CN204315527U - Wafer glue spreading jig - Google Patents
Wafer glue spreading jig Download PDFInfo
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- CN204315527U CN204315527U CN201420673104.4U CN201420673104U CN204315527U CN 204315527 U CN204315527 U CN 204315527U CN 201420673104 U CN201420673104 U CN 201420673104U CN 204315527 U CN204315527 U CN 204315527U
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- wafer
- brace table
- concave part
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- glue spreading
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Abstract
The utility model relates to a kind of wafer glue spreading jig, comprises jig body; Brace table, is formed at the upper surface of jig body continuously, for supporting inverted wafer; Concave part, by described brace table around forming, the parts on accommodating wafer, and the degree of depth of described groove is greater than the height of described wafer upper-part.Wafer is upside down on brace table, the edge of wafer is supported by brace table, wafer upper surface down, the parts (such as soldered ball) that wafer is formed then enter in concave part, at this moment gluing is carried out to wafer rear, under the effect of brace table, glue-line can not flow to the front of wafer, prevents wafer frontside contaminated.
Description
Technical field
The utility model relates to wafer stage chip encapsulation technology field, particularly relates to a kind of wafer glue spreading jig.
Background technology
Traditional wafer stage chip encapsulating structure (Wafer Level Chip Scale Packaging; be called for short WLCSP)) in the fabrication process; usual needs are at wafer rear coated back surface protective material, and back-protective material is generally called back-protective glue.Back-protective glue generally uses the mode of rotary coating and printing coating.When using rotary coating mode, as shown in Figure 1, at low speeds, glue-line easily backflows the front (as shown in dotted line circle in Fig. 1) of wafer 1 ' sheet, forms surface contamination.When adopting steel plate mode of printing, as shown in Figure 2, crystal round fringes can leave the region (as shown in dotted line circle in Fig. 2) that a circle cannot apply, and when little wafer, when easily causing cutting, wafer flies out, and forms cutting bad.
Utility model content
Provide hereinafter about brief overview of the present utility model, to provide about the basic comprehension in some of the present utility model.Should be appreciated that this general introduction is not summarize about exhaustive of the present utility model.It is not that intention determines key of the present utility model or pith, neither intended limitation scope of the present utility model.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
The utility model provides a kind of wafer glue spreading jig, comprising: a jig body; Brace table, is formed at the upper surface of jig body continuously, for supporting inverted wafer; Concave part, by described brace table around forming, the parts on accommodating wafer, and the degree of depth of described groove is greater than the height of described wafer upper-part.
Compared to prior art the utility model, at least there is technique effect: be upside down in by wafer on brace table, the edge of wafer is supported by brace table, wafer upper surface down, the parts (such as soldered ball) that wafer is formed then enter in concave part, at this moment gluing is carried out to wafer rear, under the effect of brace table, glue-line can not flow to the front of wafer, prevents wafer frontside contaminated.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 and Fig. 2 is for by carrying out the crystal circle structure schematic diagram made by coating technique to wafer in prior art;
Fig. 3 is the structural representation of the utility model wafer glue spreading jig;
Fig. 4 is the utility model wafer glue spreading jig working state schematic representation.
Reference numeral:
1 '-wafer (prior art); 1-wafer (the utility model); 2-wafer glue spreading jig; 20-jig body; 21-brace table; 22-concave part; 23-inclined plane; 24-elevating lever.
Embodiment
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.The element described in an accompanying drawing of the present utility model or a kind of execution mode and feature can combine with the element shown in one or more other accompanying drawing or execution mode and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of parts that have nothing to do with the utility model, known to persons of ordinary skill in the art and process in illustrating.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not paying creative work, all belongs to the scope of the utility model protection.
In the following embodiment of the utility model, the sequence number of embodiment and/or sequencing are only convenient to describe, and do not represent the quality of embodiment.The description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiments.
The utility model relates to a kind of wafer glue spreading jig 2 (below can referred to as tool 2), see Fig. 3 and Fig. 4, comprise jig body 20, brace table 21 and concave part 22, brace table 21 is formed in the upper surface of jig body 20 continuously, for supporting wafer 1; Concave part 22, be it is also understood that as concave part 22 is using brace table 21 as internal face around forming by brace table 21.The parts of this concave part 22 on accommodating wafer, concrete, see Fig. 4, wafer 1 is inverted, so wafer upper surface is formed as soldered ball, just can be contained in this concave part 22.Further, when wafer upside-down mounting is placed, be placed at the edge of wafer on brace table 21, during such gluing, glue-line will be subject to the stop of brace table 21, can not flow to the front of wafer.
Certainly, the generation type of above-mentioned concave part 22 and brace table 21 can be multiple, and such as on tool 2, directly form concave part 22, the surrounding of concave part 22 then can form brace table 21 naturally.Or form continuous print brace table 21 in tool 2 surrounding, also naturally can surround a concave part 22.Certainly, as long as meet can parts in accommodating wafer frontside for the degree of depth of concave part 22.Certainly, the wafer that the peripheral shape of brace table 21 and size also will should prevent with it is as the criterion.
Needs are known, and brace table is except supporting wafer, and glue-line also will be stoped to flow to the front of wafer, and therefore brace table must be continuous print, and highly identical, and knowing in other words can with crystal column surface to mating.
In the optional execution mode of one, in gluing process, certainly will have the sidewall of glue-line along wafer to dirty, at this moment under the effect of brace table 21, glue-line can not flow to the front of wafer.In order to better stop glue-line, the glue-line that also prevents from working for a long time infiltrates from the gap between wafer and brace table 21, by the one side of brace table 21 described concave part 22 dorsad, forms downward-sloping inclined plane 23.Like this, the glue-line flow down, can continue inclined plane 23 and flow, the gap between principle wafer and brace table 21, better avoid and pollute wafer frontside.
Optionally, the angle of inclination of above-mentioned incisal bevel is between 30-80 degree, and this angle is the angle of inclined plane 23 and horizontal direction.Angle α as shown in Figure 3.
In order to pick up wafer easily after gluing terminates, wafer glue spreading jig 2 of the present utility model also comprises elevating lever 24, for the convenient pickup of jack-up wafer, concrete, on the bottom surface of concave part 22, be formed with vertical mounting groove, in mounting groove, be slidably provided with elevating lever 24.After wafer gluing completes, elevating lever 24 rises, from mounting groove, hold up wafer.
Above-mentioned elevating lever 24 is that relative jig body realizes elevating movement, to hold up wafer, wafer is separated with brace table, elevating lever namely can be driven to move driving jig body also can be made to move.Further, no matter be motorized motions, hydraulic-driven or manual actuation, may be used to this novel in.
In addition, when using this novel above-mentioned wafer glue spreading jig, the general mode adopting rotary coating, can ensure the integrality that wafer rear applies.Certainly, above-mentioned jig body 20 can also arrange motor, for rotating this tool.
Although last it is noted that described the utility model and advantage thereof in detail above, be to be understood that and can carry out various change when not exceeding the spirit and scope of the present utility model limited by appended claim, substituting and converting.And scope of the present utility model is not limited only to the specific embodiment of process, equipment, means, method and step described by specification.One of ordinary skilled in the art will readily appreciate that from disclosure of the present utility model, can use perform the function substantially identical with corresponding embodiment described herein or obtain and its substantially identical result, existing and that will be developed in the future process, equipment, means, method or step according to the utility model.Therefore, appended claim is intended to comprise such process, equipment, means, method or step in their scope.
Claims (4)
1. a wafer glue spreading jig, is characterized in that, comprising:
Jig body;
Brace table, is formed at the upper surface of jig body continuously, for supporting inverted wafer;
Concave part, by described brace table around forming, the parts on accommodating wafer, and the degree of depth of described groove is greater than the height of described wafer upper-part.
2. wafer glue spreading jig according to claim 1, is characterized in that,
The one side of described brace table described concave part dorsad, forms downward-sloping inclined plane.
3. wafer glue spreading jig according to claim 2, is characterized in that,
The angle of described inclined plane and horizontal direction is between 30-80 degree.
4. wafer glue spreading jig according to claim 1, is characterized in that,
On the bottom surface of described concave part, be formed with the mounting groove vertically arranged;
Elevating lever has been mounted slidably in described mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420673104.4U CN204315527U (en) | 2014-11-12 | 2014-11-12 | Wafer glue spreading jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420673104.4U CN204315527U (en) | 2014-11-12 | 2014-11-12 | Wafer glue spreading jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204315527U true CN204315527U (en) | 2015-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420673104.4U Active CN204315527U (en) | 2014-11-12 | 2014-11-12 | Wafer glue spreading jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204315527U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921358A (en) * | 2016-06-30 | 2016-09-07 | 锐嘉（宜兴）科技有限公司 | Mobile phone shell assembling and gluing device |
-
2014
- 2014-11-12 CN CN201420673104.4U patent/CN204315527U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921358A (en) * | 2016-06-30 | 2016-09-07 | 锐嘉（宜兴）科技有限公司 | Mobile phone shell assembling and gluing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |