CN204470197U - A kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component - Google Patents
A kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component Download PDFInfo
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- CN204470197U CN204470197U CN201520040851.9U CN201520040851U CN204470197U CN 204470197 U CN204470197 U CN 204470197U CN 201520040851 U CN201520040851 U CN 201520040851U CN 204470197 U CN204470197 U CN 204470197U
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- Prior art keywords
- holddown groove
- rinse bath
- high precision
- ultrasonic cleaning
- groove
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Abstract
The utility model discloses a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component, comprise feed mechanism and wiper mechanism, described feed mechanism comprises expansion link, rotating shaft, holddown groove, porous accommodating disc and groove lid, described expansion link is connected with holddown groove by rotating shaft, described some porous accommodating disc overlaps are placed in holddown groove, and described groove lid is fixed on the notch place of holddown groove; Described wiper mechanism comprises rinse bath and ultrasonic wave and to shake sheet, and described rinse bath is square structure, and the described ultrasonic wave sheet that shakes is arranged at the center place of five sides of rinse bath respectively.The utility model is by being placed in porous accommodating disc by thermistor chip element, accommodating disc superposition is positioned in holddown groove, fixed by groove lid, expansion link drives holddown groove to enter in rinse bath downwards, reaches predetermined cleaning area, carries out Ultrasonic Cleaning, because thermistor chip component size differs, small volume, holddown groove carries out the rotation of certain angle by rotating shaft, does further cleaning to thermistor chip element.
Description
Technical field
The utility model belongs to electronic component manufacture field, is specifically related to a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component.
Background technology
Thermistor is a class of sensing element, is divided into positive temperature coefficient thermistor and negative temperature coefficient thermistor according to temperature coefficient difference.The typical feature of thermal resistor is to responsive to temperature, different resistance values is shown at different temperature, positive temperature coefficient thermistor resistance value when temperature is higher is larger, and negative temperature coefficient thermistor resistance value when temperature is higher is lower, and they belong to semiconductor devices.
Thermistor be exploitation early, kind is many, development is more ripe sensitive components, thermistor is made up of semiconductor ceramic material, and variations in temperature can cause large resistance to change, and therefore he is the sensitiveest temperature sensor.But the linearity extreme difference of thermistor, and affect larger by production technology.
In the production process of electronic product, need to clean various thermistor, in order to following process, but because thermistor volume is little, clean and improperly easily damage is caused to thermistor, particularly high precision thermosensitive resistor slice component, clean improper or do not wash clean clearly, easily its parameter is impacted, cause product fraction defective to raise, increase entreprise cost.
Utility model content
Utility model object: for above-mentioned prior art Problems existing and deficiency, the purpose of this utility model is to provide a kind of ultrasonic cleaning equipment for high precision electro sub-element, be specially adapted to high precision thermosensitive resistor slice component, realize self-feeding, cleaning function.
Technical scheme: the utility model discloses a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component, comprise feed mechanism and wiper mechanism, described feed mechanism comprises expansion link, rotating shaft, holddown groove, porous accommodating disc and groove lid, described expansion link is connected with holddown groove by rotating shaft, described some porous accommodating disc overlaps are placed in holddown groove, and described groove lid is fixed on the notch place of holddown groove; Described wiper mechanism comprises rinse bath and ultrasonic wave and to shake sheet, and described rinse bath is square structure, and the described ultrasonic wave sheet that shakes is arranged at the center place of five sides of rinse bath respectively.The utility model is by being placed in porous accommodating disc by thermistor chip element, accommodating disc superposition is positioned in holddown groove, fixed by groove lid, expansion link drives holddown groove to enter in rinse bath downwards, reaches predetermined cleaning area, carries out Ultrasonic Cleaning, because thermistor chip component size differs, small volume, holddown groove carries out the rotation of certain angle by rotating shaft, does further cleaning to thermistor chip element.
As further optimization of the present utility model, the surface of holddown groove described in the utility model and groove lid is formed by grid, the space of described grid is less than the size of electronic component, ensureing under the prerequisite that electronic component can not spill, the cleaning of all angles can be carried out electronic component, improve cleaning efficiency.
As further optimization of the present utility model, the anglec of rotation that rotating shaft described in the utility model drives holddown groove to rotate is right angle or acute angle.
As further optimization of the present utility model, the region, center of rinse bath square structure described in the utility model is predetermined cleaning area, coordinate the ultrasonic wave being positioned at the center place of five sides being arranged at rinse bath respectively to shake sheet, make predetermined cleaning area electronic component cleaning evenly.
As further optimization of the present utility model, the side of rinse bath described in the utility model is provided with heating plate, can accelerate cleaning efficiency and improve cleaning quality.
As further optimization of the present utility model, hole space size and the electronic component dimensions of porous accommodating disc described in the utility model match, electronic component is carried out first heavily fixing, coordinate holddown groove, can effectively ensure in cleaning process, electronic component can not cause unnecessary damage because of colliding everywhere.
Beneficial effect: the utility model compared with prior art, have the following advantages: the function of the utility model by adopting holddown groove, groove lid and expansion link to achieve self-feeding, by the ultrasonic wave vibration plate be arranged on each side of rinse bath, the electronic component being positioned at predetermined cleaning area is cleaned, heating plate simultaneously in matching purge groove, effectively can improve cleaning efficiency, the utility model structure is simple, easy to operate, cost of manufacture is lower, and cleaning performance is good.
figure of description
Fig. 1 is feeding machine structure schematic diagram of the present utility model;
Fig. 2 is wiper mechanism structural representation of the present utility model.
Detailed description of the invention
The utility model is illustrated further below in conjunction with Figure of description.
As shown in Figure 1, a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component of the present utility model, comprise feed mechanism and wiper mechanism, feed mechanism comprises expansion link 11, rotating shaft 12, holddown groove 13, porous accommodating disc 14 and groove lid 15, expansion link 11 is connected with holddown groove 13 by rotating shaft 12, the anglec of rotation that rotating shaft 12 drives holddown groove 13 to rotate is right angle or acute angle, the hole space size of porous accommodating disc 14 and electronic component dimensions match, electronic component is carried out first heavily fixing, coordinate holddown groove 13, can effectively ensure in cleaning process, electronic component can not cause unnecessary damage because of colliding everywhere, some porous accommodating disc 14 overlaps are placed in holddown groove 13, groove lid 15 is fixed on the notch place of holddown groove 13, the surface of holddown groove 13 and groove lid 15 is formed by grid, the space of this grid is less than the size of electronic component, ensureing under the prerequisite that electronic component can not spill, the cleaning of all angles can be carried out to electronic component, improve cleaning efficiency.
As shown in Figure 2, wiper mechanism of the present utility model comprises rinse bath 21 and ultrasonic wave and to shake sheet 22, rinse bath 21 is in square structure, the ultrasonic wave sheet 22 that shakes is arranged at the center place of five sides of rinse bath 21 respectively, the region, center of rinse bath 21 square structure is predetermined cleaning area 23, ultrasonic wave is coordinated to shake sheet 22, make in the electronic component cleaning of predetermined cleaning area 23 even, the side of rinse bath 21 of the present utility model is provided with heating plate, cleaning efficiency can be accelerated and improve cleaning quality
The utility model is by being placed in porous accommodating disc 14 by electronic component, accommodating disc superposition is positioned in holddown groove 13, fixed by groove lid 15, expansion link 11 drives holddown groove 13 to enter in rinse bath 21 downwards, reaches predetermined cleaning area 23, carries out Ultrasonic Cleaning, because electronic component dimensions differs, small volume, holddown groove 13 carries out the rotation of certain angle by rotating shaft 12, does further cleaning to electronic component.
Claims (6)
1. the ultrasonic cleaning equipment for high precision thermosensitive resistor slice component, it is characterized in that: comprise feed mechanism and wiper mechanism, described feed mechanism comprises expansion link (11), rotating shaft (12), holddown groove (13), porous accommodating disc (14) and groove lid (15), described expansion link (11) is connected with holddown groove (13) by rotating shaft (12), some described porous accommodating disc (14) overlaps are placed in holddown groove (13), and described groove lid (15) is fixed on the notch place of holddown groove (13); Described wiper mechanism comprises rinse bath (21) and ultrasonic wave and to shake sheet (22), and described rinse bath (21) is in square structure, and the described ultrasonic wave sheet (22) that shakes is arranged at the center place of five sides of rinse bath (21) respectively.
2. a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component according to claim 1, it is characterized in that: the surface of described holddown groove (13) and groove lid (15) is formed by grid, the space of described grid is less than the size of electronic component.
3. a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component according to claim 1, is characterized in that: the anglec of rotation that described rotating shaft (12) drives holddown groove (13) to rotate is right angle or acute angle.
4. a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component according to claim 1, is characterized in that: the region, center of described rinse bath (21) square structure is predetermined cleaning area (23).
5. a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component according to claim 1, is characterized in that: the side of described rinse bath (21) is provided with heating plate.
6. a kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component according to claim 2, is characterized in that: hole space size and the electronic component dimensions of described porous accommodating disc (14) match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040851.9U CN204470197U (en) | 2015-01-21 | 2015-01-21 | A kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040851.9U CN204470197U (en) | 2015-01-21 | 2015-01-21 | A kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204470197U true CN204470197U (en) | 2015-07-15 |
Family
ID=53625939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520040851.9U Expired - Fee Related CN204470197U (en) | 2015-01-21 | 2015-01-21 | A kind of ultrasonic cleaning equipment for high precision thermosensitive resistor slice component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204470197U (en) |
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2015
- 2015-01-21 CN CN201520040851.9U patent/CN204470197U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 225700 Jiangsu city of Taizhou province Xinghua city Zhaoyang Hongtai industrial park two District Road No. 18 Patentee after: Jiangsu is emerging along Electronics Co., Ltd. Address before: 225700 No. 10 Yangshan Road, Xinghua, Jiangsu, Taizhou Patentee before: Jiangsu is emerging along Electronics Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20180121 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |