CN203774374U - Substrate heat conduction paste daub device - Google Patents
Substrate heat conduction paste daub device Download PDFInfo
- Publication number
- CN203774374U CN203774374U CN201420041715.7U CN201420041715U CN203774374U CN 203774374 U CN203774374 U CN 203774374U CN 201420041715 U CN201420041715 U CN 201420041715U CN 203774374 U CN203774374 U CN 203774374U
- Authority
- CN
- China
- Prior art keywords
- substrate
- groove
- steel mesh
- pressing plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 21
- 239000010959 steel Substances 0.000 claims abstract description 21
- 239000006071 cream Substances 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model discloses a substrate heat conduction paste daub device. The device comprises a pressing plate and a substrate support plate. The pressing plate and one side edge of the substrate support plate are connected through an articulation piece. A steel mesh is arranged on the pressing plate. The substrate support plate corresponding to the steel mesh is provided with a groove 1 used for installing a substrate. A substrate pillar is arranged in the groove 1. An upper surface of the pressing plate is caved downwardly so as to form a groove 2. The steel mesh is installed in the groove 2. The heat conduction paste daub device is suitable for daubing the heat conduction paste on the substrate or an electronic component. Daubing is uniform and standard. The heat conduction paste is not daubed to some unnecessary positions. Operation is simple and working efficiency is effectively increased.
Description
Technical field
The utility model belongs to heat-conducting cream paint-on technique field, is specifically related to a kind of substrate heat-conducting cream application device.
Background technology
Heat-conducting cream is spread upon between radiator and substrate or electronic component and radiator, and as a kind of material of filling space, this material is referred to as again thermal interfacial material.Its effect is the heat for dispelling the heat out to radiator conduction electron component or substrate, make electronic component or substrate remain on one can steady operation level, prevent electronic component or substrate and damage because heat radiation is bad, and increase the service life.Current most popular heat-conducting cream is silica gel, because heat-conducting cream is the sticking material of a kind of tool, while smearing, bothers very much.Conventionally the substrate that people can smear needs is fixed up, and then by scraper, heat-conducting cream is spread upon on substrate.Adopt in this way and smear, the thermal grease uneven thickness of smearing, and conventionally disposablely can only process a substrate, inefficiency.
Utility model content
The utility model provides a kind of substrate heat-conducting cream application device, a plurality of substrates is fixed in the device of a sealing, and expose by steel mesh in the place of only needs being smeared, and it is more even that heat-conducting cream is smeared.
To achieve these goals, the technical solution adopted in the utility model is:
A substrate heat-conducting cream application device, comprises pressing plate and base plate supports plate, and a side of pressing plate and base plate supports plate is connected by articulated elements; On pressing plate, be provided with steel mesh, on base plate supports plate corresponding to steel mesh, be provided with the groove one of installation base plate, in groove one, be provided with substrate post.
Preferably, described pressing plate upper surface is recessed to form groove two downwards, and steel mesh is installed in groove two.
Preferably, described articulated elements is hinge.
Preferably, described articulated elements is provided with two.
Preferably, described steel mesh and corresponding groove one, substrate post arrange 2-4 group.
Owing to having adopted technique scheme, the beneficial effects of the utility model are:
A kind of substrate heat-conducting cream application device of the present utility model, substrate is fixing by pressing plate and the sealing of base plate supports plate, by the steel mesh on pressing plate, the place that needs on substrate to smear is exposed, while smearing, only silica gel need be applied on steel mesh, with scraper, scrape, complete heat-conducting cream and smear; It is more even that heat-conducting cream is smeared, and the scope of smearing is clear and definite, can not be applied to unwanted place; The disposable polylith substrate of processing of while, operating efficiency obviously improves.
Accompanying drawing explanation
Fig. 1 is substrate heat-conducting cream application device closure state schematic diagram of the present utility model.
Fig. 2 is substrate heat-conducting cream application device open mode schematic diagram of the present utility model.
Mark in figure: 1-pressing plate, 2-base plate supports plate, 3-articulated elements, 4-steel mesh, 5-groove one, 6-substrate post, 7-groove two.
Embodiment
With reference to Fig. 1, Fig. 2, a kind of substrate heat-conducting cream application device of the present embodiment, comprises pressing plate 1 and base plate supports plate 2, a side of pressing plate 1 and base plate supports plate 2 is articulated and connected by two articulated elementss 3 that are similar to hinge.Pressing plate 1 upper surface is recessed to form groove 27 downwards, and steel mesh 4 is installed in groove 27, and the heat-conducting cream that is conducive to smear in groove 27, can not make to be everywhere all the time.The groove 1 that is provided with installation base plate on the base plate supports plate 2 of steel mesh 4 correspondences, is provided with substrate post 6 in groove 1.Steel mesh 4 and corresponding groove 1, substrate post 6 arrange 4 groups, so just can four substrates of disposable processing.During actual use, can, according to the size of substrate, many group steel mesh 4, groove 1 and substrate posts 6 be set.
The substrate heat-conducting cream application device using method of this use-case; Before smearing, pressing plate 1 is opened, the substrate of needs coating is arranged on respectively in groove 1, and by substrate post 6 supporting and locations; Then pressing plate 1 is closed, on substrate, need the position of coating to expose by steel mesh 4; Finally heat-conducting cream is spread upon on steel mesh 4, and scrape evenly by scraper, then open pressing plate 1, taking out substrate is that completing substrate is smeared.
Claims (5)
1. a substrate heat-conducting cream application device, is characterized in that, comprises pressing plate (1) and base plate supports plate (2), and a side of pressing plate (1) and base plate supports plate (2) is connected by articulated elements (3); On pressing plate (1), be provided with steel mesh (4), on base plate supports plate (2) corresponding to steel mesh (4), be provided with the groove one (5) of installation base plate, in groove one (5), be provided with substrate post (6).
2. heat-conducting cream application device according to claim 1, is characterized in that, described pressing plate (1) upper surface is recessed to form groove two (7) downwards, and steel mesh (4) is installed in groove two (7).
3. heat-conducting cream application device according to claim 1, is characterized in that, described articulated elements (3) is hinge.
4. heat-conducting cream application device according to claim 1, is characterized in that, described articulated elements (3) is provided with two.
5. heat-conducting cream application device according to claim 1, is characterized in that, described steel mesh (4) and corresponding groove one (5), substrate post (6) arrange 2-4 group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420041715.7U CN203774374U (en) | 2014-01-22 | 2014-01-22 | Substrate heat conduction paste daub device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420041715.7U CN203774374U (en) | 2014-01-22 | 2014-01-22 | Substrate heat conduction paste daub device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203774374U true CN203774374U (en) | 2014-08-13 |
Family
ID=51291528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420041715.7U Expired - Lifetime CN203774374U (en) | 2014-01-22 | 2014-01-22 | Substrate heat conduction paste daub device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203774374U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108780767A (en) * | 2017-07-27 | 2018-11-09 | 深圳欣锐科技股份有限公司 | Crystal tube brush thermal grease auxiliary mould |
| CN108922862A (en) * | 2018-06-26 | 2018-11-30 | 格力电器（武汉）有限公司 | A kind of power module processing unit (plant) and its application method |
-
2014
- 2014-01-22 CN CN201420041715.7U patent/CN203774374U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108780767A (en) * | 2017-07-27 | 2018-11-09 | 深圳欣锐科技股份有限公司 | Crystal tube brush thermal grease auxiliary mould |
| CN108922862A (en) * | 2018-06-26 | 2018-11-30 | 格力电器（武汉）有限公司 | A kind of power module processing unit (plant) and its application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140813 |