CN204417581U - A kind of metal spraying sputtering instrument - Google Patents

A kind of metal spraying sputtering instrument Download PDF

Info

Publication number
CN204417581U
CN204417581U CN201520032898.0U CN201520032898U CN204417581U CN 204417581 U CN204417581 U CN 204417581U CN 201520032898 U CN201520032898 U CN 201520032898U CN 204417581 U CN204417581 U CN 204417581U
Authority
CN
China
Prior art keywords
sputtering
vacuum chamber
sample table
metal spraying
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520032898.0U
Other languages
Chinese (zh)
Inventor
尚跃
余夕霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Ju Yue Electronic Science And Technology Co Ltd
Original Assignee
Shanghai Ju Yue Electronic Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Ju Yue Electronic Science And Technology Co Ltd filed Critical Shanghai Ju Yue Electronic Science And Technology Co Ltd
Priority to CN201520032898.0U priority Critical patent/CN204417581U/en
Application granted granted Critical
Publication of CN204417581U publication Critical patent/CN204417581U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of metal spraying sputtering instrument, comprise cavity, the inside of described cavity is provided with gold target, sputtering head, vacuum chamber, count-down device and sample table, the outside of described cavity is provided with operating equipment and power supply, described sputtering head is fixed on the top of vacuum chamber, the side of described vacuum chamber is provided with sputter gas entrance and vacuum pump connection outlet, described gold target is arranged in sputtering head, described sample table is positioned in the middle of the bottom of internal vacuum chamber, described sample table is connected by circuit and power supply, on the circuit of described operating equipment between sample table and power supply, described gold target is connected with power supply by count-down device.The metal spraying sputtering instrument that the utility model provides can significantly improve sample electroconductibility, cost is low, control is convenient.

Description

A kind of metal spraying sputtering instrument
Technical field
The utility model relates to semi-conductor detection field, is specifically related to a kind of metal spraying sputtering instrument.
Background technology
Semi-conductor (such as chip) is when detecting, the phenomenon that electroconductibility is poor is there is in the sample of part semiconductor because of a variety of causes such as making, the postorder having a strong impact on sample detects and observes sample structure, in order to head it off, the sample of semi-conductor before detection, utilizes metal spraying sputtering instrument in the sample surfaces plating layer of metal film of semi-conductor, thus improves the electroconductibility of sample, but existing metal spraying sputtering instrument is all from external import, there is the shortcomings such as cost is high, control is inconvenient.
Utility model content
In view of current metal spraying sputtering instrument above shortcomings, the utility model provide a kind of electroconductibility, cost that significantly can improve sample low, control metal spraying sputtering instrument easily.
For achieving the above object, the utility model adopts according to lower technical scheme:
A kind of metal spraying sputtering instrument, comprise cavity, the inside of described cavity is provided with gold target, sputtering head, vacuum chamber, count-down device and sample table, the outside of described cavity is provided with operating equipment and power supply, described sputtering head is fixed on the top of vacuum chamber, the side of described vacuum chamber is provided with sputter gas entrance and vacuum pump connection outlet, described gold target is arranged in sputtering head, described sample table is positioned in the middle of the bottom of internal vacuum chamber, described sample table is connected by circuit and power supply, on the circuit of described operating equipment between sample table and power supply, described gold target is connected with power supply by count-down device.
According to an aspect of the present utility model, described metal spraying sputtering instrument also comprises rotating disk, and the top of described vacuum chamber and rotating disk is connected and sealed, and described sample table is fixed on the top of rotating disk.
According to an aspect of the present utility model, described sample table is fixed on the middle at rotating disk top.
According to an aspect of the present utility model, described vacuum chamber is circular transparent glass vacuum (-tight) housing.
According to an aspect of the present utility model, described sputtering head and vacuum chamber contact position are provided with sputtering mouth, and the position of described sputtering mouth is provided with automatically-controlled door.
Advantage of the present utility model: because the inside of cavity of the present utility model is provided with gold target, sputtering head, vacuum chamber, count-down device and sample table, the outside of cavity is provided with operating equipment and power supply, sputtering head is fixed on the top of vacuum chamber, gold target is arranged in sputtering head, sample table is positioned in the middle of the bottom of internal vacuum chamber, sample table is connected by circuit and power supply, on the circuit of operating equipment between sample table and power supply, convenient operation personnel are to the control of metal spraying sputtering instrument, gold target is connected with power supply by count-down device, suitable gas and voltage is used between the anode and negative electrode of power supply, when there is glow discharge in vacuum chamber, gold target is eroding sample under the bombardment of gaseous ion, sample surfaces is formed layer of metal film by the atoms metal sputtered out, thus significantly improve the electroconductibility of sample, side due to vacuum chamber is provided with sputter gas entrance and vacuum pump connection outlet, under the prerequisite ensureing vacuum chamber absolute seal, simplify the structure design of metal spraying sputtering instrument, such as: the feeding problem of sputter gas, the problems such as the vacuum tightness size adjustment in vacuum chamber, reduce the cost of metal spraying sputtering instrument, so metal spraying sputtering instrument of the present utility model significantly can improve the electroconductibility of sample, cost is low, it is convenient to control.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of a kind of metal spraying sputtering instrument of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, a kind of metal spraying sputtering instrument, comprise cavity 11, the inside of described cavity 11 is provided with gold target 3, sputtering 4, vacuum chamber 10, count-down device 2 and sample table 8, the outside of cavity 11 is provided with operating equipment 13 and power supply 1, sputtering 3 is fixed on the top of vacuum chamber 10, the side of vacuum chamber 10 is provided with sputter gas entrance 9 and vacuum pump connection outlet 6, gold target 3 is arranged in sputtering 4, sample table 8 is positioned in the middle of the bottom of vacuum chamber 10 inside, sample table 8 is connected by circuit 12 and power supply 1, on the circuit of operating equipment 13 between sample table 8 and power supply 1, gold target 3 is connected with power supply 1 by count-down device 2.
In actual applications, in order to specimen rotating holder 8, metal spraying sputtering instrument is provided with rotating disk 7, and the bottom of vacuum chamber 10 and the top of rotating disk 7 are connected and sealed, and sample table 8 is fixed on the top of rotating disk 7, and sample table 8 generally designs the middle at rotating disk 7 top, observe to be convenient to staff in sputter procedure, vacuum chamber 10 is designed to circular transparent glass vacuum (-tight) housing, vacuum chamber 10 is connected by vacuum pump connection outlet 6 and vacuum pump, oil seal type oil-sealed rotary pump generally selected by vacuum pump, evacuation rate: 5m3/h or 10m3/h, the final vacuum of vacuum chamber 10: be less than 2 × 10-3mbar, and show vacuum tightness by vacuumometer in real time with red green two color bar, in addition, sputter gas flows in vacuum chamber 10 by sputter gas entrance 9, sputter gas can select the rare gas element such as argon gas or nitrogen, sputtering operating pressure is generally: 5 × 10-2mbar, sputtering working current is 0-150mA or 0-250mA two kinds of ranges of choice, sputtering time is adjustable arbitrarily between 0-999s.
In actual applications, sample table 8 can be the SEM sample table of standard, and sample table 8, with altitude scale, is convenient to regulate operating distance; In addition, sputtering 4 and vacuum chamber 10 contact position are provided with sputtering mouth, and the position of sputtering mouth is provided with automatically-controlled door 5, and automatically-controlled door 5 is opened sputtering mouth or closed.
Principle of work of the present utility model: because the inside of cavity 11 of the present utility model is provided with gold target 3, sputtering 4, vacuum chamber 10, count-down device 2 and sample table 8, the outside of cavity 11 is provided with operating equipment 13 and power supply 1, sputtering 3 is fixed on the top of vacuum chamber 10, gold target 3 is arranged in sputtering 4, sample table 8 is positioned in the middle of the bottom of vacuum chamber 10 inside, sample table 8 is connected by circuit 12 and power supply 1, on the circuit of operating equipment 13 between sample table 8 and power supply 1, convenient operation personnel are to the control of metal spraying sputtering instrument, gold target 3 is connected with power supply 1 by count-down device 2, suitable gas and voltage is used between the anode and negative electrode of power supply, gas can select the rare gas element such as argon gas or nitrogen, when there is glow discharge in vacuum chamber 10, gold target 3 is eroding sample under the bombardment of gaseous ion, sample surfaces is formed layer of metal film by the atoms metal sputtered out, thus significantly improve the electroconductibility of sample, side due to vacuum chamber 10 is provided with sputter gas entrance 9 and vacuum pump connection outlet 6, under the prerequisite ensureing vacuum chamber 10 absolute seal, simplify the structure design of metal spraying sputtering instrument, such as: the feeding problem of sputter gas, the problems such as the vacuum tightness size adjustment in vacuum chamber 10, reduce the cost of metal spraying sputtering instrument, so metal spraying sputtering instrument of the present utility model significantly can improve the electroconductibility of sample, cost is low, it is convenient to control.
The above; be only embodiment of the present utility model; but protection domain of the present utility model is not limited thereto; the technician of any skilled is in technical scope disclosed in the utility model; the change that can expect easily or replacement, all should be encompassed within protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of described claim.

Claims (5)

1. a metal spraying sputtering instrument, comprise cavity, it is characterized in that, the inside of described cavity is provided with gold target, sputtering head, vacuum chamber, count-down device and sample table, the outside of described cavity is provided with operating equipment and power supply, described sputtering head is fixed on the top of vacuum chamber, the side of described vacuum chamber is provided with sputter gas entrance and vacuum pump connection outlet, described gold target is arranged in sputtering head, described sample table is positioned in the middle of the bottom of internal vacuum chamber, described sample table is connected by circuit and power supply, on the circuit of described operating equipment between sample table and power supply, described gold target is connected with power supply by count-down device.
2. metal spraying sputtering instrument according to claim 1, is characterized in that, described metal spraying sputtering instrument also comprises rotating disk, and the top of described vacuum chamber and rotating disk is connected and sealed, and described sample table is fixed on the top of rotating disk.
3. metal spraying sputtering instrument according to claim 2, is characterized in that, described sample table is fixed on the middle at rotating disk top.
4. metal spraying sputtering instrument according to claim 1, is characterized in that, described vacuum chamber is circular transparent glass vacuum (-tight) housing.
5., according to the arbitrary described metal spraying sputtering instrument of Claims 1-4, it is characterized in that, described sputtering head and vacuum chamber contact position are provided with sputtering mouth, and the position of described sputtering mouth is provided with automatically-controlled door.
CN201520032898.0U 2015-01-17 2015-01-17 A kind of metal spraying sputtering instrument Expired - Fee Related CN204417581U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520032898.0U CN204417581U (en) 2015-01-17 2015-01-17 A kind of metal spraying sputtering instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520032898.0U CN204417581U (en) 2015-01-17 2015-01-17 A kind of metal spraying sputtering instrument

Publications (1)

Publication Number Publication Date
CN204417581U true CN204417581U (en) 2015-06-24

Family

ID=53467968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520032898.0U Expired - Fee Related CN204417581U (en) 2015-01-17 2015-01-17 A kind of metal spraying sputtering instrument

Country Status (1)

Country Link
CN (1) CN204417581U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106399965A (en) * 2016-11-15 2017-02-15 东莞市秦智工业设计有限公司 Coating box equipment with front door and rear door and with automatic material push function
CN106498345A (en) * 2016-11-15 2017-03-15 东莞市秦智工业设计有限公司 A kind of plated film case equipment for being provided with front/rear door
CN106498346A (en) * 2016-11-15 2017-03-15 东莞市秦智工业设计有限公司 A kind of plated film case equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106399965A (en) * 2016-11-15 2017-02-15 东莞市秦智工业设计有限公司 Coating box equipment with front door and rear door and with automatic material push function
CN106498345A (en) * 2016-11-15 2017-03-15 东莞市秦智工业设计有限公司 A kind of plated film case equipment for being provided with front/rear door
CN106498346A (en) * 2016-11-15 2017-03-15 东莞市秦智工业设计有限公司 A kind of plated film case equipment
CN106399965B (en) * 2016-11-15 2019-01-11 徐州天力模具制造有限公司 A kind of plated film case equipment equipped with front/rear door and automatic stocking
CN106498345B (en) * 2016-11-15 2019-07-12 陈玲婷 A kind of plated film case equipment equipped with front/rear door
CN106498346B (en) * 2016-11-15 2019-07-19 何莹莹 A kind of plated film case equipment

Similar Documents

Publication Publication Date Title
CN204417581U (en) A kind of metal spraying sputtering instrument
CN203411602U (en) Bell jar-shaped device for coating cylindrical inner walls
GB1243655A (en) D.c. circuit breaker
SI1747608T1 (en) Encapsulated, flameproof, not hermetically sealed, rotationally symmetrical high-performance spark gap
CN102709815B (en) A kind of rotation electrode gas spark gap switch
TW200735726A (en) Plasma gun and plasma gun film forming apparatus provided with the same
WO2013138085A3 (en) Chamber filler kit for plasma etch chamber useful for fast gas switching
CN201749003U (en) Magnetofluid shaft seal leakage detection device
CN103320752B (en) Evaporating and coating equipment and air aspiration process thereof
CN104091741B (en) Multifunction ion rifle
CN103820759A (en) Method for improving utilization rate of rectangular planar magnetron sputtering cathode target material
CN110010403A (en) A kind of glass tilt switch and preparation method based on gallium base liquid metal
CN101550538A (en) Magnetron sputtering target used for ultra high vacuum and process for preparing magnet in the target
GB692232A (en) Improvements in or relating to electric discharge devices for the measurement of high vacuums
WO2021213273A1 (en) Semiconductor processing device and magnetron mechanism thereof
CN203320121U (en) Magnetron-sputtering shielding cover
CN204401101U (en) A kind of vacuum plating anode cap automatic-adjusting device
CN101311300A (en) Ultra high vacuum magnetron sputtering rectangular plane sputtering target
CN104213089B (en) Magnetron sputtering apparatus and magnetically controlled sputter method
CN210176939U (en) Vacuum coating sputtering target material plating through alarm device
CN103388156B (en) A kind of Ventilation type electrolytic cell for laboratory
CN207781528U (en) A kind of three pole gas-discharge tubes
CN100539789C (en) A kind of organic elctroluminescent device
CN208142827U (en) A kind of Novel lightning-proof case
CN202096838U (en) Anti-explosion pulse control instrument

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150624

Termination date: 20180117