CN204087068U - Computer heating radiator syndeton - Google Patents
Computer heating radiator syndeton Download PDFInfo
- Publication number
- CN204087068U CN204087068U CN201420556662.2U CN201420556662U CN204087068U CN 204087068 U CN204087068 U CN 204087068U CN 201420556662 U CN201420556662 U CN 201420556662U CN 204087068 U CN204087068 U CN 204087068U
- Authority
- CN
- China
- Prior art keywords
- groove
- heat pipe
- radiator body
- radiator
- computer heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 14
- 238000004080 punching Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of computer heating radiator syndeton, comprise radiator body and heat pipe, this radiator body is provided with some radiating fins, the side of described radiator body is provided with one for the groove of accommodating described heat pipe, the dual-side of this groove forms one respectively and upwarps portion, two these upturned portion do not tilt towards described groove center, and when described heat pipe is placed in this groove, two these portions of upwarping to be driven plain on the side of described radiator body and this radiator body and described heat pipe are closely linked.This computer heating radiator syndeton adopts and arrange groove on radiator body, and the formation of groove dual-side upwarps portion, being placed in by heat pipe after in groove makes radiator body and heat pipe be closely linked by the riveted punching press portion of upwarping, thus avoid soldering, connection procedure does not need electroplating chemical nickel yet, not only manufacturing process environmental protection, and energy consumption is little, and production cost also reduces greatly.
Description
Technical field
The utility model relates to a kind of syndeton, particularly relates to a kind of computer heating radiator syndeton.
Background technology
At present, the connection between the band heating radiator of radiating fin and heat pipe adopts lead-free tin cream to spread upon to need the surface be combined with each other, then passes through the soldering furnace of about 200 DEG C, makes it weld together.But there is many defects in this connected mode, such as, together with use aluminium radiating fin is soldered to mutually with copper material heat pipe, must in aluminium radiating fin electroplating surface chemical nickel, otherwise cannot weld successfully, and the waste water produced in the process of electronickelling is harmful, and soldering furnace energy consumption in welding process is very large, therefore this connected mode not only not environmentally, and cost is very high.
Summary of the invention
In order to overcome above-mentioned defect, the utility model provides a kind of computer heating radiator syndeton, not only environmental protection, and it is little to consume energy, and production cost is lower.
The utility model in order to the technical scheme solving its technical matters and adopt is: a kind of computer heating radiator syndeton, comprise radiator body and heat pipe, this radiator body is provided with some radiating fins, the side of described radiator body is provided with one for the groove of accommodating described heat pipe, the dual-side of this groove forms one respectively and upwarps portion, two these upturned portion do not tilt towards described groove center, when described heat pipe is placed in this groove, two these portions of upwarping to be driven plain on the side of described radiator body and this radiator body and described heat pipe are closely linked.
As further improvement of the utility model, described in two, the portion of upwarping is symmetrical set.
As further improvement of the utility model, the cross section of described groove is half elliptic.
As further improvement of the utility model, riveted punching press is adopted to flatten on the side of described radiator body by the portion of upwarping described in two.
The beneficial effects of the utility model are: this computer heating radiator syndeton adopts and arrange groove on radiator body, and the formation of groove dual-side upwarps portion, being placed in by heat pipe after in groove makes radiator body and heat pipe be closely linked by the riveted punching press portion of upwarping, thus avoid soldering, connection procedure does not need electroplating chemical nickel yet, not only manufacturing process environmental protection, and energy consumption is little, and production cost also reduces greatly.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is radiator body cross-sectional view described in the utility model;
Fig. 3 is that heat pipe described in the utility model is placed in described groove inner structure schematic diagram;
Fig. 4 is the utility model cross-sectional view.
By reference to the accompanying drawings, make the following instructions:
1---radiator body 2---heat pipe
11---radiating fin 12---groove
13---upwarp portion
Embodiment
Below in conjunction with accompanying drawing, a preferred embodiment of the present utility model is elaborated.But protection domain of the present utility model is not limited to following embodiment, the simple equivalence namely in every case done with the utility model claim and description changes and modifies, and all still belongs within the utility model patent covering scope.
As shown in Figure 1, a kind of computer heating radiator syndeton, comprise radiator body 1 and heat pipe 2, this radiator body is provided with some radiating fins 11, the side of radiator body 1 is provided with one for the groove 11 of accommodating heat pipe 2, the cross section of groove is half elliptic, according to the large little makings of heat pipe, as shown in Figure 2.The dual-side of this groove 11 forms one respectively, and to upwarp this upturned portion of 12, two, portion not centroclinal and be symmetric towards groove 11.When heat pipe is placed in this groove, two these portions of upwarping to be driven plain on the side of radiator body and this radiator body and heat pipe are closely linked, as shown in Figure 3,4.
Preferably, riveted punching press is adopted to flatten on the side of radiator body by the portion of upwarping described in two, and need when heat pipe penetrates groove to keep suitable elasticity, Ruo Taisong, can not ensure after pressing that radiator body and heat pipe are closely linked, and do not reach the optimum efficiency of heat radiation yet, if too tight, heat pipe be difficult to through, or reluctantly through damaging radiator body.Before riveted, need heat pipe and radiator body to fix, then riveting die drift only needs to upwarp portion's correspondence contact to two, and mould close a stroke, and taking-up product, namely completes combining closely of radiator body and heat pipe.
Claims (4)
1. a computer heating radiator syndeton, comprise radiator body (1) and heat pipe (2), this radiator body is provided with some radiating fins (11), it is characterized in that: on the side of described radiator body, be provided with one for the groove (12) of accommodating described heat pipe, the dual-side of this groove forms one respectively and upwarps portion (13), two these upturned portion do not tilt towards described groove center, when described heat pipe is placed in this groove, two these portions of upwarping to be driven plain on the side of described radiator body and this radiator body and described heat pipe are closely linked.
2. computer heating radiator syndeton according to claim 1, is characterized in that: described in two, the portion of upwarping is symmetrical set.
3. computer heating radiator syndeton according to claim 1 and 2, is characterized in that: the cross section of described groove is half elliptic.
4. computer heating radiator syndeton according to claim 1 and 2, is characterized in that: adopt riveted punching press to flatten on the side of described radiator body by the portion of upwarping described in two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420556662.2U CN204087068U (en) | 2014-09-25 | 2014-09-25 | Computer heating radiator syndeton |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420556662.2U CN204087068U (en) | 2014-09-25 | 2014-09-25 | Computer heating radiator syndeton |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204087068U true CN204087068U (en) | 2015-01-07 |
Family
ID=52179762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420556662.2U Active CN204087068U (en) | 2014-09-25 | 2014-09-25 | Computer heating radiator syndeton |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204087068U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056344A (en) * | 2019-01-09 | 2021-06-29 | 古河电气工业株式会社 | Heat pipe structure, heat sink, method for manufacturing heat pipe structure, and method for manufacturing heat sink |
| CN114472744A (en) * | 2022-03-03 | 2022-05-13 | 惠州汉旭五金塑胶科技有限公司 | Riveting method of heat dissipation base and heat pipe |
-
2014
- 2014-09-25 CN CN201420556662.2U patent/CN204087068U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056344A (en) * | 2019-01-09 | 2021-06-29 | 古河电气工业株式会社 | Heat pipe structure, heat sink, method for manufacturing heat pipe structure, and method for manufacturing heat sink |
| CN114472744A (en) * | 2022-03-03 | 2022-05-13 | 惠州汉旭五金塑胶科技有限公司 | Riveting method of heat dissipation base and heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240117 Address after: Room 2, No. 269, Shaoqing East Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province, 215341 Patentee after: Suzhou Anminrui Electronic Technology Co.,Ltd. Address before: Room 3, No. 78, Gangpu East Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province 215300 Patentee before: Kunshan Baofutong Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |