CN204565427U - The efficient laser etching device of a kind of small pieces OGS - Google Patents
The efficient laser etching device of a kind of small pieces OGS Download PDFInfo
- Publication number
- CN204565427U CN204565427U CN201520187819.3U CN201520187819U CN204565427U CN 204565427 U CN204565427 U CN 204565427U CN 201520187819 U CN201520187819 U CN 201520187819U CN 204565427 U CN204565427 U CN 204565427U
- Authority
- CN
- China
- Prior art keywords
- platform
- axis displacement
- displacement platform
- ogs
- small pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses the efficient laser etching device of a kind of small pieces OGS, comprise workpiece Placement Cell, two CCD grabs marking machine structure and scanning etching mechanism, workpiece Placement Cell comprises optical table, DD motor and absorption platform; While a sensor processing, another station on absorption platform can complete material loading operation simultaneously; DD motor driving absorption platform rotates 180 °, by lower a slice work piece delivery within the scope of laser-induced thermal etching, simultaneously by supreme for manufactured work piece delivery discharge station.The utility model had both eliminated grabs mark motion required time, and significantly improving production efficiency, improves utilization ratio of manual labor simultaneously, can complete the output of the nearly twice of common laser etching machine, also without the need to using XY axle motion platform, reduces equipment cost.
Description
Technical field
The utility model relates to laser etching machine manufacturing field of equipment, particularly relates to the efficient laser etching device of a kind of small pieces OGS.
Background technology
Existing OGS laser etching machine is before etching and processing, all need by mobile workpiece to be added, on workpiece to be added two Mark marks are made to be placed in CCD camera within sweep of the eye, identify the relative position of workpiece to be added at CCD after, then moved to the work centre below lens by industrial computer controlled motion platform, and controlled the etching and processing that laser instrument and scanning galvanometer complete circuit.
Be not difficult to find out thus, location needs repeatedly to move XY axle motion platform, the waste plenty of time, and frequent motion also will affect the precision and stability of equipment for a long time; Need to purchase XY axle motion platform, its frame for movement and motion control are all comparatively complicated, and cost is higher; Before previous OGS to be processed does not complete processing, cannot the preparations such as the material loading of lower a slice be carried out, utilization ratio of manual labor and production efficiency low.
Utility model content
The purpose of this utility model is for above-mentioned the deficiencies in the prior art, provides a kind of without the need to XY axle motion platform, efficiently can complete the efficient laser etching device of a kind of small pieces OGS of Laser Processing work.
The technical solution of the utility model is achieved in that the efficient laser etching device of a kind of small pieces OGS, comprise workpiece Placement Cell, two CCD grabs marking machine structure and scanning etching mechanism, the DD motor that described workpiece Placement Cell comprises optical table, base is arranged on optical table center and center are fixed on the absorption platform of DD motor round end, described couple of CCD grabs marking machine structure and comprises X-axis displacement platform, Y-axis displacement platform, Z axis displacement platform, two CCD camera, two axis light and two prisms, described Y-axis displacement platform is made up of two symmetrical structures, and be separately fixed at X-axis displacement platform two ends, Z axis displacement platform is made up of two symmetrical structures equally, and be separately fixed at two nearly absorption platform one end of Y-axis displacement platform, described two axis light to be separately fixed on Z axis displacement platform and parallel with X-axis displacement platform, described two CCD camera are fixed on the absorption platform side far away of two axis light, described two prisms is fixed on the nearly absorption platform side of two axis light, described scanning etching mechanism comprises laser instrument, galvanometer and lens, and described laser instrument is connected with the light inlet of galvanometer, and lens are horizontally set on vibration mirror scanning mouth lower central place.
As to further improvement of the utility model, the anglec of rotation of described DD motor is constant is set to 180 °.
As to further improvement of the utility model, the work area of described lens scan is greater than the surface area of workpiece to be added.
