CN204946868U - A kind of upset gathering-device for small chip - Google Patents
A kind of upset gathering-device for small chip Download PDFInfo
- Publication number
- CN204946868U CN204946868U CN201520680903.9U CN201520680903U CN204946868U CN 204946868 U CN204946868 U CN 204946868U CN 201520680903 U CN201520680903 U CN 201520680903U CN 204946868 U CN204946868 U CN 204946868U
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- CN
- China
- Prior art keywords
- chip
- silicon chip
- face plate
- returning face
- upper track
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of upset gathering-device for small chip, involving vibrations cylinder, described vibrating barrel connects upper track, lower tracks is provided with immediately below described upper track, described upper track is provided with returning face plate, described returning face plate is provided with the silicon chip groove suitable with chip, and the bottom of described silicon chip groove is provided with spring contact strip, and the height of described spring contact strip approximates 1/2nd of silicon chip height; The upset motor of described spring contact strip electrical connection returning face plate.The upset gathering-device of this structure, when the silicon chip of chip moves in the silicon chip groove of upper track, presses spring contact strip, thus returning face plate is overturn, thus chip is reversed and drops in lower tracks, thus the silicon chip place guaranteeing all chips upward, is convenient to the processing of later process.The utility model structure is simple, easy to operate, effectively can reduce manually, increases work efficiency and reduce error rate.
Description
Technical field
The utility model relates to chip manufacture field, particularly relates to a kind of upset gathering-device for small chip.
Background technology
Chip (chip) is exactly the general designation of semiconductor element product.Be the carrier of integrated circuit (IC, integratedcircuit), be split to form by wafer.After the silicon chip machine-shaping of chip, need thereon brave enter the relative electronic components such as electric capacity, resistance.At this moment need chip to ajust one by one, and guarantee that working position upward, thus make the relative electronic components such as electric capacity, resistance accurately can put into relevant position.This mostly is to operation and manually puts at present, needs employee to confirm the positive and negative of chip, is then manually well placed.The not only manpower of at substantial, inefficiency, and also error rate is higher.
Utility model content
The purpose of this utility model solves the deficiencies in the prior art, provides a kind of positive and negative that automatically can confirm chip, thus the gathering-device of effective turning-over of chip.
The technical solution adopted in the utility model is: a kind of upset gathering-device for small chip, involving vibrations cylinder, described vibrating barrel connects upper track, lower tracks is provided with immediately below described upper track, described upper track is provided with returning face plate, described returning face plate is provided with the silicon chip groove suitable with chip, and the bottom of described silicon chip groove is provided with spring contact strip, and the height of described spring contact strip approximates 1/2nd of silicon chip height; The upset motor of described spring contact strip electrical connection returning face plate.
As further improvement of the utility model, described lower tracks is provided with buffering area, and described buffering area is positioned at immediately below returning face plate.
The beneficial effect that the utility model adopts is: the upset gathering-device of this structure, when the silicon chip of chip moves in the silicon chip groove of upper track, press spring contact strip, thus returning face plate is overturn, thus chip is reversed and drops in lower tracks, thus the silicon chip place guaranteeing all chips upward, is convenient to the processing of later process.The utility model structure is simple, easy to operate, effectively can reduce manually, increases work efficiency and reduce error rate.
Accompanying drawing explanation
Fig. 1 is the utility model schematic diagram.
Fig. 2 is the utility model vertical view.
Shown in figure: 1 vibrating barrel, 2 upper track, 3 lower tracks, 4 returning face plates, 5 buffering areas, 41 silicon chip grooves, 42 spring contact strips.
Embodiment
Below in conjunction with Fig. 1 and Fig. 2, the utility model is described further.
As shown in the figure, a kind of upset gathering-device for small chip, involving vibrations cylinder 1, described vibrating barrel connects upper track 2, be provided with lower tracks 3 immediately below described upper track, described upper track 2 is provided with returning face plate 4, and described returning face plate 4 is provided with the silicon chip groove 41 suitable with chip, the bottom of described silicon chip groove 41 is provided with spring contact strip 42, and the height of described spring contact strip 42 approximates 1/2nd of silicon chip height; Described spring contact strip 42 is electrically connected the upset motor of returning face plate 4.
The utility model is following work, and chip is positioned at vibrating barrel, be driven into by vibrating barrel in upper track, upper track is provided with returning face plate.One side due to chip is solder side, and processing chip arranges a silicon chip block at the edge of its another side, and returning face plate is provided with the silicon chip groove adapted with silicon chip block.When chip moves to returning face plate, if solder side down, then passes through smoothly, if be provided with silicon chip block one faces down, then silicon chip block drops in silicon chip groove, and silicon chip block contacts with spring contact strip, thus drives the upset motor of returning face plate, and returning face plate is overturn.After chip upset, drop into the lower tracks be arranged in immediately below upper track, now the solder side of chip is down, and by lower tracks transmission.
For guaranteeing that chip can not be impaired when upset drops into lower tracks, described lower tracks is provided with buffering area 5, and described buffering area 5 is positioned at immediately below returning face plate.
The upset gathering-device of this structure, when the silicon chip of chip moves in the silicon chip groove of upper track, presses spring contact strip, thus returning face plate is overturn, thus chip is reversed and drops in lower tracks, thus the silicon chip place guaranteeing all chips upward, is convenient to the processing of later process.The utility model structure is simple, easy to operate, effectively can reduce manually, increases work efficiency and reduce error rate.
Those skilled in the art should know; protection scheme of the present utility model is not limited only to the above embodiments; various permutation and combination and conversion can also be carried out on the basis of above-described embodiment; under the prerequisite without prejudice to the utility model spirit, the various conversion that the utility model carries out all are dropped in protection range of the present utility model.
Claims (2)
1. the upset gathering-device for small chip, it is characterized in that involving vibrations cylinder (1), described vibrating barrel connects upper track (2), lower tracks (3) is provided with immediately below described upper track, described upper track (2) is provided with returning face plate (4), described returning face plate (4) is provided with the silicon chip groove (41) suitable with chip, and the bottom of described silicon chip groove (41) is provided with spring contact strip (42), and the height of described spring contact strip (42) approximates 1/2nd of silicon chip height; The upset motor of described spring contact strip (42) electrical connection returning face plate (4).
2. a kind of upset gathering-device for small chip according to claim 1, it is characterized in that described lower tracks is provided with buffering area (5), described buffering area (5) are positioned at immediately below returning face plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520680903.9U CN204946868U (en) | 2015-09-06 | 2015-09-06 | A kind of upset gathering-device for small chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520680903.9U CN204946868U (en) | 2015-09-06 | 2015-09-06 | A kind of upset gathering-device for small chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204946868U true CN204946868U (en) | 2016-01-06 |
Family
ID=55014270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520680903.9U Expired - Fee Related CN204946868U (en) | 2015-09-06 | 2015-09-06 | A kind of upset gathering-device for small chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204946868U (en) |
-
2015
- 2015-09-06 CN CN201520680903.9U patent/CN204946868U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20170906 |