CN202752157U - Heat-conducting silicone grease coating device for semiconductor device - Google Patents
Heat-conducting silicone grease coating device for semiconductor device Download PDFInfo
- Publication number
- CN202752157U CN202752157U CN 201220325359 CN201220325359U CN202752157U CN 202752157 U CN202752157 U CN 202752157U CN 201220325359 CN201220325359 CN 201220325359 CN 201220325359 U CN201220325359 U CN 201220325359U CN 202752157 U CN202752157 U CN 202752157U
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- Prior art keywords
- metal bushing
- silicone grease
- conducting silicone
- base
- heat
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Abstract
The utility model relates to the field of manufacturing technology of auxiliary tools for circuit board processing and production, and provides a heat-conducting silicone grease coating device for a semiconductor device. The heat-conducting silicone grease coating device for the semiconductor device comprises a base seat, a metal bushing fixing support frame, a metal bushing and a scraper, wherein at least one row of concave grooves are arranged on the base seat, the shape of each concave groove is matched with the shape of the coated device, at least one positioning pin is arranged on each of two sides of the base seat, the positioning pins penetrate through the positioning holes in the metal bushing fixing support frame, the metal bushing is mounted in the middle of the metal bushing fixing support frame, leak holes are arranged in the metal bushing and opposite to the positions of the concave grooves on the base seat, and the leak holes are matched with the to-be-coated surface of the coated device in area and shape. The heat-conducting silicone grease coating device for the semiconductor device has the advantages of being even in coating, high in coating efficiency and stable in coating quality, the whole product is enabled to be attractive, heat-conducting silicone grease materials are effectively saved, work intensity of operators is lowered, and production efficiency is high.
Description
Technical field
The semiconductor devices heat-conducting silicone grease coating device of using when the utility model discloses a kind of printed board assembly (PCBA) assembling belongs to circuit board processing auxiliary mould class manufacturing technology field by International Patent Classification (IPC) (IPC) division.
Background technology
At present, during the electronic circuit board assembling, often need to install the devices such as flange-cooled controllable silicon, and device need to be at its bottom coated with thermally conductive silicone grease to reduce thermal resistance before being locked in fin.
Traditionally, we make mode coated with thermally conductive silicone grease by hand, cut out an amount of heat-conducting silicone grease with pocket knife or little bamboo chip, single individually by hand coating, control because of amount and manual being difficult to of coating uniformity that little bamboo chip takes, so that coating thickness and shape differ, apply so inhomogeneous easily so that have the gap between semiconductor devices base plate and the radiator, affect the radiating effect of semiconductor devices, also may be exerted an influence the service life of semiconductor devices; Simultaneously, apply blocked up too much heat-conducting silicone grease and easily cause the waste of heat conductive silicon grease material, and affect the attractive in appearance and quality of whole product.
The utility model content
For the deficiencies in the prior art, the semiconductor devices heat conducting silicone grease coating device that the utility model provides a kind of and applied evenly, coating efficiency is high.
For achieving the above object, the utility model is achieved through the following technical solutions: a kind of semiconductor devices heat conducting silicone grease coating device, comprise base, metal bushing fixed support, metal bushing and scraper, described base is provided with at least one row's groove, the shape of described groove and coated device shape are complementary, described base each side is provided with at least one alignment pin, described alignment pin passes the locating hole that arranges on the metal bushing fixed support, metal bushing fixed support middle part is equipped with the metal bushing, position with respect to base groove on the metal bushing is provided with small opening, and the area shape of the area shape of described small opening and the required coating surface of coated device is complementary.
Described base is the base that approrpiate wts is arranged, and is stable in the time of can guaranteeing the coated with thermally conductive silicone grease, and is convenient to transmit between the station.The groove quantity of described base can arrange according to size of devices, and the groove shapes on the described base and coated device shape are complementary, and firmly and easily pick and place so that device is placed in the groove.
Locating hole on alignment pin on the described base and the metal bushing fixed support cooperates, the metal bushing can be fixed on the base so that when the small opening on the metal bushing and base groove matched moulds the position accurate, also can like a dream the metal bushing be opened, so that semiconductor devices can conveniently pick and place.
Further, described base is provided with two row's grooves, and every row's groove number is ten.
Further, this device also comprises at least one card base button, and described base is provided with card base button groove and is used for inlaying this card base button.The card base button can left and right sides push-and-pull, turns right and draws, and card base is cramped out, and semiconductor devices can pick and place, and turning left pushes away, and the card base button blocks the semiconductor devices pin, so that semiconductor devices is firm in base groove.
Further, described card base button number is two, and two row's groove outsides are provided with the card base button groove of two strips on the described base.
Further, the support bracket fastened thickness of described metal bushing is higher than the thickness of described metal bushing, so that described metal bushing fixed support surrounds a baffle plate around the metal bushing.Such design and is convenient to the workman and is picked and placeed and store a certain amount of heat-conducting silicone grease so that the metal bushing is convenient to pick and place, and used metal bushing thickness can be chosen according to the heat-conducting silicone grease thickness of the required coating of semiconductor devices.
Further, the width of described scraper is complementary with the width of the metal bushing that is trapped among metal bushing fixed support middle part, and described scraper is neither too hard, nor too soft, and lever is suitable.Like this width design so that scraper only need on the metal bushing back and forth wiper just heat-conducting silicone grease can be coated with small opening on the full block of metal bushing, improve coating efficiency, and scraper is neither too hard, nor too soft, the suitable more efficiently coated with thermally conductive of lever silicone grease.
During coating, a plurality of semiconductor devices are fixed in the described base groove, the card base button are pushed away left again, the card base button blocks the semiconductor devices pin, so that semiconductor devices is firm in base groove; Again the metal bushing is installed on the metal bushing fixed support, then the alignment pin on the base is passed the locating hole that arranges on the metal bushing fixed support, described metal bushing is fixed on the base; Use an amount of heat-conducting silicone grease of described scraper scraping on the metal bushing, the baffle plate that metal bushing fixed support surrounds around the metal bushing is stored described heat-conducting silicone grease again; The scraper that is complementary with the width of width and the metal bushing that is trapped among metal bushing fixed support middle part is the wiper heat-conducting silicone grease back and forth, heat-conducting silicone grease by the small opening uniform high-efficiency be coated to all semiconductor devices bottom surfaces on the base.
The beneficial effects of the utility model are: this device needs the heating power device of coated with thermally conductive silicone grease being applied to circuit board, such as semiconductor devices such as the large power triode of needs configurations fin, rectistack, controllable silicons, this device can be simultaneously with the heat-conducting silicone grease uniform high-efficiency be coated in a plurality of semiconductor devices bottom surface, coating efficiency is high, coating quality is stable, so that whole product is attractive in appearance, effectively saved heat conductive silicon grease material, reduce operating personnel's working strength, improved production efficiency.
Description of drawings
Fig. 1 is perspective view of the present utility model;
Fig. 2 is the schematic diagram that semiconductor devices of the present utility model is fixed in base groove;
Fig. 3 is practical operation schematic diagram of the present utility model.
The specific embodiment
Now with the specific embodiment the utility model is further specified by reference to the accompanying drawings.
Referring to figs. 1 to shown in Figure 2, a kind of semiconductor devices heat conducting silicone grease coating device, comprise base 1, metal bushing fixed support 2, metal bushing 3 and scraper 4, described base 1 is provided with two row row grooves 11, every row's groove 11 numbers are ten, the shape of described groove 11 and coated semiconductor devices 6 shapes are complementary, described base 1 each side is provided with an alignment pin 12, described alignment pin 12 passes the locating hole 21 that arranges on the metal bushing fixed support 2, metal bushing fixed support 2 middle parts are equipped with metal bushing 3, position with respect to base groove 11 on the metal bushing 3 is provided with small opening 31, and the area shape of the area shape of described small opening 31 and coated semiconductor devices 6 required coating surfaces is complementary.
Described base 1 is the base 1 that approrpiate wts is arranged, and is stable in the time of can guaranteeing the coated with thermally conductive silicone grease, and is convenient to transmit between the station.Groove 11 shapes and coated semiconductor devices 6 shapes on the described base 1 are complementary, and firmly and easily pick and place so that semiconductor devices 6 is placed in the groove.
Locating hole 21 on alignment pin 12 on the described base 1 and the metal bushing fixed support 2 cooperates, metal bushing 3 can be fixed on the base 2 so that the small opening 31 on the metal bushing 3 during with base groove 11 matched moulds the position accurate, also can like a dream metal bushing 3 be opened, so that semiconductor devices 6 can conveniently pick and place.
This device also comprises two card base buttons 5, and these card base 5 buttons are embedded in the card base button groove 13 of two strips of two row's grooves, 11 arranged outside on the base 1.This card base button 5 can left and right sides push-and-pull, turns right and draws, and card base is cramped out, and semiconductor devices can pick and place, and turning left pushes away, and card base button 5 blocks semiconductor devices 6 pins, so that semiconductor devices 6 is firm in base groove 11.
