CN204303774U - Double-deck automated bonding carrier - Google Patents
Double-deck automated bonding carrier Download PDFInfo
- Publication number
- CN204303774U CN204303774U CN201520035844.XU CN201520035844U CN204303774U CN 204303774 U CN204303774 U CN 204303774U CN 201520035844 U CN201520035844 U CN 201520035844U CN 204303774 U CN204303774 U CN 204303774U
- Authority
- CN
- China
- Prior art keywords
- hole
- support plate
- double
- deck
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000001788 irregular Effects 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a kind of carrier, be specially double-deck automated bonding carrier, comprise support plate and lower support plate, upper support plate and lower support plate are assembled into double-decker by positioning screw hole, described upper support plate distributes multiple upper through hole, in described lower support plate correspondence, there is lower through-hole the position of through hole, and described upper clear size of opening is greater than the through hole of lower through-hole forming station scalariform.The double-deck automated bonding carrier that the utility model provides, form double-deck through-hole structure, the product of sizes and shape can be placed, lower through-hole is for holding product back side irregular structure, Product Level is kept to be placed in through hole, upper support plate and lower support plate also better can combine according to different sizes and structure, improve the versatility of carrier.
Description
Technical field
The utility model relates to a kind of carrier, is specially double-deck automated bonding carrier.
Background technology
Automated bonding carrier is placed on for carrying product carrier bonder carrying out automated bonding operation, bonder does not need carrier when the product that operation regular shape, size are suitable, be mainly used in some structures or the special product of size, such as product size is too small, thickness is blocked up when causing equipment material grasping, and clamp cannot capture and tape transport, and product structure is irregular, such as: the PCB back side mounts some electronic devices and components etc., product cannot the product of horizontal positioned, needs the carrier by coupling could operation.Be the carrier for different product design specialized at present, the versatility of carrier is not high.
Utility model content
For above-mentioned technical problem, the utility model provides the carrier that a kind of versatility is higher, can carry sizes and the special product of structure.
Concrete technical scheme is:
Double-deck automated bonding carrier, comprise support plate and lower support plate, upper support plate and lower support plate are assembled into double-decker by positioning screw hole, described upper support plate distributes multiple upper through hole, in described lower support plate correspondence, there is lower through-hole the position of through hole, and described upper clear size of opening is greater than the through hole of lower through-hole forming station scalariform.
Described upper through hole both sides have avoiding hollow groove.
The double-deck automated bonding carrier that the utility model provides, form double-deck through-hole structure, the product of sizes and shape can be placed, lower through-hole is for holding product back side irregular structure, Product Level is kept to be placed in through hole, upper support plate and lower support plate also better can combine according to different sizes and structure, improve the versatility of carrier.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present utility model;
Fig. 2 is plan structure schematic diagram of the present utility model.
Detailed description of the invention
Below in conjunction with embodiment, detailed description of the invention of the present utility model is described, as depicted in figs. 1 and 2, double-deck automated bonding carrier, comprise support plate and lower support plate, upper support plate and lower support plate are assembled into double-decker by positioning screw hole 4, described upper support plate distributes multiple upper through hole 1, and in described lower support plate correspondence, there is lower through-hole 3 position of through hole 1, and described upper through hole 1 size is greater than the through hole of lower through-hole 3 forming station scalariform.
Described upper through hole 1 both sides have avoiding hollow groove 2.
Upper support plate and lower support plate are aluminium sheet, upload plate thickness thinner, upper through hole 1 matches with the Outside Dimensions of product, for placing product main body, the lower through-hole 3 of lower support plate carries out perforate according to the structure at the product back side, for holding product back side special construction, the size of lower through-hole 3 is less than the size of through hole 1, and forming step is place for Product Level to provide support a little.Avoiding hollow groove 2 is to avoid bonder clamp.
Upper support plate and lower support plate also can combine according to the different size of different product and structure, improve the utilization rate of carrier.
Claims (2)
1. double-deck automated bonding carrier, it is characterized in that: comprise support plate and lower support plate, upper support plate and lower support plate are assembled into double-decker by positioning screw hole, described upper support plate distributes multiple upper through hole, in described lower support plate correspondence, there is lower through-hole the position of through hole, and described upper clear size of opening is greater than the through hole of lower through-hole forming station scalariform.
2. double-deck automated bonding carrier according to claim 1, is characterized in that: described upper through hole both sides have avoiding hollow groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520035844.XU CN204303774U (en) | 2015-01-20 | 2015-01-20 | Double-deck automated bonding carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520035844.XU CN204303774U (en) | 2015-01-20 | 2015-01-20 | Double-deck automated bonding carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204303774U true CN204303774U (en) | 2015-04-29 |
Family
ID=53109294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520035844.XU Expired - Fee Related CN204303774U (en) | 2015-01-20 | 2015-01-20 | Double-deck automated bonding carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204303774U (en) |
-
2015
- 2015-01-20 CN CN201520035844.XU patent/CN204303774U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150429 |