CN203185331U - Novel IC pasting containing placing disc - Google Patents
Novel IC pasting containing placing disc Download PDFInfo
- Publication number
- CN203185331U CN203185331U CN 201320176263 CN201320176263U CN203185331U CN 203185331 U CN203185331 U CN 203185331U CN 201320176263 CN201320176263 CN 201320176263 CN 201320176263 U CN201320176263 U CN 201320176263U CN 203185331 U CN203185331 U CN 203185331U
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- CN
- China
- Prior art keywords
- novel
- base board
- base plate
- holding tray
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a novel IC pasting containing placing disc which comprises a square base board. Multiple separating boards distributed in a longitudinally and transversely staggered mode are arranged on the upper surface of the base board. The portion above the base board is divided into a plurality of IC material placing grooves in the same size. The base board and the separating boards are connected in an integral injection molding mode. The length and the width of each IC material placing groove are identical to those of an IC material respectively so that the IC material can be firmly placed in each IC material placing groove and can be correctly grabbed by a mechanical arm. Therefore, production efficiency is improved, the novel IC pasting containing placing disc is high in pasting containing stability, and a device material throwing rate is zero; chips do not need to be frequently added in the process of production.
Description
Technical field
The utility model relates to a kind of novel I C and mounts holding tray, is particularly useful for SMT and mounts operation.
Background technology
In the SMT production process, part IC material adopts the tubular wrapping pattern, and the tradition pattern of mounting is to use the tubulose bin to mount, the tubulose bin is obliquely installed, the IC material of bin inside is arranged downslide in turn, is grasped by mechanical hand then, is welded on the specified location of pcb board.Yet adopt the tubulose bin to have following two aspect deficiencies: (1) because the tubulose bin is list structure, capacity is little, needs in the production process to add the IC material frequently, influences production efficiency; (2) width of tubulose bin is too small, can influence the IC material and glide, width is excessive, then causes the IC material to occur tilting in the inner landing process of tubulose bin easily, as shown in Figure 1, when arriving tubulose bin bottom, caused material casting by mechanical hand because of error detection, in the actual production process, tubulose bin material casting rate is 0.1～0.3%, the IC material can't use because of distortion after the material casting, influences production efficiency, causes the waste of IC material.
The utility model content
The purpose of the utility model embodiment is to propose a kind of novel I C and mounts holding tray, and it is convenient that it is simple in structure, the IC material grasps, and can effectively solve the above-mentioned technical problem that exists in the prior art.
To achieve these goals, the utility model adopts following technical scheme:
Novel I C mounts holding tray, comprise a square base plate, the upper surface of base plate is provided with a plurality of dividing plates that are criss-cross arrangement, will be described the base plate top be divided into several big or small identical IC material standing grooves, adopt the one injection moulding to be connected between base plate and the dividing plate.
Above-mentioned novel I C mounts in the holding tray, and the length of described IC material standing groove and width equate with length and the width of IC material respectively.
Above-mentioned novel I C mounts in the holding tray, and the degree of depth of described IC material standing groove is more than or equal to the height of IC material.
Above-mentioned novel I C mounts in the holding tray, and described IC material standing groove adopts 10*10 spread pattern or 10*15 spread pattern or 10*20 spread pattern.
The utility model has the advantages that:
The novel I C that the utility model is addressed mounts holding tray, its base plate is square-shaped, base plate is provided with several big or small identical IC material standing grooves, the length of this IC material standing groove and width all equate with length and the width of IC material, make the IC material in the inner placement of IC material standing groove firmly, be easy to correctly be grasped by mechanical hand, improved production efficiency, novel I C mounts holding tray and mounts the stability height, and equipment material casting rate is 0; Production process does not need frequently to add chip.
Description of drawings
Fig. 1 is the structural representation of tubulose bin in the prior art;
Fig. 2 mounts the structural representation of holding tray for novel I C among the utility model embodiment;
Fig. 3 is the side view among Fig. 2.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and the specific embodiment:
In conjunction with Fig. 2, shown in Figure 3, novel I C mounts holding tray, comprise a square base plate 1, the upper surface of base plate is provided with a plurality of dividing plates 2 that are criss-cross arrangement, base plate 1 top is divided into several big or small identical IC material standing grooves 3, adopts the one injection moulding to be connected between base plate 1 and the dividing plate 2.
The length of IC material standing groove 3 and width equate with length and the width of IC material 4 respectively, make the IC material place firmly, are convenient to mechanical hand and grasp.
The degree of depth of IC material standing groove 3 is more than or equal to the height of IC material 4.
Fig. 2 shows the IC material and places the structure chart that 3 grooves adopt the 10*15 spread pattern, and certainly, IC material standing groove can also adopt but be not limited to and adopt 10*10 spread pattern or 10*20 spread pattern.
Certainly; more than explanation only is preferred embodiment of the present utility model; the utility model is not limited to enumerate above-described embodiment; should be noted that; any those of ordinary skill in the art are under the instruction of this specification; alternative, obvious variant that all that make are equal to all drops within the essential scope of this specification, ought to be subjected to protection of the present utility model.
Claims (4)
1. novel I C mounts holding tray, it is characterized in that comprise a square base plate, the upper surface of base plate is provided with a plurality of dividing plates that are criss-cross arrangement, will be described the base plate top be divided into several big or small identical IC material standing grooves, adopt the one injection moulding to be connected between base plate and the dividing plate.
2. novel I C according to claim 1 mounts holding tray, it is characterized in that, the length of described IC material standing groove and width equate with length and the width of IC material respectively.
3. novel I C according to claim 2 mounts holding tray, it is characterized in that, the degree of depth of described IC material standing groove is more than or equal to the height of IC material.
4. novel I C according to claim 1 mounts holding tray, it is characterized in that, described IC material standing groove adopts 10*10 spread pattern or 10*15 spread pattern or 10*20 spread pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320176263 CN203185331U (en) | 2013-04-09 | 2013-04-09 | Novel IC pasting containing placing disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320176263 CN203185331U (en) | 2013-04-09 | 2013-04-09 | Novel IC pasting containing placing disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203185331U true CN203185331U (en) | 2013-09-11 |
Family
ID=49102220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320176263 Expired - Fee Related CN203185331U (en) | 2013-04-09 | 2013-04-09 | Novel IC pasting containing placing disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203185331U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302114A (en) * | 2013-11-28 | 2015-01-21 | 中国航空工业集团公司洛阳电光设备研究所 | Positioning device and method for chip mounter surface mounting bulk device |
-
2013
- 2013-04-09 CN CN 201320176263 patent/CN203185331U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302114A (en) * | 2013-11-28 | 2015-01-21 | 中国航空工业集团公司洛阳电光设备研究所 | Positioning device and method for chip mounter surface mounting bulk device |
| CN104302114B (en) * | 2013-11-28 | 2018-05-08 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of positioner and method of chip mounter surface mount device in bulk |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20140409 |