CN204569803U - A kind of novel UV with electrostatic-proof function cuts film - Google Patents
A kind of novel UV with electrostatic-proof function cuts film Download PDFInfo
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- CN204569803U CN204569803U CN201520242283.0U CN201520242283U CN204569803U CN 204569803 U CN204569803 U CN 204569803U CN 201520242283 U CN201520242283 U CN 201520242283U CN 204569803 U CN204569803 U CN 204569803U
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- rete
- electrostatic
- base material
- film layer
- novel
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- 239000000463 material Substances 0.000 claims abstract description 28
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000009503 electrostatic coating Methods 0.000 claims abstract description 5
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 13
- 238000005507 spraying Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 241001050985 Disco Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model describes a kind of novel UV with electrostatic-proof function and cuts film, comprise base material rete, the gluing rete of UV and release film layer, and base material film layer fits in the upper surface of the gluing rete of UV, and release film layer fits in the lower surface of the gluing rete of UV; Wherein, be coated with antistatic coating at the upper surface of base material rete, this antistatic coating is made up of anti-electrostatic coating fluid and thickness is 0.001 ~ 0.004mm.Owing to have employed above-mentioned technology, namely the utility model passes through at the thick anti-static coating of surface spraying one deck 0.001 ~ 0.004mm of base material rete, the surface resistivity of base material rete is made to reach 106 Ω/sq ~ 108 Ω/sq, thus reduce the possibility producing electrostatic when wafer cutting picks crystal grain, and then the risk avoided chip damage, possess the advantages such as the simple and ductility of processing is good simultaneously, and finally to have reached objects such as improving product yield and reduction production cost.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of novel UV with electrostatic-proof function and cuts film.
Background technology
In the operation manufacturing semi-conductor and LED, generally need when cutting off semiconductor wafer or LED product parts to use cutting film.This cutting film is used as supporting mainly through stickup semiconductor wafer or LED product parts, logical cutting facility is (as equipment vendors: Disco commercial firm again, the accurate commercial firm in Tokyo etc.) carry out cutting and being separated, portioned product need be expanded etc. this cutting film; Again from the product after film pickup or stripping cutting.
But, in the pad pasting, the link such as carrying and cutting of product, pick in the process of chip after the cutting of particularly later product and all very easily produce electrostatic, this electrostatic can cause damage to a certain degree to the performance of chip, thus the reduction of yield in causing subsequent product to be tested.
At present, existing way picks on equipment at crystal grain to install ion anti-electrostatic blower fan additional, thus the electrostatic of generation of being dissipated by ion wind, adopt the adhesive tape with antistatic performance to cut simultaneously, namely in base material film preparation or tackiness agent, add multiple anlistatig material to reach the effect of anti-electrostatic.But, because filming technology is comparatively complicated and antistatic performance is unstable, material simultaneously owing to adding can affect some fundamental propertys of base material film and tackiness agent, thus causes occurring the abnormal conditions such as cull or wire drawing during adhesive tape cutting prod, and then affects the yield of product; The cost of ion anti-electrostatic blower fan costly simultaneously, thus cause into the raising of product cost.
Utility model content
In order to solve above-mentioned electrostatic problem, the utility model provides a kind of novel UV with electrostatic-proof function to cut film, the advantage such as possess that processing is simple, anti-static effect is good and ductility is good.
Above-mentioned a kind of novel UV with electrostatic-proof function cuts film, and comprise base material rete, the gluing rete of UV and release film layer, described base material film layer fits in the upper surface of the gluing rete of UV, and described release film layer fits in the lower surface of the gluing rete of UV; Wherein, the upper surface of described base material rete is coated with antistatic coating, and described antistatic coating is made up of anti-electrostatic coating fluid and thickness is 0.001 ~ 0.004mm.
In said structure, the thickness of described base material rete is 0.07 ~ 0.1mm.
In said structure, the resistance value of the gluing rete of described UV is 10
11Ω/sq ~ 10
12Ω/sq.
In said structure, described release film layer is PET release film.
In said structure, the thickness of described release film layer is 0.025 ~ 0.045mm.
Advantage of the present utility model and beneficial effect are: the utility model provides a kind of novel UV with electrostatic-proof function and cuts film, by the anti-static coating that the surface spraying one deck 0.001 ~ 0.004mm at base material rete is thick, the surface resistivity of base material rete is made to reach 106 Ω/sq ~ 108 Ω/sq, thus reduce the possibility producing electrostatic when wafer cutting picks crystal grain, and then the risk avoided chip damage, possess the advantages such as the simple and ductility of processing is good simultaneously, and finally to have reached objects such as improving product yield and reduction production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation that in the utility model, novel UV cuts film.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
As shown in Figure 1, the utility model describes a kind of novel UV with electrostatic-proof function and cuts film, comprises base material rete 2, the gluing rete 3 of UV and release film layer 4.
Wherein, above-mentioned base material rete 2 fits in the upper surface of the gluing rete 3 of UV, and release film layer 4 then fits in the lower surface of the gluing rete 3 of UV;
Preferably, the thickness of above-mentioned base material rete 2 be 0.07 ~ 0.1mm and adopt be existing PVC film, its main component is Low Density Polyethylene and polyvinyl chloride etc.This PCV film has good ductility and certain antistatic property; Meanwhile, the gluing rete 3 of UV is mainly mixed by polycomponent solvent-type acrylic pressure sensitive adhesive, UV monomer or UV oligopolymer, light trigger and solidifying agent, and its resistance value is 1011 Ω/sq ~ 1012 Ω/sq; In addition, release film layer 4 have employed existing PET release film, and what this PET release film was general has lateral silicon PET and one side fluorine element PET etc., and its thickness is 0.025 ~ 0.045mm.
