CN204353620U - Flue reflow soldering cooling device - Google Patents

Flue reflow soldering cooling device Download PDF

Info

Publication number
CN204353620U
CN204353620U CN201420784868.0U CN201420784868U CN204353620U CN 204353620 U CN204353620 U CN 204353620U CN 201420784868 U CN201420784868 U CN 201420784868U CN 204353620 U CN204353620 U CN 204353620U
Authority
CN
China
Prior art keywords
volute
cowling panel
air
boxboard
upper furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420784868.0U
Other languages
Chinese (zh)
Inventor
陈洁欣
余云辉
徐军龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen JT Automation Equipment Co Ltd
Original Assignee
Shenzhen JT Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen JT Automation Equipment Co Ltd filed Critical Shenzhen JT Automation Equipment Co Ltd
Priority to CN201420784868.0U priority Critical patent/CN204353620U/en
Application granted granted Critical
Publication of CN204353620U publication Critical patent/CN204353620U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The utility model discloses a kind of flue reflow soldering cooling device, the lower furnace comprising upper furnace and removably connect with upper furnace, upper furnace sidewall is provided with air inlet, the upper surface of upper furnace is provided with air outlet, the first volute be communicated with air inlet and the second volute be communicated with air outlet is provided with inside upper furnace, be provided with pressure fan in described first volute, in described second volute, be provided with air exhauster; Also comprise the boxboard for covering the first volute and the second volute, boxboard is provided with the through hole be communicated with the first volute air outlet, boxboard both sides of the edge are provided with the first return air inlet, the one-level cowling panel for disperseing wind is provided with directly over through hole, also comprise the secondary cowling panel covering boxboard, secondary cowling panel is positioned at directly over one-level cowling panel and the both sides of the edge of secondary cowling panel are provided with the second return air inlet, and form air channel between secondary cowling panel and boxboard, air channel is communicated with the second volute.Its advantage is the balance of air intake and air-out, and compact conformation is reliable, and running is simple.

Description

Flue reflow soldering cooling device
Technical field
The utility model relates to flue reflow soldering apparatus, especially a kind of flue reflow soldering cooling device.
Background technology
On market, existing flue reflow soldering cooling device comprises upper furnace and lower furnace, and the cooling zone in upper furnace is provided with motor external wind sucked in upper furnace, if a large amount of wind is discharged not in time, the air-flow of cooling zone can flow to the thermal treatment zone.The air-flow in whole stove can be caused so uneven, thus affect the overall performance of Reflow Soldering, even, when air intake is large, temperature channelingly can be caused between the thermal treatment zone and weld zone unstable, and then cause machine exit end easily to produce hot gas spilling.And when intake is little, cooling effectiveness is inadequate, during PCB workpiece ejecting plate, due to the operation that work after the too high impact of temperature is continuous.
Utility model content
The purpose of this utility model solves the deficiencies in the prior art, provides a kind of flue reflow soldering cooling device.
A kind of technical scheme of the present utility model:
A kind of flue reflow soldering cooling device, the lower furnace comprising upper furnace and removably connect with upper furnace, upper furnace sidewall is provided with air inlet, the upper surface of upper furnace is provided with air outlet, the first volute be communicated with air inlet and the second volute be communicated with air outlet is provided with inside upper furnace, be provided with pressure fan in described first volute, in described second volute, be provided with air exhauster; Also comprise the boxboard for covering the first volute and the second volute, boxboard is provided with the through hole be communicated with the first volute air outlet, boxboard both sides of the edge are provided with the first return air inlet, the one-level cowling panel for disperseing wind is provided with directly over through hole, and there is gap between through hole and one-level cowling panel, also comprise the secondary cowling panel for covering boxboard, secondary cowling panel is positioned at directly over one-level cowling panel and the both sides of the edge of secondary cowling panel are provided with the second return air inlet, form air channel between secondary cowling panel and boxboard, air channel is communicated with the second volute.
A kind of preferred version is that air outlet place is provided with collecting box, and collecting box is in communication with the outside.
A kind of preferred version is that air inlet is provided with shutter.
Comprehensive technique scheme is known, the utility model has following beneficial effect: because the cooling zone in upper furnace adds the second volute, second volute can extract the air being drawn into cooling zone from the first volute out in a large number, air will take away the hot gas on pcb board surface, improve pcb board cooling velocity, achieve the balance of air intake and air-out simultaneously.It is reliable that the utility model also has compact conformation, and running is simple.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to technological means of the present utility model can be better understood, and can be implemented according to the content of description, and can become apparent to allow above and other object of the present utility model, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model;
Fig. 2 is the schematic diagram at a upper furnace visual angle in the utility model;
Fig. 3 is the schematic diagram at another visual angle of upper furnace in the utility model;
Fig. 4 is the schematic diagram removing secondary cowling panel in Fig. 3;
Fig. 5 is the schematic diagram removing boxboard in Fig. 4.
Detailed description of the invention
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below in conjunction with accompanying drawing, the utility model is described further.
As shown in Figures 1 to 5, a kind of flue reflow soldering cooling device, the lower furnace comprising upper furnace 13 and removably connect with upper furnace 13, in the present embodiment, upper furnace 13 is connected by hinge 9 with lower furnace.Upper furnace 13 sidewall is provided with air inlet 3, the upper surface of upper furnace 13 is provided with air outlet 4, the first volute 1 be communicated with air inlet 3 and the second volute 2 be communicated with air outlet 4 is provided with inside upper furnace 13, pressure fan is provided with in first volute 1, air exhauster is provided with in second volute 2, also comprise the boxboard 8 for covering the first volute 1 and the second volute 2, boxboard 8 is provided with the through hole be communicated with the air-out passage 10 of the first volute 1, air-out passage 10 runs through through hole, the one-level cowling panel 5 for disperseing wind is provided with directly over through hole, and there is gap between through hole and one-level cowling panel 5, namely one-level cowling panel 5 is positioned at directly over air-out passage 10, outside cold wind spreads out after one-level cowling panel 5.Boxboard 8 both sides of the edge are provided with the first return air inlet 12, also comprise the secondary cowling panel 6 for covering boxboard 8, secondary cowling panel 6 is positioned at directly over one-level the cowling panel 5 and both sides of the edge of secondary cowling panel 6 and is provided with the second return air inlet 14, form circulation air channel between secondary cowling panel 6 and boxboard 8, circulation air channel is communicated with the wind inlet channel of the second volute 2.
The pressure fan be provided with in first volute 1 is sent into the cold wind in the external world in the first volute 1, under the effect of one-level cowling panel 5, the cold wind entering the air-out passage 10 of the first volute 1 is scattered in the surrounding of one-level cowling panel 5, namely be distributed in circulation air channel, heat on pcb board in upper furnace 13 is taken away by the cold wind in circulation air channel, and under air exhauster effect, these wind with heat is discharged upper furnace 13 through the second return air inlet 14 and air outlet 4.
Owing to being provided with the first volute 1 and the second volute 2 in upper furnace 13, pressure fan is provided with in first volute 1, air exhauster is provided with in second volute 2, under the effect of pressure fan and air exhauster, enter the wind in upper furnace 13 roughly the same with the wind of discharge, therefore air balance in upper furnace 13, does not affect flue reflow soldering cooling device overall performance.Can be good at cooling pcb board 7 simultaneously.
In order to better realize of the present utility model buying, in other embodiments, air outlet 4 place is provided with collecting box 11, and collecting box 11 is in communication with the outside.Air inlet 3 place is provided with shutter.
It is more than detailed description of the invention of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.

Claims (3)

1. a flue reflow soldering cooling device, the lower furnace comprising upper furnace and removably connect with upper furnace, it is characterized in that, described upper furnace sidewall is provided with air inlet, the upper surface of described upper furnace is provided with air outlet, be provided with the first volute be communicated with air inlet and the second volute be communicated with air outlet inside described upper furnace, be provided with pressure fan in described first volute, in described second volute, be provided with air exhauster, also comprise the boxboard for covering the first volute and the second volute, described boxboard is provided with the through hole be communicated with the first volute air outlet, described boxboard both sides of the edge are provided with the first return air inlet, the one-level cowling panel for disperseing wind is provided with directly over described through hole, and there is gap between through hole and one-level cowling panel, also comprise the secondary cowling panel for covering boxboard, described secondary cowling panel is positioned at directly over one-level cowling panel and the both sides of the edge of secondary cowling panel are provided with the second return air inlet, air channel is formed between described secondary cowling panel and boxboard, described air channel is communicated with the second volute.
2. flue reflow soldering cooling device as claimed in claim 1, it is characterized in that, described air outlet place is provided with collecting box, and described collecting box is in communication with the outside.
3. flue reflow soldering cooling device as claimed in claim 1, it is characterized in that, described air inlet is provided with shutter.
CN201420784868.0U 2014-12-11 2014-12-11 Flue reflow soldering cooling device Active CN204353620U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420784868.0U CN204353620U (en) 2014-12-11 2014-12-11 Flue reflow soldering cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420784868.0U CN204353620U (en) 2014-12-11 2014-12-11 Flue reflow soldering cooling device

Publications (1)

Publication Number Publication Date
CN204353620U true CN204353620U (en) 2015-05-27

Family

ID=53255117

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420784868.0U Active CN204353620U (en) 2014-12-11 2014-12-11 Flue reflow soldering cooling device

Country Status (1)

Country Link
CN (1) CN204353620U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798419A (en) * 2016-05-12 2016-07-27 深圳市新迪精密科技有限公司 Dual-air-outlet type air circulation air flue device and running method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798419A (en) * 2016-05-12 2016-07-27 深圳市新迪精密科技有限公司 Dual-air-outlet type air circulation air flue device and running method thereof

Similar Documents

Publication Publication Date Title
CN105224052A (en) Computer to dissipate heat cooling system
CN204353620U (en) Flue reflow soldering cooling device
CN206162362U (en) External radiator of computer that easily carries
CN203549955U (en) Smoke exhaust ventilator
CN204631733U (en) A kind of computer memory bank dustproof heat radiator
CN204513990U (en) A kind of gas heating drying device
CN203518437U (en) Baking chamber
CN201697195U (en) Bi-directional range hood
CN214757142U (en) Pre-welding preheating system for PCB
CN104934144A (en) Cooling device of enameled wire
CN204792189U (en) Cooling system of enameled wire
CN206366723U (en) A kind of quick heat radiating waste air reflow soldering
CN203417904U (en) Airflow guiding device installed with plume trap for welding door and window workpiece
CN203947149U (en) A kind of bimodal temperature tinning stack with cold blast engine
CN206260154U (en) The cooling device of the surface mounted welding of pcb board
CN205005411U (en) Energy -saving machine room
CN204792191U (en) Cooling device of enameled wire
CN205316811U (en) Water tank cooling device
CN204195113U (en) A kind of smoke removing device for weld job
CN203518015U (en) Fan-coil unit
CN207694825U (en) A kind of reflow tin soldering machine improved structure
CN205812633U (en) A kind of heat abstractor for bonding machine power supply
CN204353619U (en) Hot gas discharger in Reflow Soldering body of heater
CN204329219U (en) Heat sink
CN205980296U (en) Gas heat transfer formula heating device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant