CN204460836U - A kind of sandwich Semi-conductor - Google Patents
A kind of sandwich Semi-conductor Download PDFInfo
- Publication number
- CN204460836U CN204460836U CN201520087019.4U CN201520087019U CN204460836U CN 204460836 U CN204460836 U CN 204460836U CN 201520087019 U CN201520087019 U CN 201520087019U CN 204460836 U CN204460836 U CN 204460836U
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- CN
- China
- Prior art keywords
- semiconductor chilling
- chilling plate
- main body
- conductor
- utility
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- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a kind of sandwich Semi-conductor, comprise three main bodys be stacked, three described main bodys are made by Heat Conduction Material, each described body interior is provided with liquid reservoir, three described main bodys are respectively equipped with liquid feeding end and outlet end, liquid feeding end in each main body is connected with its liquid reservoir with outlet end, the first semiconductor chilling plate and the second semiconductor chilling plate is folded with respectively between the main body and the main body of both sides of centre, described first semiconductor chilling plate and the second semiconductor chilling plate all have the heat of symmetrical number and mirror image respectively, cold effect surface.Sandwich Semi-conductor structure of the present utility model is simple, and cooling or heating effect is desirable.
Description
Technical field
The utility model relates to a kind of refrigerating and heating combined equipment, particularly relates to a kind of sandwich Semi-conductor.
Background technology
In refrigerating field, Application comparison is wide at present, and the good refrigeration modes of effectiveness comparison is the low pressure evaporation characteristic utilizing cold-producing medium, latent heat is large, stability is high, coagulability is good, the feature that condensing pressure is suitable, completes refrigeration in conjunction with compression refrigerating machine, rely on the effect of compressor to improve the pressure of cold-producing medium to realize kind of refrigeration cycle, vapour compression refrigerator and gas compression refrigerating machine two kinds can be divided into again by refrigerant category.Be applied in the cold-producing medium mainly freon on compression refrigerating machine at present, because freon can damage the ozone layer, therefore country forbids utilizing freon as cold-producing medium at present.
At present progressively by promote except Absorption Refrigerator and steam jet refrigerator, also comprise the semiconductor cooler having more market prospects.Current semiconductor cooler mainly includes the semiconductor chilling plate with fuel factor face and cold effect surface, to ozone layer without destruction, is very beneficial to environmental protection, but current semiconductor cooler complex structure, and volume is large, and cooling or heating effect is undesirable.
Summary of the invention
The purpose of this utility model is to provide a kind of sandwich Semi-conductor, and structure is simple, and conduction cooling, heat-conducting effect are desirable.
For achieving the above object, the utility model provides a kind of sandwich Semi-conductor, comprise three main bodys be stacked, three described main bodys are made by Heat Conduction Material, each described body interior is provided with liquid reservoir, three described main bodys are respectively equipped with liquid feeding end and outlet end in same side, feed tube in each main body is connected with its liquid reservoir with drain pipe, the first semiconductor chilling plate and the second semiconductor chilling plate is folded with respectively between the main body and the main body of both sides of centre, described first semiconductor chilling plate and the second semiconductor chilling plate all have the heat of corresponding number and mirror image respectively, cold effect surface.
Compared with prior art, the beneficial effect of sandwich Semi-conductor of the present utility model is as follows:
(1) structure is simple, and being positioned at middle main body both sides all has semiconductor chilling plate, thus cooling or heating effect is desirable.
(2) volume is little, occupies little space.
(3) conduction cooling, good heat conduction effect.
By following description also by reference to the accompanying drawings, the utility model will become more clear, and these accompanying drawings are for explaining embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the exploded view of the sandwich Semi-conductor in the utility model.
Fig. 2 is the constitutional diagram of the sandwich Semi-conductor in the utility model.
Detailed description of the invention
With reference now to accompanying drawing, describe embodiment of the present utility model, element numbers similar in accompanying drawing represents similar element.
Please refer to Fig. 1-2, described sandwich Semi-conductor comprises three main bodys be stacked 1, and described main body 1 is in prolate type structure, and three described main bodys 1 are made by Heat Conduction Material.Each described main body 1 inside is provided with liquid reservoir (not shown), leads geothermal liquid for dress.Three described main bodys 1 are respectively equipped with liquid feeding end 11 and outlet end 12 in same side, and the liquid feeding end 11 in each main body 1 is connected with its liquid reservoir with outlet end 12.Between the main body 1 and the main body 1 of both sides of centre, be folded with the first semiconductor chilling plate 2 and the second semiconductor chilling plate 3 respectively, described first semiconductor chilling plate 2 and the second semiconductor chilling plate 3 all have corresponding number and the heat of mirror image, cold effect surface respectively.The quantity of described first semiconductor chilling plate 2 and the second semiconductor chilling plate 3 is ten, ten described first semiconductor chilling plates 2 are evenly divided into two rows be set up in parallel, these two terminals 21 that ranked first semiconductor chilling plate 2 oppositely arrange and extend outside the side of main body 1, and ten described second semiconductor chilling plates 3 are symmetrically distributed in described ten first semiconductor chilling plates 2 both sides being positioned at middle main body 1.The terminals 21 of each first semiconductor chilling plate 2 have two, connect power positive cathode respectively, if the upper surface of the first semiconductor chilling plate 2 is fuel factor faces, lower surface is cold effect surface, the upper surface of corresponding second semiconductor chilling plate 3 is cold effect surface, lower surface is fuel factor face, two terminals 21 on first semiconductor chilling plate 2 and two terminals 31 on the second semiconductor chilling plate 2 just connect, namely can realize freezing to the liquid in the main body 1 of centre, liquid in the main body 1 of upper and lower both sides is heated, each main body 1 is connected to realize heat exchange with external equipment with outlet end 12 by liquid feeding end 11, if need to realize heating the liquid in the main body 1 of centre, liquid in the main body 1 of upper and lower both sides is freezed, then by two terminals 21 on the first semiconductor chilling plate 2 and two terminals 31 reversal connection on the second semiconductor chilling plate 3, then the upper surface of the first semiconductor chilling plate 2 becomes cold effect surface, lower surface becomes fuel factor face, and the upper surface of the second semiconductor chilling plate 3 becomes fuel factor face, lower surface becomes cold effect surface.
More than in conjunction with most preferred embodiment, the utility model is described, but the utility model is not limited to the embodiment of above announcement, and should contain various carry out according to essence of the present utility model amendment, equivalent combinations.
Claims (1)
1. a sandwich Semi-conductor, it is characterized in that, comprise three main bodys be stacked, three described main bodys are made by Heat Conduction Material, each described body interior is provided with liquid reservoir, three described main bodys are respectively equipped with liquid feeding end and outlet end in same side, liquid feeding end in each main body is connected with its liquid reservoir with outlet end, the first semiconductor chilling plate and the second semiconductor chilling plate is folded with respectively between the main body and the main body of both sides of centre, described first semiconductor chilling plate and the second semiconductor chilling plate all have the heat of corresponding number and mirror image respectively, cold effect surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520087019.4U CN204460836U (en) | 2015-02-09 | 2015-02-09 | A kind of sandwich Semi-conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520087019.4U CN204460836U (en) | 2015-02-09 | 2015-02-09 | A kind of sandwich Semi-conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204460836U true CN204460836U (en) | 2015-07-08 |
Family
ID=53667709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520087019.4U Expired - Fee Related CN204460836U (en) | 2015-02-09 | 2015-02-09 | A kind of sandwich Semi-conductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204460836U (en) |
-
2015
- 2015-02-09 CN CN201520087019.4U patent/CN204460836U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20200209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |