CN204491011U - Electroplating substrate system - Google Patents
Electroplating substrate system Download PDFInfo
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- CN204491011U CN204491011U CN201420852323.9U CN201420852323U CN204491011U CN 204491011 U CN204491011 U CN 204491011U CN 201420852323 U CN201420852323 U CN 201420852323U CN 204491011 U CN204491011 U CN 204491011U
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Abstract
The utility model is about electroplating substrate system.Electroplating substrate system according to the utility model one embodiment comprises: current source, plating tank, one group of induction installation and plating controller.Current source is configured to export electroplating current.Plating tank is configured to receive this electroplating current, and this plating tank comprises anode array and negative electrode further.This group induction installation is arranged at opposite, substrate feeding area, and what wherein each induction installation was positioned at each electroplated substrate of this substrate feeding area can sense position.Plating controller comprises further: be configured to the quantity of the electroplated substrate receiving this group induction installation sensing and the receptor of a reference quantity, be configured to the comparer quantity of sensed electroplated substrate and this reference quantity compared, be configured to the counter of the value calculating this electroplating current when sensed quantity is identical with reference to quantity based on sensed quantity, and be configured to the feeder value of this electroplating current being fed to this current source.
Description
Technical field
The utility model is about semiconductor packaging, especially for the electroplating substrate system of semiconductor packages.
Background technology
Along with the development of semiconductor packaging, base plate for packaging obtains using more and more widely.Usually, before electroplating substrate, electroplated substrate can be positioned over feeding area by operator, and by electroplated number of substrates input electroplating control system, by the electroplated number of substrates calculating required electroplating current of electroplating control system based on input.Number of substrates is larger, and the electroplating current of needs is larger.If the electroplated number of substrates mistake of input causes electroplating current improper, then can affect the effect of plating, substrate time serious, even can be caused to scrap.
And manual handling unavoidably there will be careless omission, some artificial subjective factors in addition, cause the consequence of this careless omission to be exaggerated, the substrate brought as done over again without authorization heavily plates.The generation of careless omission can be reduced by increasing reinspection person, but still the impact of human factor can not be got rid of, and the rising of cost of labor can be brought.Simultaneously this manual operation does not also meet the trend of automated job.
Thus, existing electroplating substrate system requires further improvement, thus improves automated job degree and plated item qualification rate.
Utility model content
One of the purpose of this utility model is to provide one for the electroplating substrate system of semiconductor packages, and its careless omission that manual operation electroplating control system can be avoided to bring, ensures electroplating quality.
According to an embodiment of the present utility model, one comprises for the electroplating substrate system of semiconductor packages: current source, plating tank, one group of induction installation and plating controller.Current source is configured to export electroplating current.Plating tank is configured to receive this electroplating current, and this plating tank comprises anode array and negative electrode further.This group induction installation is arranged at opposite, substrate feeding area, and what wherein each induction installation was positioned at each electroplated substrate of this substrate feeding area can sense position.Plating controller comprises further: be configured to the quantity of the electroplated substrate receiving this group induction installation sensing and the receptor of a reference quantity, be configured to the comparer quantity of sensed electroplated substrate and this reference quantity compared, be configured to the counter of the value calculating this electroplating current when sensed quantity is identical with reference to quantity based on sensed quantity, and be configured to the feeder value of this electroplating current being fed to this current source.
In an embodiment of the present utility model, this reference quantity is the quantity of the artificial electroplated substrate calculated.And in another embodiment of the present utility model, this reference quantity is that another group induction installation being arranged at this substrate feeding area senses.This plating controller can comprise the warning howler being configured to give the alarm when sensed quantity and reference different amts further.
This plating controller also can comprise telltale further, and it is configured to indicate this group induction installation again to sense and re-enter with reference to quantity.But this group induction installation pyroscan, this can sense position can be just to the position of this each electroplated substrate center.This electroplating substrate system is applicable to chemical plating, particularly electronickelling gold.
Electroplating substrate system of the present utility model uses the quantity of induction installation sensing electroplated substrate, and only this sensing quantity verification by time just electroplate, improve the level of automation of electroplating activity, avoid the electroplating quality problem that the miscount of electroplated number of substrates causes simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electroplating substrate system according to the utility model one embodiment.
Fig. 2 is the layout schematic side view of substrate feeding area according to the utility model one embodiment and induction installation, and it is applicable to the electroplating substrate system of Fig. 1.
Fig. 3 is the structural representation of the plating controller according to the utility model one embodiment, and it is applicable to the electroplating substrate system of Fig. 1.
Embodiment
For better understanding spirit of the present utility model, below in conjunction with part preferred embodiment of the present utility model, it is described further.
In electroplating substrate system, human factor participates in too much causing electroplating quality to be difficult to remain stable, and production efficiency cannot be produced with full-automation and compared.
The electroplating substrate system for semiconductor packages that the utility model embodiment provides then can solve the problem, and it is applicable to chemical plating, particularly electronickelling gold.
Fig. 1 is the structural representation of the electroplating substrate system 10 according to the utility model one embodiment.
As shown in Figure 1, electroplating substrate system 10 comprises current source 20, plating tank 30, plating controller 40, substrate feeding area 50, and one group of induction installation 60.
Fig. 2 is the layout schematic side view of substrate feeding area 50 according to the utility model one embodiment and induction installation 60, and it is applicable to the electroplating substrate system 10 of Fig. 1.
Composition graphs 1,2, substrate feeding area 50 is provided with substrate holder 14, and electroplated substrate 12 is hung on this substrate holder 14.Induction installation 60 is arranged at this substrate holder 14 opposite, and what wherein each induction installation 60 was positioned at each electroplated substrate 12 of this substrate feeding area 50 can sense position.Such as, as shown in Figure 2, this can sense position be just to the position at this each electroplated substrate 12 center in the present embodiment.Induction installation 60 can use any induction installation comprising infrared inductor, even camera.Such as, when selecting infrared inductor 60, each infrared inductor 60 may correspond to induction a slice electroplated substrate.When infrared inductor 60 right opposite needs electroplating substrate 12, then this infrared inductor 60 is in opened condition; If infrared inductor 60 right opposite does not have electroplated substrate 12, then infrared inductor 60 is in closing condition.
Fig. 3 is the structural representation of the plating controller 40 according to the utility model one embodiment, and it is applicable to the electroplating substrate system 10 of Fig. 1.
As shown in Figure 3, plating controller 40 comprises receptor 42, comparer 44, counter 46 further, and feeder 48.Wherein receptor 42 is configured to the quantity and one of the electroplated substrate 12 receiving this group induction installation 60 sensing with reference to quantity; Comparer 44 is configured to the quantity of sensed electroplated substrate 12 and this reference quantity to compare; Counter 46 is configured to when sensed quantity is identical with reference to quantity, based on the value of the electroplating current that sensed quantity calculating current source 20 should export; And feeder 48 is configured to the value of calculated electroplating current to be fed to this current source 20.With reference to the quantity that quantity can be the artificial electroplated substrate 12 calculated, directly check as during workman's material loading.In other embodiments, this reference quantity also can be by expecting that district 50 arranges another group induction installation sensing and obtains on the substrate, realizing full automatic treatment.
Plating controller 40 can comprise warning howler 41 further, and it is configured to give the alarm with reference to during different amts in sensed quantity, and warning does not carry out electroplating operations.This plating controller 40 also can comprise telltale 43 further, and it is configured to indicate this group induction installation 60 again to sense and re-enter with reference to quantity.
Current source 20 is configured to export electroplating current according to the feeding value of plating controller 40.The electroplating current that plating tank 30 received current source 20 exports is electroplated with the electroplated substrate 12 be opposite to wherein.Concrete, plating tank 30 comprises anode array 32, negative electrode 34 and electroplate liquid (not shown) further.Anode array 32 is connected with the positive pole of current source 20, and negative electrode 34 is connected with the negative pole of current source 20.After plating controller 40 confirms the quantity of electroplated substrate 12, electroplated substrate 12 is transferred to plating tank 30 by substrate feeding area 50.Such as, overhead traveling crane (not shown) can be designed electroplated substrate 12 entirety of substrate holder 14 and upper extension thereof is mentioned plating tank 30.Electroplated substrate 12 is connected with the negative electrode 34 of plating tank 30, thus can be plated.
The electroplating substrate system 10 that the utility model embodiment provides, can the parts of self-inspection by using induction installation 60 and increasing at plating controller 40, avoid occurring because number of substrates calculates the inaccurate electroplating quality problem brought.And can full automatic control be realized when using two group induction installation 60, stop interference from human factor and can improve electroplating efficiency simultaneously.
Technology contents of the present utility model and technical characterstic disclose as above, but those of ordinary skill in the art still may do all replacement and the modification that do not deviate from the utility model spirit based on teaching of the present utility model and announcement.Therefore, protection domain of the present utility model should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present utility model and modification, and is contained by present patent application claims.
Claims (10)
1., for an electroplating substrate system for semiconductor packages, it is characterized in that it comprises:
Current source, is configured to export electroplating current;
Plating tank, is configured to receive this electroplating current; This plating tank comprises anode array and negative electrode further;
One group of induction installation, is arranged at opposite, substrate feeding area, and what each wherein in this group induction installation was positioned at each electroplated substrate of this substrate feeding area can sense position; And
Plating controller, it comprises further:
Receptor, is configured to the quantity and one of the electroplated substrate receiving this group induction installation sensing with reference to quantity;
Comparer, is configured to the quantity of sensed electroplated substrate and this reference quantity to compare;
Counter, is configured to, when sensed quantity is identical with reference to quantity, calculate the value of this electroplating current based on sensed quantity; And
Feeder, is configured to the value of this electroplating current to be fed to this current source.
2. electroplating substrate system as claimed in claim 1, is characterized in that this reference quantity is the quantity of the artificial electroplated substrate calculated.
3. electroplating substrate system as claimed in claim 1, is characterized in that this reference quantity is that another group induction installation being arranged at this substrate feeding area senses.
4. electroplating substrate system as claimed in claim 1, is characterized in that this plating controller comprises warning howler further, is configured to give the alarm with reference to during different amts in sensed quantity.
5. electroplating substrate system as claimed in claim 1, is characterized in that this plating controller comprises telltale further, is configured to indicate this group induction installation again to sense and re-enter with reference to quantity.
6. electroplating substrate system as claimed in claim 1, is characterized in that this group induction installation is pyroscan.
7. electroplating substrate system as claimed in claim 1, is characterized in that this can sense position be just to the position of this each electroplated substrate center.
8. electroplating substrate system as claimed in claim 1, it is characterized in that, during plating, substrate holder goes on this plating tank, and on it, electroplated substrate connects this negative electrode.
9. electroplating substrate system as claimed in claim 1, is characterized in that this electroplating substrate system is applicable to chemical plating.
10. electroplating substrate system as claimed in claim 9, is characterized in that this electroplating substrate system is applicable to electronickelling gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420852323.9U CN204491011U (en) | 2014-12-24 | 2014-12-24 | Electroplating substrate system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420852323.9U CN204491011U (en) | 2014-12-24 | 2014-12-24 | Electroplating substrate system |
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| Publication Number | Publication Date |
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| CN204491011U true CN204491011U (en) | 2015-07-22 |
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| CN201420852323.9U Active CN204491011U (en) | 2014-12-24 | 2014-12-24 | Electroplating substrate system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480507A (en) * | 2014-12-24 | 2015-04-01 | 日月光半导体(上海)有限公司 | Substrate electroplating system |
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2014
- 2014-12-24 CN CN201420852323.9U patent/CN204491011U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480507A (en) * | 2014-12-24 | 2015-04-01 | 日月光半导体(上海)有限公司 | Substrate electroplating system |
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