CN204373784U - For local elasticity's cold chain of infrared focus plane Dewar - Google Patents

For local elasticity's cold chain of infrared focus plane Dewar Download PDF

Info

Publication number
CN204373784U
CN204373784U CN201520041409.8U CN201520041409U CN204373784U CN 204373784 U CN204373784 U CN 204373784U CN 201520041409 U CN201520041409 U CN 201520041409U CN 204373784 U CN204373784 U CN 204373784U
Authority
CN
China
Prior art keywords
cold
cold chain
heat conducting
conducting bar
elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520041409.8U
Other languages
Chinese (zh)
Inventor
范广宇
范崔
李俊
龚海梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Technical Physics of CAS
Original Assignee
Shanghai Institute of Technical Physics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Technical Physics of CAS filed Critical Shanghai Institute of Technical Physics of CAS
Priority to CN201520041409.8U priority Critical patent/CN204373784U/en
Application granted granted Critical
Publication of CN204373784U publication Critical patent/CN204373784U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

This patent discloses a kind of local elasticity's cold chain for infrared focus plane Dewar, the lower end of cold chain is cold head installed surface and mounting hole, upper end is cold platform installed surface and mounting hole, be connected by heat conducting bar between upper surface with lower surface, every root heat conducting bar there is multiple slot segmentation that heat conducting bar is separated, many groups heat conducting bar resembles " petal " sample and upwards scatters from lower surface, and the upper surface of all heat conducting bars forms cold platform installed surface; Between heat conducting bar and lower end cold head installed surface, junction is serpentine or " C " shape, and the groove having many group serpentines or " C " shape at serpentine or " C " shape place lateral location makes cold chain structure possess the elasticity of local.The advantage of this patent is: that organizes heat conducting bar is designed with the temperature homogeneity being beneficial to cold platform more, the integrative-structure of cold chain can reduce the thermal resistance of cold chain to greatest extent and improve the mechanics reliability of cold chain itself, local elasticity's design of cold chain can the reduction of releasing heat stress to the additional load of Dewar stem stem or refrigeration machine.

Description

For local elasticity's cold chain of infrared focus plane Dewar
Technical field
This patent relates to the Dewar encapsulation technology of infrared focal plane detector, be specifically related to splice substrate hot linked a kind of local elasticity cold chain for setting up Dewar or refrigeration machine cold head and detector in the encapsulation of a kind of Dewar, it is suitable for super long alignment focus planardetector cooling assembly.
Background technology
The principal mode that Dewar encapsulates as focus planardetector, is widely used in fields such as space flight.At present, due to the raising to detecting devices space and time resolution requirement, long alignment and super long alignment focal plane device come into one's own day by day, splicing substrate from small-scale Dewar device directly welds or is glued on Dewar or refrigeration machine cold head different, super long alignment Dewar needs to adopt cold chain connection cold head and device to splice substrate, to reach the object transmitting cold and control device splicing substrate temperature uniformity.
Cold chain can be divided into rigidity cold chain, elasticity cold chain according to its deformation behavior, rigidity cold chain is by the good materials processing of heat conduction or be welded at low temperatures such as red copper, jewel, due to larger deformation can not be produced under external force, thus the thermal stress produced and the vibration coupling of isolating between refrigeration machine and device cannot be changed by release temperature, be not suitable for the extensive detectors such as super long alignment, elasticity cold chain is widely adopted owing to can overcome the shortcoming of more than rigidity cold chain.
Elasticity cold chain is according to the scope of elastic part, be divided into again integral, flexible cold chain and local elasticity's cold chain, wherein integral, flexible cold chain is generally worked out by copper wire or is combined by multilayer copper sheet or aluminium flake, although the cold chain that this mode is made has good elasticity or flexibility, but the thermo-contact comparison at cold chain two ends is difficult, if adopt the mode of welding many or multi-disc cold chain material to be connected at two ends, solder often can overflow contact area thus affect the elasticity of cold chain, and can between the tinsel of contact area or sheet metal, produce space thus affect thermo-contact effect, thermal contact resistance is caused to become large, although if there is not above welding manner Problems existing in the mode padding indium sheet between employing sheet metal, but heat transfer efficiency is not as welding manner, particularly for the cold chain that sheet number is more, the heat transfer efficiency of contact area can be affected.In addition integral, flexible cold chain fundamental vibration frequency is lower, although may be used for isolating the vibration between cold platform and vascular, but larger mechanical loading can be applied to its stiff end when Dewar vibrates, and due to Dewar reduce leak heat requirement, on the thin-wall part being fixed on Dewar or refrigeration machine that cold chain two ends can be direct or indirect, particularly for straight line vascular refrigerator structure, integral, flexible cold chain is unfavorable for the mechanics reliability of Dewar.The scheme that local elasticity's cold chain adopts copper wire to weld with rigidity cold chain at present substantially, as rigid element adopts gem stick, link adopts metal material, but this needs four parts by being welded to connect, complex manufacturing technology, welding too much also can reduce reliability and increase cold chain thermal resistance.
Summary of the invention
Based on the problem existing for the design of current cold chain, the object of this patent is to provide one can discharge cold chain thermal stress and the vibration of isolation cold chain two ends, to refrigeration machine add mechanical loading less while local elasticity's cold chain of high heat transfer efficiency can be provided again.
Local elasticity's cold chain structure of this patent as shown in Figure 1, its lower end is cold head installed surface and mounting hole 2, upper end is cold platform installed surface and mounting hole 1, be connected by heat conducting bar 5 between upper surface with lower surface, every root heat conducting bar there is multiple slot segmentation that heat conducting bar is separated, many groups heat conducting bar 5 resembles " petal " sample and upwards scatters from lower surface, and the upper surface of all heat conducting bars 5 forms cold platform installed surface; Between heat conducting bar 5 and lower end cold head installed surface, junction is serpentine or " C " shape, and the groove having many group serpentines or " C " shape at serpentine or " C " shape place lateral location makes cold chain structure possess the elasticity of local.
Described local elasticity's cold chain adopts the good metal material overall processing of hot coefficient high ductibility to form, as oxygen-free copper or fine aluminium.Processing technology is low-speed WEDM technique.
The advantage of this patent is:
Cold chain is made up of the heat conducting bar that many connect Dewar cold platform and Dewar or refrigeration machine cold head, heat conducting bar converges at the cold head stiff end of cold chain at cold head end, determine the position fixed ends of each heat conducting bar at cold-smoothing you according to the size of cold platform, determine that its sectional area is to ensure the temperature homogeneity of cold platform according to the length of each heat conducting bar.
Each heat conducting bar is being designed to by the laminar S shape of multi-disc or C shape structure near cold head end; be partially formed elasticity to discharge the thermal stress of low temperature generation and the vibration between isolation cold platform part and refrigeration machine; because elastic part is near cold head end; thus very little to the quality that cold head is additional, be conducive to the mechanics reliability protecting Dewar stem stem or refrigeration machine.
The cold chain processed thus is structure as a whole, there is not face of weld, thus can reduce the thermal resistance of cold chain to greatest extent and improve the mechanics reliability of cold chain itself, in addition because the installed surface of cold chain is not all sandwich construction, the cold chain installation end thermal coupling efficiency reduction because multilayer Contact thermal resistance causes can not thus be produced.Owing to there is not welding indium sheet structure, thus cold chain can carry out high annealing to increase cold chain flexibility further, can carry out entirety gold-plated to it simultaneously, hot with the radiation leakage reducing cold chain itself.
Owing to not needing to weld, only need to adopt Linear cut mode to process, atomization degree is high, and yield rate is high, saves time and cost.
Accompanying drawing explanation
Fig. 1 is cold chain 3-D view.
Fig. 2 is cold chain local elasticity structure.
Embodiment
Be described in detail below in conjunction with accompanying drawing, with enable architectural feature and functional characteristics that this patent is described better, instead of limit the protection domain of this patent.
See Fig. 1, this local elasticity's cold chain is made up of 4 heat conducting bars 5, and lower end is cold head installed surface and mounting hole 2, and upper end is cold platform installed surface and mounting hole 1, outside heat conducting bar is designed to outside S shape elastic construction 3 at cold head end, and inner side heat conducting bar is designed to inner side S shape elastic construction 4 at cold head end.
Fig. 2 is the specific design of elastic part, the moment of inertia of rectangular cross section beam is directly proportional to width, be directly proportional to the cube of thickness, thus cold chain elastic part is all adopt separated many heat conductive filaments or multi-disc conducting strip two ends are formed good thermo-contact to make.In the design, the elastic part of inner side two cold chains is slit into 5 0.25mm thick S shape thin slices, the elastic part of outside cold chain is slit into 6 0.25mm thick S shape thin slices, sheet thickness and shape are determined according to design requirement, enough elasticity can be reached and can meet Dewar deformation and reliability index, at cold chain Width, cold chain be carried out quartern cutting with the deformability increasing cold chain.
Cold chain adopts oxygenless copper material processing, first adopts Cutter Body Processing with Machining Center to go out cold chain profile envelope, processes mounting hole, accomplish fluently the fabrication hole of Linear cut with tapping machine by drilling machine, gold-plated after finally completing processing by slow wire feeding technique.
Test proves that the design's additional deformation that thermal stress produces cold platform while can reaching high heat transfer efficiency is very little, the vibration at cold chain two ends can well be isolated, only the quality of cold head installed surface part can have an impact to the stem stem vibration of refrigeration machine or Dewar, solves Problems existing in cold chain design in the past.

Claims (1)

1. the local elasticity's cold chain for infrared focus plane Dewar, it is characterized in that: the lower end of described local elasticity cold chain is cold head installed surface and mounting hole (2), upper end is cold platform installed surface and mounting hole (1), be connected by many heat conducting bars (5) between upper surface with lower surface, every root heat conducting bar there is multiple slot segmentation that heat conducting bar is separated, organize heat conducting bar (5) to resemble " petal " sample and upwards scatter from lower surface, the upper surface of all heat conducting bars (5) forms cold platform installed surface more; Between heat conducting bar (5) and lower end cold head installed surface, junction is serpentine or " C " shape, and the groove having many group serpentines or " C " shape at serpentine or " C " shape place lateral location makes cold chain structure possess the elasticity of local.
CN201520041409.8U 2015-01-21 2015-01-21 For local elasticity's cold chain of infrared focus plane Dewar Expired - Fee Related CN204373784U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520041409.8U CN204373784U (en) 2015-01-21 2015-01-21 For local elasticity's cold chain of infrared focus plane Dewar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520041409.8U CN204373784U (en) 2015-01-21 2015-01-21 For local elasticity's cold chain of infrared focus plane Dewar

Publications (1)

Publication Number Publication Date
CN204373784U true CN204373784U (en) 2015-06-03

Family

ID=53329996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520041409.8U Expired - Fee Related CN204373784U (en) 2015-01-21 2015-01-21 For local elasticity's cold chain of infrared focus plane Dewar

Country Status (1)

Country Link
CN (1) CN204373784U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104596647A (en) * 2015-01-21 2015-05-06 中国科学院上海技术物理研究所 Partial-elasticity cold chain for infrared focal plane dewar

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104596647A (en) * 2015-01-21 2015-05-06 中国科学院上海技术物理研究所 Partial-elasticity cold chain for infrared focal plane dewar
CN104596647B (en) * 2015-01-21 2017-11-21 中国科学院上海技术物理研究所 A kind of local elasticity's cold chain for infrared focus plane Dewar

Similar Documents

Publication Publication Date Title
JP4953841B2 (en) Thermoelectric module
US20050211288A1 (en) Thermoelectric device
KR20130098391A (en) Cladding material for insulated substrates
CN103457151B (en) The quasi-continuous semiconductor laser bar of a kind of high temperature braze material folds battle array method for packing
US3295089A (en) Semiconductor device
CN204373784U (en) For local elasticity's cold chain of infrared focus plane Dewar
CN204514477U (en) The thermal coupling structure of super long alignment detector and single-point low-temperature receiver
CN106549067B (en) A kind of large-scale Infrared Focal Plane Structure with thermal stress relieving capacity
CN104596647A (en) Partial-elasticity cold chain for infrared focal plane dewar
CN106663639B (en) Semiconductor device
JP2011029295A (en) Thermoelectric conversion module and method of manufacturing the same
CN109974864A (en) Three-dimension flexible board structure for the splicing of GaAs base large area array infrared focus plane
CN110854080A (en) Multi-lead ceramic component packaging shell and processing method thereof
CN105378955A (en) Carrier element and module
CN202066612U (en) Grindable semi-artifical thermocouple measurement device for grinding surface temperature
US9871006B2 (en) Semiconductor module having a solder-bonded cooling unit
CN102425879B (en) Preparation method of thermoelectric refrigerator for high orbit space
US6534792B1 (en) Microelectronic device structure with metallic interlayer between substrate and die
Kraemer et al. Mechanical stress analysis in photovoltaic cells during the string-ribbon interconnection process
JP2006216642A (en) Thermoelement
CN100374808C (en) Flexible cooling chain for connecting between cold source and heat source
CN106546780B (en) probe structure and manufacturing method thereof
Chen et al. Effect of rapid thermal cycles on the microstructure of single solder joint
JP2010287729A (en) Heating/cooling test apparatus
Britten et al. Stress-minimized laser soldering of h-pattern multicrystalline silicon solar cells

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150603

Termination date: 20180121