As to further improvement of the utility model, the adsorption area of described absorption platform is greater than the twice of vibration mirror scanning area.
The beneficial effects of the utility model are, while a sensor processing, another station on absorption platform can complete material loading operation simultaneously.After previous sensor completes, staff starts start button, and DD motor driving absorption platform rotates 180 °, by lower a slice work piece delivery within the scope of laser-induced thermal etching, simultaneously by supreme for manufactured work piece delivery discharge station; Move in circles and constantly produce, both eliminated and grabbed mark motion required time, significantly improving production efficiency, improves utilization ratio of manual labor simultaneously, can complete the output of the nearly twice of common laser etching machine, also without the need to using XY axle motion platform, reduces equipment cost.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
In figure: 1, optical table, 2, DD motor, 3, absorption platform, 4, X-axis displacement platform, 5, Y-axis displacement platform, 6, Z axis displacement platform, 7, CCD camera, 8, axis light, 9, prism, 10, laser instrument, 11, galvanometer, 12, lens, the 13, first workpiece, 14, second workpiece.
Detailed description of the invention
As shown in Figure 1, the efficient laser etching device of a kind of small pieces OGS of the present utility model, comprises workpiece Placement Cell, two CCD grabs marking machine structure and scanning etching mechanism.
The DD motor 2 that workpiece Placement Cell comprises optical table 1, base is arranged on optical table 1 center and center are fixed on the absorption platform 3 of DD motor 2 round end.Wherein, the anglec of rotation of DD motor 2 is constant is set to 180 °, and the adsorption area of absorption platform 3 is greater than the twice of galvanometer 11 scan area, and absorption platform 3 can be made like this can to place two workpiece simultaneously, and previous station is in and adds man-hour, a rear station can carry out loading and unloading work.
Two CCD grabs marking machine structure and comprises X-axis displacement platform 4, Y-axis displacement platform 5, Z axis displacement platform 6, two CCD camera 7, two axis light 8 and two prisms 9; Y-axis displacement platform 5 is made up of two symmetrical structures, and is separately fixed at X-axis displacement platform 4 two ends, and Z axis displacement platform 6 is made up of two symmetrical structures equally, and is separately fixed at nearly absorption platform 3 one end of two Y-axis displacement platforms 5; Two axis light 8 to be separately fixed on Z axis displacement platform 6 and parallel with X-axis displacement platform 4, and two CCD camera 7 are fixed on absorption platform far away 3 side of two axis light 8, and two prisms 9 is fixed on nearly absorption platform 3 side of two axis light 8.
Scanning etching mechanism comprises laser instrument 10, galvanometer 11 and lens 12, and laser instrument 10 is connected with the light inlet of galvanometer 11, and lens 12 are horizontally set on galvanometer 11 and scan mouth lower central place.
During implementation, first workpiece 13 is placed in working range that galvanometer 11 scans, and make the mark of the Mark on the first workpiece 13 two diagonal angles (not shown) be placed in two CCD camera 7 within sweep of the eye, now, synchronously capture Mark by CCD camera 7 mark and identify the relative position of the first workpiece 13, control laser instrument 10 by industrial computer (not shown) and complete etching and processing; While the first workpiece 13 etching and processing, absorption platform 3 can carry out the blanking work of a upper workpiece and the material loading work of second workpiece 14, after the first workpiece 13 completes etching and processing, staff opens DD motor 2, absorption platform 3 is made to rotate 180 °, second workpiece 14 is delivered in the range of work, then the blanking work of the first workpiece 13 and the material loading work of next workpiece is completed, i.e. production capable of circulation like this, significantly promote the production efficiency of small pieces OGS, simultaneously also without the need to XY axle motion platform, reduce equipment cost.
The concrete operation step of this utility model is as follows:
1, roughly determine the putting position of workpiece to be added according to the relative dimensions of vibration mirror scanning center and workpiece to be etched, when absorption platform being laid limited block to ensure each material loading, workpiece is in same position all substantially.
2, according to the position of workpiece to be added, 2 CCD are moved to respectively the workpiece upper right corner and two, lower right corner target (Mark point) top, and lock.
3, carry out CCD demarcation, after making to grab mark, control software design accurately can calculate the particular location of workpiece, and can control galvanometer and accurately complete Etching.
4, material loading, puts workpiece to be added well rear startup etch system, and workpiece will by automatic absorbing on absorption platform, and rotates 180 ° and enter into position to be processed.
5, after DD motor movement puts in place, two CCD captures 2 targets simultaneously, calculates the particular location of workpiece, completes etching by industrial computer gated sweep etching mechanism; While etching, staff can carry out the material loading of second OGS.
6, first has etched, and second material loading is complete, again starts processing by staff, second by automatic absorbing on absorption platform, DD motor rotates 180 °, by second send into Working position.After DD motor is rotated in place, first is unclamped automatically, is convenient to staff and takes off the workpiece machined, and puts the 3rd workpiece to be added well.So move in circles, continuous production.
Claims (4)
1. the efficient laser etching device of small pieces OGS, comprise workpiece Placement Cell, two CCD grabs marking machine structure and scanning etching mechanism, it is characterized in that: the DD motor that described workpiece Placement Cell comprises optical table, base is arranged on optical table center and center are fixed on the absorption platform of DD motor round end, described couple of CCD grabs marking machine structure and comprises X-axis displacement platform, Y-axis displacement platform, Z axis displacement platform, two CCD camera, two axis light and two prisms, described Y-axis displacement platform is made up of two symmetrical structures, and be separately fixed at X-axis displacement platform two ends, Z axis displacement platform is made up of two symmetrical structures equally, and be separately fixed at two nearly absorption platform one end of Y-axis displacement platform, described two axis light to be separately fixed on Z axis displacement platform and parallel with X-axis displacement platform, described two CCD camera are fixed on the absorption platform side far away of two axis light, described two prisms is fixed on the nearly absorption platform side of two axis light, described scanning etching mechanism comprises laser instrument, galvanometer and lens, and described laser instrument is connected with the light inlet of galvanometer, and lens are horizontally set on vibration mirror scanning mouth lower central place.
2. the efficient laser etching device of a kind of small pieces OGS according to claim 1, is characterized in that: the anglec of rotation of described DD motor is constant is set to 180 °.
3. the efficient laser etching device of a kind of small pieces OGS according to claim 1, is characterized in that: the work area of described lens scan is greater than the surface area of workpiece to be added.
4. the efficient laser etching device of a kind of small pieces OGS according to claim 1, is characterized in that: the adsorption area of described absorption platform is greater than the twice of vibration mirror scanning area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187819.3U CN204565427U (en) | 2015-03-31 | 2015-03-31 | The efficient laser etching device of a kind of small pieces OGS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187819.3U CN204565427U (en) | 2015-03-31 | 2015-03-31 | The efficient laser etching device of a kind of small pieces OGS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204565427U true CN204565427U (en) | 2015-08-19 |
Family
ID=53858118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520187819.3U Active CN204565427U (en) | 2015-03-31 | 2015-03-31 | The efficient laser etching device of a kind of small pieces OGS |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204565427U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741795A (en) * | 2015-03-31 | 2015-07-01 | 武汉先河激光技术有限公司 | Efficient laser etching device for small OGS |
| CN106346138A (en) * | 2016-09-30 | 2017-01-25 | 广东正业科技股份有限公司 | Laser machining device and double-station switching device and method thereof |
| CN108994445A (en) * | 2018-08-06 | 2018-12-14 | 东晶电子金华有限公司 | The control method of vacuum laser welder and vacuum laser welder |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
| CN111383924A (en) * | 2018-12-27 | 2020-07-07 | 新科金朋私人有限公司 | Semiconductor device with partial EMI shield removal using laser ablation |
-
2015
- 2015-03-31 CN CN201520187819.3U patent/CN204565427U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741795A (en) * | 2015-03-31 | 2015-07-01 | 武汉先河激光技术有限公司 | Efficient laser etching device for small OGS |
| CN106346138A (en) * | 2016-09-30 | 2017-01-25 | 广东正业科技股份有限公司 | Laser machining device and double-station switching device and method thereof |
| CN108994445A (en) * | 2018-08-06 | 2018-12-14 | 东晶电子金华有限公司 | The control method of vacuum laser welder and vacuum laser welder |
| CN108994445B (en) * | 2018-08-06 | 2024-05-03 | 东晶电子金华有限公司 | Vacuum laser sealing machine and control method thereof |
| CN111383924A (en) * | 2018-12-27 | 2020-07-07 | 新科金朋私人有限公司 | Semiconductor device with partial EMI shield removal using laser ablation |
| CN111383924B (en) * | 2018-12-27 | 2022-07-15 | 星科金朋私人有限公司 | Semiconductor device with partial EMI shield removal using laser ablation |
| US11444035B2 (en) | 2018-12-27 | 2022-09-13 | STATS ChipPAC Pte. Ltd. | Semiconductor device with partial EMI shielding removal using laser ablation |
| US11935840B2 (en) | 2018-12-27 | 2024-03-19 | STATS ChipPAC Pte. Ltd. | Semiconductor device with partial EMI shielding removal using laser ablation |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104741795A (en) | Efficient laser etching device for small OGS | |
| CN204565427U (en) | The efficient laser etching device of a kind of small pieces OGS | |
| CN102248309B (en) | Wafer laser dicing method and wafer laser dicing equipment with charge coupled device (CCD) assisting in positioning | |
| KR20200071643A (en) | Interactive dual table inkjet machine | |
| CN103453889B (en) | Ccd video camera calibration alignment method | |
| CN204021920U (en) | The self-propelled material transporter of coupling electric logging device equipment | |
| CN102531367A (en) | Substrate processing method | |
| CN105538518B (en) | Cutting method applying intelligent stone cutting robot | |
| CN201702514U (en) | Laser scribing machine used for CCD device assisted positioning type wafer processing | |
| CN110009685A (en) | A kind of laser camera hand and eye calibrating method increasing material applied to electric arc | |
| CN106735878A (en) | The laser process equipment and its method of cell phone rear cover and frame | |
| CN205979028U (en) | Hand -held type laser scanner assists numerical control workbench | |
| CN202648619U (en) | Moving bridge type coordinate measuring machine added with bottom portion light source moving part | |
| CN211135919U (en) | Ceramic material laser scribing processing device | |
| CN106346139B (en) | A kind of unordered vision positioning marking system | |
| CN205246712U (en) | Full -automatic probe station image positioner | |
| CN202331007U (en) | Lens test focusing machine | |
| CN202582485U (en) | Image measuring instrument with automatic product information input | |
| CN109500817B (en) | 360-Degree vision tracking control system and control method for multi-legged robot | |
| CN102411257A (en) | Lens testing focusing machine | |
| CN114309991B (en) | Laser automatic cutting control system and control method thereof | |
| CN217196196U (en) | Glass processing center equipment with visual positioning function | |
| CN101566462A (en) | Measuring method of virtual clamp | |
| CN214322624U (en) | Positioning tool for numerical control edge milling of circuit board without PIN holes | |
| CN205147591U (en) | Mirror welding set shakes at a high speed based on visual positioning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170216 Address after: Suqian City, Jiangsu province 223800 laser Industrial Park Sucheng District small foreign processing zone Patentee after: Jiangsu precedent Laser Technology Co., Ltd. Address before: 430223 Hubei city of Wuhan province and Economic Development Zone Jiangxia road ERON Island Garden 12 district 502 Building 1 unit 102 Patentee before: Wuhan Xianhe Laser Technology Co., Ltd. |