CN204268073U - A kind of semiconductor machining gas transportation facilities - Google Patents
A kind of semiconductor machining gas transportation facilities Download PDFInfo
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- CN204268073U CN204268073U CN201420639361.6U CN201420639361U CN204268073U CN 204268073 U CN204268073 U CN 204268073U CN 201420639361 U CN201420639361 U CN 201420639361U CN 204268073 U CN204268073 U CN 204268073U
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- Prior art keywords
- valve
- total
- gas
- modulating valve
- outlet pipe
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000003754 machining Methods 0.000 title claims abstract description 18
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 63
- 239000010959 steel Substances 0.000 claims abstract description 63
- 239000007789 gas Substances 0.000 claims description 93
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 66
- 229910052757 nitrogen Inorganic materials 0.000 claims description 33
- 238000010926 purge Methods 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000126 substance Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Pipeline Systems (AREA)
Abstract
The utility model discloses a kind of semiconductor machining gas transportation facilities, comprise four steel cylinders be arranged in parallel; Each described steel cylinder correspondence connects a steam outlet pipe, four described steam outlet pipes are equipped with the gas pressure sensor that is positioned at described steel cylinder air outlet place, and a modulating valve, four described modulating valve are one group with two, often group is corresponding connects a total modulating valve, two described total modulating valve connect a total steam outlet pipe simultaneously, and described total steam outlet pipe is provided with the total gas outlet valve being positioned at described total steam outlet pipe outlet port with described two stop valves that total modulating valve is connected and.Its technique effect is: it under the prerequisite not reducing gas supply, can reduce steel cylinder and change number of times, reduces the artificial contact to accessory and reduces accessory cost, reducing the cost of production of enterprise.
Description
Technical field
The utility model relates to a kind of semiconductor machining gas transportation facilities.
Background technique
Chemical gas is absolutely necessary in semiconductor processing, and safety, quickly use chemical gas are very important.And the specification of loading the steel cylinder of chemical gas differs, it is artificial for changing steel cylinder, there is certain uncertainty, current technique is that four steel cylinders are divided into two groups, this packet mode, cause and change in gas process, when test for leaks rate, when finding that gas delivery system has a leakage, can not judge in one group, which bottle steel cylinder has problem, do not coincide when may be only and install, or there is problem steel cylinder air outlet own, at this moment need to pull down again and again to reinstall to investigate problem points with this, long-term so operation, the aging of pipeline and interface in gas transportation facilities can be accelerated, fittings cost is caused to increase.
By being equipped with a set of gas pressure sensor for often organizing steel cylinder, two steel cylinders be can be regarded as an entirety, and in steel cylinder, gas pressure is lower than limit value alarm, and alarm times only has twice, only needs people for checking once.But grouping must wait two steel cylinders to be all finished and could to change like this, but when changing, the quality of new steel cylinder is not judged accurately.Therefore use this packet mode, cause artificial waste equally, and increase the loss speed of interface, cause related accessory life cycle to reduce, increase correlative charges.
Model utility content
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of semiconductor machining gas transportation facilities is provided, under the prerequisite not reducing gas supply, steel cylinder can be reduced and change number of times, reduce the artificial contact to accessory and reduce accessory cost, reducing the cost of production of enterprise.
A kind of technological scheme realizing above-mentioned purpose is: a kind of semiconductor machining gas transportation facilities, comprises four steel cylinders be arranged in parallel;
Each described steel cylinder correspondence connects a steam outlet pipe, four described steam outlet pipes are equipped with the gas pressure sensor that is positioned at described steel cylinder air outlet place, and a modulating valve, four described modulating valve are one group with two, often group is corresponding connects a total modulating valve, two described total modulating valve connect a total steam outlet pipe simultaneously, and described total steam outlet pipe is provided with the total gas outlet valve being positioned at described total steam outlet pipe outlet port with described two stop valves that total modulating valve is connected and.
Further, this gas transportation facilities also comprises a set of gas pressure and maintains equipment, comprise nitrogen inlet duct, switching valve and air shooter, described nitrogen inlet duct is provided with nitrogen suction valve, described nitrogen inlet duct is connected with described switching valve, one end of described air shooter connects described switching valve, one end is connected with described total steam outlet pipe between described stop valve and described total gas outlet valve in addition, described air shooter is provided with a gas flow regulating valve, and described switching valve is connected by circuit with described four modulating valve.
Further, described switching valve is also connected with an air intake duct.
Further, this gas transportation facilities also comprises a set of gas purge system, described gas purge system comprises two outlet valves and a total outlet valve, two described outlet valves are corresponding with between two described total modulating valve to be connected by an outlet pipe, by a total air escape pipe connection between described total outlet valve and two described outlet valves.
Have employed the technological scheme of a kind of semiconductor machining gas transportation facilities of the present utility model, namely comprise four steel cylinders be arranged in parallel; Each described steel cylinder correspondence connects a steam outlet pipe, four described steam outlet pipes are equipped with the gas pressure sensor that is positioned at described steel cylinder air outlet place, and a modulating valve, four described modulating valve are one group with two, often group is corresponding connects a total modulating valve, two described total modulating valve connect a total steam outlet pipe simultaneously, and described total steam outlet pipe is provided with the technological scheme of the total gas outlet valve being positioned at described total steam outlet pipe outlet port with described two stop valves that total modulating valve is connected and.Its technique effect is: it under the prerequisite not reducing gas supply, can reduce steel cylinder and change number of times, reduces the artificial contact to accessory and reduces accessory cost, reducing the cost of production of enterprise.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of semiconductor machining gas transportation facilities of the present utility model.
Embodiment
Refer to Fig. 1, inventor of the present utility model, in order to understand the technical solution of the utility model better, below by embodiment particularly, and is described in detail by reference to the accompanying drawings:
Refer to Fig. 1, a kind of semiconductor machining gas transportation facilities of the present utility model, comprise the first steel cylinder 11, second steel cylinder 12, the 3rd steel cylinder 13 and the 4th steel cylinder 14.First steel cylinder 11 connects the first steam outlet pipe, and the second steel cylinder 12 connects the second steam outlet pipe, and the 3rd steel cylinder 13 connects the 3rd steam outlet pipe, and the 4th steel cylinder 14 connects the 4th steam outlet pipe.First steam outlet pipe is provided with the first modulating valve 31 and is positioned at the first gas pressure sensor 21 at the first steel cylinder 11 air outlet place, second steam outlet pipe is provided with the second modulating valve 32 and is positioned at the second gas pressure sensor 22 at the second steel cylinder 12 air outlet place, the 3rd gas pressure sensor the 23, four steam outlet pipe that 3rd steam outlet pipe is provided with the 3rd modulating valve 33 and is positioned at the 3rd steel cylinder 13 air outlet place is provided with the 4th modulating valve 34 and is positioned at the 4th gas pressure sensor 24 at the 4th steel cylinder 14 air outlet place.First gas pressure sensor 21, second gas pressure sensor the 22, three gas pressure sensor the 23, four gas pressure sensor 14, in order to detect the gas pressure in the first steel cylinder 11, second steel cylinder 12, the 3rd steel cylinder 13 and the 4th steel cylinder 14.
First modulating valve 31 and the second modulating valve 32 are connected first total modulating valve 41 simultaneously, 3rd modulating valve 33 and the 4th modulating valve 34 are connected second total modulating valve 42 simultaneously, first total modulating valve 41 is connected total steam outlet pipe 51 with second total modulating valve 42 simultaneously, total steam outlet pipe 51 is provided with the stop valve 52 that modulating valve 41 total with first and second total modulating valve 42 are connected, and be positioned at total gas outlet valve 53 in total steam outlet pipe 51 outlet port, from the station of the nitrogen flow direction in order to process semiconductor that total steam outlet pipe 51 flows out.
This semiconductor machining gas transportation facilities also comprises a set of gas pressure and maintain equipment, to maintain the first modulating valve 31, second modulating valve 32, the 3rd total modulating valve 33, the 4th modulating valve 34, and the total modulating valve 43 of first total modulating valve 41, second, and desired pressure is done in the normal work of stop valve 52.This system comprises nitrogen inlet duct 61, switching valve 62 and air shooter 63, nitrogen inlet duct 61 is provided with nitrogen suction valve 64, in order to regulate the flow of nitrogen, air shooter 63 one end connects switching valve 62, and one end is connected with total steam outlet pipe 51 between total gas outlet valve 53 and stop valve 52 in addition.Air shooter 63 is provided with a gas flow regulating valve 65, switching valve 62 is also connected with an air intake duct 66.
This semiconductor machining gas transportation facilities also comprises a set of gas purge system, comprise first row air valve 71, second row air valve 72 and a total outlet valve 73, first row air valve 71 is connected with first total modulating valve 41 and second total modulating valve 42 with second exhaust pipe by downtake pipe with second row air valve 72 correspondence, total outlet valve 73 and first row air valve 71, and connected by a total air escape pipe between second row air valve 72.
When this semiconductor machining gas transportation facilities air feed normal to the station processed semiconductor, air intake duct 66 is closed by switching valve 62, nitrogen inlet duct 61 is opened, first modulating valve 31, second modulating valve 32, the 3rd modulating valve 33, the total modulating valve 42 of the 4th modulating valve 34, first total modulating valve 41, second are opened, stop valve 52 is opened, and first row air valve 71, second row air valve 72 and total outlet valve 73 are closed.
First gas pressure sensor 21 connects the first steel cylinder 11, detect the gas pressure in the first steel cylinder 11, second gas pressure sensor 22 connects the second steel cylinder 12, detect the atmospheric pressure in the second steel cylinder 12, 3rd gas pressure sensor 23 connects the 3rd steel cylinder 13, detect the gas pressure in the 3rd steel cylinder 13, 4th gas pressure sensor 24 connects the 4th steel cylinder 14, detect the gas pressure in the 4th steel cylinder 14, as long as change steel cylinder all read data on a gas pressure sensor at every turn, so also can change steel cylinder when three steel cylinders are all empty, namely steel cylinder is changed more flexible for opportunity, first steel cylinder 11, second steel cylinder 12, when in 3rd steel cylinder 13 and the 4th steel cylinder 14, gas is finished, corresponding modulating valve or total modulating valve are closed.The position of the steel cylinder of judgement leakage is in time convenient in such design simultaneously, and therefore it under the prerequisite not reducing gas supply, can reduce steel cylinder and change number of times, reduces the artificial contact to accessory and reduces accessory cost, the cost of production of reduction enterprise.
When in detecting first steel cylinder 11 during gas pressure, first gas pressure sensor 21 is opened, second gas pressure sensor 22, the 3rd gas pressure sensor 23, the 4th gas pressure sensor 24 are closed, switching valve 62 is communicated with nitrogen inlet duct 61, nitrogen suction valve 64 and stop valve 52 are opened, nitrogen in nitrogen inlet duct 61 pours, and gives the first gas pressure sensor 21 and measures required air pressure.
When in detecting second steel cylinder 12 during gas pressure, second gas pressure sensor 22 is opened, first gas pressure sensor 21, the 3rd gas pressure sensor 23 and the 4th gas pressure sensor 24 are closed, switching valve 62 is communicated with nitrogen inlet duct 61, nitrogen suction valve 64 and stop valve 52 are opened, nitrogen in nitrogen inlet duct 61 pours, and gives the second gas pressure sensor 22 and measures required air pressure.
When in detecting the 3rd steel cylinder 13 during gas pressure, 3rd gas pressure sensor 23 is opened, second gas pressure sensor 22, first gas pressure sensor 21 and the 4th gas pressure sensor 24 are closed, switching valve 62 is communicated with nitrogen inlet duct 61, nitrogen suction valve 64 and stop valve 52 are opened, nitrogen in nitrogen inlet duct 61 pours, and gives the 3rd gas pressure sensor 23 and measures required air pressure.
When in detecting the 4th steel cylinder 14 during gas pressure, 4th gas pressure sensor 24 is opened, second gas pressure sensor 22, the 3rd gas pressure sensor 23 and the first gas pressure sensor 21 are closed, switching valve 62 is communicated with nitrogen inlet duct 61, nitrogen suction valve 64 and stop valve 52 are opened, nitrogen in nitrogen inlet duct 61 pours, and gives the 4th pressure detection device 24 and measures required air pressure.
When this semiconductor machining gas transportation facilities is safeguarded, air intake duct 66 is opened by switching valve 62, nitrogen inlet duct 61 is closed, first modulating valve 31, second modulating valve 32, the 3rd modulating valve 33, the total modulating valve 42 of the 4th modulating valve 34, first total modulating valve 41, second are closed, stop valve 52 is closed, pass into air, to prevent the damage of switching valve 62.
When this semiconductor machining gas transportation facilities will be restarted, air intake duct 66 is closed by switching valve 62, nitrogen inlet duct 61 is opened, first modulating valve 31, second modulating valve 32, the 3rd modulating valve 33, the 4th modulating valve 34 are opened, the total modulating valve 42 of first total modulating valve 41, second cuts out, stop valve 52 is opened, and first row air valve 71 and second row air valve 72 and total outlet valve 73 are opened, to make to be full of nitrogen in whole pipeline.
Those of ordinary skill in the art will be appreciated that, above embodiment is only used to the utility model is described, and be not used as restriction of the present utility model, as long as in spirit of the present utility model, all will drop in Claims scope of the present utility model the change of the above embodiment, modification.
Claims (4)
1. a semiconductor machining gas transportation facilities, comprises four steel cylinders be arranged in parallel; It is characterized in that:
Each described steel cylinder correspondence connects a steam outlet pipe, four described steam outlet pipes are equipped with the gas pressure sensor that is positioned at described steel cylinder air outlet place, and a modulating valve, four described modulating valve are one group with two, often group is corresponding connects a total modulating valve, two described total modulating valve connect a total steam outlet pipe simultaneously, and described total steam outlet pipe is provided with the total gas outlet valve being positioned at described total steam outlet pipe outlet port with described two stop valves that total modulating valve is connected and.
2. a kind of semiconductor machining gas transportation facilities according to claim 1, it is characterized in that: this gas transportation facilities also comprises a set of gas pressure and maintains equipment, comprise nitrogen inlet duct, switching valve and air shooter, described nitrogen inlet duct is provided with nitrogen suction valve, described nitrogen inlet duct is connected with described switching valve, one end of described air shooter connects described switching valve, one end is connected with described total steam outlet pipe between described stop valve and described total gas outlet valve in addition, described air shooter is provided with a gas flow regulating valve, described switching valve is connected by circuit with described four modulating valve.
3. a kind of semiconductor machining gas transportation facilities according to claim 2, is characterized in that: described switching valve is also connected with an air intake duct.
4. a kind of semiconductor machining gas transportation facilities according to claim 1, it is characterized in that: this gas transportation facilities also comprises a set of gas purge system, described gas purge system comprises two outlet valves and a total outlet valve, two described outlet valves are corresponding with between two described total modulating valve to be connected by an outlet pipe, by a total air escape pipe connection between described total outlet valve and two described outlet valves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420639361.6U CN204268073U (en) | 2014-10-30 | 2014-10-30 | A kind of semiconductor machining gas transportation facilities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420639361.6U CN204268073U (en) | 2014-10-30 | 2014-10-30 | A kind of semiconductor machining gas transportation facilities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204268073U true CN204268073U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420639361.6U Expired - Lifetime CN204268073U (en) | 2014-10-30 | 2014-10-30 | A kind of semiconductor machining gas transportation facilities |
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| Country | Link |
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| CN (1) | CN204268073U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105439067A (en) * | 2015-11-24 | 2016-03-30 | 南京国盛电子有限公司 | Trichlorosilane supply device suitable for 8-inch silicon epitaxy process system |
-
2014
- 2014-10-30 CN CN201420639361.6U patent/CN204268073U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105439067A (en) * | 2015-11-24 | 2016-03-30 | 南京国盛电子有限公司 | Trichlorosilane supply device suitable for 8-inch silicon epitaxy process system |
| CN105439067B (en) * | 2015-11-24 | 2018-06-29 | 南京国盛电子有限公司 | Suitable for the trichlorosilane feeding mechanism of 8 inches of silicon epitaxy process systems |
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