CN202372559U - Current density meter for electroplating - Google Patents
Current density meter for electroplating Download PDFInfo
- Publication number
- CN202372559U CN202372559U CN2011205281253U CN201120528125U CN202372559U CN 202372559 U CN202372559 U CN 202372559U CN 2011205281253 U CN2011205281253 U CN 2011205281253U CN 201120528125 U CN201120528125 U CN 201120528125U CN 202372559 U CN202372559 U CN 202372559U
- Authority
- CN
- China
- Prior art keywords
- current density
- electroplating
- electroplated
- ammeter
- standard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 11
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a current density meter for electroplating. The upper end of an upper metal hanging rod is connected with a cathode bar of a rectifier, and the lower end of the upper metal hanging rod is connected with an ammeter and one electrode of the ammeter. The upper end of a lower metal hanging rod is connected with the ammeter and the other electrode of the ammeter, and the lower end of the lower metal hanging rod is connected with a standard electroplating test sample through a metal joint. The area of the standard electroplating test sample is a unit area. The standard electroplating test sample of the unit area and a part to be electroplated are connected in parallel with a cathode bar of the same electroplating bath at the same time for electroplating. A numerical value displayed by the ammeter is equal to the average current density of the electroplated part which is connected in parallel. Current in an electroplating process can be controlled and regulated by the measurement and online monitoring of current density in the electroplating process instead of the conventional labor-consuming and time-consuming complex calculation over the areas of the electroplated part and a rack, so that the influence of calculation errors and time errors is avoided, the control and regulation of the current density are greatly facilitated, and the quality of an electroplated product is ensured.
Description
Technical field
The utility model relates to a kind of current density design, and particularly a kind of can the measurement with the plating of on-line monitoring current density in the electroplating process used current density design.
Background technology
In electroplating process, current density is the technological parameter of necessary strict control, and whether current density meets the quality that the electroplating standard requirement will directly influence electroplated product.At present, the control mode of electroplating (containing electrolytic degreasing) current density is: multiply by technological specification predetermined electric current density according to the plating total area and draw the total current of plating, come Control current density through the output current of adjusting rectifier.Electroplate the plating area that area that the total area comprises that product need be electroplated adds hanger.Therefore before plating, at first should calculate the plating area of part and the plating area of hanger.For complex-shaped part, the calculated amount of electroplating area can be bigger, and calculated amount is bigger when a groove has the part of a plurality of kinds and need the different hanger of employing to electroplate, in process of production the also phenomenon of area of discovery miscount often.
Summary of the invention
The technical matters that the utility model will solve provides the plating of current density in a kind of measurement and the on-line monitoring electroplating process and uses current density design.
The technical scheme of the utility model is: current density design is used in a kind of plating; Comprise reometer; Last metal peg upper end is connected with the cathode bar of rectifier; Last metal peg lower end is connected with the reometer and the one of which utmost point, and following metal peg upper end is connected with reometer and another utmost point thereof, and following metal peg lower end is electroplated sample through metal joint and standard and is connected.
The area that said standard is electroplated sample is a unit area; The part that the standard of unit area is electroplated sample and electroplated is connected in parallel on the cathode bar of same electroplating bath simultaneously and electroplates, the numerical value that reometer shows equal the while the average current density of parallelly connected electroplated component.
It all is to be electrically connected that the cathode bar of said rectifier, last metal peg, reometer, following metal peg and metal joint are electroplated being connected of sample with standard.
The beneficial effect of the utility model is: it can be measured and on-line monitoring current density in the electroplating process; So that strict control and the electric current of regulating automatically in the electroplating process; Originally the time-consuming complicated calculations of the effort of electroplated component and hanger area was confirmed the electric current in the electroplating process in order to substitute; Avoid sum of errors time difference influence, be very easy to control and adjusting, guarantee the quality of electroplated product current density because of calculating.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is this structural representation.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is the use synoptic diagram of the utility model.
Embodiment
In electroplating process; Electroplating sample 5 with the part 8 of groove electroplated with standard all is parallelly connected relations; And the part 8 of electroplated is basic identical to the distance that is connected in parallel on the positive plate 11 on the anode stub 10 with standard plating sample 5; Therefore can think that the current density that standard electroplates on the part 8 of sample 5 and electroplated is identical, can realize thus the current density in the electroplating process is measured and on-line monitoring.
Claims (2)
1. current density design is used in a plating; Comprise reometer; It is characterized in that: go up metal peg (1) upper end and be connected with the cathode bar (7) of rectifier (6); Last metal peg (1) lower end is connected with the reometer (2) and the one of which utmost point, and following metal peg (3) upper end is connected with reometer (2) and another utmost point thereof, and following metal peg (3) lower end is electroplated sample (5) through metal joint (4) and standard and is connected.
2. current density design is used in said a kind of plating according to claim 1; It is characterized in that: the area that said standard is electroplated sample (5) is a unit area; The part (8) that the standard of unit area is electroplated sample (5) and electroplated is connected in parallel on the cathode bar (7) of same electroplating bath (9) simultaneously and electroplates, the numerical value that reometer (2) shows equal simultaneously the average current density of parallelly connected electroplated component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205281253U CN202372559U (en) | 2011-12-16 | 2011-12-16 | Current density meter for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205281253U CN202372559U (en) | 2011-12-16 | 2011-12-16 | Current density meter for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202372559U true CN202372559U (en) | 2012-08-08 |
Family
ID=46596256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205281253U Expired - Lifetime CN202372559U (en) | 2011-12-16 | 2011-12-16 | Current density meter for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202372559U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103823099A (en) * | 2014-03-04 | 2014-05-28 | 东莞市常晋凹版模具有限公司 | Liquid current density gauge |
| CN105842523A (en) * | 2016-05-31 | 2016-08-10 | 中南大学 | Surface current density measuring method and system for micro blind TSV (Through Silica Via) |
| CN107268067A (en) * | 2016-04-08 | 2017-10-20 | 贵州黎阳航空动力有限公司 | A kind of method that total current is correctly entered in guarantee electroplating work procedure |
-
2011
- 2011-12-16 CN CN2011205281253U patent/CN202372559U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103823099A (en) * | 2014-03-04 | 2014-05-28 | 东莞市常晋凹版模具有限公司 | Liquid current density gauge |
| CN103823099B (en) * | 2014-03-04 | 2017-02-22 | 东莞市脉拓表面处理科技有限公司 | Liquid current density gauge |
| CN107268067A (en) * | 2016-04-08 | 2017-10-20 | 贵州黎阳航空动力有限公司 | A kind of method that total current is correctly entered in guarantee electroplating work procedure |
| CN105842523A (en) * | 2016-05-31 | 2016-08-10 | 中南大学 | Surface current density measuring method and system for micro blind TSV (Through Silica Via) |
| CN105842523B (en) * | 2016-05-31 | 2018-05-04 | 中南大学 | A kind of assay method and system of TSV Microvias surface current density |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Dobó et al. | Impact of the current fluctuation on the efficiency of Alkaline Water Electrolysis | |
| CN104120455B (en) | The anode current On-line Measuring Method and device of a kind of aluminium cell | |
| CN202372559U (en) | Current density meter for electroplating | |
| CN102776552B (en) | Automatic control process during melanism Copper Foil supplementation with copper ion and the equipment of use thereof | |
| US10047449B2 (en) | Device and method for electrolytically coating an object | |
| CN102851704A (en) | Single-point feeding control method of feeder of aluminum electrolytic cell | |
| CN103014773A (en) | Device and method for balancing alumina concentration of aluminium electrolysis tank | |
| CN103706897B (en) | The electrical conductivity on-line measurement device and method of electrolyte in a kind of Electrolyzed Processing | |
| JP6381555B2 (en) | Device for monitoring current distribution in interconnected electrolysis cells | |
| CN202913072U (en) | Improved structure of electroplating hanger | |
| CN108254611B (en) | Electrode current measuring method and system | |
| CN109457276A (en) | Electrode short circuit detection method and system | |
| CN203683711U (en) | Copper plating rectifying device | |
| CN203159736U (en) | Uniform plating test tank | |
| KR101174988B1 (en) | Device for making electrolytic polishing of surface | |
| CN104962957B (en) | A kind of method detecting electrolytic copper foil anode strap potential change | |
| CN108914162B (en) | Method and system for controlling feeding amount of aluminum oxide | |
| CN204008361U (en) | A kind of composite plating coating diamond content pick-up unit | |
| JP6877070B2 (en) | Plating equipment and plating system | |
| CN213708541U (en) | Novel electroplating layer thickness automatic control system | |
| CN202139321U (en) | Electroplating device capable of automatically detecting control current density | |
| CN201971919U (en) | Automatic electrolysis unit for plating solution | |
| CN105301294A (en) | Titanium anode life test clamp | |
| CN219260248U (en) | Thermocouple wire electroplating tool | |
| CN101942691B (en) | Method and device for controlling electrolysis current density |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120808 |
|
| CX01 | Expiry of patent term |