CN103909240A - Composite copper bush and preparation method thereof - Google Patents
Composite copper bush and preparation method thereof Download PDFInfo
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- CN103909240A CN103909240A CN201410142619.6A CN201410142619A CN103909240A CN 103909240 A CN103909240 A CN 103909240A CN 201410142619 A CN201410142619 A CN 201410142619A CN 103909240 A CN103909240 A CN 103909240A
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Abstract
The invention discloses a composite copper bush for cooling. The composite copper bush comprises an outer copper bush, a horizontal high-heat-conductivity material layer and an inner copper bush which are laminated together closely and sequentially from outside to inside, the outer copper bush is prepared from chromium zirconium copper, and the outer copper bush is prepared from oxygen-free copper. The composite copper bush has high cooling efficiency, can improve performance of amorphous and nanocrystalline products, and can increase product percent of pass of amorphous and nanocrystalline belting equipment. The invention further discloses a preparation method of the composite copper bush.
Description
Technical field
The present invention relates to a kind of for cooling copper sheathing of copper and preparation method thereof, especially a kind of cooling with copper sheathing and preparation method thereof for preparations such as amorphous, nanocrystalline strips.
Background technology
The cooling copper sheathing cooling velocity of existing copper is limited to the thermal conductivity of copper alloy, and in common amorphous, nanocrystalline strip production process, its cooling effect still can meet the demands.But compared with high amorphous nano-crystalline product, the cooling effect of the cooling copper sheathing of existing copper cannot satisfy the demands for ask for something.Be mainly because:
One, the thickness of existing copper sheathing is that 30mm is to 50mm, as shown in attached Fig. 1 and 2, in the time that molten steel 2 contacts with cooling copper sheathing 1, the heat of molten steel 2 is by the cooling water 3 of concentrating along vertical direction Directed cooling copper sheathing 1 inside, because cooling copper sheathing 1 temperature is very high herein, less with cooling water 3 contacts area, easily make cooling water 3 produce gasification, the thermal conductivity of air is equivalent to 1/25th left and right of water, cause the actual heat transfer efficiency between cooling copper sheathing 1 and cooling water 3 significantly to reduce, affect the stability of amorphous moulding process.
Two, existing copper sheathing thermal conductivity factor made of copper is 330W/m.k, lower than the 400-410W/m.k of oxygen-free copper, more lower than the 1200-1500W/m.k of graphite heat-conducting fin and the 5000W/m.k of Graphene.
Therefore, need a kind of new-type cooling copper sheathing of research and development badly, can effectively promote cooling effectiveness, thereby promote amorphous, the performance of nanocrystalline product and the product percent of pass of amorphous nano-crystalline carrying device processed.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part and provide a kind of heat transfer efficiency higher, there is uniform cooling, can improve the compound copper sheathing of the product percent of pass of amorphous nano-crystalline carrying device processed; Meanwhile, the present invention also provides the preparation method of described compound copper sheathing.
For achieving the above object, the technical scheme that the present invention takes is: a kind of compound copper sheathing, described compound copper sheathing comprises the outer copper sheathing fitting tightly together, horizontal high thermal conductivity material layer and interior copper sheathing from outside to inside successively, described outer copper sheathing adopts chromium zirconium copper to be prepared from, and described outer copper sheathing adopts oxygen-free copper to be prepared from.
In horizontal high thermal conductivity material layer of the present invention, laterally high thermal conductivity material refers to the material of transverse thermal conductivity higher than the 400-410W/m.k of oxygen-free copper.
Compound copper sheathing of the present invention, be followed successively by from outside to inside the outer copper sheathing fitting tightly together, horizontal high thermal conductivity material layer and interior copper sheathing, described outer copper sheathing adopts chromium zirconium copper to be prepared from, chromium zirconium copper has characteristic wear-resisting, high temperature resistant erosion, be placed on the outside of compound copper sheathing, be conducive to extend the service life of compound copper sheathing of the present invention.Between described outer copper sheathing and interior copper sheathing, be provided with horizontal high thermal conductivity material layer, described horizontal high thermal conductivity material layer is the material with horizontal high thermal conductivity, the heat that can make outer copper sheathing receive conducts to surrounding, increase efficiently radiates heat area, strengthen the cooling effectiveness of outer copper sheathing, prevented hot-spot and internal cooling aqueous vapor.Described interior copper sheathing adopts oxygen-free copper to be prepared from, and utilizes the higher feature of heat-exchange capacity of interior copper sheathing prepared by oxygen-free copper and cooling water, has effectively promoted the cooling uniformity of the compound copper sheathing of the present invention, makes strip quality more stable.
As the preferred embodiment of compound copper sheathing of the present invention, the thickness of described outer copper sheathing is 5～30mm, and the thickness of described horizontal high thermal conductivity material layer is 0.1～1.5mm, and the thickness of described outer copper sheathing is 5～15mm.The thickness of outer copper sheathing should not be greater than 30mm, otherwise can make heat conduction distance long, and then is that surface temperature is too high, is unfavorable for amorphous formation, and certainly, the thickness of described outer copper sheathing should not be less than 5mm yet, not so insufficient strength, and the life-span is short.The thickness of described horizontal high thermal conductivity material layer is not more than 1.5mm, if the too thick high cost of thickness, and would affect the structural stability of copper sheathing entirety.The thickness of described interior copper sheathing should not be greater than 15mm, and the blocked up heat that will affect is conducted distance, affects radiating efficiency, promotes outer copper sheathing surface temperature, affects amorphous formation, and the thickness of described interior copper sheathing should not be less than 5mm, otherwise insufficient strength.
As the preferred embodiment of compound copper sheathing of the present invention, described horizontal high thermal conductivity material layer is Graphene or graphite heat-conducting fin.Described horizontal high thermal conductivity material layer is selected Graphene or graphite heat-conducting fin, the thermal conductivity factor of Graphene or graphite heat-conducting fin is respectively Graphene 5000W/m.k, graphite heat-conducting fin 1200-1500W/m.k, there is the thermal conductivity factor far above existing copper sheathing, the heat that outer copper sheathing can be received conducts to surrounding, increase efficiently radiates heat area, the cooling effectiveness of strengthening outer copper sheathing, prevents hot-spot and internal cooling aqueous vapor.
As the preferred embodiment of compound copper sheathing of the present invention, in the chromium zirconium copper that described outer copper sheathing adopts, the quality percentage composition of chromium is 0.5～1.5%, and the quality percentage composition of zirconium is 0.08～0.3%, and surplus is copper.
In addition, the present invention also provides the preparation method of described compound copper sheathing, said method comprising the steps of:
(1) preparation of outer copper sheathing: adopt chromium zirconium copper for outer copper sheathing;
(2) preparation of interior copper sheathing: adopt copper sheathing in oxygen-free copper preparation;
(3) the interior copper sheathing outer surface preparing in step (2) is evenly pasted horizontal high thermal conductivity material layer;
(4) dwindle or dwindle cooling interior copper sheathing by outer copper sheathing expanded by heating time by outer copper sheathing expanded by heating or by cooling interior copper sheathing, be greater than the external diameter of described interior copper sheathing to the internal diameter of described outer copper sheathing;
(5) the interior copper sheathing that outer surface is pasted with to horizontal high thermal conductivity material layer is placed in internal diameter and becomes large outer copper sheathing because of expanded by heating, naturally cooling, obtains compound copper sheathing.
In described step (1) and step (2), can make inside and outside smooth outer copper sheathing and interior copper sheathing by techniques such as melting, casting, forging, machining, rubbing downs.
As the preparation method's of compound copper sheathing of the present invention preferred embodiment, the external diameter of the interior copper sheathing preparing in described step (2) is more than or equal to the internal diameter of the outer copper sheathing that step (1) prepares.As the preparation method's of compound copper sheathing of the present invention more preferably embodiment, the difference in internal diameters of the outer copper sheathing that the external diameter of the interior copper sheathing that described step (2) prepares and step (1) prepare is not more than 5mm, if the external diameter of interior copper sheathing is more too many greatly than the internal diameter of outer copper sheathing, in can existing, copper sheathing is difficult for being placed in the problem in outer copper sheathing, and therefore the external diameter of preferably interior copper sheathing is than in the large 5mm of the internal diameter of outer copper sheathing.
As the preparation method's of compound copper sheathing of the present invention preferred embodiment, in described step (3), adopt adhesive that horizontal high thermal conductivity material layer is sticked on the outer surface of interior copper sheathing, described adhesive can bear the variations in temperature of-30～300 ℃.Described horizontal high thermal conductivity material layer can be pasted the outer surface at interior copper sheathing by adhesive, and described adhesive need to be able to bear the variations in temperature of-30～300 ℃, to prevent that preparing gained complex copper overlaps in use, adhesive failure.The outer surface of described interior copper sheathing can evenly be pasted one deck or above horizontal high thermal conductivity material layer.Described adhesive preferably but be not limited to HBC1099 heat conductive silica gel, thermal conductivity coefficient 0.86W/(mK), serviceability temperature-60～300 ℃.
As the preparation method's of compound copper sheathing of the present invention preferred embodiment, in described step (4), outer copper sheathing is soaked in high-temp liquid and make the internal diameter of outer copper sheathing be expanded to the external diameter that is greater than described interior copper sheathing; Or described interior copper sheathing is soaked and makes the external diameter of interior copper sheathing be contracted to the internal diameter that is less than described outer copper sheathing in cryogenic liquid; Or in outer copper sheathing being soaked in high-temp liquid to the internal diameter expansion that makes outer copper sheathing, interior copper sheathing is soaked in cryogenic liquid the external diameter of interior copper sheathing is shunk, be greater than the external diameter of described interior copper sheathing to the internal diameter of described outer copper sheathing.Described high-temp liquid preferably but be not limited to high-temperature hot oil.
Compound copper sheathing of the present invention, comprise that successively the outer copper sheathing being prepared from by chromium zirconium copper, horizontal high thermal conductivity material layer and the three kinds of different materials of interior copper sheathing that are prepared from by oxygen-free copper form, chromium zirconium copper has characteristic wear-resisting, high temperature resistant erosion, be placed on the outside of compound copper sheathing, be conducive to extend the service life of described compound copper sheathing; Described horizontal high thermal conductivity material layer is the material with horizontal high thermal conductivity, and the heat that can make outer copper sheathing receive conducts to surrounding, has increased efficiently radiates heat area, has strengthened the cooling effectiveness of outer copper sheathing, prevents hot-spot and internal cooling aqueous vapor; Described interior copper sheathing adopts oxygen-free copper to be prepared from, and utilizes the higher feature of heat-exchange capacity of interior copper sheathing prepared by oxygen-free copper and cooling water, has effectively promoted the cooling uniformity of the compound copper sheathing of the present invention, makes strip quality more stable.The preparation method of compound copper sheathing of the present invention, simple to operate, facilitate industrialization promotion to use.
Accompanying drawing explanation
Fig. 1 is the structural representation that adopts existing cooling copper sheathing non-crystal belt making.
Fig. 2 is the heat conduction schematic diagram while adopting existing cooling copper sheathing non-crystal belt making.
Fig. 3 is the structural representation of a kind of embodiment of the compound copper sheathing of the present invention.
Fig. 4 is the blast structural representation of compound copper sheathing shown in Fig. 3.
Fig. 5 is the heat conduction schematic diagram while adopting Compound cooling copper sheathing non-crystal belt making of the present invention.
In figure, 1 is that cooling copper sheathing, 2 is that copper liquid, 3 is that cooling water, 4 is that amorphous steel band, 5 is that heat conduction orientation, 10 is that outer copper sheathing, 20 is that horizontal high thermal conductivity material layer, 30 is interior copper sheathing.
The specific embodiment
For the object, technical solutions and advantages of the present invention are better described, below in conjunction with the drawings and specific embodiments, the invention will be further described.
Embodiment 1
A kind of embodiment of the compound copper sheathing of the present invention, as shown in Figure 3, described in the present embodiment, compound copper sheathing comprises the outer copper sheathing 10 fitting tightly together, horizontal high thermal conductivity material layer 20 and interior copper sheathing 30 from outside to inside successively, the thickness of described outer copper sheathing 10 is 5～30mm, the thickness of described horizontal high thermal conductivity material layer 20 is 0.1～1.5mm, the thickness of described interior copper sheathing 30 is 5～15mm, and those skilled in the art can select the outer copper sheathing of suitable thickness, horizontal high thermal conductivity material layer and interior copper sheathing according to actual needs.
As shown in Figure 4, described in the present embodiment, compound copper sheathing adopts following methods to be prepared from:
(1) preparation of outer copper sheathing: adopt chromium zirconium copper by inside and outside smooth outer copper sheathings 10 of technique preparation such as melting, casting, forging, machining, rubbing downs;
(2) preparation of interior copper sheathing: adopt oxygen-free copper by copper sheathing 30 in the inside and outside smooth preparations of technique preparation such as melting, casting, forging, machining, rubbing down, the external diameter of described interior copper sheathing is more than or equal to the internal diameter of the outer copper sheathing that step (1) prepares, and the difference in internal diameters of the outer copper sheathing for preparing of the external diameter of described interior copper sheathing and step (1) is not more than 5mm;
(3) interior copper sheathing 30 outer surfaces that prepare in step (2) adopt adhesive evenly to paste one deck or above horizontal high thermal conductivity material layer 20, and described adhesive can bear the variations in temperature of-30～300 ℃;
(4) outer copper sheathing 10 is soaked in high-temperature hot oil, make outer copper sheathing 10 internal diameters become the external diameter that the large internal diameter to described outer copper sheathing 10 is greater than described interior copper sheathing 30 because of expanded by heating;
(5) the interior copper sheathing 30 that outer surface is pasted with to horizontal high thermal conductivity material layer 20 is placed in internal diameter and becomes large outer copper sheathing 10 because of expanded by heating, naturally cooling, obtains compound copper sheathing.
In the preparation method of the present embodiment compound copper sheathing described above, in described step (4), described interior copper sheathing 30 can also be soaked and makes the external diameter of interior copper sheathing 30 be contracted to the internal diameter that is less than described outer copper sheathing 10 in cryogenic liquid; Or in outer copper sheathing 10 being soaked in high-temperature hot oil to the internal diameter expansion that makes outer copper sheathing 10, interior copper sheathing 30 is soaked in cryogenic liquid the external diameter of interior copper sheathing 30 is shunk, be greater than the external diameter of described interior copper sheathing 30 to the internal diameter of described outer copper sheathing 10.
Compound copper sheathing described in the present embodiment, outer copper sheathing 10 adopts chromium zirconium copper to be prepared from, and chromium zirconium copper has characteristic wear-resisting, high temperature resistant erosion, is placed on the outside of compound copper sheathing, is conducive to extend the service life of compound copper sheathing.While adopting described in the present embodiment compound copper sheathing non-crystal belt making, as shown in Figure 5, owing to being provided with horizontal high thermal conductivity material layer 20 between outer copper sheathing 10 and interior copper sheathing 30, described horizontal high thermal conductivity material layer 20 is for having the material of horizontal high thermal conductivity, the heat that can make outer copper sheathing 10 receive conducts to surrounding, increase efficiently radiates heat area, strengthened the cooling effectiveness of outer copper sheathing 10, prevented hot-spot and internal cooling aqueous vapor.And, because interior copper sheathing 30 adopts oxygen-free copper to be prepared from, utilize interior copper sheathing 30 feature higher with the heat-exchange capacity of cooling water 3 prepared by oxygen-free copper, effectively promote the cooling uniformity of the compound copper sheathing of the present invention, make strip quality more stable.
Embodiment 2
The cooling effect experiment of the compound copper sheathing of the present invention
Use 100kg level amorphous strip maker system band, one-tenth brand is 1k101, and molten steel temperature is controlled at 1000～1450 ℃, adopts respectively existing cooling copper sheathing and complex copper cover of the present invention to carry out cooling, and experimental result is as shown in table 1:
The contrast of table 1 cooling effect
| Project | The compound copper sheathing of the present invention | Existing cooling copper sheathing promotes |
| Band process chill roll surface temperature processed | 97.5℃ | 112.7℃15.2℃ |
| The ten thousand metres amorphous ribbon quantity that on average breaks end | 5.5 | 7.223.6% |
| Average broken end quantity after ten thousand metres heat treatment | 9.4 | 12.826.5% |
| Comprehensive yields | 78.4% | 74.2%5.7% |
As seen from Table 1, the compound copper sheathing of the present invention can effectively improve cooling effectiveness, improves the performance of amorphous, nanocrystalline product, and the product percent of pass of amorphous nano-crystalline carrying device processed.
Last institute should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention is explained in detail with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not depart from essence and the scope of technical solution of the present invention.
Claims (10)
1. a compound copper sheathing, it is characterized in that, described compound copper sheathing comprises the outer copper sheathing fitting tightly together, horizontal high thermal conductivity material layer and interior copper sheathing from outside to inside successively, and described outer copper sheathing adopts chromium zirconium copper to be prepared from, and described outer copper sheathing adopts oxygen-free copper to be prepared from.
2. compound copper sheathing as claimed in claim 1, is characterized in that, the thickness of described outer copper sheathing is 5～30mm, and the thickness of described horizontal high thermal conductivity material layer is 0.1～1.5mm, and the thickness of described interior copper sheathing is 5～15mm.
3. compound copper sheathing as claimed in claim 1, is characterized in that, described horizontal high thermal conductivity material layer is Graphene or graphite heat-conducting fin.
4. compound copper sheathing as claimed in claim 1, is characterized in that, in the chromium zirconium copper that described outer copper sheathing adopts, the quality percentage composition of chromium is 0.5～1.5%, and the quality percentage composition of zirconium is 0.08～0.3%, and surplus is copper.
5. as described in as arbitrary in claim 1～4, a preparation method for compound copper sheathing, is characterized in that, comprises the following steps:
(1) preparation of outer copper sheathing: adopt chromium zirconium copper for outer copper sheathing;
(2) preparation of interior copper sheathing: adopt copper sheathing in oxygen-free copper preparation;
(3) the interior copper sheathing outer surface preparing in step (2) is evenly pasted horizontal high thermal conductivity material layer;
(4) dwindle or dwindle cooling interior copper sheathing by outer copper sheathing expanded by heating time by outer copper sheathing expanded by heating or by cooling interior copper sheathing, be greater than the external diameter of described interior copper sheathing to the internal diameter of described outer copper sheathing;
(5) the interior copper sheathing that outer surface is pasted with to horizontal high thermal conductivity material layer is placed in outer copper sheathing, naturally cooling, obtains compound copper sheathing.
6. the preparation method of compound copper sheathing as claimed in claim 5, is characterized in that, the external diameter of the interior copper sheathing preparing in described step (2) is more than or equal to the internal diameter of the outer copper sheathing that step (1) prepares.
7. the preparation method of compound copper sheathing as claimed in claim 6, is characterized in that, the difference in internal diameters of the outer copper sheathing that the external diameter of the interior copper sheathing that described step (2) prepares and step (1) prepare is not more than 5mm.
8. the preparation method of compound copper sheathing as claimed in claim 5, is characterized in that, adopts adhesive that horizontal high thermal conductivity material layer is sticked on the outer surface of interior copper sheathing in described step (3), and described adhesive can bear the variations in temperature of-30～300 ℃.
9. the preparation method of compound copper sheathing as claimed in claim 8, is characterized in that, described adhesive is heat conductive silica gel.
10. the preparation method of compound copper sheathing as claimed in claim 5, is characterized in that, in described step (4), outer copper sheathing is soaked in high-temp liquid and make the internal diameter of outer copper sheathing be expanded to the external diameter that is greater than described interior copper sheathing; Or described interior copper sheathing is soaked and makes the external diameter of interior copper sheathing be contracted to the internal diameter that is less than described outer copper sheathing in cryogenic liquid; Or in outer copper sheathing being soaked in high-temp liquid to the internal diameter expansion that makes outer copper sheathing, interior copper sheathing is soaked in cryogenic liquid the external diameter of interior copper sheathing is shunk, be greater than the external diameter of described interior copper sheathing to the internal diameter of described outer copper sheathing.
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| CN201410142619.6A CN103909240B (en) | 2014-04-10 | 2014-04-10 | A kind of compound copper sheathing and preparation method thereof |
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| CN201410142619.6A CN103909240B (en) | 2014-04-10 | 2014-04-10 | A kind of compound copper sheathing and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104694780A (en) * | 2015-02-06 | 2015-06-10 | 中国能建集团装备有限公司北京技术中心 | Cu-Ni-Si alloy material and cooling roller sleeve containing alloy |
| CN108555259A (en) * | 2018-06-29 | 2018-09-21 | 王春龙 | A kind of chill roll and equipment producing amorphous band |
| CN110517837A (en) * | 2018-05-21 | 2019-11-29 | 灯达（深圳）电器有限公司 | A kind of highly sensitive self- recoverage insurance using self breakaway-element of graphene energy |
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| CN103056319A (en) * | 2013-01-28 | 2013-04-24 | 青岛云路新能源科技有限公司 | Structure of copper bush of amorphous crystallizer |
| CN103567402A (en) * | 2012-07-19 | 2014-02-12 | 常州市武进长虹结晶器有限公司 | Production process for chromium-zirconium-copper copper pipes |
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| US3715265A (en) * | 1969-09-03 | 1973-02-06 | Mc Donnell Douglas Corp | Composite thermal insulation |
| CN2213035Y (en) * | 1994-08-16 | 1995-11-22 | 吕爱菊 | Thermometal compounded horizontal continuous casting crystallizer internal member |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104694780A (en) * | 2015-02-06 | 2015-06-10 | 中国能建集团装备有限公司北京技术中心 | Cu-Ni-Si alloy material and cooling roller sleeve containing alloy |
| CN110517837A (en) * | 2018-05-21 | 2019-11-29 | 灯达（深圳）电器有限公司 | A kind of highly sensitive self- recoverage insurance using self breakaway-element of graphene energy |
| CN108555259A (en) * | 2018-06-29 | 2018-09-21 | 王春龙 | A kind of chill roll and equipment producing amorphous band |
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| CN103909240B (en) | 2016-01-27 |
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