CN203128648U - Substrate cooling device and electronic beam evaporation device with same - Google Patents
Substrate cooling device and electronic beam evaporation device with same Download PDFInfo
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- CN203128648U CN203128648U CN 201220742372 CN201220742372U CN203128648U CN 203128648 U CN203128648 U CN 203128648U CN 201220742372 CN201220742372 CN 201220742372 CN 201220742372 U CN201220742372 U CN 201220742372U CN 203128648 U CN203128648 U CN 203128648U
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- cooling liquid
- coolant seal
- magnetic region
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Abstract
The utility model relates to a substrate cooling device and an electronic beam evaporation device with the substrate cooling device. The substrate cooling device sequentially comprises a driving motor, a drive rod, a magnetic drive part and a substrate fixed tray rack, wherein a cooling sealing part is arranged between the magnetic drive part and the substrate fixed tray rack, and the magnetic drive part is connected with the substrate fixed tray rack through the drive rod. The substrate cooling device is arranged on the electronic beam evaporation device. The substrate cooling device and the electronic beam evaporation device have the characteristics of simple and reasonable structure are easy to operate, and can effectively prevent thermal expansion deformation or smelting of a photoresist pattern caused by temperature raising in Lift-off process, so that a prepared micro-nano pattern meets the design requirements, and sample error or sample damge caused by equipment problems is reduced.
Description
Technical field
The utility model belongs to vacuum electron beam evaporated device technical field, a kind of substrate refrigerating unit specifically is provided and has the electron beam evaporation plating device of this device.The utility model is applied to prevent that the formed photoresist material pattern of substrate Yin Wendu in the stripping technology (Lift-off) from raising and the generation of the pattern dimension variation, distortion even the melten gel phenomenon that cause, with the pattern dimension precision of vacuum plating in the control lift-off technology.
Background technology
Lift-off technology (Lift-off) is a kind of technology of making the fine metal figure, is a kind of have vitality and valuable technology in micron, submicron even nanoscale scope.The basic order of lift-off technology is at first to coat one or more layers lithographic mask layer in the wafer surface of cleaning, expose, toast, develop, different process such as back baking handles and afterwards obtains being down " eight " font photoresist material side section geometricdrawing at substrate, then by methods such as evaporations, obtain discontinuous metal level at substrate surface, peel off mask layer at last and go up metal level, and kept with metal electrode figure that substrate closely contacts.It peels off flow process as shown in Figure 1.
Electron beam evaporation equipment is simple in structure, with low cost, evaporation direction is good, the electron beam Heating temperature that focuses on is very high, can evaporate materials with high melting point, such as gold, platinum, tungsten, palladium, zirconium white etc., its coating quality purity height is a kind of main method of the Lift-off of being applied to prepared metal pattern.
The shortcoming of existing electron beam evaporation deposition technology is not control the device of underlayer temperature, when adopting Lift-off prepared metallic pattern, because the heat of electron beam heating evaporation material production is accumulated at vacuum chamber, be difficult to derive the vacuum cavity outside, the substrate that causes having the photoresist material figure is heated, temperature raises, and makes photoresist material generation heat expansion even the fusing of macromolecular material to cause the distortion of photoresist material pattern dimension.Especially for the figure under submicron even the nanoscale, underlayer temperature raises and causes the photoresist material heat expansion, makes that photoresist material dimension of picture distortion phenomenon is even more serious, thereby makes the failure of Lift-Off technology.
The utility model content
The purpose of this utility model is to overcome underlayer temperature rising in the existing electron-beam coating equipment, make photoresist material generation heat expansion in the lift-off technology and the aliasing problem that causes, a kind of substrate refrigerating unit is provided and has the electron beam evaporation plating device of this device, to reach the control underlayer temperature, make the photoresist material pattern on the substrate in the evaporation coating process, can remain on lower temperature, avoid photoresist material to change because expanded by heating causes pattern dimension, the metallic pattern dimensional precision of preparation is controlled.
For reaching this purpose, the utility model by the following technical solutions:
One of the purpose of this utility model is to provide a kind of substrate refrigerating unit, and described device comprises fixedly plate rail of CD-ROM drive motor, transmission rod, magnetic drive element and substrate from top to bottom successively; Described magnetic drive element and substrate fixedly are provided with the coolant seal parts between the plate rail, described magnetic drive element connects fixedly plate rail of substrate by dwang.
Mode of connection between each parts of substrate refrigerating unit described in the utility model can be known according to prior art by those skilled in the art.Magnetic drive element described in the utility model can drive fixedly plate rail rotation of substrate by dwang.
During work, the substrate after the photoetching is installed in substrate fixedly on the plate rail by anchor clamps, is fixed on the dwang.CD-ROM drive motor makes the magnetic drive element rotate by transmission rod, and the rotation of magnetic drive element drives dwang and rotates, thereby makes the fixedly substrate rotation on the plate rail of substrate.In actual applications, substrate is plate rail and coolant seal parts (being generally 2mm) spaced apart fixedly, the rotation of dwang drives fixedly plate rail rotation of substrate, by the coolant seal parts underlayer temperature is controlled at 20 ± 3 ℃, can obtain more uniform metallic film simultaneously.
Magnetic drive element described in the utility model is made up of the moving rotor of external magnetic region and the moving rotor of inner magnetic region that is set in the moving internal rotor of external magnetic region; The moving rotor of described inner magnetic region connects fixedly plate rail of substrate by dwang.The moving rotor of external magnetic region, is driven the moving rotor of inner magnetic region by magnetictransmission then and rotates by the transmission rod driven rotary by CD-ROM drive motor, thus make be fixed on the dwang substrate fixedly plate rail rotate.The moving rotor of described external magnetic region comprises external magnet, and the moving rotor of inner magnetic region comprises internal magnet.
Be provided with the vacuum-sealing lid between the moving rotor of external magnetic region described in the utility model and the moving rotor of inner magnetic region; Be provided with first vacuum-sealing O circle between described vacuum-sealing lid and the coolant seal parts.The vacuum-sealing lid is kept apart the moving rotor of external magnetic region and the moving rotor of inner magnetic region, makes vacuum chamber and ambient atmosphere completely cut off and comes, and has avoided the motor transmission rod directly to enter vacuum chamber, thereby has made vacuum chamber keep high vacuum.First vacuum-sealing O circle can strengthen the stopping property between vacuum-sealing lid and coolant seal parts, thereby vacuum chamber is hedged off from the outer world.
Coolant seal parts described in the utility model comprise the coolant seal chamber, and described coolant seal chamber sidewall is provided with cooling liquid inlet and cooling liquid outlet.Also deep floor can be set as required in the coolant seal described in the utility model chamber, at deep floor a plurality of cooling fluid through holes be set.Cooling fluid enters the coolant seal chamber from cooling liquid inlet, and the through hole from deep floor flows to cooling liquid outlet, in flow process substrate is cooled off, and avoids photoresist material to change because expanded by heating causes pattern dimension.
The most preferred design form in coolant seal of the present utility model chamber is:
Described coolant seal is provided with a plurality of deep floors in the chamber; Be provided with a plurality of cooling fluid through holes from cooling liquid inlet along liquid flow path direction to the deep floor in the cooling liquid outlet space; To the cooling liquid inlet space, be provided with a deep floor along the liquid flow path direction from cooling liquid outlet, do not establish the cooling fluid through hole on it.Be provided with a plurality of cooling fluid through holes along the liquid flow path direction to the deep floor in the cooling liquid outlet space from cooling liquid inlet, purpose is to make cooling fluid flow to cooling liquid outlet from through hole, in flow process substrate is cooled off.Be provided with a deep floor from cooling liquid outlet along the liquid flow path direction to the cooling liquid inlet space, do not establish the cooling fluid through hole on it, purpose is that the cooling fluid behind the released cold quantity is flowed out from cooling liquid outlet, and no longer circulates.
Above-mentioned design of the present utility model can take full advantage of the cold of the cooling fluid that enters the coolant seal chamber to the full extent, and the institute that makes the cooling fluid that enters arrive the coolant seal chamber has living space.Cooling fluid is entered by cooling liquid inlet under certain pressure, and pressure was flowed out by cooling liquid outlet after one week of coolant seal chamber circulation, and with the cooling uniformity of assurance annular seal space bottom, thereby the cooling that guarantees substrate is even.Coolant seal described in the utility model chamber both can be for substrate provides cooling, again as the sealing upper top cover of vacuum chamber.
Coolant seal parts described in the utility model also comprise refrigerator, and described refrigerator links to each other with cooling liquid inlet by input duct; Described cooling liquid outlet links to each other with refrigerator by the fluid pipeline.Refrigerator provides cooling fluid, and after cooling fluid entered the coolant seal chamber by cooling liquid inlet, refrigerator was got back to by cooling liquid outlet in the circulation back, to keep the low temperature in coolant seal chamber.
Two of the purpose of this utility model is to provide a kind of electron beam evaporation plating device, and described electron beam evaporation plating device is equipped with aforesaid substrate refrigerating unit.
Device described in the utility model comprises vacuum chamber, and the top of described vacuum chamber and coolant seal chamber are tightly connected, and described vacuum chamber inside is provided with excitation electron bundle and crucible device.Described electron-beam excitation and crucible device are used for the excitation electron bundle, the evaporating materials heating evaporation in the crucible is become gaseous state or ionic state, thereby be deposited on the substrate.
Be provided with second vacuum-sealing O circle between the roof of vacuum chamber described in the utility model and the coolant seal chamber; Described vacuum chamber links to each other by vacuum pipe with vacuum pump system.The acquisition of high vacuum condition is to link to each other to finish with vacuum pipe by vacuum pump system in the vacuum chamber.The effect of described second vacuum-sealing O circle is to make to keep high vacuum in the vacuum chamber.
The principle of work of electron beam evaporation plating device provided by the utility model is: under the prerequisite that guarantees the chamber vacuum degree, to substrate fixedly the substrate on the plate rail cool off, keep substrate evaporation metal film under certain low temperature, effectively prevent photoresist material pattern deformation or the fusion of substrate, thereby effectively control precision and the pattern of preparation metallic film micro-nano structure.Wherein, substrate temperature control is in 20 ± 3 ℃ of scopes.Photoresist material on the substrate is the material of any routine.The utility model adopts high vacuum magnetic to drive, and with vacuum chamber and isolated from atmosphere, effectively guarantees the vacuum tightness of vacuum chamber by the magnetic transmission.Material therefor is conventional vacuum standard accessory.
Compare with the prior art scheme, the utlity model has following beneficial effect:
(1) substrate refrigerating unit described in the utility model and electron beam evaporation plating device have simple and reasonable for structure, the characteristics of processing ease.
(2) control underlayer temperature in 20 ± 3 ℃ of scopes by circulating cooling liquid, the photoresist material pattern that can effectively prevent substrate in the lift-Off technology is out of shape or fusion because of the heat expansion that intensification causes, make prepared micro-nano graph satisfy designing requirement, reduce error or the destruction of sample being caused owing to the equipment reason.
(3) because the substrate cooling effect is arranged, all conventional photoresist materials are all available, do not need special high temperature resistant photoresist material, can deposit thicker film, make making processes more convenient.
Description of drawings
Fig. 1 is the stripping technology general flow chart;
Fig. 2 is electron beam evaporation plating structure drawing of device described in the utility model;
Fig. 3 is coolant seal described in the utility model chamber cut-away view;
Fig. 4: Fig. 4 a is the micro-nano structure figure that adopts the utility model embodiment 1 electron beam resist lift-off prepared; Fig. 4 b is the micro-nano structure figure that embodiment 2 does not adopt the utility model photoresist material lift-off prepared;
Fig. 5 is the micro-nano structure figure of the utility model embodiment 3 ultraviolet photoresist lift-off prepared.
Among the figure: 1-second vacuum-sealing O circle; The 2-external magnetic region moves rotor; The 3-external magnet; The 4-internal magnet; 5-vacuum-sealing lid; The 6-substrate is plate rail fixedly; The 7-vacuum pipe; The 8-vacuum pump system; The 9-CD-ROM drive motor; The 10-transmission rod; The 11-inner magnetic region moves rotor; 12-coolant seal parts; 13-first vacuum-sealing O circle; The 14-dwang; The 15-vacuum chamber; 16-electron-beam excitation and crucible device; The 17-input duct; 18-fluid pipeline; The 19-refrigerator; 20-cooling fluid through hole; The 21-deep floor; The 22-cooling liquid inlet; The 23-cooling liquid outlet.
Below the utility model is further described.But following example only is simple and easy example of the present utility model, does not represent or limit rights protection scope of the present utility model, and protection domain of the present utility model is as the criterion with claims.
Embodiment
For the utility model is described better, be convenient to understand the technical solution of the utility model, typical but non-limiting embodiment of the present utility model is as follows:
As depicted in figs. 1 and 2, a kind of electron beam evaporation plating device, described device comprise vacuum chamber 15 and are installed on the substrate refrigerating unit at vacuum chamber 15 tops.
Described substrate refrigerating unit comprises fixedly plate rail 6 of CD-ROM drive motor 9, transmission rod 10, magnetic drive element and substrate from top to bottom successively; Described magnetic drive element and substrate fixedly are provided with coolant seal parts 12 between the plate rail 6, described magnetic drive element connects fixedly plate rail 6 of substrate by dwang 14.
Described magnetic drive element is made up of the moving rotor 2 of external magnetic region and the moving rotor 11 of inner magnetic region that is set in moving rotor 2 inside of external magnetic region; The moving rotor 11 of described inner magnetic region connects fixedly plate rail 6 of substrate by dwang 14.The moving rotor 2 of described external magnetic region comprises external magnet 3, and the moving rotor 11 of inner magnetic region comprises internal magnet 4.The moving rotor 2 of described external magnetic region and moving 11 of the rotors of inner magnetic region are provided with vacuum-sealing lid 5; Be provided with first vacuum-sealing O circle 13 between described vacuum-sealing lid 5 and the coolant seal parts 12.
Described coolant seal parts 12 comprise the coolant seal chamber, and described coolant seal chamber sidewall is provided with cooling liquid inlet 22 and cooling liquid outlet 23.Be provided with a plurality of deep floors 21 in the described coolant seal chamber; Be provided with a plurality of cooling fluid through holes 20 from cooling liquid inlet 22 along liquid flow path direction to the deep floor in cooling liquid outlet 23 spaces; To cooling liquid inlet 22 spaces, be provided with a deep floor along the liquid flow path direction from cooling liquid outlet 23, do not establish the cooling fluid through hole on it.Described coolant seal parts 12 also comprise refrigerator 19, and described refrigerator 19 links to each other with cooling liquid inlet 22 by input duct 17; Described cooling liquid outlet 23 links to each other with refrigerator 19 by fluid pipeline 18.
Top and the coolant seal chamber of the vacuum chamber 15 in the described electron beam evaporation plating device are tightly connected; Described vacuum chamber 15 inside are provided with electron-beam excitation and crucible device 16.Be provided with second vacuum-sealing O circle 1 between the roof of described vacuum chamber 15 and the coolant seal chamber; Described vacuum chamber 15 links to each other by vacuum pipe 7 with vacuum pump system 8.
During work, substrate is installed in substrate fixedly on the plate rail 6, opens 8 pairs of vacuum chambers 5 of vacuum pump system and vacuumize, guarantee the vacuum tightness that it is inner.The CD-ROM drive motor 9 that is installed on the substrate refrigerating unit at vacuum chamber top starts, make the moving rotor 2 of external magnetic region rotate by transmission rod 10, drive the moving rotor 11 of inner magnetic region by magnetictransmission and rotate, rotate thereby drive dwang 14, thereby make the fixedly substrate rotation on the plate rail 6 of substrate.In this process, the cooling fluid of refrigerator preparation enters the coolant seal chamber by input duct 17, cooling liquid inlet 22, substrate is cooled off, and the cooling fluid behind the released cold quantity loops back refrigerator from cooling liquid outlet 23, fluid pipeline 18 and continues refrigeration, recycling.Electron-beam excitation and crucible device 16 become gaseous state with the evaporating materials heating evaporation in the crucible, and it is deposited on the substrate.The substrate refrigerating unit can be controlled underlayer temperature on the one hand, avoids photoresist material to change because expanded by heating causes pattern dimension, makes that the metallic pattern dimensional precision of preparation is controlled, and can keep the high vacuum of vacuum chamber 15 on the other hand.
Embodiment 1:
The electron beam resist PMMA of present embodiment, the ordinary electronic bundle photoresist material for routine goes out the micro-nano structure figure by the electron-beam direct writing apparatus processing, and design configuration is of a size of 1.5 μ m.Adopt Lift-off technology, under recirculated cooling water cooling substrate situation, carry out the experiment of electrode gold evaporation film, experimental result shows that the photoresist material pattern keeps original pattern, the precision of images is controlled, experiment obtains the metal electrode of required micro-nano structure, and its optical microscope photograph is seen Fig. 4 a, and wherein Fig. 4 a live width is 1.5 μ m.
Embodiment 2:
The electron beam resist PMMA of present embodiment is the ordinary electronic bundle photoresist material of routine, goes out the micro-nano structure figure through the electron-beam direct writing apparatus processing, and design configuration is of a size of 1.5 μ m.Adopt Lift-off technology, under the situation that does not have circulating cooling liquid cooling substrate, carry out the experiment of electrode gold evaporation film, experimental result shows the photoresist material temperature distortion as mask, can not keep original image, the gained result has lost needed micro-nano structure figure, and the optical microscope photograph of the metal electrode that experiment obtains is seen Fig. 4 b.
Embodiment 3:
The ultraviolet photoresist BN308-450 of present embodiment is the negative glue of the general ultraviolet photoetching of routine, and exposure draws the micro-nano structure figure through the ultraviolet photolithographic machine.Adopt Lift-off technology, under circulating cooling liquid cooling substrate situation, carry out the experiment of electrode gold evaporation film, experimental result shows that photoresist material keeps original dimension of picture precision, pattern precision is controlled, and experiment obtains the metal electrode of required micro-nano structure and sees Fig. 5.
Adopt the embodiment 1 of the utility model device and the micro-nano structure figure of embodiment 3 preparations to see Fig. 4 a, Fig. 5, do not adopt the micro-nano structure figure (photoresist material distortion even melten gel) of embodiment 2 preparations of the utility model device to see Fig. 4 b.From Fig. 4 a as can be seen, substrate cooling control lift-off technology figure dimensional precision electron beam evaporation plating device of the present utility model, prepared micro-nano structure figure is high-visible, and precision is controlled.From Fig. 4 b as can be seen: do not adopt the micro-nano structure figure of the utility model device preparation fuzzy, precision is uncontrollable, and the micro-nano graph that resulting experimental result has not designed in advance causes the failure of lift-off technology.The utility model is applicable to all conventional photoresist materials, has great application potential, has broad application prospects and potential economic benefit.
Applicant's statement, the utility model illustrates detailed construction feature of the present utility model and method of work by above-described embodiment, but the utility model is not limited to above-mentioned detailed construction feature and method, does not mean that namely the utility model must rely on above-mentioned detailed construction feature and method could be implemented.The person of ordinary skill in the field should understand; to any improvement of the present utility model; to the increase of the equivalence replacement of the selected parts of the utility model and accessory, the selection of concrete mode etc., all drop within protection domain of the present utility model and the open scope.
Claims (10)
1. a substrate refrigerating unit is characterized in that, described device comprises fixedly plate rail (6) of CD-ROM drive motor (9), transmission rod (10), magnetic drive element and substrate from top to bottom successively; Described magnetic drive element and substrate fixedly are provided with coolant seal parts (12) between the plate rail (6), described magnetic drive element connects fixedly plate rail (6) of substrate by dwang (14).
2. device as claimed in claim 1 is characterized in that, described magnetic drive element moves rotor (2) by external magnetic region and is set in the inner moving rotor (11) of inner magnetic region of the moving rotor (2) of external magnetic region to be formed; Described inner magnetic region moves rotor (11) and connects fixedly plate rail (6) of substrate by dwang (14).
3. device as claimed in claim 2 is characterized in that, described external magnetic region moves rotor (2) and comprises external magnet (3), and inner magnetic region moves rotor (11) and comprises internal magnet (4).
4. device as claimed in claim 2 is characterized in that, described external magnetic region moves between rotor (2) and the moving rotor (11) of inner magnetic region and is provided with vacuum-sealing lid (5); Be provided with first vacuum-sealing O circle (13) between described vacuum-sealing lid (5) and the coolant seal parts (12).
5. device as claimed in claim 1 is characterized in that, described coolant seal parts (12) comprise the coolant seal chamber, and described coolant seal chamber sidewall is provided with cooling liquid inlet (22) and cooling liquid outlet (23).
6. device as claimed in claim 5 is characterized in that, is provided with a plurality of deep floors (21) in the described coolant seal chamber; Be provided with a plurality of cooling fluid through holes (20) from cooling liquid inlet (22) along liquid flow path direction to the deep floor in cooling liquid outlet (23) space; To cooling liquid inlet (22) space, be provided with a deep floor along the liquid flow path direction from cooling liquid outlet (23), do not establish the cooling fluid through hole on it.
7. device as claimed in claim 6 is characterized in that, described coolant seal parts (12) also comprise refrigerator (19), and described refrigerator (19) links to each other with cooling liquid inlet (22) by input duct (17); Described cooling liquid outlet (23) links to each other with refrigerator (19) by fluid pipeline (18).
8. an electron beam evaporation plating device is characterized in that, described electron beam evaporation plating device is equipped with the described substrate refrigerating unit as one of claim 1-7.
9. device as claimed in claim 8 is characterized in that, described device comprises vacuum chamber (15), and top and the coolant seal chamber of described vacuum chamber (15) are tightly connected; Described vacuum chamber (15) inside is provided with electron-beam excitation and crucible device (16).
10. device as claimed in claim 9 is characterized in that, is provided with second vacuum-sealing O circle (1) between the roof of described vacuum chamber (15) and the coolant seal chamber; Described vacuum chamber (15) links to each other by vacuum pipe (7) with vacuum pump system (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220742372 CN203128648U (en) | 2012-12-28 | 2012-12-28 | Substrate cooling device and electronic beam evaporation device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220742372 CN203128648U (en) | 2012-12-28 | 2012-12-28 | Substrate cooling device and electronic beam evaporation device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203128648U true CN203128648U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220742372 Expired - Lifetime CN203128648U (en) | 2012-12-28 | 2012-12-28 | Substrate cooling device and electronic beam evaporation device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203128648U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220126A (en) * | 2014-05-28 | 2016-01-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Refrigerating unit, loading chamber and semiconductor processing equipment |
| CN105551926A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Rotary workpiece stage adopting base cooling rotary workpiece |
| CN109023260A (en) * | 2018-10-09 | 2018-12-18 | 京东方科技集团股份有限公司 | Evaporation source, evaporation coating device |
-
2012
- 2012-12-28 CN CN 201220742372 patent/CN203128648U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220126A (en) * | 2014-05-28 | 2016-01-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Refrigerating unit, loading chamber and semiconductor processing equipment |
| CN105551926A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Rotary workpiece stage adopting base cooling rotary workpiece |
| CN109023260A (en) * | 2018-10-09 | 2018-12-18 | 京东方科技集团股份有限公司 | Evaporation source, evaporation coating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130814 |
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| CX01 | Expiry of patent term |