Further, in order to reach good anti-static effect, so be coated with antistatic coating 1 at the upper surface of base material rete 2, this antistatic coating 1 is formed primarily of anti-electrostatic coating fluid, and thickness is 0.001 ~ 0.004mm.
In actual use, first tackiness agent is coated on board, and the lower surface of base material rete 2 is coated with one deck UV tackiness agent, thus forms the gluing rete 3 of UV;
Then, then by supporting equipment the glue layer of gluing for UV rete 3 and release film compound rolling, to form release film layer 4;
Finally, adopt the mode of spraying coating anti-electrostatic coating fluid to be evenly sprayed on the upper surface of base material rete 2, thus form the antistatic coating 1 of layer at the upper surface of base material rete 2.The advantage of this spraying coating process is, utilizes the good covering that lower glue spread can realize former base material rete 2 upper surface, and the thickness of spraying can control at about 2um according to the material of spraying.
Detect through reality, in the utility model, the surperficial resistance of novel UV cutting film can reach 106 Ω/sq ~ 108 Ω/sq, and the resistance value of the gluing rete 3 of UV then can reach 1011 Ω/sq ~ 1012 Ω/sq, effectively can avoid the generation of electrostatic.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (5)
1. the novel UV with electrostatic-proof function cuts a film, and comprise base material rete, the gluing rete of UV and release film layer, described base material film layer fits in the upper surface of the gluing rete of UV, and described release film layer fits in the lower surface of the gluing rete of UV; It is characterized in that, the upper surface of described base material rete is coated with antistatic coating, and described antistatic coating is made up of anti-electrostatic coating fluid and thickness is 0.001 ~ 0.004mm.
2. a kind of novel UV with electrostatic-proof function cuts film as claimed in claim 1, and it is characterized in that, the thickness of described base material rete is 0.07 ~ 0.1mm.
3. a kind of novel UV with electrostatic-proof function cuts film as claimed in claim 1, and it is characterized in that, the resistance value of the gluing rete of described UV is 10
11Ω/sq ~ 10
12Ω/sq.
4. a kind of novel UV with electrostatic-proof function cuts film as claimed in claim 1, and it is characterized in that, described release film layer is PET release film.
5. a kind of novel UV with electrostatic-proof function cuts film as claimed in claim 4, and it is characterized in that, the thickness of described release film layer is 0.025 ~ 0.045mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520242283.0U CN204569803U (en) | 2015-04-20 | 2015-04-20 | A kind of novel UV with electrostatic-proof function cuts film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520242283.0U CN204569803U (en) | 2015-04-20 | 2015-04-20 | A kind of novel UV with electrostatic-proof function cuts film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204569803U true CN204569803U (en) | 2015-08-19 |
Family
ID=53862473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520242283.0U Active CN204569803U (en) | 2015-04-20 | 2015-04-20 | A kind of novel UV with electrostatic-proof function cuts film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204569803U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110564329A (en) * | 2018-06-05 | 2019-12-13 | 利诺士尖端材料有限公司 | Antistatic die attach film, method of manufacturing the same, and wafer dicing process using the same |
| CN113770557A (en) * | 2021-10-22 | 2021-12-10 | 无锡韦感半导体有限公司 | Method for removing static electricity of laser cutting wafer |
| CN115433912A (en) * | 2022-08-30 | 2022-12-06 | 歌尔微电子股份有限公司 | Magnetic control sputtering method of BGA product and BGA product |
| CN116120853A (en) * | 2023-02-28 | 2023-05-16 | 苏州恒悦新材料股份有限公司 | Semiconductor UV cutting film and processing technology thereof |
-
2015
- 2015-04-20 CN CN201520242283.0U patent/CN204569803U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110564329A (en) * | 2018-06-05 | 2019-12-13 | 利诺士尖端材料有限公司 | Antistatic die attach film, method of manufacturing the same, and wafer dicing process using the same |
| CN110564329B (en) * | 2018-06-05 | 2022-11-22 | 利诺士尖端材料有限公司 | Antistatic die attach film, method of manufacturing the same, and wafer dicing process using the same |
| CN113770557A (en) * | 2021-10-22 | 2021-12-10 | 无锡韦感半导体有限公司 | Method for removing static electricity of laser cutting wafer |
| CN115433912A (en) * | 2022-08-30 | 2022-12-06 | 歌尔微电子股份有限公司 | Magnetic control sputtering method of BGA product and BGA product |
| CN116120853A (en) * | 2023-02-28 | 2023-05-16 | 苏州恒悦新材料股份有限公司 | Semiconductor UV cutting film and processing technology thereof |
| CN116120853B (en) * | 2023-02-28 | 2023-11-14 | 苏州恒悦新材料股份有限公司 | Semiconductor UV cutting film and processing technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231219 Address after: No. 110 Meicheng Road, Qingjiangpu District, Huai'an City, Jiangsu Province, 223001 Patentee after: Jiangsu Dongxu Electronic Technology Co.,Ltd. Address before: Room 202, 2nd Floor, Building 1, No. 218 Huashen Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 200052 Patentee before: SHANGHAI DONGXU ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |