CN204329698U - A kind of electronics cold drawing - Google Patents
A kind of electronics cold drawing Download PDFInfo
- Publication number
- CN204329698U CN204329698U CN201420774744.4U CN201420774744U CN204329698U CN 204329698 U CN204329698 U CN 204329698U CN 201420774744 U CN201420774744 U CN 201420774744U CN 204329698 U CN204329698 U CN 204329698U
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- CN
- China
- Prior art keywords
- cold drawing
- cover plate
- shell body
- cylindrical support
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a kind of electronics cold drawing, it is characterized in that: comprise shell body (1), base plate (2), cylindrical support (3), cover plate (4), formed the cavity of a sealing by shell body (1), base plate (2) and cover plate (4), inside cavity is carried out load by cylindrical support (3) and is distributed flow field.This structure welding defect, bear fluid pressure good, flow process is evenly distributed, and reliability is high.
Description
Technical field
The utility model relates to a kind of electronic cold intralamellar part stream field structure and processing mode.
Background technology
As shown in Figure 1, the mode of interior flow field machining, the flow field that cutting is inner, forms simple runner to the common structure of electronics cold drawing.By the mode of cover plate by welding, link together with the lower house of cold drawing, form the cavity of a sealing, for fluid in internal flow.
The internal placement of this electronics cold drawing and the method for processing are comparatively simple, are easy to batch production, but in use weld sealing-off between common cover plate and lower house, cause fluid to leak, when body pressure is comparatively greatly or fluid has corrosivity, this type of situation is particularly serious.And welding quality is also comparatively large on the impact of this place, the uniformity of the quality of wayward core body.The flow field of machining, distribute also uneven, heat-transfer effect is poor, and heavier-weight.
Summary of the invention
The purpose of this utility model is to provide a kind of flow passage structure and processing mode of electronics cold drawing, and this class formation can be good at solving the Flow Field Distribution inequality of conditional electronic cold drawing and the problem of processing difficulties.
Technical solution of the present utility model is: a kind of electronics cold drawing, comprises shell body, base plate, cylindrical support, cover plate, and formed the cavity of a sealing by shell body, base plate and cover plate, inside cavity is carried out load by cylindrical support and distributed flow field.
Described electronics cold drawing is processed by the mode increasing material manufacture, does not need welding.
Advantageous Effects: adopt cylindrical structural to support, enhance the inside bearing capacity of electronics cold drawing, and decrease unnecessary contact surface, be more conducive to the heat exchange of cold drawing, also effectively weight is alleviated, utilize the mode increasing material and manufacture, decrease the possibility of traditional processing mode existing defects, add the reliability of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model application;
Fig. 2 is prior art structural representation;
Fig. 3 is structural representation of the present utility model.
Detailed description of the invention
Below in conjunction with Figure of description, the utility model is described in further detail, refers to Figure of description 3.This structure is made up of shell body 1, base plate 2, cylindrical support 3, cover plate 4.Formed the cavity of a sealing by shell body 1, base plate 2 and cover plate 4, inside cavity is carried out load by cylindrical support 3 and is distributed flow field.Whole product is processed by the mode increasing material manufacture, does not need welding, welding defect.
Claims (2)
1. an electronics cold drawing, it is characterized in that: comprise shell body (1), base plate (2), cylindrical support (3), cover plate (4), formed the cavity of a sealing by shell body (1), base plate (2) and cover plate (4), inside cavity is carried out load by cylindrical support (3) and is distributed flow field.
2. electronics cold drawing according to claim 1, is characterized in that: described electronics cold drawing is processed by the mode increasing material manufacture, does not need welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420774744.4U CN204329698U (en) | 2014-12-10 | 2014-12-10 | A kind of electronics cold drawing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420774744.4U CN204329698U (en) | 2014-12-10 | 2014-12-10 | A kind of electronics cold drawing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204329698U true CN204329698U (en) | 2015-05-13 |
Family
ID=53166049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420774744.4U Active CN204329698U (en) | 2014-12-10 | 2014-12-10 | A kind of electronics cold drawing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204329698U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108291785A (en) * | 2015-09-21 | 2018-07-17 | 洛克希德马汀股份有限公司 | Integral type multicell heat exchanger |
| CN110165355A (en) * | 2019-07-02 | 2019-08-23 | 电子科技大学 | A kind of 3D printing integral heat radiator and its application in phased array antenna |
| US10527362B2 (en) | 2015-09-21 | 2020-01-07 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
| US10914535B2 (en) | 2015-09-21 | 2021-02-09 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
-
2014
- 2014-12-10 CN CN201420774744.4U patent/CN204329698U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108291785A (en) * | 2015-09-21 | 2018-07-17 | 洛克希德马汀股份有限公司 | Integral type multicell heat exchanger |
| US10527362B2 (en) | 2015-09-21 | 2020-01-07 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
| US10816280B2 (en) | 2015-09-21 | 2020-10-27 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
| US10914535B2 (en) | 2015-09-21 | 2021-02-09 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
| CN110165355A (en) * | 2019-07-02 | 2019-08-23 | 电子科技大学 | A kind of 3D printing integral heat radiator and its application in phased array antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |