CN204325478U - A kind of sample chamber structure of vacuum coating system - Google Patents
A kind of sample chamber structure of vacuum coating system Download PDFInfo
- Publication number
- CN204325478U CN204325478U CN201420804646.0U CN201420804646U CN204325478U CN 204325478 U CN204325478 U CN 204325478U CN 201420804646 U CN201420804646 U CN 201420804646U CN 204325478 U CN204325478 U CN 204325478U
- Authority
- CN
- China
- Prior art keywords
- vacuum
- mask
- locating platform
- light path
- coating system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The utility model relates to a kind of sample chamber structure of vacuum coating system, comprising: vacuum chamber, and the top of this vacuum chamber is fixedly connected with datum plate; Described datum plate is evenly equipped with several pilot holes; Be installed on the vacuum nano locating platform of described datum plate lower surface, vacuum nano locating platform transfers heat to the chamber wall of vacuum chamber by datum plate; Described vacuum nano locating platform is provided with substrate; The below of vacuum nano locating platform is provided with mask support, and mask support is fixedly connected with datum plate, and mask support has mask open holes; The side of described vacuum chamber is provided with laser ruler light path mouth and multiple functional interface; This vacuum chamber also has cavity door.The utility model, by designing brand-new sample chamber structure, achieves the coated film deposition of specified shape.
Description
Technical field
The present invention relates to field of vacuum coating, specifically, relate to a kind of sample chamber structure of vacuum coating system.
Background technology
Film is a kind of physical form, and widely, can be simple substance without element or compound, also can be inorganic materials or organic materials to the mould material that it uses.Film is the same with cake mass, can be monocrystalline state, polycrystalline state or amorphous.Functional membranes and laminated film also grow a lot in recent years.The application industrially of coating technique and film product widely, especially occupies extremely important status in electronically materials and component industrial circle.Masking (or plated film) method can be divided into gas phase method of formation, oxidation style, ion implantation, diffusion process, electrochemical plating, coating method and liquid-phase growth method etc.Gas phase method of formation can be divided into again physical vaporous deposition (Physical Vapor Deposition) to be called for short PVD method, chemical Vapor deposition process (Chemical Vapor Deposition) is called for short CVD and elektrin process etc.
Physical vaporous deposition vacuum coating technology, due to this method be substantially all in vacuum environment under carry out, therefore claim them to be vacuum coating technology.Vacuum coating technology is a kind of materials synthesis of novelty and the new technology of processing, is the important component part of field of surface engineering technique.Vacuum coating technology makes to put plating metal and plated plastics are positioned at vacuum chamber, and adopt certain method to heat material to be plated, make evaporation of metal or distillation, metallic vapor runs into cold surface of plastic products and is condensed into metallic film.The atom of evaporating materials can be reduced under vacuum, molecule is flying in plastics process and the collision of other molecules, reduce the bioactive molecule in gas and the chemical reaction between evaporation source material (as oxidation etc.), thus the density of rete, purity, sedimentation rate and and sticking power are provided.Usual vacuum evaporation requires that filming chamber's internal pressure is equal to or less than 10-2Pa, for evaporation source and by plated product and the exigent occasion of film quality, then requires pressure lower (10-5Pa).When thickness of coating is between 0.04-0.1um, coating is too thin, and reflectivity is low; If coating is too thick, poor adhesive force, easily comes off.When thickness of coating is 0.04um, reflectivity is 90%.Suitable thickness of coating can make solid surface have many high-performances being better than solid material itself such as wear-resistant, high temperature resistant, corrosion-resistant, anti-oxidant, radioprotective, conduction, magnetic conduction, insulation and decoration, reaches the effect of the remarkable technical economic benefit of product life, save energy and acquisition of improving the quality of products, extend.
Vacuum evaporatation (abbreviation vacuum evaporation) is in a vacuum chamber, the starting material of film to be formed in heating evaporation container, make its atom or molecule from surface gasification effusion, form steam stream, incide solid (being called substrate or substrate) surface, condensation forms the method for solid film.In the middle of vacuum evaporatation, evaporation source is the key part of evaporation unit, and different according to evaporation source, vacuum evaporatation can be divided into again following several:
1. thermal resistance evaporation source vapour deposition method;
2. electron beam evaporation source vapour deposition method;
3. high-frequency induction evaporation source vapour deposition method;
4. laser beam evaporation source vapour deposition method.
Existing vacuum coating technology is all make to be overflowed from surface gasification by the atom of deposition material or molecule by being placed in the method for vacuum chamber by resistive heating or resistance Shu Jiare by deposition material, form vapour stream, then be deposited directly on substrate, if want the film forming specified shape on substrate, multi-step process such as then also needing to comprise whirl coating, drying glue, development by other scribing process, metallize, remove photoresist, these operations can bring unavoidable contaminating impurity in workpiece process, make the effect after plated film undesirable.
The vacuum coating method that current technical level is higher is will evaporate the atomic beam that comes up by carrying out convergences collimation after mask plate in coating chamber, and controls substrate by vacuum nano locating platform and relatively converge the atomic beam after collimation and carry out particular track and move and then can deposit the film of specified shape.Vacuum nano locating platform as can be seen here in vacuum chamber and mask plate most important for realizing specified shape thin film deposition.
Meanwhile, vacuum nano locating platform in the course of the work, can produce certain heat, can affect the kinematic accuracy of self accordingly, finally causes form film and design requirements to there is larger error.
Application number be 201410081835.4 Chinese patent literature describe a kind of vacuum coater, this device comprises: for carrying and the base plate driving mechanism of moving substrate; For carrying and move the first mask plate driving mechanism of the first mask plate, described first mask plate is positioned at the below of described substrate; For carrying and mobile second mask plate, to coordinate with described first mask plate driving mechanism, change the second mask plate driving mechanism of the mutual overlapping state of the mask plate graph area of described first mask plate and described second mask plate, described second mask plate is positioned at the below of described first mask plate; And evaporation source, described evaporation source is positioned at the below of described second mask plate.The program is by arranging at least two pieces of mask plates, according to the graphic feature of substrate surface graph area to be deposited, change the mutual overlapping state of the mask plate graph area at least two pieces of mask plates, with suitable with the figure of substrate surface graph area to be deposited, thus realize the graphical of each layer evaporated film, reduce the manufacturing cost of mask plate.But, the program is comparatively difficult to the shape controlling coated film deposition, its concrete reason is: its control coated film deposition shape is the relative position by adjusting two mask plates, and it also needs the shape depending on mask aperture, so change that can only realize simple shape, is difficult to the adjustment realizing the such as complicated coated film deposition shape of annulus, ellipse and so on.
Therefore, how to design a kind of sample chamber structure of brand new, being easy to the shape controlling coated film deposition, is the problem that those skilled in the art's letter need solve.
Summary of the invention
The object of the invention is, for overcoming above-mentioned the deficiencies in the prior art, to provide a kind of sample chamber structure of vacuum coating system.This programme, by designing brand-new sample chamber structure, realizes the accurate control of coated film deposition shape.
In order to reach above-mentioned purpose, the present invention adopts following technique means:
A sample chamber structure for vacuum coating system, comprising:
Vacuum chamber, the top of this vacuum chamber is fixedly connected with datum plate;
Described datum plate is evenly equipped with several threaded holes;
Be installed on the vacuum nano locating platform of described datum plate lower surface, vacuum nano locating platform transfers heat to the chamber wall of vacuum chamber by datum plate;
Described vacuum nano locating platform is provided with substrate, realizes the deposition of specified shape plated film.
The below of described vacuum nano locating platform is covered by mask support, and mask support is fixedly connected with datum plate, and mask support has mask open holes.
The side of described vacuum chamber is provided with laser ruler light path mouth and multiple functional interface.
This vacuum chamber also has cavity door.
Preferably, described vacuum nano locating platform drive substrate motion, realizes the deposition of specified shape plated film.
Preferably, described mask support being distributed with 4 mutually different mask open holess for installing mask plate of the degree of depth, realizing the coated film deposition layer that plated film obtains multiple different shapes feature.
Preferably, described vacuum nano locating platform covers by the orthographicprojection of described mask support completely, makes vacuum nano locating platform can not be subject to the impact of atom in vacuum evaporation or molecule in coating process.
Preferably, orthogonal two sides of mask support are respectively arranged with the mask support light path mouth corresponding with described laser ruler light path mouth, realize the accurate noncontact Real-Time Monitoring to vacuum nano Platform movement state.
Preferably, described datum plate deducts datum plate to the distance of mask stent inner surface and is distance between mask plate and substrate to the distance of substrate surface.
Preferably, described mask open holes is arranged in a linear, and the benefit of linear arrangement is can transfer mask installation site easily by the position of mask support.
Preferably, described vacuum chamber is also provided with vision slit.
Preferably, described vacuum nano locating platform comprises the base with drop-center, chip bench is provided with in drop-center, the X-direction of chip bench is fixed on base through X to flexible hinge, the Y direction of chip bench is fixed on base through Y-direction flexible hinge, X is provided with X to piezoelectric ceramic actuator to flexible hinge, and Y-direction flexible hinge is provided with Y-direction piezoelectric ceramic actuator; The X of chip bench is provided with X to light path speculum on edge, side, and the edge, Y-direction side of chip bench is provided with Y-direction light path speculum.
The invention has the beneficial effects as follows:
(1) substrate motion is driven to realize the accurate control of coated film deposition shape facility by vacuum nano locating platform.And two orthogonal sides have square opening on mask support, be used for by the measuring beam of laser ruler, thus can realize the accurate noncontact Real-Time Monitoring to vacuum nano Platform movement state, this makes plated film shape facility can by Real-Time Monitoring.
(2) vacuum nano locating platform covers by mask support orthographicprojection completely, makes vacuum nano locating platform can not be subject to the impact of atom in vacuum evaporation or molecule in coating process.
(3) partial heat that vacuum nano locating platform produces at work passes to chamber walls by datum plate, further ensures the kinematic accuracy of vacuum nano locating platform, provides guarantee for coated film deposition reaches higher form accuracy.
Accompanying drawing illustrates:
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is side sectional view of the present invention;
Fig. 2 is vacuum chamber right side view;
Fig. 3 is vacuum chamber lateral side view;
Fig. 4 is vacuum chamber front view;
Fig. 5 is the structural representation of datum plate;
Fig. 6 is the front view of mask support;
Fig. 7 is that the axle that waits of mask support surveys side-view;
Fig. 8 is the structural representation of vacuum nano locating platform in the present invention;
Wherein: 1, mask support, 2, datum plate, 3, vacuum nano locating platform, 4, substrate, 5, vacuum chamber, 2-1, first gas passage mouth, 2-2, second gas passage mouth, 2-3, first laser ruler light path mouth, 2-4, start and stop baffle plate access port, 3-1, second laser ruler light path mouth, 3-2, crystal oscillator film thickness gauge interface, 3-3, pressure controller interface, 3-4, molecular pump interface, 3-5, cavity door, 4-1, plated film state observation mouth, 4-2, vacuumometer interface, 4-3, mechanical pump interface, 4-4, optional equipment interface, 6-1, mask open holes, 7-1, first mask support light path mouth, 7-2, second mask support light path mouth, 8-1, chip bench, 8-2, X to light path speculum, 8-3, X to piezoelectric ceramic actuator, 8-4, Y-direction light path speculum, 8-5, Y-direction piezoelectric ceramic actuator, 8-6, base.
Embodiment:
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment: as shown in Figure 1: a kind of sample chamber structure of vacuum coating system, comprise: vacuum chamber 5, the top of this vacuum chamber 5 is connected with datum plate 2 by bolt, the surface that vacuum chamber 5 and benchmark version 2 contact with each other has good surfaceness, datum plate 2 is evenly equipped with several threaded holes (blind hole); Datum plate 2 is connected with vacuum nano locating platform 3 by bolt, realizes the origin reference location of vacuum nano locating platform 3, and this vacuum nano locating platform 3 is provided with substrate 4; Mask support 1 is also fixed on datum plate 2 by identical bolt, and mask support 1 has mask open holes mask open holes 6-1; Also with datum plate 2 for positioning datum, to ensure that mask support 1 internal surface reaches design needs to the distance of datum plate 1 when mask support 1 is installed.
In this programme, vacuum nano locating platform 3 directly contacts with datum plate 2, datum plate 2 directly contacts with vacuum chamber 5, according to heat-conduction principle, the heat that then vacuum nano locating platform 3 produces can be delivered to outside, thus solves vacuum nano locating platform under vacuum and do not have the problem of heat-transfer medium.
Substrate 4 can select countersunk bolts or vacuum glue with the mode of connection of vacuum nano locating platform 3.If when the distance accuracy between substrate 4 and mask is less demanding, vacuum glue is used to fix more convenient, if need the distance accuracy ensured preferably between substrate 4 and mask, then need to ensure the distance of substrate 4 surface to datum plate 2, being connected by precision bolt is obviously that one is selected more reliably.
A very important constitutional features is, datum plate 2 deducts datum plate 2 to the distance of mask support 1 internal surface and is distance between mask plate and substrate 4 to the distance on substrate 4 surface.
In order to adjust the distance of substrate 4 to mask plate further, can realize by adding ultra-thin pad between mask support 1 and datum plate 2 contact surface.
Datum plate 2 carries out outside vacuum chamber 5 with the assembling process of vacuum nano locating platform 3 and mask support 1, reaches higher assembly precision, and then the entirety assembled is put into vacuum chamber by the cavity door 3-5 of vacuum chamber 5 side, be fixed on vacuum chamber inner top.
When in use needing to change mask or substrate 4, datum plate 2, vacuum nano locating platform 3 and mask support 1 together need be taken off as a whole takes out outside vacuum chamber 5, the substrate more renewed again or mask, after replacing, after assembling outside vacuum chamber, load end face on vacuum chamber 5 inside as a whole.
It should be noted that, the shape size of the cavity door 3-5 of vacuum chamber 5 side will be suitable for, if the size of cavity door 3-5 is less, inconvenience when may cause internal structure cannot being put in or assembling, if the size of cavity door 3-5 is larger, then can bring difficulty to vacuum-sealing, especially vacuum chamber 5 inside needs the environment reaching high vacuum.
The sealing of cavity door 3-5 can be selected seal with elastometic washer or be used copper band sealing, and copper band sealing can obtain good sealing effectiveness, but then needs to change copper band after each unlatching cavity door 3-5, and use cost can be made to increase; Sealing effectiveness is poor to use the words of seal with elastometic washer can reuse still, does not likely reach vacuum level requirements required in vacuum chamber.Therefore sealing-ring how is selected can be decided by actual demand.
As shown in Figure 2, the left surface of vacuum chamber 5 is distributed with multiple functional interface.Specifically, the left surface of vacuum chamber 5 is distributed with four vacuum C F flange-interfaces, is the first gas passage mouth 2-1, the second gas passage mouth 2-2, the first laser ruler light path mouth 2-3 and start and stop baffle plate access port 2-4 respectively.Wherein, the first gas passage mouth 2-1 and the second gas passage mouth 2-2 is used for passing into N
2or other rare gas elementes, leading to vacuum chamber 5 inner along the first laser ruler light path mouth 2-3 is the passage on a direction of laser ruler optical path, and the first laser ruler light path mouth 2-3 place is provided with high transmission glass, and optical path can well be passed through.Start and stop baffle plate access port 2-4, for getting involved start and stop baffle plate, when needs stop plated film, drives damper shaft to rotate by motor, makes it block the atom evaporating, can stop plated film timely, thus ensure the film thickness value of needs.
As shown in Figure 3, the trailing flank of vacuum chamber 5 is distributed with multiple functional interface.Specifically, the trailing flank of vacuum chamber 5 is distributed with four vacuum C F flange-interfaces, is the second laser ruler light path mouth 3-1 respectively, crystal oscillator film thickness gauge interface 3-2, pressure controller interface 3-3 and molecular pump interface 3-4.Leading to vacuum chamber 5 inner along the second laser ruler light path mouth 3-1 is the passage on another direction of laser ruler optical path.Crystal oscillator film thickness gauge interface 3-2 is used to the interface of the crystal oscillator film thickness gauge detecting thickness.Pressure controller interface 3-3 is the interface for Bonding pressure controller, and effect ensures that pressure-stabilisation in vacuum chamber 5 is in required force value.Molecular pump interface 3-4 is the interface for connecting molecular pump, is used for extracting vacuum.
As shown in Figure 4, the leading flank of vacuum chamber 5 is distributed with multiple functional interface.Specifically, the leading flank of vacuum chamber 5 is distributed with four CF vacuum flange interfaces, is plated film state observation mouth 4-1 respectively, vacuumometer interface 4-2, mechanical pump interface 4-3 and optional equipment interface 4-4.Plated film state observation mouth 4-1 is used for seeing that plated film is the state of vacuum chamber 5 inside intuitively.Vacuumometer interface 4-2 is used for measurement of vacuum; Mechanical pump interface 4-3 is used for extracting vacuum; Optional equipment interface 4-4 is for connecting other optional equipments and reserved spare interface.
As shown in Figure 6, be linearly distributed with the mask open holes 6-1 that four degree of depth are different on the surface of mask support 1, mask open holes 6-1 is used for placing the mask plate of different thickness.During actual plated film, mask plate can be placed in these four mask open holes 6-1 simultaneously, so just plated film can obtain the coated film deposition layer of four kinds of different shapes features, avoiding repeatedly plated film needs to carry out mask plate exchonge step, substantially increases plated film efficiency.When substrate shape is less or only wish to obtain a coated film deposition layer on substrate, the baffle plate of perforate can not had to be positioned over do not need in the mask open holes 6-1 that uses with shape size same with mask plate, thus avoid on substrate, obtain unwanted settled layer.
As shown in Figure 7, be distributed with in the orthogonal side of mask support 1 for being rectangle by the first mask support light path mouth 7-1 of laser ruler optical path and the second mask support light path mouth 7-2, the first mask support light path mouth 7-1 and the second mask support light path mouth 7-2.Position and the corresponding 2-3 of the first laser ruler light path mouth of the first mask support light path mouth 7-1, the second mask support light path mouth 7-2 is corresponding with the position of the second laser ruler light path mouth 3-1.Specifically, the shape of the first mask support light path mouth 7-1 and the second mask support light path mouth 7-2, position and size need shape and position dimension according to being arranged on two pieces of plane mirrors on vacuum nano locating platform 3 to determine.First mask support light path mouth 7-1 and the second mask support light path mouth 7-2 all needs to ensure that laser ruler input path and reflected light path all can pass through smoothly, otherwise outside laser ruler will be caused to measure.
As shown in Figure 8, described vacuum nano locating platform 3 comprises the base 8-6 with drop-center, chip bench 8-1 is provided with in drop-center, the X-direction of chip bench 8-1 is fixed on base 8-6 through X to flexible hinge, the Y direction of chip bench 8-1 is fixed on base 8-6 through Y-direction flexible hinge, X is provided with X to piezoelectric ceramic actuator 8-3 to flexible hinge, and Y-direction flexible hinge is provided with Y-direction piezoelectric ceramic actuator 8-3; The X of chip bench 8-1 is provided with X and is provided with Y-direction light path speculum 8-4 on the edge, Y-direction side of light path speculum 8-2, chip bench 8-1 on edge, side.The application process of vacuum nano locating platform 3 is: substrate 4 is installed on chip bench 8-1, and after applying voltage to X to piezoelectric ceramic actuator 8-3, piezoelectric ceramic actuator output displacement, after X amplifies to flexible hinge, drive substrate 4 is moved in X direction.X is used for being reflected through to light path speculum 8-2 the light path that the first laser ruler light path mouth 2-3 shines, and realizes the measurement to chip bench 8-1 moving displacement.Y-direction mode of motion is identical with X-direction.When X, Y-direction are moved simultaneously, then chip bench 3-1 can do complicated track motion, thus on substrate 4, realize the deposition plating of complicated track.
The present invention is when actual plated film, start and stop baffle plate in start and stop baffle plate access port 2-4 is in the position perpendicular with the lower surface of mask support 1, deposition material is entered vacuum chamber 5 by heating effusion in evaporator room, evaporating materials atom or molecular motion are to mask support 1 place, major part evaporation atom or molecule stop by mask support 1 to only have small part can by the aperture of mask plate on mask support 1.Collected by the evaporated atom of mask plate aperture or molecule and become a branch of, continue the surface moving upward to substrate 4, substrate 4 moves under the driving of vacuum nano locating platform 3.When vacuum nanopositioning stage 3 carries out the motion of single shaft, then substrate 4 is also cooked single axial movement thereupon, so just on substrate 4, obtains striped settled layer.Substrate 4 has two kinds of modes when carrying out single axial movement, and one is doing simple translational motion, and another kind moves reciprocatingly.When substrate 4 is cooked simple translational motion, can not relate to the problem of repetitive positioning accuracy, but the consequent is the problem of film thickness monitoring, the thickness of institute's plated film may be uneven; When substrate 4 moves reciprocatingly, the homogeneity of coatings thickness is relatively good, and repetitive positioning accuracy is then comparatively difficult to ensure card, and the length of institute's deposit stripes or live width can be caused to be difficult to meet the demands.Which kind of mode of motion of concrete employing, then consider according to the purposes of deposit stripes is compromise, select the scheme that optimum.When vacuum nanopositioning stage 3 carries out diaxon driving, then substrate just can realize the motion of some complexity, such as when the diaxon of vacuum nano platform inputs sinusoidal signal respectively, then substrate 4 just can realize circumferential motion, such coated film deposition layer will present toroidal, thus realizes the plated film of specified shape.
The present invention does not need replacing mask plate from realizing bar shaped settled layer to the settled layer realizing other complicated shapes, only needs a simple adjustment control signal to realize, has greatly saved the fund needed for replacing different shapes mask plate and time cost.
Therefore, after have employed said structure, this programme achieves the coated film deposition of specified shape, solves in prior art and realizes the comparatively difficult problem of specified shape plated film.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a sample chamber structure for vacuum coating system, is characterized in that, comprising:
Vacuum chamber, the top of this vacuum chamber is fixedly connected with datum plate;
Described datum plate is evenly equipped with several pilot holes;
Be installed on the vacuum nano locating platform of described datum plate lower surface, vacuum nano locating platform transfers heat to the chamber wall of vacuum chamber by datum plate;
Described vacuum nano locating platform is provided with substrate;
The below of described vacuum nano locating platform is provided with mask support, and mask support is fixedly connected with datum plate, and mask support has mask open holes;
The side of described vacuum chamber is provided with laser ruler light path mouth and multiple functional interface;
This vacuum chamber also has cavity door.
2. the sample chamber structure of vacuum coating system according to claim 1, is characterized in that, described vacuum nano locating platform drive substrate motion, realizes the deposition of specified shape plated film.
3. the sample chamber structure of vacuum coating system according to claim 2, it is characterized in that, described mask support being distributed with 4 mutually different mask open holess for installing mask plate of the degree of depth, realizing the coated film deposition layer that plated film obtains four kinds of different shapes features.
4. the sample chamber structure of vacuum coating system according to claim 2, it is characterized in that, described vacuum nano locating platform covers by the projection of described mask support completely, makes vacuum nano locating platform can not be subject to the impact of atom in vacuum evaporation or molecule in coating process.
5. the sample chamber structure of vacuum coating system according to claim 1, is characterized in that, described laser ruler light path mouth is two, on the left surface that two laser ruler light path mouths are separately positioned on vacuum chamber and trailing flank.
6. the sample chamber structure of vacuum coating system according to claim 5, it is characterized in that, orthogonal two sides of mask support are respectively arranged with the mask support light path mouth corresponding with described laser ruler light path mouth, realize the accurate noncontact Real-Time Monitoring to vacuum nano Platform movement state.
7. the sample chamber structure of vacuum coating system according to claim 3, is characterized in that, described datum plate deducts datum plate to the distance of mask stent inner surface and is distance between mask plate and substrate to the distance of substrate surface.
8. the sample chamber structure of the vacuum coating system according to claim 3 or 7, is characterized in that, described mask open holes is arranged in a linear.
9. the sample chamber structure of vacuum coating system according to claim 1, is characterized in that, described vacuum chamber is also provided with vision slit.
10. the sample chamber structure of vacuum coating system according to claim 1, it is characterized in that, described vacuum nano locating platform comprises the base with drop-center, chip bench is provided with in drop-center, the X-direction of chip bench is fixed on base through X to flexible hinge, the Y direction of chip bench is fixed on base through Y-direction flexible hinge, and X is provided with X to piezoelectric ceramic actuator to flexible hinge, and Y-direction flexible hinge is provided with Y-direction piezoelectric ceramic actuator; The X of chip bench is provided with X to light path speculum on edge, side, and the edge, Y-direction side of chip bench is provided with Y-direction light path speculum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420804646.0U CN204325478U (en) | 2014-12-17 | 2014-12-17 | A kind of sample chamber structure of vacuum coating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420804646.0U CN204325478U (en) | 2014-12-17 | 2014-12-17 | A kind of sample chamber structure of vacuum coating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204325478U true CN204325478U (en) | 2015-05-13 |
Family
ID=53161855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420804646.0U Withdrawn - After Issue CN204325478U (en) | 2014-12-17 | 2014-12-17 | A kind of sample chamber structure of vacuum coating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204325478U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104404452A (en) * | 2014-12-17 | 2015-03-11 | 山东大学 | Sample room structure of vacuum coating system |
| CN105132861A (en) * | 2015-10-13 | 2015-12-09 | 京东方科技集团股份有限公司 | Evaporation mask plate and evaporation device |
| CN107082572A (en) * | 2017-03-23 | 2017-08-22 | 合肥协耀玻璃制品有限公司 | A kind of glass evacuated coating system |
| CN109136861A (en) * | 2018-10-09 | 2019-01-04 | 山东大学 | A kind of high-precision write-through vacuum coating equipment and method |
| CN109338307A (en) * | 2018-10-19 | 2019-02-15 | 山东大学 | A kind of more target vacuum coaters and film plating process |
-
2014
- 2014-12-17 CN CN201420804646.0U patent/CN204325478U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104404452A (en) * | 2014-12-17 | 2015-03-11 | 山东大学 | Sample room structure of vacuum coating system |
| CN105132861A (en) * | 2015-10-13 | 2015-12-09 | 京东方科技集团股份有限公司 | Evaporation mask plate and evaporation device |
| US10640861B2 (en) | 2015-10-13 | 2020-05-05 | Boe Technology Group Co., Ltd. | Evaporation mask and evaporation device |
| CN107082572A (en) * | 2017-03-23 | 2017-08-22 | 合肥协耀玻璃制品有限公司 | A kind of glass evacuated coating system |
| CN109136861A (en) * | 2018-10-09 | 2019-01-04 | 山东大学 | A kind of high-precision write-through vacuum coating equipment and method |
| CN109338307A (en) * | 2018-10-19 | 2019-02-15 | 山东大学 | A kind of more target vacuum coaters and film plating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204325478U (en) | A kind of sample chamber structure of vacuum coating system | |
| CN104404452A (en) | Sample room structure of vacuum coating system | |
| TWI494969B (en) | Method for coating a substrate and coater | |
| CN103243302B (en) | Baffle mechanism, thin film deposition device and thin film deposition method | |
| CN101783397B (en) | Organic el device manufacture apparatus, deposition apparatus and deposition method thereof, liquid crystal display manufacture apparatus, alignment apparatus and alignment method | |
| CN101956176B (en) | Continuous evaporation apparatus | |
| US20130284590A1 (en) | Systems and methods for forming a layer of sputtered material | |
| CN100594256C (en) | Product line for producing AR film | |
| US9299958B2 (en) | Device for detecting evaporation source and method for applying the same | |
| CN105112856A (en) | Evaporation source, evaporation device and evaporation method | |
| CN107058970B (en) | A kind of fuel battery metal polar plate vacuum plated film pipelining equipment and its film plating process | |
| CN102051580A (en) | Vapor plating device and vapour plating method | |
| CN104674182B (en) | A kind of reciprocal continuous coating magnetic-control sputtering coiling film coating machine of one side | |
| JP2019512042A (en) | Material deposition apparatus, vacuum deposition system and method therefor | |
| CN208762573U (en) | A kind of vacuum and low temperature magnetron sputtering coater | |
| KR20180067463A (en) | A measurement assembly for measuring a deposition rate, an evaporation source, a deposition apparatus, and a method therefor | |
| US20110192716A1 (en) | Method for producing an ito layer and sputtering system | |
| CN209778983U (en) | Dual-purpose vacuum coating machine of evaporation sputtering | |
| CN201793730U (en) | Evaporation plating equipment | |
| CN203128648U (en) | Substrate cooling device and electronic beam evaporation device with same | |
| CN204138757U (en) | Ion sputtering film coating machine | |
| JP6502528B2 (en) | Diffusion barrier for oscillating quartz, measuring assembly for measuring deposition rate and method thereof | |
| CN105179634A (en) | Constant-angle speed changing device applied to vapor-phase deposition of coating of blade and control method | |
| CN206858649U (en) | Target is arranged and processing equipment | |
| CN107082572A (en) | A kind of glass evacuated coating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150513 Effective date of abandoning: 20171013 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150513 Effective date of abandoning: 20171013 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |