixing for plate more firm and to lead and in via, make distribution of current evenly more stable.
2., because gold-plated line is not specific equipment, so without specific aim, understand device characteristics, carry out the homogeneity of testing nickel plating cylinder, silver-colored cylinder, golden cylinder, sum up coating thickness rule, the annode area that then Matching and modification is corresponding, anode distance, anode distribution, liquid medicine cycle perspective etc.
3. according to variant production model, the design of amendment base plate for packaging electroplate lead wire, reduces to the lead-in wire on the PCS of corner, and in the middle of densifying plate, the wiring layout of PCS, makes current potential uniformity on plate.
4. the electroplating parameter that test is different, the impact on coating uniformity such as verificating current size.
The foregoing is only preferred implementation of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification sheets and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. the electroplating clamp for SMD LED package substrate plating nickel gold, comprise and being welded together by two vertical supports (12) and two horizontal supports (14), form into the support body of " well " word shape, it is characterized in that: described vertical supports (12) is provided with some threaded holes, and screw in screw (21) at each threaded hole.
2. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 1, it is characterized in that: described screw (21) is at least through the threaded hole of vertical supports (12), and the marginal ridge of screw (21) and vertical supports (12) at least leave the distance of 5mm.
3. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 1, is characterized in that: two vertical supports (12) tops are respectively provided with a clamping section (22).
4. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 1 or 3, it is characterized in that: two vertical supports (12) tops are provided with top cross bar (23), and this top cross bar (23) two ends are enclosed between two clamping sections (22).
5. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 3, it is characterized in that: described clamping section (22) front end is provided with a long spiro nail (221), this long spiro nail (221) is through clamping section (22).
6. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 5, is characterized in that: described long spiro nail (221), through after clamping section (22), at least exposes the distance of 100mm.
7. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 3, it is characterized in that: described clamping section (22) top is fixed by screw (222), this screw (222) is spun on the screw top hole of vertical supports (12), clamping section (22) is fixed.
8. a kind of electroplating clamp for SMD LED package substrate plating nickel gold according to claim 3, is characterized in that: described clamping section (22) lower end is by gim peg (223) location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420865120.3U CN204589358U (en) | 2014-12-31 | 2014-12-31 | A kind of electroplating clamp for SMD LED package substrate plating nickel gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420865120.3U CN204589358U (en) | 2014-12-31 | 2014-12-31 | A kind of electroplating clamp for SMD LED package substrate plating nickel gold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204589358U true CN204589358U (en) | 2015-08-26 |
Family
ID=53925530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420865120.3U Expired - Fee Related CN204589358U (en) | 2014-12-31 | 2014-12-31 | A kind of electroplating clamp for SMD LED package substrate plating nickel gold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204589358U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107587184A (en) * | 2017-07-31 | 2018-01-16 | 杭州莱源环保科技有限公司 | A kind of special electroplating system of automobile caliper bracket |
-
2014
- 2014-12-31 CN CN201420865120.3U patent/CN204589358U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107587184A (en) * | 2017-07-31 | 2018-01-16 | 杭州莱源环保科技有限公司 | A kind of special electroplating system of automobile caliper bracket |
| CN107587184B (en) * | 2017-07-31 | 2023-12-22 | 浙江泛源科技股份有限公司 | Electroplating system special for automobile caliper bracket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20171231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |