CN204377242U - A kind of flexible circuit board FPC and electronic equipment - Google Patents
A kind of flexible circuit board FPC and electronic equipment Download PDFInfo
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- CN204377242U CN204377242U CN201520012957.8U CN201520012957U CN204377242U CN 204377242 U CN204377242 U CN 204377242U CN 201520012957 U CN201520012957 U CN 201520012957U CN 204377242 U CN204377242 U CN 204377242U
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Abstract
The utility model is about a kind of flexible circuit board FPC and electronic equipment, relate to flexible circuit board technical field, the problem stress of existing flexible circuit board in bending place solved is comparatively large, easily fracture and the problem to impact connected electronic component.The technical scheme of main employing is: a kind of flexible circuit board FPC is used for being arranged in electronic equipment, and it comprises flat region and bending region; Wherein, flat region is provided with circuit layer; Bending region comprises first area and second area, and first area is provided with circuit layer, and described second area is provided with hole.Electronic equipment comprises above-mentioned flexible circuit board.The utility model arranges hole by the second area place in the bending region at FPC, to discharge the larger stress suffered by FPC bending place, thus avoid FPC that fracture and the larger stress pair destruction that the electronic devices and components be connected with FPC cause occur in bending place.
Description
Technical field
The utility model relates to flexible circuit board technical field, particularly relates to a kind of flexible circuit board FPC and electronic equipment.
Background technology
Flexible circuit board (Flexible Printed Circuit, hereinafter referred to as FPC) is a kind of special printed circuit board.It has lightweight, thickness is thin, the feature such as soft, flexible, and be widely used in each class of electronic devices, as mobile phone, notebook computer, panel computer, liquid crystal indicator (LCD) etc.
FPC has kink (or treating kink), and kink in use can be subject to larger stress usually; Larger stress is easy to produce stress on the one hand and concentrates, and FPC is ruptured at kink, also can impact the electronic component of electronic equipment on the other hand.Show module for LCD, the stress of the FPC bonding with glass plate suffered by kink that current LCD shows in module is comparatively large, and such FPC can be applied to the larger stress of glass plate after bending; When carrying out touch-screen (touch panel, referred to as " TP ") and LCD full laminating after, FPC is applied to the larger stress of glass plate and the liquid crystal layer gap (cell gap) of LCD can be caused to change, and then make LCD display occur yellow block, thus very large impact is caused on the display effect of LCD.
Utility model content
Main purpose of the present utility model is the flexible circuit board FPC and the electronic equipment that provide a kind of new structure, and technical problem to be solved reduces the stress of FPC suffered by bending place.
The purpose of this utility model and solve its technical problem and realize by the following technical solutions:
First aspect, the utility model provides a kind of flexible circuit board FPC, and described flexible circuit board FPC is used for being arranged in electronic equipment, and it comprises:
Flat region, described flat region is provided with circuit layer;
Bending region, described bending region comprises first area and second area, and described first area is provided with circuit layer, and described second area is provided with hole.
Aforesaid flexible circuit board FPC, the area ratio of described first area and second area is 4:1-8:1.
Aforesaid flexible circuit board FPC, the shape of described hole is oval, circular or one or more in rhombus.
Aforesaid flexible circuit board FPC, the junction in described flat region and described bending region is provided with arc groove or chamfering.
Aforesaid flexible circuit board FPC, the flexibility of described flat region is less than the flexibility in described bending region.
Aforesaid flexible circuit board FPC, described flexible circuit board also comprises pad area;
Described flexible circuit board FPC comprises at least one bending region;
Described pad area with wherein bend Local handover described in one.
Aforesaid flexible circuit board FPC, there are arc groove or chamfering in the junction in described pad area and described bending region.
Aforesaid flexible circuit board FPC, described pad area and form " L " type region with the bending region of its handing-over.
On the other hand, of the present utility modelly also provide a kind of electronic equipment, comprising: electronic equipment body and the flexible circuit board FPC described in above-mentioned any one;
The intrinsic connected component of described electronic equipment welds with described flexible circuit board FPC.
Aforesaid electronic equipment, described flexible circuit board FPC comprises pad area;
The intrinsic connected component of described electronic equipment is welded in the pad area of described flexible circuit board FPC.
By technique scheme, the utility model structure at least has following advantages:
The flexible circuit board FPC that enforcement of the present utility model provides comprises flat region and bending region.Wherein, flat region is equipped with circuit layer; Bending region comprises first area and second area; First area is equipped with circuit layer, second area is provided with hole.The present embodiment arranges hole by the region place not being equipped with circuit in the bending region on FPC, after bending to make FPC, larger Stress Release suffered by bending place is gone out, thus avoids FPC that fracture and the larger stress pair destruction that the electronic devices and components be connected with FPC cause occur in bending place.
Further, the flexible circuit board FPC that embodiment of the present utility model provides is by being set to 4:1-8:1 by the bending routing region (first area) in region with the area ratio of perforated area (second area), being set to following ratio can make hole play the effect of best release stress, discharges the stress that FPC bending region produces as much as possible.
Further, the flexible circuit board FPC that embodiment of the present utility model provides is by being provided with chamfering or arc groove in the junction in flat region and bending region, the stress that can reduce flexible circuit board FPC bending place is further concentrated, to make FPC bending place not easy fracture.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.
Accompanying drawing explanation
The structural representation of a kind of flexible circuit board FPC that the embodiment that Fig. 1 is the utility model embodiment provides;
The structural representation of a kind of flexible circuit board FPC that another embodiment that Fig. 2 is the utility model embodiment provides.
Embodiment
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of testing stand, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
Embodiment 1
As shown in Figure 1, this enforcement provides a kind of flexible circuit board FPC, and this flexible circuit board FPC is arranged in electronic equipment, for connecting the electronic devices and components in electronic equipment.Wherein, the flexible circuit board FPC in the present embodiment comprises flat region 1 and bending region 2 (the bending region in the present embodiment is also called and treats territory, bent area, mainly represents the region that FPC circuit board needs to bend in use).Wherein, flat region 1 is equipped with circuit layer (cabling 22 as shown in Figure 1); Bending region 2 comprises first area and second area; First area is equipped with circuit layer (cabling 23 as shown in Figure 1), second area is provided with hole 21 (mainly bending at this second area the region not being equipped with cabling in region, region as shown in phantom in Figure 1).
The present embodiment arranges hole by the region place not being equipped with circuit in the bending region on FPC, after bending to make FPC, larger Stress Release suffered by bending place is gone out, thus avoids FPC that fracture and the larger stress pair destruction that the electronic devices and components be connected with FPC cause occur in bending place.
Embodiment 2
Further, the present embodiment provides a kind of flexible circuit board FPC, compared with a upper embodiment, in the present embodiment flexible circuit board FPC bending region in first area and the area ratio of second area be 4:1-8:1.Preferably, in the present embodiment flexible PCB FPC bending region in first area and the area ratio 6:1 of second area.
The flexible circuit board FPC that the present embodiment provides is by being set to aforementioned proportion by the bending routing region (first area) in region with the area ratio of perforated area (second area), such effect that hole can be made to play best release stress, the Stress Release produced in bending region when being bent by flexible circuit board FPC is as much as possible fallen.
Preferably, in the present embodiment, the shape of the hole of the second area of flexible circuit board FPC is one or more in ellipse, circle and prismatic.
In addition, size and the distribution of the hole in the present embodiment can be determined arbitrarily according to actual application environment, and the present embodiment does not do concrete restriction.
Preferably, the hole in the present embodiment is evenly distributed on second area, and the gap between the size of hole and hole can be determined arbitrarily according to actual application environment, and the present embodiment does not do concrete restriction.
Embodiment 3
As shown in Figure 2, further, the present embodiment provides a kind of flexible circuit board FPC, and compared with above-described embodiment, in the present embodiment, the flat region of flexible circuit board FPC is provided with chamfering 3 or arc groove with the junction in bending region.
The flexible circuit board FPC that the present embodiment provides is by being provided with chamfering or arc groove in the junction in flat region and bending region, and the stress that can reduce flexible circuit board FPC bending place is further concentrated, to make FPC bending place not easy fracture.Wherein, the radius of chamfering 3 or arc groove is preferably greater than 1.0mm, but the radian of arc groove and chamfering can be determined arbitrarily according to actual application environment, and the present embodiment does not do concrete restriction.
Preferably, the flexibility of the flat region in above-described embodiment is less than the flexibility in bending region.By design like this, the pliability in bending region can be increased further, avoid flexible circuit board FPC at rupture.It should be noted that the flexibility making the flexibility of flat region be less than bending region, can realize in the following way: flat region and described bending region can adopt different materials; Or flat region is identical with the material that bending region adopts, and applies on bending region or arrange hard layer.
Embodiment 4
Further, the present embodiment provides a kind of flexible circuit board FPC, and compared with above-described embodiment, in the present embodiment, flexible circuit board FPC also comprises pad area, for connecting the connected component in electronic equipment.In the present embodiment, flexible circuit board FPC comprises at least one bending region; Wherein at least one bending region is the first bending region, and the first bending region and pad area join.
The flexible circuit board FPC that the present embodiment provides bends region by employing first and pad area joins, because the flexibility bending region is better, and then the risk that pad can be avoided to rupture.
Preferably, there are arc groove or chamfering in the junction of pad area and the first bent area, and wherein, the radius of chamfering or arc groove is preferably greater than 1.0mm, is beneficial to the shaping of FPC so on the one hand, on the other hand FPC in bending place not easy fracture.The present embodiment, by arc groove or chamfering are arranged in the junction of pad area and the first bent area, can reduce the phenomenon that the junction stress of pad area and the first bent area is concentrated, thus avoids the risk of bent area and pad fracture.
Preferably, pad area and the first bending region form " L " type region.The present embodiment can reduce the stress of pad area and the first bending junction, region by so arranging, thus avoids flexible circuit board FPC to rupture in this junction.
Preferably, in order to reduce the situation of FPC rupture, in above-described embodiment, the copper sheet at flexible circuit board FPC bent area place is not windowed, if electromagnetic membrane ground connection is windowed need demixing zone of staggering, prevents demixing zone copper sheet bending easily fracture.Liquid can be windowed not stratified district ground connection, ensures that abundant ground connection reaches release electrostatic requirement.
Preferably, in above-described embodiment, flexible circuit board FPC mainly comprises substrate layer, copper foil layer, adhesive layer and cover layer.Copper foil layer plating is on substrate layer, and cover layer is covered on copper foil layer by adhesive layer.Wherein, copper foil layer, adhesive layer and cover layer are provided with windowed regions, wherein, windowed regions forms bending region.Preferably, tectal edge extends to bending intra-zone, exceedes and the edge of covering copper layers of foil and adhesive layer.Tectal means are extended to bending intra-zone owing to have employed, edge with layers of foil can be extended out a bit of cover layer and covered, there is the buffering on a height fall marginal portion of cutting copper thus, and the stress of this position is dispersed, thus not easily cause FPC to be fractureed when bending, greatly reduce the risk that bending marginal position place, region FPC is easily torn, improve life-span and the reliability of FPC.
Embodiment 5
The present embodiment provides a kind of electronic equipment, and this electronic equipment comprises electronic equipment body and flexible circuit board FPC.Flexible circuit board is arranged in apparatus body, for connecting the intrinsic electronic devices and components of electronic equipment.Wherein, flexible circuit board FPC comprises flat region and bending region.Wherein, flat region is equipped with circuit layer; Bending region comprises first area and second area; First area is equipped with circuit layer, second area is provided with hole.
Particularly, the described flexible PCB FPC that the flexible PCB FPC described in the present embodiment 5 can directly adopt above-described embodiment 1-embodiment 4 to provide, concrete implementation structure see the related content described in above-described embodiment, can repeat no more herein.
Further, flexible circuit board FPC comprises pad area; The intrinsic connected component of electronic equipment is welded in the pad area of flexible circuit board FPC.
Electronic equipment in the present embodiment can be mobile phone, liquid crystal indicator, notebook computer, panel computer etc.Showing module for LCD, is the FPC described in above-mentioned any embodiment because the LCD in the present embodiment shows flexible circuit board FPC included in module; Like this in LCD module, the larger stress of the FPC bonding with glass plate suffered by kink can discharge, and FPC can not be applied to the larger stress of glass plate after bending; When after the full laminating carrying out touch-screen (touch panel, referred to as " TP ") and LCD, the liquid crystal layer gap (cell gap) of LCD can not change, and the display effect of LCD is better.
To sum up, the flexible circuit board FPC that enforcement of the present utility model provides comprises flat region and bending region.Wherein, flat region is equipped with circuit layer; Bending region comprises first area and second area; First area is equipped with circuit layer, second area is provided with hole.The present embodiment arranges hole by the region place not being equipped with circuit in the bending region on FPC, after bending to make FPC, larger Stress Release suffered by bending place is gone out, thus avoids FPC that fracture and the larger stress pair destruction that the electronic devices and components be connected with FPC cause occur in bending place.
Above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a flexible circuit board FPC, is characterized in that, described flexible circuit board FPC is used for being arranged in electronic equipment, and it comprises:
Flat region, described flat region is provided with circuit layer;
Bending region, described bending region comprises first area and second area, and described first area is provided with circuit layer, and described second area is provided with hole.
2. flexible circuit board FPC according to claim 1, is characterized in that, the area ratio of described first area and second area is 4:1-8:1.
3. flexible circuit board FPC according to claim 1 and 2, is characterized in that, the shape of described hole is oval, circular or one or more in rhombus.
4. flexible circuit board FPC according to claim 1 and 2, is characterized in that, the junction in described flat region and described bending region is provided with arc groove or chamfering.
5. flexible circuit board FPC according to claim 1, is characterized in that, the flexibility of described flat region is less than the flexibility in described bending region.
6. flexible circuit board FPC according to claim 1, is characterized in that, described flexible circuit board FPC also comprises pad area;
Described flexible circuit board FPC comprises at least one bending region;
Described pad area with wherein bend Local handover described in one.
7. flexible circuit board FPC according to claim 6, is characterized in that, there are arc groove or chamfering in the junction in described pad area and described bending region.
8. flexible circuit board FPC according to claim 6, is characterized in that, described pad area and form " L " type region with the bending region of its handing-over.
9. an electronic equipment, is characterized in that, comprising: electronic equipment body and flexible circuit board FPC; Wherein, described flexible circuit board FPC is the flexible circuit board FPC in any one of the claims 1-8;
The intrinsic connected component of described electronic equipment welds with described flexible circuit board FPC.
10. electronic equipment according to claim 9, is characterized in that, described flexible circuit board FPC comprises pad area;
The intrinsic connected component of described electronic equipment is welded in the pad area of described flexible circuit board FPC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520012957.8U CN204377242U (en) | 2015-01-08 | 2015-01-08 | A kind of flexible circuit board FPC and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520012957.8U CN204377242U (en) | 2015-01-08 | 2015-01-08 | A kind of flexible circuit board FPC and electronic equipment |
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| CN204377242U true CN204377242U (en) | 2015-06-03 |
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| CN201520012957.8U Active CN204377242U (en) | 2015-01-08 | 2015-01-08 | A kind of flexible circuit board FPC and electronic equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105554198A (en) * | 2016-02-01 | 2016-05-04 | 广东欧珀移动通信有限公司 | Display device and mobile terminal with the same |
| CN106775114A (en) * | 2017-01-11 | 2017-05-31 | 四川创智慧科技有限公司 | The man-machine interaction ring and its exchange method of a kind of use capacitance touch |
| CN108511504A (en) * | 2018-05-31 | 2018-09-07 | 昆山国显光电有限公司 | The manufacturing method of display module and display module |
| WO2021189550A1 (en) * | 2020-03-26 | 2021-09-30 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and display device |
-
2015
- 2015-01-08 CN CN201520012957.8U patent/CN204377242U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105554198A (en) * | 2016-02-01 | 2016-05-04 | 广东欧珀移动通信有限公司 | Display device and mobile terminal with the same |
| CN106775114A (en) * | 2017-01-11 | 2017-05-31 | 四川创智慧科技有限公司 | The man-machine interaction ring and its exchange method of a kind of use capacitance touch |
| CN108511504A (en) * | 2018-05-31 | 2018-09-07 | 昆山国显光电有限公司 | The manufacturing method of display module and display module |
| CN108511504B (en) * | 2018-05-31 | 2021-03-30 | 广州国显科技有限公司 | Display module and manufacturing method thereof |
| WO2021189550A1 (en) * | 2020-03-26 | 2021-09-30 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and display device |
| US11515382B2 (en) | 2020-03-26 | 2022-11-29 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display panel and display device |
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