CN204313012U - Shell in LED lamp and light fixture - Google Patents
Shell in LED lamp and light fixture Download PDFInfo
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- CN204313012U CN204313012U CN201220350641.6U CN201220350641U CN204313012U CN 204313012 U CN204313012 U CN 204313012U CN 201220350641 U CN201220350641 U CN 201220350641U CN 204313012 U CN204313012 U CN 204313012U
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Abstract
The utility model relates to the shell in LED lamp and light fixture, and which describe light emitting diode (LED) light fixture, it comprises: at least one LED chip of a.; B. metallic plate, this metallic plate arranges at least one LED chip described; C. with the LED module of at least one LED chip electrical contact described; With the shell that d. contacts with metallic plate, and LED module is arranged in shell, and described shell comprises: resin bed i) with inner surface and outer surface; And ii) metal level, form of more than described metal level covering is arranged on going up at least partially and contacting with metallic plate of the outer surface of resin bed; Wherein: described resin bed comprises electric insulation thermoplastic resin composition; And described metal level comprises aluminium alloy and has at least 20 W/m, K is to the thermal conductivity of the highest 40W/m, K and the thermal emissivity between 0.5 to 0.8.There is also described herein the LED shell that is arranged in LED lamp as herein described and use these shells to keep environment temperature around at least one LED chip described lower than 70 DEG C.
Description
the cross reference of related application
That patent application claims on July 22nd, 2011 submits to and the priority of current unsettled Japanese patent application 2011-174342, and be incorporated herein by reference accordingly.
Technical field
This document describes light emitting diode (LED) light fixture comprising two-layer shell, described shell have by outer metal level completely on the inner resin layer that covers or part is covered, metal level has at least 20W/m, the thermal conductivity of K and the thermal emissivity between 0.5 and 0.8, and contact with metallic plate, wherein LED chip is arranged on a metal plate.
Background technology
As light source, light emitting diode (LED) light fixture provides high luminous intensity and the service life longer than incandescent lamp bulb.LED lamp generally includes LED module and the shell for described module.LED module is essentially a kind of semiconductor and comprises LED chip (light emitting source) and the carrier for LED chip.LED chip is essentially following bulb, and they do not have filament, but has built-in circuit driver or be electrically connected to external circuit.When electricity is by LED module, will utilizing emitted light.Say to a certain extent due to chip (i.e. light source) and be positioned at module, if therefore light from chip emission out and continue to extend the period, then the heat (its can more than 70 DEG C) from chip can accumulate in module.Therefore, the LED lamp of many routines also comprises the structure being commonly referred to LED control and drive system covering, and it has thermal deviation effectively to dissipate from the heat of LED module.
Usually, LED shell plays and dissipates the heat that produced by LED module and provide the effect of the support structure to module and circuit thereof just.Although disclosed the various structural allocation of LED lamp, but still needed following LED lamp, its shell due to its composition and parts configuration cause and promote heat dissipation.
the LED lamp of prior art
Fig. 1 shows a kind of profile of LED lamp 10 of prior art of routine, and it has the LED chip 100 be installed on circuit board 102, and described circuit board is then installed to metallic plate 104 and directly contacts with metallic plate 104.LED chip 100 is used as light source, its heat of emission, and is therefore also used as thermal source.
Metallic plate 104 directly contacts and is attached to the shell 106 be usually made of metal, encapsulating control and drive system 108 and the covering 110 be made up of electrically insulating material thereof.LED module 150 comprises metallic plate 104, LED chip 100, control and drive system 108 and covering 110.
Except providing the support to circuit board 102, metallic plate 104 also dissipates by the heat of chip emission.Electrode 112,114 forms the pedestal for shell 106 and control and drive system 108 is electrically connected to external power source.Shell and each electrode separate and electrode are electrically insulated from each other by the insulating resin 116 be made up of electrically insulating material.As shown in the figure, electrode 112 is as the pedestal be placed on it for shell; Electrode 114 that insulating resin 116 and electrode 112 insulate is connected to and maybe can be connected to external power source.The electric wire connecting various electric assembly is not shown.
the structure of LED lamp as herein described
Fig. 2 shows a kind of modification of described herein and claimed LED lamp.Compared with the shell of existing LED lamp, the shell of LED lamp as herein described is transferred to from LED chip or from the heat of LED module in environment better.That is, compared with previously known shell, the structure of this shell provides better fin effect to dissipate from the heat of LED chip together with the transport properties of sheathing material.The improvement of heat trnasfer is partly because the LED lamp of prior art is just like lower casing, and they are almost made of metal completely and comprise the LED control and drive system covering as the element independent of shell.
Fig. 2 depicts the LED lamp 20 with chip 200, and described chip is installed to circuit board 202, and described circuit board is then installed to metallic plate 204 and directly contacts with metallic plate 204.Shell 206 (it encapsulates control and drive system 208) comprises resin bed 205 and metal level 207, more than described metal level covers form and is arranged on the outer surface of resin bed.Resin bed 205 is made up of electric insulation thermoplastic compounds as herein described and is used as the covering of control and drive system 208, thus has the function identical with the element 110 in the LED lamp of the prior art shown in Fig. 1.
Metal level 207 contacts with metallic plate 204 while it is arranged on resin bed 205, thus produces metal shell part in the LED chip end of LED lamp.Metal level 207 can overlie all or part of of the outer surface of resin bed 205.Situation time Fig. 2 shows following: metal level 207 overlies the outer surface of resin bed 205 to certain length from metallic plate 204, described length corresponds to the length of control and drive system 208 at least partially.Fig. 5 A shows the situation when metal level 207 overlies the whole outer surface of resin bed 205.Electrode 212 and 214 is insulated by insulating resin 216, and described insulating resin can have the same or similar insulating layer and thermoplastic composition with resin bed 205.Due to the difference of these structures with the conventional LED lamp shown in Fig. 1, in fact the LED module 250 in Fig. 2 becomes consistent with LED lamp 20.
LED and described herein and between the LED lamp shown in Fig. 2 the primary structure difference of the prior art shown in Fig. 1 are: (1) eliminates unnecessary independent control and drive system covering 110 (Fig. 1); (2) shell 206 (Fig. 2) instead of covering 110 (in FIG) and has two layers, i.e. resin bed 205 and (on partial extent or total degree) metal level 207 of above covering.Resin bed 205 can be used as both control and drive system covering and shell just because: (1) its can be injection moulded into any suitable geometry and be suitable for encapsulating the cavity of control and drive system to be formed; (2) owing to being made up of electric insulation thermoplastic compounds, resin bed 205 can be integrated to produce the LED shell that weight is lighter than the one of the weight of conventional mainly metallic LED lamp with insulating resin 216.
how LED lamp outer shell as herein described shifts the heat from LED chip
LED lamp as herein described depends on the described two-part character of LED lamp outer shell structure as herein described, depends on following characteristics specifically: (1) selects the material forming metal level; (2) resin bed is completely or partially covered, typically with metal layers and covers; (3) metal level with finally keep the metallic plate of LED chip to contact; And (4) resin bed is what insulate.Therefore, it is shell mechanism, and described shell mechanism is included in the material behavior of contact between metallic plate and metal level and resin bed, and described material behavior promotes the effective heat trnasfer of the LED chip left as thermal source.
Say in a capsule, resin bed is used as heat insulation layer in its position near LED module, and causes the heat from LED chip and LED module mainly to flow through metallic plate.Metal level overlies resin bed due to it and is electrically connected to metallic plate and enters in environment to make the hot-fluid from metallic plate as fin.In addition, the thermal conductivity of metal level and thermal emissivity also contribute to the fin effect measuring metal level.
Also continue see Fig. 2 particularly, in order to promote the available heat transmission through double-layer shell structure as herein described, metal level 207 should be selected to the composite performance with following performance: sufficiently high namely higher than 20W/m, K thermal conductivity and sufficiently high be namely greater than 0.5 thermal emissivity ε.The suitable metal with this composite attribute includes but not limited to magnesium, aluminium, titanium etc.Aluminium is preferred, because its weight is low and can be coated with anodic oxidation aluminized coating, it is generally called anodised aluminium or alumite coating, and the IUPAC had (International Union of Pure and Applied Chemistry) name is called oxo (oxoalumanyloxy) alumane.
In LED lamp outer shell as herein described, aluminium alloy especially ADC12 alloy (usually the obtainable alloy based on aluminium-organosilicon-copper) can be used as metal level.The thermal conductivity of ADC12 alloy is about 96W/m, K, but its thermal emissivity ε is extremely low, is about 0.02 to 0.04.
Although ADC12 has been widely used as the cast material of LED lamp outer shell, its cost has been much higher than the cost of the aluminium of anodised aluminium coating, and its lower thermal emissivity (0.02-0.04) causes heat dissipation not enough sometimes in LED lamp.Due to these reasons, metal level preferably can comprise the aluminium alloy of anodised aluminium coating, and it can be the ADC12 aluminium alloy of anodised aluminium coating.The aluminium alloy layer of described anodised aluminium coating should have the well balanced of thermal conductivity and emissivity.For the ADC12 alloy-layer of anodised aluminium coating, the thermal conductivity of anodic oxidation aluminized coating is 21W/m, K, and the thermal conductivity of alloy-layer is 96W/m, K, but the thermal emissivity of overall layer is 0.5 to 0.8.
The present inventor finds, there is 20-40W/m, the material of the composite attribute of the thermal conductivity of K and the thermal emissivity of 0.5 to 0.8 shows surprisingly and has 96W/m, the Thermal release performance of the uncoated aluminium alloy layer phase same level of the thermal conductivity of K and the thermal emissivity of 0.02-0.04.Briefly, the present inventor has found following combination:
The aluminium alloy using anodised aluminium to apply in LED shell is as metal level;
Use electric insulation thermoplastic resin composition as resin bed;
Metal level is connected to metallic plate; And
Metal level is overlie on the outer surface of resin bed at least in part,
The heat sink functionality improved in LED shell makes the temperature of LED chip keep below 70 DEG C.This type of LED shell extends service life and the effectiveness of LED lamp.Preferably, the temperature of the LED chip in LED shell as herein described remains on lower than 70 DEG C at least 10 DEG C; More preferably low than 70 DEG C at least 12 DEG C; And it is most preferably low than 70 DEG C at least 15 DEG C.
thermal conductivity and thermal emissivity
Thermal conductivity is the inherent characteristic of the heat by conduction of material, it is represented as k, and be defined as the thermal conduction rate through material of per unit area per unit thickness per unit temperature difference (Delta [Δ] T) physically, and under K, measure (W/m, K) with watts/meter.The inverse of thermal conductivity is resistivity, is also referred to as specific insulation, and it is measuring the intensity of material resistive.It represents with rho (ρ), and usually measures according to Kelvin-meter /watt (Km/W).Low-resistivity shows the material easily allowing the motion of electric charge (measuring by ohm meter [Ω m]).
The thermal conductivity of material becomes with temperature.In general, material becomes along with the rising of mean temperature and has more thermal conductivity.In addition, according to Wiedemann-Franz law, in a metal, thermal conductivity approximately follows electrical conductivity.Measure thermal conductivity mainly to carry out with experiment method, and there is its method of many measurements, each in these methods all depends on thermal characteristics and the medium temperature of material.The thermal conductivity of material used herein has been reported in scientific literature.
The thermal emissivity of material (is expressed as ε or e) is its surface relative ability by radiation-emitting energy.It is at the same temperature by energy and the ratio by the energy of black body radiation of certain material radiation.Real black matrix will have ε=1, and any actual object will have ε <1.Emissivity is characteristic.
In general, more secretly and more black, its emissivity is more close to 1 for material.Material reflective stronger, its emissivity is lower.Press polished silver has the emissivity of about 0.02.
Emissivity depends on the factor of such as temperature, the angle of departure and wavelength.The reflecting surface or the metal surface that are exposed to radiation are tending towards keeping lower temperature than dark nonmetallic surface.Typical hypothesis is, the spectral emissivity on certain surface does not depend on wavelength, and therefore emissivity is constant, and this is called as " grey body hypothesis ".
Although the emissivity of material depends on its thickness in general, the emissivity reported in document is the sample supposing to be intended to for infinitely great thickness.Therefore the thinner sample of material will have the emissivity of the reduction reported in document.
Show enough be namely greater than 20W/m to be conducive to metal level 207 (Fig. 2), the thermal conductivity of K and enough composite attributes being namely greater than the emissivity of 0.5, anodic oxidation aluminized coating preferably has the average thickness being greater than 10 μm.In general, when the thickness of anodic oxide coating is less than or equal to 10 μm, the thermal emissivity on the metallic surface of coating is less than 0.5 usually.However, as long as the metal level of coating shows the thermal emissivity being greater than 0.5 in its surface, and show at its core place and be greater than 96W/m, the thermal conductivity of K and show in its surface and be greater than 20W/m, the thermal conductivity of K, then the average thickness of anodic oxide coating can be 10 μm or less.Which ensure that metal level is used as effective fin the heat produced in LED module to be transferred in ambient air.
thermoplastic resin in LED lamp as herein described
The resin bed 205 of shell 206 can be made up of almost any electrically insulating material.Suitable material includes but not limited to: 1) rubber composition, comprises Ding bis-Xi – nitrile (CTBN) of such as natural rubber, organosilicon, isobutene rubber, s-B-S (SBS) polymer and/or liquid rubber carboxyl-end-blocking; 2) compositions of thermosetting resin, comprises such as epoxides, polyurethane, vulcanized rubber, polyester and/or polyimides; With 3) thermoplastic resin composition, comprise such as polyethylene, Kynoar, polypropylene, nylon, polyester, acrylonitrile-butadiene-styrene (ABS) (ABS) polymer and/or their copolymer; With 4) these mixture.Specifically, thermoplastic resin is optional from polyester terephthalate, polybutylene terephthalate (PBT), polytrimethylene's ester, conjugated polyether ester elastomer and these mixture.The thermoplastic compounds comprising the commercially available acquisition of polyester or copolyesters comprises
with
they are all purchased from DuPont.
Because the maximum admissible temperature on the outer surface of LED lamp typical before LED chip deterioration is generally about 70 DEG C, therefore suitable compositions of thermosetting resin can comprise functional group, such as amine, acid, acid anhydrides, isocyanates, halogen, alcohol and epoxides are to improve resin bed mechanical strength at these higher temperatures and stability.Suitable thermoplastic resin composition can experience cross-linking process, such as radiation or interpolation chemical cross-linking agent.
The electric insulation of the thermoplastic resin in resin bed 205 (Fig. 2) supports the fin effect of the improvement of LED lamp outer shell as herein described.That is, resin bed is needed to have the insulating properties of certain level to support the fin performance of the metal level in LED lamp outer shell as herein described.This is for following reason:
(1) resin bed as electrical insulator can promote gathering of that produced by hot LED chip and in LED module heat;
(2) metallic plate (LED chip is disposed thereon) is following conductive surface, and the heat gathered must flow and leave described conductive surface so that at the temperature making LED chip remain on lower than 70 DEG C.Heat flow is left metallic plate and must be realized by making metallic plate contact with heat-transfer surface; And
(3) metal level is owing to guiding to hot-fluid environment from metallic plate on its material behavior and it contacts with metallic plate and it is arranged on resin bed outer surface.
The typical case of the electric insulation of material measures as its resistivity or specific insulation, and it is represented as ρ, and measures with ohmcm (Ω cm).In fact, specific insulation is the inverse of electrical conductivity, and described electrical conductivity is roughly the same with thermal conductivity or substantially similar.
Therefore, described LED lamp outer shell depends on: the novel structure of (1) metal level, and described metal level contacts with metallic plate and part overlies or overlies resin bed completely; And depend on (2) novelty, namely the resin bed of shell has certain specific insulation (i.e. the inverse of thermal conductivity), and metal level has certain thermal conductivity and certain thermal emissivity on its surface and chip place simultaneously.Shell mechanism, and metal level particularly, together with the melange effect of the thermal characteristics of outer shell, produce fin, the heat sink functionality of the shell be made up of uncoated aluminium alloy simulated by described fin.
General preferred resin bed (example is 205 in fig. 2) is thermoplastic resin composition, its have measure according to IEC60093 standard be greater than 10
7the specific insulation ρ of Ω cm.This type of thermoplastic resin composition can comprise one or more organic additives of 0-20wt.%, described additive is selected from lubricant, flow ability modifying agent, heat stabilizer, antioxidant, dyestuff, pigment and UV stabilizing agent etc., as long as they can not affect physical characteristic or thermal characteristics negatively.
In addition, this type of thermoplastic resin composition also can comprise 0-50wt.%, or 1-50wt.%, or 1-50wt.%, or 5-45wt.%, or at least one filler of 10 to about 40wt.%, described filler be usually used in thermoplastic resin composition any material and comprise reinforcing agent.Described at least one filler can have thereon or not have coating, and such as sizing material and/or coating are to improve its adhesiveness to thermoplastic resin composition.Described at least one filler can be organic or inorganic.Suitable filler includes but not limited to: mineral are as clay, sepiolite, talcum, wollastonite, mica and calcium carbonate; Various forms of glass is as fiber, cullet, solid or hollow glass ball; Carbon is as carbon black or fiber; Titanium dioxide; The aromatic polyamides of short fiber, fibril or fibrid; Fire retardant is as antimony oxide, sodium antimonate, and these any combination.Described at least one filler can be no more than the 50wt.% of thermoplastic resin composition as herein described.
The dielectric being suitable for the thermoplastic resin composition making resin bed 205 and also can be used as in other polymer elements any of LED shell or LED lamp as herein described, comprises insulating barrier 216.
manufacture LED lamp as herein described
LED lamp as herein described relates to by manufacturing LED shell by the metal level of shell completely or partially overmolding to the resin bed of shell.In fact, shell is electrically connected to LED metallic plate by the surface that metal level is incorporated into resin bed by overmolding, and described metallic plate is not be electrically connected to LED circuit board.Overmolding is by any conventional method as extruded or compression moulding is carried out, and described compression moulding is carried out forming metal layer by heat and/or pressure and improved the adhesiveness between the metal level of shell and resin bed.
In order to form irregular surface with grappling resin bed better, silicon primer or anodic oxide coating can be applied to layer on surface of metal, the contiguous resin bed of described metal level.International application published WO2004/0055248 describes the anodic oxide coating for this object.
In order to be placed to by the metallic plate of LED lamp and two-part LED housing contacts as herein described, metallic plate is by mechanical part such as screw etc. or the metal level being such as directly fixed to shell by adhesion with pointing.
Utility model content
Solution mentioned herein is a kind of light emitting diode (LED) light fixture, and described light fixture comprises:
A. at least one LED chip;
B. metallic plate, this metallic plate arranges described LED chip;
C. with the LED module of described LED chip electrical contact; With
D. the shell contacted with described metallic plate, and described LED module is arranged in the housing,
Described shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially of the outer surface of resin bed and contacts with described metallic plate;
Wherein:
Described resin bed comprises thermoplastic resin composition; And
Described metal level comprises aluminium alloy and has at least 20W/m, the K extremely thermal conductivity of the highest 40W/m, K and the thermal emissivity between 0.5 to 0.8.
Accompanying drawing explanation
The utility model will obtain more detailed description by following figure, wherein:
Fig. 1 shows the profile of conventional prior art LED lamp.
Fig. 2 shows the profile of LED lamp as herein described, shows LED shell as herein described.
Fig. 3 A shows the profile of the LED lamp comprising LED shell, and described shell only has metal level.
Fig. 3 B shows the profile of LED simulation test device, the thermal characteristics of the LED lamp of described unit simulation Fig. 3 A.
Fig. 4 A shows the profile of the LED lamp comprising LED shell, and described shell only has polymer resins layers and do not covered by metal.
Fig. 4 B shows the profile of LED simulation test device, the thermal characteristics of the LED lamp of described unit simulation Fig. 4 A.
Fig. 5 A shows the profile comprising the LED lamp of two-part LED shell as herein described, and described shell has the metal level overlying polymer resins layers completely.
Fig. 5 B shows the profile of LED simulation test device, the thermal characteristics of the LED lamp of described unit simulation Fig. 5 A.
Fig. 6 A shows the profile comprising the LED of two-part LED shell as herein described, and described shell has length and is 25mm and the metal level partly overlying resin bed.
Fig. 6 B shows the profile of LED simulation test device, the thermal characteristics of the LED of described unit simulation row Fig. 6 A.
Fig. 7 A shows the profile comprising the LED of two-part LED shell as herein described, and described shell has length and is 20mm and the metal level partly overlying resin bed.
Fig. 7 B shows the profile of LED simulation test device, the thermal characteristics of the LED lamp of described unit simulation Fig. 7 A.
Fig. 8 show in plan view as comparing embodiment 2 or 3 and the rectangular test sample be only made up of resin bed.
Fig. 9 show in plan view as rectangular test sample used in embodiment E1 and E4, and it has the resin bed being covered, typically with metal layers covering completely.
Detailed description of the invention
definition
The implication for explaining term that is that discuss in description and that quote in claims is intended to give a definition.
As used herein, article " " refers to one and more than one, and need not to limit its indication noun be odd number.
As used herein, term " about " and " for or for about " refer to that described amount or numerical value can be designated value or is similar to designated value or certain close other value.This term is intended to express, and similar value causes the equivalent result or effect stated in claim.
As used herein, term " comprises/comprises " (comprises, comprising), " comprise " (includes, including), " having " (has, having) or these other modification any and all refer to comprising of nonexcludability.Such as, comprise the process of key element list, method, goods or equipment and be not limited only to listed elements, but other that clearly do not list or intrinsic key element can be comprised.In addition, illustrate unless clear and definite contrary, "or" refer to inclusive or, instead of refer to exclusiveness or.Such as, following any one situation all satisfies condition A or B:A for real (or existence) and B is false (or non-existent), A is false (or non-existent) and B is real (or existence), and A and B is really (or existence).
As used herein, term " comprises/comprises " (comprises, comprising), (includes " is comprised ", including), " there is " (has, having), " substantially by forming " and " by forming " or these other modification any and can refer to comprising of comprising of nonexcludability or exclusiveness.
When these terms refer to the comprising of the nonexcludability comprising key element list, technique, method, goods or equipment, be not limited to listed elements, but can comprise clearly do not list or can be other intrinsic key element.In addition, illustrate unless clear and definite contrary, "or" refer to inclusive or, instead of refer to exclusiveness or.Such as, following any one situation all satisfies condition A or B:A for real (or existence) and B is false (or non-existent); A is false (or non-existent) and B is real (or existence); And A and B to be really (or existence).
When these terms refer to have more the comprising of exclusiveness time, these terms the scope of claim is limited to following material or step quote those, described material or step greatly affect the novel key element that the utility model is quoted.
When these terms refer to comprising of complete exclusiveness, these terms do not comprise any key element of non-specific reference in claim, step or assembly.
As used herein, term " goods " refer to article (item) that are that do not complete or that complete, object (thing), object (object) or do not complete or the element of article, object or object that completes or parts.As used herein, when goods do not complete, term " goods " can refer to process in the goods be included in and/or by experience so that any article, object, object, element, device etc. of the goods become further.
As used herein, when goods complete, term " goods " refers to and lives through complete machining thus the article, object, object, element, device etc. that are applicable to special-purpose/object.
Goods can comprise one or more element or sub-component, and described element or sub-component are that part is done and await processing further or fit together with other element/sub-component forming finished product.In addition, as used herein, term: " goods " also can refer to system or the configuration of goods.
As used herein, term " anodic oxidation aluminized coating ", " alumite coating " refer to that having IUPAC name is called that oxo (oxoalumanoxy) alumane, CAS number of registration is 90669-62-8, and chemical formula is Al
2o
3anodic oxide coating.
As used herein, term " interior " refers to when resin bed is closer to the placement situation of this outer shell during LED module.
As used herein, term " outward " refers to the placement situation when metal level is oriented to further from this layer during LED module.
As used herein, term " above covers ", " by above covering " refers to that metal level is relevant to the orientation of resin bed in LED lamp outer shell as herein described, and represent metal level be placed on and contiguous resin bed from LED module surface farthest, therefore metal level is positioned to the skin of shell.
As used herein, term " heat conduction ", " thermal conductivity " represent with k, and refer to that material can lead thermal property.Cross over heat trnasfer in high thermal conductivity material with than the heat trnasfer crossed in low thermal conductivity material faster speed carry out.The thermal conductivity of material becomes with temperature.In general, material becomes along with the rising of mean temperature and has more thermal conductivity.
The inverse of thermal conductivity is thermal resistivity, is represented as r.Thermal conductivity is measured according to W/m, K and watts/meter Kelvin.
As used herein, term " heat emission ", " thermal emissivity " (usually representing with ε or e) generally refer to material in its surface the relative ability characteristic by radiation-emitting energy.It is at the same temperature by energy and the ratio by the energy of black body radiation of certain material radiation.Real black matrix will have ε=1, and any actual object will have ε <1.Emissivity is characteristic.
In general, more secretly and more black, its emissivity is more close to 1 for material.Material reflective stronger, its emissivity is lower.Press polished silver has the emissivity of about 0.02.
As used herein, term " electric insulation " refers to the performance of material in impedance flow of charge.This type of material is called as dielectric.The typical index of electrical insulation capability is specific insulation, and it is represented as ρ (rho)." specific insulation ": be also referred to as " resistivity " and refer to measuring the intensity of material resistive.Low-resistivity shows following material, and it easily allows charge movement.The unit of resistivity in the International System of Units is ohm meter (Ω m).
As used herein, term " thermoplastic polymer " refers to following polymer, its heat and freezing extremely like glassy state time (when sufficiently cooling) become liquid.Due to the cause of this characteristic, thermoplastic polymer can by molding.Thermoplastic polymer is at its concrete glass transition temperature T
git is more than flexible and flexibility.Second and higher melt temperature T
mbelow, most of thermoplastic has the crystalline domain replaced with amorphous areas, and the chain in amorphous areas is approximate randomly to reel.Amorphous areas provides elasticity, and crystal region provides strength and stiffness.
As used herein, term " heat dissipation " refers to by the passing in time of electronic device and circuit and the heat loss produced, and this is necessary for these devices, to improve reliability and to prevent premature breakdown.
As used herein, term " fin " refers to following assembly or sub-assembly, and the heat produced in solid material is transferred to fluid media (medium) such as air or liquid by it.Fourier Heat Conduction law (being simplified as the one dimension form on x direction) shows, when there is thermograde in object, heat can be passed to lower temperature region from higher temperature region, and its speed is proportional to the product of the cross-sectional area of thermograde and heat trnasfer.
As used herein, term thermograde is temperature gap, is identified as Δ [d] T in this article
0-T
1or Δ [d] T
1-T
2.
As used herein, the cross-sectional area of heat trnasfer is set as 1.
As used herein, " the fin effect " of the LED shell of term simulation refers to that the LED shell of simulation crosses over the ability of the transmission heat of certain thermograde as above used.This term also refers to these heat dissipation effect of LED shell simulated or the ability of burn-off.
As used herein, term " overmolding " refers to following method, and wherein thermoplastic resin part is directly molded onto and comprises on the second assembly of metal level.Overmolding relates generally to the independent material of use two kinds and forms an adhesive member.There is the overmolding of two types: insert and " secondary injection ".Insert overmolding and be more general method and for following injection moulding process, wherein a kind of material (being generally elastomeric material) is molded onto second " substrate " material (being generally rigidity plastics or object) " on ".
As used herein, " light emitting diode " can be abbreviated as " LED ".
As used herein, " micron " can be abbreviated as " μm ".
As used herein, " millimeter " is abbreviated as " mm ".
As used herein, " wt.% " can be abbreviated as " wt% ".
As used herein, " aluminium " can be abbreviated as " Al ".
As used herein, " thermal source " can be abbreviated as " HS ".
As used herein, " watts/meter " under " Kelvin " can be abbreviated as W/m, K.
As used herein, " ohm meter " can be abbreviated as Ω m.
scope
Except as otherwise noted, any scope as herein described comprises its end value all clearly.When setting forth certain amount, disclose as the concentration of scope or other value or parameter all scopes formed by any a pair any range limit and any range lower limit specifically, and no matter this type of limit value to be whether herein institute separately disclosed in.Occurrence disclosed in when method as herein described and goods are not limited to limited range in the description.
preferred variant
Press any variant of disclosed method as herein described, composition and the goods such as material, method, step, value and/or scope herein, no matter whether be identified as preferred variant, be intended to openly any method and goods specifically, and comprise any combination of this type of material, method, step, value, scope etc.In order to provide for claim accurately with the object of enough supports, this type of disclosed combination any is all intended for the preferred variant of methods described herein, composition and goods specifically.
ordinary circumstance
This document describes light emitting diode (LED) light fixture, described light fixture comprises:
A. at least one LED chip;
B. metallic plate, this metallic plate arranges at least one LED chip described;
C. with the LED module of at least one LED chip electrical contact described; With
D. the shell contacted with described metallic plate, and described LED module is arranged in the housing.
Described shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially of the outer surface of resin bed and contacts with described metallic plate;
Wherein:
Described resin bed comprises electric insulation thermoplastic resin composition; And
Described metal level comprises aluminium alloy and has at least 20W/m, the K extremely thermal conductivity of the highest 40W/m, K and the thermal emissivity between 0.5 to 0.8.
There is also described herein the LED shell be arranged in LED as herein described,
Wherein said LED shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially and contacting with metallic plate of the outer surface of resin bed; And
Wherein:
Described resin bed comprises electric insulation thermoplastic resin composition; And
Described metal level comprises aluminium alloy and has at least 20W/m, the K extremely thermal conductivity of the highest 40W/m, K and the thermal emissivity between 0.5 to 0.8.
In any one LED lamp as herein described or LED shell, thermoplastic resin composition can comprise and is selected from following thermoplastic resin: polyethylene, Kynoar, polypropylene, nylon, polyester, acrylonitrile-butadiene-styrene (ABS) (ABS) polymer and/or their copolymer.In any LED lamp as herein described, thermoplastic resin is optional from polyester terephthalate, polybutylene terephthalate (PBT), polytrimethylene's ester, conjugated polyether ester elastomer and these any mixture, and can have and be greater than 10
7the specific insulation ρ of Ω cm.The metal level of any one in LED lamp as herein described can comprise the anode aluminized coating with following thickness, and described thickness is enough to guarantee that the metal level applied has the thermal emissivity between 0.5 and 0.8.In addition, metal level also can overlie whole length or 10mm or 15mm or 20mm or 25mm or 30mm or 35mm or 40mm or 50mm of the outer surface of resin bed.
In preferred LED shell described herein, thermoplastic resin composition can comprise and is selected from following thermoplastic resin: polyester terephthalate, polybutylene terephthalate (PBT), polytrimethylene's ester, conjugated polyether ester elastomer and these any mixture, and has and be greater than 10
7the specific insulation ρ of Ω cm.In addition, in preferred LED shell described herein, metal level can comprise anodic oxidation aluminized coating, have between 25W/m, thermal conductivity between K and 32W/m, K and the thermal emissivity between 0.6 and 0.8, and can overlie the outer surface of resin bed between 20 to 25mm.
There is also described herein the use of LED shell as herein described in LED lamp, thus the temperature measured in 5 millimeters or 4 millimeters or 3 millimeters or 2 millimeters or 1 millimeter of at least one LED chip is less than 70 DEG C.Preferably, the temperature measured in 5 millimeters or 4 millimeters or 3 millimeters or 2 millimeters or 1 millimeter of at least one LED chip is lower than 70 DEG C at least 10 DEG C, or 11 DEG C, or 12 DEG C, or 15 DEG C, or 18 DEG C.
There is also described herein method, said method comprising the steps of:
Keep 5 millimeters that are arranged at least one LED chip in any one LED lamp as herein described, or 4 millimeters, or 3 millimeters, or 2 millimeters, the temperature in 1 millimeter is lower than 70 DEG C, or lower than 70 DEG C at least 10 DEG C, or 11 DEG C, or 12 DEG C, or 15 DEG C, or 18 DEG C.
There is also described herein the method manufacturing LED lamp, described method comprises:
Be fixed to by the metallic plate of any one LED as herein described on any one LED shell as herein described, wherein at least one LED chip is arranged on described metallic plate,
Wherein said shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially of the outer surface of resin bed and contacts with described metallic plate;
Described resin bed comprises thermoplastic resin composition; And
Described metal level comprises aluminium alloy and has at least 20W/m, the K extremely thermal conductivity of the highest 40W/m, K and the thermal emissivity between 0.5 to 0.8.
embodiment
These embodiments also show the effect of metal level-resin bed structure from LED thermal source releasing heat of the overmolding of LED shell as herein described in the following way: simulate shell as herein described and measure at the thermal source with simulation at a distance of the heat dissipation of various distance.
lED simulated test:
LED simulated test is suitable for measuring the heat trnasfer undertaken by the shell of overmolding as herein described.This test by use be measured as 6mm wide × rectangular test sample that 50mm length × 2mm is thick come, described test sample resin mouldedly to be formed by as herein described, and is coated with metal disclosed in the thick table 1 of 0.3mm to simulate the shell of overmolding as herein described.The placement situation of LED thermal source on these test samples of these rectangular test samples and simulation has approached the LED module of concrete kind, that is, have the module of the LED chip being arranged on one end, and the one end from LED lamp is produced by the heat from chip.
LED is simulated as thermal source by one end of testing element grid (TEG) chip purchased from Japanese Kyocera Corp. being set to test specimen.Temperature sensor is arranged on the different distance place away from TEG chip.Distance T
obe positioned at immediately below TEG chip.Distance T
1with TEG chip at a distance of 20mm; Distance T
2with TEG chip at a distance of 35mm and and T
1at a distance of 15mm.Expect and showing the effect of shell from thermal source heat of transfer of simulation with thermal source different distance place measuring tempeature apart, that is, it has the ability as fin.
for the material of LED simulated test:
Thermal source: TEG chip AD-A6086A7, purchased from Kyocera;
The magnitude of voltage of thermal source and current value setting are respectively 3.99V and 100mA, to control at 80.0 DEG C by the temperature of thermal source independently;
Hot thin plate: the hot thin plate HF-543 of organosilicon, purchased from Sun Hatoya, Japan;
Temperature sensor: ST-23K-100-TS1.5, purchased from Adachi Co.Ltd., Japan;
Aluminium alloy: ADC12 is (based on the aluminium alloy of aluminium-organosilicon-copper, purchased from Kamiyama Production Co., Japan.
Thermoplastic compounds:
The polybutylene terephthalate (PBT) [PBT] that the glass of (1) 30% is strengthened, with
sK605NC010Lot.AFCKH16101 is purchased and derives from DuPont (Wilmington, DE, USA);
(2) PBT of heat conduction [TC] PBT=21wt.%; The fire retardant of 12wt.%; Titanium dioxide [the TiO of 18wt.%
2]; The magnesia [MgO] of 48wt.%; Other filler/additive of 1wt.%.TC – PBT has 15W/m, the core thermal conductivity of K, and uses it to observe the metal-resin shell of the PBT that use 30% glass is strengthened and to have the heat trnasfer difference of PBT of low sizing concentration.
prepare rectangular test sample
By carry out in 32mm Werner and Pfleiderer double screw extruder compounding come polymer composition in preparation table 1 and table 2.Most of composition is blended together and is added in the rear portion (cylinder 1) of extruder.But heat filling and fiberfill are from sidepiece feeding (10 cylinders) cylinder 5.For polybutylene polymer composition, barrel temperature is set as about 250 DEG C, it causes the melt temperature of about 270 DEG C.
Polybutylene polymer composition is injection molded into rectangular test sample, and wherein mold temperature is about 100 DEG C.Each test specimen have as table 1 the metal of different length reported covers.The different length that described metal overlies resin affects the fin characteristic of test specimen.
Fig. 3 to Fig. 7 respectively illustrates the LED lamp 30,40,50,60 and 70 of the simulation of five kinds of different configurations, and their corresponding test samples 31,41,51,61 and 71, tests their heat transfer effect and is reported in table 1.
Fig. 3 A depicts the LED lamp 30 of the simulation with shell 306, and described shell only comprises the metal level 307 be made up of ADC12 aluminium alloy and do not have resin bed.Fig. 3 B shows test sample 31, and it simulates LED lamp 30.Sample 31 shows the single metal level 307 of 50mm length and the comparing embodiment C1 depicted in table 1.
Fig. 4 A depicts the LED lamp 40 of the simulation with shell 406, and described shell only comprises the resin bed 405 made of PBT or TC-PBT strengthened by 30% glass and do not have metal level.Fig. 4 B shows test sample 41, and it simulates LED lamp 40.Sample 41 shows the resin bed 407 of 50mm length, and depicts comparing embodiment C2 and C3.
Fig. 5 A depicts the LED lamp 50 of the simulation with shell 506, and described shell is made by being covered, typically with metal layers the resin bed 505 covered on 507 completely.Fig. 5 B shows test sample 51, and it simulates LED lamp 50.Completely be there is 50mm length L by comprising
5metal level on the resin bed that covers, test sample 51 depicts embodiment E 1 in table 1 and E4.
Fig. 6 A depicts the LED lamp 60 of the simulation with shell 606, and described shell is made by being partly covered, typically with metal layers the resin bed 605 covered on 607.Fig. 6 B shows test sample 61, and it simulates LED lamp 60, because it has 25mm length L
6metal layer part overlie resin bed.Test sample 61 depicts embodiment E 2 in table 1 and E5.
Fig. 7 A depicts the LED lamp 70 of the simulation with shell 706, and described shell is made by being covered, typically with metal layers the resin bed 705 covered on 707.Fig. 6 B shows test sample 71, and it simulates LED lamp 70.By comprising part, be there is the length L of 20mm
7metal level on the resin bed that covers, test sample 71 depicts embodiment E 3 in table 1 and E6.
Fig. 8 show in plan view as comparing embodiment 2 or 3 and the rectangular test sample be only made up of resin bed.Fig. 9 show in plan view as rectangular test sample used in embodiment E1 and E4, and it has the resin bed being covered, typically with metal layers covering completely.
measure and the temperature of thermal source at a distance of different distance place
In LED simulated test, T
0for the temperature measured at thermal source place, therefore approach the temperature in LED lamp or the LED chip extremely in LED lamp.In general, for the LED lamp (at room temperature) in use, T
0must lower than 70 DEG C to prevent from causing pyrolytic damage to LED chip.As mentioned above, T
1for with thermal source at a distance of the temperature at 20mm place; T
2for with thermal source at a distance of the temperature at 35mm place.Therefore, the simple subtraction that the temperature passed through between surveyed distance is fallen is measured, and measures and the temperature T of thermal source at a distance of different distance place
0, T
1and T
2.
measure thermal emissivity and thermal conductivity
Thermal emissivity measured value is respectively available from the center of the test sample shown in Fig. 8 and Fig. 9, and they are then corresponding to the embodiment 1-3 in table 1 and 4-6.By NSG Techno Research Co. to the measurement of thermal emissivity, Ltd., measure the ratio of the integral radiation intensity (for wavelength region: 4-20 μm) of correlated samples and the bulk strength of absolute black body, use infrared spectroscopy method, be equipped with purchased from Nippon Denshi Co., Ltd., the JIR-5500 instrument of Japan carries out.
Also by laser flash method (ASTM E1461) in the sample the heart measure the thermal conductivity of identical sample.Thermal conductivity at T DEG C can be calculated by following formula (1).
λ(T)＝a(T)×Cp(T)×ρ(T)，
(1)
Wherein:
λ (T) is the thermal conductivity at T DEG C;
A (T) is the thermal conductivity at T DEG C, uses NETZSCH LFA447 to measure;
Cp (T) is the specific heat at T DEG C, uses TA instrument Q100) measure; And
ρ (T) is the density at T DEG C, uses alfa-mirage SD-200L to measure.
result
This joint is divided into two parts.First segment provides in the temperature measurement result with thermal source discrete distance place apart, the T of the LED lamp outer shell of the simulation particularly exemplified by table 1
0(thermal source [" HS "] place/its above) T
1place (with HS at a distance of 15mm); And T
2place (with HS at a distance of 20mm).First segment also discusses the impact of resin bed composition on the variations in temperature of these and thermal source distance apart.
Second section discusses the T of each discrete length (50mm, 25mm or 20mm) of the metal level of the LED lamp outer shell for the simulation exemplified by table 1
0and T
1between difference and T
1and T
2between difference.This joint concentrate on metal level due to thermal conductivity of its length and its mixing and thermal emissivity the fin effect that has.
t
0
result (at thermal source place)
T in table 1
0result measures at the thermal source place of test sample, and simulate exemplary/compare LED lamp outer shell at LED chip place or the desired temperature under it.Importantly by T
0result and 70 DEG C compare, and the latter is the internal temperature of LED module, and LED chip starts to break down at such a temperature.
Comparing embodiment 1 [CE1] simulates the chlamydate LED lamp of tool, and described shell is only made up of the aluminum metal layer that 2mm is thick; Its T
0it is 47.9 DEG C.The T of CE2 (it simulates the chlamydate LED lamp of tool, and the PBT resin layer that described shell is only strengthened by 30% glass is formed)
0it is 83.9 DEG C.Because 83.9 DEG C are greater than 70 DEG C, therefore suppose that in fact the LED lamp outer shell only with the PBT resin layer that 30% glass is strengthened can make LED break down.The T of CE3 (it simulates the chlamydate LED of tool, and described shell is only made up of TC-PBT resin bed)
0it is 56.2 DEG C.
Embodiment 1 to 3 simulates the chlamydate LED lamp of tool, and described shell has the different PBT resin layer of 30% glass reinforcement of length and the aluminum metal layer of anodised aluminium coating; T
0be respectively 51.0 DEG C, 51.2 DEG C and 51.4 DEG C.For the T of the different length (being respectively 50mm, 25mm and 20mm) of metal level
0mean change be only 0.4%.
Similarly, the T of embodiment 4 to 6 (they simulate the chlamydate LED lamp of tool, and described shell has the aluminum metal layer of the different TC-PBT resin bed of length and anodised aluminium coating)
0be respectively 50.9 DEG C, 50.9 DEG C and 51.1 DEG C.For the T of the different length (being respectively 50mm, 25mm and 20mm) of metal level
0mean change be only 0.1%.
Therefore, table 1 demonstrates the different length directly not depending on outer cover metal layer at LED chip place or the heat dissipation under it.More briefly, the T of all embodiments (E1-E6)
0measured value is at least 17 DEG C and is less than 70 DEG C (temperature thresholds when LED chip breaks down).Therefore, all six embodiments are all pointed out, and LED lamp outer shell as herein described will be conducive to and maintains the operation of LED lamp.
Table 1 also shows the average T of all six embodiments
0only than the T of CE1
0large 6.7%, CE1 represents the shell be made up of the aluminium alloy with 0.02 thermal emissivity.The fin effect of aluminum alloy casing results from the thermal conductivity of aluminium and the melange effect of thermal emissivity.The thermal conductivity of the 96W/m of aluminium alloy (ADC-12), K is far away higher than anodised aluminium.But due to the thermal conductivity of described two-part structure and the melange effect of thermal emissivity of the shell of simulation, E1-E3 and E4-E6 shows the fin performance be almost equal to aluminium alloy (ADC-12).
The T of E1-E3
0slightly be greater than the T of E4-E6
0.This prompting uses the metal level of 30%GR-PBT and any length to give slightly better fin performance, but TC-PBT resin can be had fabulous result by being used as the substitute of described 30%GR-PBT for certain.
Table 1 clearly show described herein and with embodiment simulation described two-part shell approached aluminum alloy casing heat dissipation and will be indubitable prevent LED chip because extreme heat expose and damage.
t
1
result (with HS at a distance of 20mm)
T in table 1
1result is those temperature measured at a distance of 15mm place at the thermal source with test sample.The T of CE1 (only 2mm Al-alloy metal layer)
1it is 40.6 DEG C.The T of CE2 (only 30%GR-PBT resin bed)
1it is 25.8 DEG C.The T of CE3 (only a TC-PBT resin bed)
1it is 39.3 DEG C.These data show, the PBT resin layer that 30% independent glass is strengthened can not by heat trnasfer because its thermal conductivity is lower.
The T of embodiment 1-3 (aluminum metal layer of the 30%GR-PBT resin bed that length is different and anodised aluminium coating)
1be respectively 43.7 DEG C, 43.5 DEG C and 26.5 DEG C.T between E1 (50mm metal level) and E2 (25mm metal level)
1change be only 0.2%.But, the T between the E1/E2 (50mm, 25mm) of associating and E3 (20mm metal level)
1mean change be 39% surprisingly.The T of the reduction of E3
1the PBT resin layer strengthened owing to the temperature sensor for E3 to be installed to described 30% glass, instead of as E1 and E2 do be installed on anodic aluminum oxide layer.
The T of embodiment 4-6 (aluminum metal layer of the TC-PBT resin bed that length is different and anodised aluminium coating)
1be respectively 43.5 DEG C, 43.6 DEG C and 41.4 DEG C.T between E4 (50mm metal level) and E5 (25mm metal level)
1change be only 0.1%.But, the T between the E4-E5 (50mm, 25mm) of associating and E6 (20mm metal level)
1mean change be 5%.
To the T of E1-E3
1with the T of E4-E6
1relatively demonstrate T
0and T
1between bulk temperature homogenizing TC-PBT embodiment (4-6) is better than to the bulk temperature homogenizing of 30%GR-PBT far away due to the better thermal conductivity of TC-PBT.In addition, the heat dissipation difference of the described different metal length of TC-PBT embodiment (4-6) is not basic, this prediction when with thermal source at a distance of 20mm place dissipate the heat in the metal level using TC-PBT resin and any length will be almost effective on an equal basis.
t
2
result (with HS at a distance of 35mm)
T in table 1
2result is in those temperature measured at a distance of 35mm place with thermal source, and they simulate and the desired temperature at the thermal source apart 35mm place that compares LED lamp outer shell and LED lamp outer shell as herein described.
Table 1 demonstrates the T of comparing embodiment 1
2be 37.9 DEG C, embodiment 1 simulates the chlamydate LED lamp of tool, and described shell is only made up of the aluminium alloy layer that 2mm is thick.The T of comparing embodiment 2
1be 25.7 DEG C, embodiment 2 simulates the chlamydate LED lamp of tool, and the PBT resin layer that described shell is only strengthened by 30% glass forms.The T of comparing embodiment 3
1be 35.4 DEG C, embodiment 3 simulates the chlamydate LED lamp of tool, and described shell is only made up of TC-PBT resin bed.These data consistents show, the PBT resin layer that 30% glass without metal level is strengthened can not by heat from T
1carrying is to T
2.
The T of embodiment 1-3 (aluminum metal layer of the 30%G-R PBT resin layer that length is different and anodised aluminium coating)
2be respectively 40.2 DEG C, 25.7 DEG C and 25.7 DEG C.Therefore, between E2 (there is 25mm metal level) and E3 (there is 20mm metal level), there is not T
2change.But, the T between the E2-E3 (20mm-35mm) of E1 (50mm) and associating
2be changed to about 36%.Therefore, table 1 demonstrates the dissipating the heat in when having 25mm or 20mm metal level of LED lamp with the PBT resin layer that 30% glass is strengthened and reduces 1/3.
The T of embodiment 4-6 (aluminum metal layer of the TC-PBT resin bed that length is different and anodised aluminium coating)
2be respectively 40.2 DEG C, 38.6 DEG C and 37.6 DEG C.The T of these three embodiments
2mean change be about 2.4%.
t
0
and T
1
between difference (Δ T
0
-T
1
) result
In this discussion, lower Δ T
0-T
1show better heat dissipation performance.That is, T
0and T
1between temperature difference show the different length of the metal level on described different thermoplastic resin with thermal source at a distance of the fin effect at 20mm place.
Δ T
0-T
1for T
0(observing at HS place) and T
1temperature difference between (at HS at a distance of the observation of 20mm place), and be by from T
0deduct T
1obtain.Table 1 demonstrates the Δ T of CE1, CE2 and CE3
0-T
1value is 7.3 DEG C, 58.1 DEG C and 16.9 DEG C.CE1, CE2 and CE3 simulate LED lamp outer shell, and described shell is only made up of a layer respectively: the Al-alloy metal layer that 2mm is thick, or the PBT resin layer that 30% glass is strengthened, or TC-PBT resin bed.
Because C1-C3 simulates LED shell, described shell has heat emission layer or heat-conducting layer, and CE1-CE3 is at T
0and T
1" at all " falls in the LED lamp outer shell temperature at place can not owing to the melange effect of heat emission and Heat Conduction Material.Therefore, the Δ T of CE1-CE3
0-T
1illustrate only fin effect, namely owing to the heat dissipation with thermal source distance apart.Finally, this heat dissipation is relevant to intrinsic heat emissivity or the intrinsic heat conductance of the LED lamp outer shell layer of CE1, CE2 and CE3.
Table 1 demonstrates the Δ T of the embodiment with the PBT resin layer that glass is strengthened
0-T
1for: E1 (50mm metal level), 7.3 DEG C; E2 (25mm metal level), 7.8 DEG C; With E3 (20mm metal level), 24.9 DEG C.There is the Δ T of the embodiment of TC-PBT resin bed
0-T
1for: E4 (50mm metal level), 7.4 DEG C; E5 (25mm metal level), 7.3 DEG C; With E6 (20mm metal level), 9.7 DEG C.
Importantly, the Δ T of CE1 and E1, E4 (50mm metal level) and E2, E5 (25mm metal level)
0-T
1measured value is substantially similar, that is, their change mostly is 7% most.Therefore, E1, E4 (50mm anodised aluminium coating aluminium lamination) and E2 and E5 (aluminium lamination of 25mm anodised aluminium coating) in burn-off and the LED lamp outer shell be only made up of the aluminium alloy layer that 3mm is thick effective on an equal basis.This effect is explained by following Consideration.
The thermal conductivity of the aluminium alloy of CE1 is high, be 96, and aluminum alloy heat emissivity is extremely low, is only 0.02.CE1 is probably with equal speed heat by conduction in the whole length of lamp outer casing efficiently.
The thermal conductivity of the aluminium lamination of the anodised aluminium coating of E1-E6 is medium level, be 30, and the thermal emissivity of resin bed is quite high, is 91 for E1-E3, and is 92 for E4-E6.The metal level of all embodiments all has substantially the same thermal conductivity and thermal emissivity.Expect that they are by with identical speed burn-off in the whole length of lamp outer casing, described speed will be different from the speed of the shell of the CE1 only with the thick aluminium alloy layer of 3mm.
But as shown in table 1, in fact E1, E2, E4 and E5 are sentencing the speed heat by conduction substantially the same with CE1 with thermal source at a distance of 20mm.E1, E2, E4 and E5 simulate LED lamp outer shell, and described shell has the metal level of 50mm or 25mm.Obtain the heat dissipation speed identical with CE1 and depend at least following factor:
1) thermal conductivity of metal level and the ratio of thermal emissivity; With
2) length of 50mm or 25mm of metal level.
Therefore, table 1 demonstrate with thermal source at a distance of 20mm place, the LED shell of simulation as herein described shows and is similar to-T
1fin effect.
The Δ T of E3 and E6 (20mm metal level)
0-T
1be respectively 24.9 DEG C and 9.7 DEG C.Δ T between E3 and C1
0-T
1be changed to-241%, and be changed to-33% between E6 and C1.Negative value reflects that E3 and E6 has the heat dissipation larger than CE1 with thermal source at a distance of 20mm place.The metal level of E3 has the thermal conductivity identical with E5 with E1, E2, E4 and emissivity with the metal level of E6.Therefore, be metal level that the principal element of the larger fin effect reason of E3 and E6 is described 20mm far away.
Generally speaking, the metal level that table 1 demonstrates the 20mm in LED lamp outer shell as herein described is obtaining more effective fin effect more remarkable in described 25mm or 50mm metal level with thermal source at a distance of 20mm place.But, it is emphasized that the validity of upper metal-clad in burn-off of 25mm or 50mm in LED lamp outer shell as herein described is similar to the whole metal LED lamp outer casing of the thick aluminium alloy of 3mm.Therefore, Δ T
0-T
1result shows, and LED lamp outer shell as herein described has the commercialization beneficial effect of expection, because at least equally good and cost of their the heat dissipation performance aluminum alloy casing thick with 3mm is lower than the latter.
t
1
and T
2
between difference (Δ T
1
-T
2
) result
In this discussion, Δ T
2-T
1lower, then heat dissipation performance is better.That is, T
1and T
2between difference be to the different length of metal level with the measuring of the fin effect of thermal source at a distance of 35mm place.
Δ T
1-T
2for T
1(observing at a distance of 20mm place with HS) and T
2temperature difference between (observing at a distance of 35mm place at HS), and be pass through T
1deduct T
2obtain.Table 1 demonstrates Δ T
1-T
2value be 2.7 DEG C, 0.1 DEG C and 3.9 DEG C.Clearly say, C1, C2 and C3 simulate LED lamp outer shell, and described shell is only made up of a layer respectively: the Al-alloy metal layer that 2mm is thick, or the PBT resin layer that 30% glass is strengthened, or TC-PBT resin bed.
Table 1 display has the Δ T of the embodiment of the PBT resin layer that glass is strengthened
1-T
2for: E1 (50mm metal level), 3.5 DEG C; E2 (25mm metal level), 17.7 DEG C; With E3 (20mm metal level), 0.8 DEG C.There is the Δ T of the embodiment of TC-PBT resin bed
1-T
2measured value is: E4 (50mm metal level), 3.3 DEG C; E5 (25mm metal level), 5 DEG C; With E6 (20mm metal level), 3.8 DEG C.
E1-E6 all has the ratio of the thermal conductivity of substantially the same metal level and the thermal emissivity of resin bed.Δ T between E1 and E4 (50mm metal level)
1-T
2be changed to about 6%.Therefore, with thermal source at a distance of 35mm place, the 50mm metal level on the PBT resin layer that 30% glass is strengthened obtains fin effect slightly more better than the same metal layer on TC-PBT resin bed.
Δ T between E2 and E5 (25mm metal level)
1-T
2be changed to about 72% and (obtain as follows: 17.7-5=12.7/17.7).Therefore, with thermal source at a distance of 35mm place, the 25mm metal level on the PBT resin layer of 30% glass reinforcement obtains the fin effect than the same metal layer 72% on TC-PBT resin bed.
Δ T between E3 and E6 (20mm metal level)
1-T is changed to-375% (acquisition as follows: 0.8 – 3.8=-3.0/0.8).Therefore, with thermal source at a distance of 35mm place, the 20mm metal level on TC-PBT layer obtains than the well almost fin effect of 4 times of the same metal layer on the PBT resin layer of glass reinforcement.
These results confirm previous conclusion: namely, and the most efficient LED lamp outer shell structure for burn-off has the metal level of 20mm or 25mm length.In addition, with thermal source at a distance of 35mm place, the PBT resin layer that longer metal level is strengthened at glass creates better fin effect.But described 20mm metal level creates better fin effect on TC-PBT resin bed.
Therefore, the different length focusing on described different resin combination or metal level causes the conclusion of the same or similar LED shell about the simulation in embodiment E 1-E6.Although one or the other resin bed may depend on the metal level of different length and more effective, but use be oxidized anodically aluminium coating aluminum metal layer completely on the resin bed that covers or part is covered simulate following LED lamp outer shell, described shell is at thermal source place, or with HS at a distance of 20mm place, or with HS at a distance of 35mm place burn-off, make the LED simulated can not be excessive and break down due to beat exposure.
Claims (7)
1.LED light fixture, comprising:
A. at least one LED chip;
B. metallic plate, this metallic plate arranges at least one LED chip described;
C. with the LED module of at least one LED chip electrical contact described; With
D. the shell contacted with described metallic plate, and described LED module is arranged in the housing,
Described shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially of the outer surface of described resin bed and contacts with described metallic plate;
Wherein:
Described resin bed is made up of electrically insulating material;
Described metal level comprises the aluminium alloy of anodised aluminium coating, and wherein said anodic oxidation aluminized coating has the average thickness being greater than 10 μm; And described electrically insulating material has and is greater than 10
7the specific insulation ρ of Ω cm.
2. LED lamp as claimed in claim 1, wherein said electrically insulating material is selected from: polyethylene, Kynoar, polypropylene, nylon, polyester, acrylonitrile-butadiene-styrene (ABS) polymer and/or their copolymer.
3. LED lamp as claimed in claim 1, wherein said electrically insulating material is selected from: polyester terephthalate, polybutylene terephthalate (PBT), polytrimethylene's ester, conjugated polyether ester elastomer and these any mixture.
4. LED lamp as claimed any one in claims 1 to 3, wherein said metal level overlies the whole length of the outer surface of described resin bed.
5. as claimed any one in claims 1 to 3 LED lamp, wherein said metal level overlie the outer surface of described resin bed between 20 to 25mm.
6. be arranged on the LED shell in LED lamp,
Described LED lamp comprises
At least one LED chip;
Metallic plate, this metallic plate arranges at least one LED chip described;
With the LED module of at least one LED chip electrical contact described, and
Described LED shell comprises:
I) there is the resin bed of inner surface and outer surface; With
Ii) metal level, form of more than described metal level covering is arranged on going up at least partially of the outer surface of described resin bed and contacts with described metallic plate;
Wherein:
Described resin bed is made up of electrically insulating material; Described metal level comprises the aluminium alloy of anodised aluminium coating, and wherein said anodic oxidation aluminized coating has the average thickness being greater than 10 μm, and described electrically insulating material has and is greater than 10
7the specific insulation ρ of Ω cm.
7. LED shell as claimed in claim 6,
Wherein:
Described electrically insulating material is selected from: polyester terephthalate, polybutylene terephthalate (PBT), polytrimethylene's ester, conjugated polyether ester elastomer and these any mixture; And
Described metal level
Overlie the outer surface of described resin bed between 20 to 25mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-174342 | 2011-07-22 | ||
| JP2011174342A JP2013026206A (en) | 2011-07-22 | 2011-07-22 | Structure of led lighting fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204313012U true CN204313012U (en) | 2015-05-06 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220350641.6U Expired - Fee Related CN204313012U (en) | 2011-07-22 | 2012-07-17 | Shell in LED lamp and light fixture |
| CN201210250178.2A Expired - Fee Related CN102889479B (en) | 2011-07-22 | 2012-07-17 | Shell in LED lamp, its preparation method, light fixture and application thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210250178.2A Expired - Fee Related CN102889479B (en) | 2011-07-22 | 2012-07-17 | Shell in LED lamp, its preparation method, light fixture and application thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013026206A (en) |
| CN (2) | CN204313012U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103791356B (en) * | 2014-01-22 | 2014-10-15 | 台州市老百姓车业有限公司 | LED lamp used for electric bicycle |
| CN107388056A (en) * | 2017-08-25 | 2017-11-24 | 中山进成塑料制品有限公司 | A kind of light fixture |
| CN107987443A (en) * | 2017-12-07 | 2018-05-04 | 安徽新欧电子科技有限公司 | A kind of LED panel lamp fire-retardant diffuser plate and preparation method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3125529U (en) * | 2006-07-13 | 2006-09-21 | 西村陶業株式会社 | Radiant heat dissipation structure |
| US20090290353A1 (en) * | 2008-05-22 | 2009-11-26 | Tony Chou | Lamp Heat Dissipating Structure |
| EP2395277B1 (en) * | 2009-02-04 | 2014-05-07 | Panasonic Corporation | Bulb-shaped lamp and lighting device |
| CN102518950B (en) * | 2009-09-09 | 2015-01-14 | 松下电器产业株式会社 | Bulb-shaped lamp and lighting device |
| CN102032481B (en) * | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | Lamp with base and lighting equipment |
| JP4987062B2 (en) * | 2009-11-26 | 2012-07-25 | スワン電器株式会社 | lighting equipment |
| JP4762349B2 (en) * | 2010-01-14 | 2011-08-31 | シャープ株式会社 | Lighting device |
| CN201724013U (en) * | 2010-05-07 | 2011-01-26 | 苏州盟泰励宝光电有限公司 | LED lamp with combined metal body heat dissipating structure |
-
2011
- 2011-07-22 JP JP2011174342A patent/JP2013026206A/en active Pending
-
2012
- 2012-07-17 CN CN201220350641.6U patent/CN204313012U/en not_active Expired - Fee Related
- 2012-07-17 CN CN201210250178.2A patent/CN102889479B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013026206A (en) | 2013-02-04 |
| CN102889479A (en) | 2013-01-23 |
| CN102889479B (en) | 2016-09-28 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150506 Termination date: 20200717 |
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| CF01 | Termination of patent right due to non-payment of annual fee |