Further, the thickness of described metal bushing fixed support 2 is higher than the thickness of described metal bushing 3, so that described metal bushing fixed support 2 surrounds a baffle plate around metal bushing 3.Such design and is convenient to the workman and is picked and placeed and store a certain amount of heat-conducting silicone grease so that metal bushing 3 is convenient to pick and place, and used metal bushing 3 thickness can be chosen according to the heat-conducting silicone grease thickness of semiconductor devices 6 required coatings.
Further, the width of described scraper 4 is complementary with the width that is trapped among the metal bushing 3 at metal bushing fixed support 2 middle parts, and described scraper 4 is neither too hard, nor too soft, and lever is suitable.Like this width design so that 4 of scrapers need on the metal bushing 3 back and forth wiper just heat-conducting silicone grease can be coated with small opening on the full block of metal bushing 3, improve coating efficiency, and scraper is neither too hard, nor too soft, the suitable more efficiently coated with thermally conductive of lever silicone grease.
Referring to figs. 2 and 3 shown in, during coating, a plurality of semiconductor devices 6 are fixed in the described base groove 11, again card base button 5 is pushed away left, card base button 5 blocks semiconductor devices 6 pins, so that semiconductor devices 6 is firm in base groove 11; Again metal bushing 3 is installed on the metal bushing fixed support 2, then the alignment pin 12 on the base 1 is passed the locating hole 21 that arranges on the metal bushing fixed support 2, described metal bushing 3 is fixed on the base 1; Use an amount of heat-conducting silicone grease of described scraper 4 scrapings on metal bushing 3, the baffle plate that metal bushing fixed support 2 surrounds around metal bushing 3 is stored described heat-conducting silicone grease again; The scraper that is complementary with width and the width that is trapped among the metal bushing 3 at metal bushing fixed support 2 middle parts is the wiper heat-conducting silicone grease back and forth, heat-conducting silicone grease by small opening 31 uniform high-efficiencies be coated to all semiconductor devices 6 bottom surfaces on the base 1.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection domain of the present utility model.
Claims (5)
1. semiconductor devices heat conducting silicone grease coating device, it is characterized in that, comprise base, metal bushing fixed support, metal bushing and scraper, described base is provided with at least one row's groove, the shape of described groove and coated device shape are complementary, described base each side is provided with at least one alignment pin, described alignment pin passes the locating hole that arranges on the metal bushing fixed support, metal bushing fixed support middle part is equipped with the metal bushing, position with respect to base groove on the metal bushing is provided with small opening, and the area shape of the area shape of described small opening and the required coating surface of coated device is complementary.
2. a kind of semiconductor devices heat conducting silicone grease coating device according to claim 1 is characterized in that, this device also comprises at least one card base button, and described base is provided with card base button groove and is used for inlaying this card base button.
3. a kind of semiconductor devices heat conducting silicone grease coating device according to claim 1 and 2 is characterized in that, described base is provided with two row's grooves, and every row's groove number is ten.
4. a kind of semiconductor devices heat conducting silicone grease coating device according to claim 1 and 2, it is characterized in that, the support bracket fastened thickness of described metal bushing is higher than the thickness of described metal bushing, so that described metal bushing fixed support surrounds a baffle plate around the metal bushing.
5. a kind of semiconductor devices heat conducting silicone grease coating device according to claim 4 is characterized in that, the width of described scraper is complementary with the width of the metal bushing that is trapped among metal bushing fixed support middle part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220325359 CN202752157U (en) | 2012-07-06 | 2012-07-06 | Heat-conducting silicone grease coating device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220325359 CN202752157U (en) | 2012-07-06 | 2012-07-06 | Heat-conducting silicone grease coating device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202752157U true CN202752157U (en) | 2013-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220325359 Expired - Lifetime CN202752157U (en) | 2012-07-06 | 2012-07-06 | Heat-conducting silicone grease coating device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202752157U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9462673B2 (en) | 2013-12-13 | 2016-10-04 | Huawei Technologies Co., Ltd. | Heat sink and heat dissipation system |
| CN108922862A (en) * | 2018-06-26 | 2018-11-30 | 格力电器（武汉）有限公司 | A kind of power module processing unit (plant) and its application method |
-
2012
- 2012-07-06 CN CN 201220325359 patent/CN202752157U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9462673B2 (en) | 2013-12-13 | 2016-10-04 | Huawei Technologies Co., Ltd. | Heat sink and heat dissipation system |
| CN108922862A (en) * | 2018-06-26 | 2018-11-30 | 格力电器（武汉）有限公司 | A kind of power module processing unit (plant) and its application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: XIAMEN HUALIAN ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130227 |