CN204216795U - For the elementary cell of multi-level converter, three level and m level topological structure - Google Patents
For the elementary cell of multi-level converter, three level and m level topological structure Download PDFInfo
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Abstract
Description
技术领域technical field
本实用新型属于电工、电力电子、电机应用的技术领域,具体来说,涉及用于多电平变换器的基本单元、三电平和m电平拓扑结构。The utility model belongs to the technical field of electric engineering, power electronics and motor application, and specifically relates to a basic unit, a three-level and an m-level topological structure for a multilevel converter.
背景技术Background technique
当前,电压源型两电平拓扑结构逆变系统已被广泛应用于电机驱动、轨道交通、电能转换等众多工业领域,然而这种拓扑结构的逆变系统承受电压应力高、dv/dt较大、输出电流谐波畸变率高、输出滤波器体积大等局限。At present, the voltage source two-level topology inverter system has been widely used in many industrial fields such as motor drive, rail transit, and electric energy conversion. However, this topology inverter system withstands high voltage stress and large dv/dt , High harmonic distortion rate of output current, large volume of output filter and other limitations.
采用电压源型多电平拓扑结构逆变系统可以很好地解决两电平变换器带来的不足。然而在传统几类多电平逆变系统中,不同的多电平拓扑结构除了具有输出最多电平数只能为奇数外,还具有特定的缺点:(1)二极管箝位型多电平拓扑结构虽然采用的开关器件少,但是同一桥臂不同功率器件损耗不均衡,模块化程度弱,需要大量箝位二极管。(2)飞跨电容型多电平拓扑结构采用的开关器件少,但是需要大量的飞跨电容。(3)级联H桥型多电平拓扑结构需要开关器件多,而且需要隔离的直流电压源。(4)有源箝位型和P2通用型多电平拓扑结构:虽然可以解决二极管箝位型多电平变换器的功率损耗不平衡问题,并具有模块化等优势,但是所含开关器件多。Using the voltage source type multi-level topology inverter system can well solve the shortcomings brought about by the two-level converter. However, in several types of traditional multi-level inverter systems, different multi-level topologies not only have the maximum number of output levels that can only be odd, but also have specific disadvantages: (1) Diode-clamped multi-level topology Although the structure uses fewer switching devices, the loss of different power devices in the same bridge arm is uneven, and the degree of modularization is weak, requiring a large number of clamping diodes. (2) Flying-capacitor-type multilevel topology uses fewer switching devices, but requires a large number of flying-capacitors. (3) The cascaded H-bridge multi-level topology requires many switching devices and an isolated DC voltage source. (4) Active clamp type and P2 general-purpose multilevel topology: Although it can solve the power loss imbalance problem of the diode clamp type multilevel converter, and has the advantages of modularization, but it contains many switching devices .
在中低压应用场合,考虑到成本的成倍增加,通常采用两电平拓扑结构,而通过增加开关频率、采用输出滤波措施来达到相应的性能指标,这种方式具有损耗大、效率低、体积大等缺点。In medium and low voltage applications, considering the multiplication of cost, two-level topology is usually adopted, and the corresponding performance index is achieved by increasing the switching frequency and adopting output filtering measures. This method has the advantages of large loss, low efficiency, and size Big and other shortcomings.
在中高压大功率应用场合,采用上述(1)-(3)类拓扑结构时,则不得不解决大量飞跨电容、大量箝位二极管、大量隔离直流电源带来的问题。而采用有源箝位型或者P2通用型多电平拓扑结构,开关器件的增多在增加系统控制复杂性的同时,还会导致驱动电路和缓冲电路数量的增加,以及成本的增加。In medium-high voltage and high-power applications, when using the topologies (1)-(3) above, problems caused by a large number of flying capacitors, a large number of clamping diodes, and a large number of isolated DC power supplies have to be solved. However, if the active clamp type or P2 general-purpose multi-level topology is adopted, the increase of switching devices will not only increase the complexity of system control, but also lead to an increase in the number of driving circuits and buffer circuits, as well as an increase in cost.
与传统两电平逆变器拓扑结构相比,新型简化二极管箝位型三电平拓扑结构降低了系统复杂型,但具有传统I型三电平逆变器输出电流谐波畸变率小,dv/dt小的优点,并具有传统T型三电平相同的电压应力。简化二极管箝位型三电平拓扑结构具有两种可选的演变型拓扑结构,它们都采用有源换流方式,可用于解决功率损耗不平衡问题。Compared with the traditional two-level inverter topology, the new simplified diode-clamped three-level topology reduces the complexity of the system, but has the traditional I-type three-level inverter output current harmonic distortion rate is small, dv /dt is small, and has the same voltage stress as the traditional T-type three-level. The simplified diode-clamped three-level topology has two optional evolution topologies, both of which use active commutation, which can be used to solve the power loss imbalance problem.
与传统的多电平变换器拓扑结构相比,本实用新型提出的通用型多电平变换器拓扑结构模块化程度高、可扩展性好、开关器件数量少、结构简单,可解决功率损耗不均衡问题,并保留了传统多电平变换器的优势。Compared with the traditional multi-level converter topology, the general-purpose multi-level converter topology proposed by the utility model has a high degree of modularization, good scalability, a small number of switching devices, and a simple structure, which can solve the problem of power loss. Balance issues, and retain the advantages of traditional multilevel converters.
实用新型内容Utility model content
技术问题:本实用新型所要解决的技术问题是:提供一种用于多电平变换器的基本单元,该基本单元具备三个端子,可形成三种不同类型的双向电流路径,可以解决现有结构基本单元中电流路径单一的问题,更易形成多电平。还提供基于上述基本单元的三电平拓扑结构,该结构所用器件数量少,输出电平数多,具有传统T型三电平结构相同的电压应力,并可以解决传统两电平结构用于大功率场合开关频率低、电流谐波畸变率高,输出滤波器体积大,损耗不均衡等问题;以及提供基于上述基本单元的m电平拓扑结构,该结构省去了二极管箝位多电平结构中大量的箝位器件,并可以解决箝位型多电平拓扑结构中的损耗不均衡问题,并具备更高的容错能力。该结构还可以解决飞跨电容型及级联型多电平结构大量的独立电源及飞跨电容问题。由于该结构采用模块化设计,可以降低维护和安装的成本。由于该结构采用功率器件少,可以简化调制策略的设计。Technical problem: The technical problem to be solved by this utility model is: to provide a basic unit for a multilevel converter, the basic unit has three terminals, which can form three different types of bidirectional current paths, which can solve the existing The problem of a single current path in the basic unit of the structure makes it easier to form multiple levels. It also provides a three-level topology based on the above-mentioned basic unit. This structure uses a small number of devices and a large number of output levels. It has the same voltage stress as the traditional T-type three-level structure, and can solve the traditional two-level structure for large Low switching frequency, high current harmonic distortion rate, large output filter, unbalanced loss and other issues in power applications; and provide an m-level topology based on the above-mentioned basic unit, which eliminates the need for a diode-clamped multi-level structure There are a large number of clamping devices in it, and it can solve the problem of unbalanced loss in the clamping multilevel topology, and has higher fault tolerance. This structure can also solve the problem of a large number of independent power supplies and flying capacitors in the flying capacitor type and the cascaded multilevel structure. Due to the modular design of the structure, maintenance and installation costs can be reduced. Since the structure uses few power devices, the design of the modulation strategy can be simplified.
技术方案:为解决上述技术问题,本实用新型采用的技术方案是:Technical solution: In order to solve the above-mentioned technical problems, the technical solution adopted in the utility model is:
一种用于多电平变换器的基本单元,该基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧和两个二极管之间引出三个接线端。A basic unit for a multilevel converter, the basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in series and antiparallel to both sides of the insulated gate bipolar transistor. Three terminals are drawn from both sides of the polar transistor and between the two diodes.
一种采用上述的基本单元的三电平拓扑结构,该拓扑结构包括第一直流电压源、母线电容组件和第一变换器桥臂;母线电容组件包括两个串联的母线电容,母线电容组件并联到第一直流电压源的两端,第一直流电压源由母线电容组件分出P电位、O电位和N电位三种电位,其中,O电位位于两个母线电容的中间,P电位位于直流电压源的正极,N电位位于直流电压源的负极;变换器桥臂包括P电平单元、O电平单元和N电平单元,所述的P电平单元、O电平单元和N电平单元分别采用基本单元结构构成,该基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧设有第一接线端和第二接线端,两个二极管之间设有第三接线端;O电平单元的第一接线端和P电平单元的第三接线端连接,O电平单元的第二接线端和N电平单元的第三接线端连接,O电平单元的第三接线端和O电位连接;P电平单元的第一接线端和P电位连接,P电平单元的第二接线端和N电平单元的第一接线端连接,N电平单元的第二接线端和N电位连接;第一变换器桥臂的输出端由P电平单元的第二接线端和N电平单元的第一接线端连接处引出。A three-level topology using the above-mentioned basic unit, the topology includes a first DC voltage source, a bus capacitor component and a first converter bridge arm; the bus capacitor component includes two bus capacitors connected in series, and the bus capacitor components are connected in parallel To the two ends of the first DC voltage source, the first DC voltage source is divided into three potentials: P potential, O potential and N potential by the bus capacitor component, wherein the O potential is located in the middle of the two bus capacitors, and the P potential is located in the DC voltage The positive pole of the source, the N potential is located at the negative pole of the DC voltage source; the bridge arm of the converter includes a P level unit, an O level unit and an N level unit, and the P level unit, O level unit and N level unit The basic unit structure is respectively adopted. The basic unit includes an insulated gate bipolar transistor and two diodes. The two diodes are connected in series and antiparallel to both sides of the IGBT. There are a first terminal and a second terminal, and a third terminal is provided between the two diodes; the first terminal of the O level unit is connected to the third terminal of the P level unit, and the third terminal of the O level unit The second terminal is connected to the third terminal of the N level unit, the third terminal of the O level unit is connected to the O potential; the first terminal of the P level unit is connected to the P potential, and the second terminal of the P level unit is connected to the O potential. The terminal is connected to the first terminal of the N level unit, and the second terminal of the N level unit is connected to the N potential; the output end of the first converter bridge arm is connected by the second terminal of the P level unit to the N potential. Lead out from the first terminal connection of the flat unit.
进一步,所述的O电平单元还包括一个绝缘栅双极型晶体管;两个绝缘栅双极型晶体管串联,形成第一绝缘栅双极型晶体管组件,O电平单元中的两个二极管串联后反向并联至第一绝缘栅双极型晶体管组件的两侧,在第一绝缘栅双极型晶体管组件两侧引出第一接线端和第二接线端,两个二极管之间引出第三接线端,两个绝缘栅双极型晶体管之间引出第四接线端;O电平单元的第四接线端和第一变换器桥臂的输出端连接。Further, the O-level unit also includes an IGBT; two IGBTs are connected in series to form a first IGBT assembly, and the two diodes in the O-level unit are connected in series Then reverse parallel to both sides of the first insulated gate bipolar transistor assembly, lead out the first terminal and the second terminal on both sides of the first insulated gate bipolar transistor component, and lead out the third connection between the two diodes The fourth terminal is drawn between the two IGBTs; the fourth terminal of the O-level unit is connected to the output terminal of the first converter bridge arm.
进一步,所述的O电平单元还包括一个绝缘栅双极型晶体管;两个绝缘栅双极型晶体管串联,形成第二绝缘栅双极型晶体管组件,O电平单元中的两个二极管串联后反向并联至第二绝缘栅双极型晶体管组件的两侧,在第二绝缘栅双极型晶体管组件两侧引出第一接线端和第二接线端,两个二极管之间引出第三接线端,两个绝缘栅双极型晶体管之间引出第四接线端;O电平单元的第四接线端和O电位连接。Further, the O-level unit also includes an IGBT; two IGBTs are connected in series to form a second IGBT component, and the two diodes in the O-level unit are connected in series Then reversely connect to both sides of the second insulated gate bipolar transistor assembly, draw the first terminal and the second terminal on both sides of the second insulated gate bipolar transistor assembly, and draw the third wiring between the two diodes The fourth terminal is drawn between the two insulated gate bipolar transistors; the fourth terminal of the O level unit is connected to the O potential.
一种含有上述的基本单元的m电平拓扑结构,该拓扑结构包括第二变换器桥臂、第二二极管串联组件、第二母线电容串联组件和第二直流电压源;第二母线电容串联组件由m-1个母线电容串联组成,第二母线电容串联组件并联于第二直流电压源的两端,将直流电源分出m种电位节点,第1至m电位位于第二母线电容串联组件的连接点,且第1电位位于第二直流电压源的正极,第m电位位于第二直流电压源的负极;第二二极管串联组件包括2m个二极管,第二二极管串联组件中的奇数节点与第二母线电容串联组件的第1~m电位节点依次连接;第二变换器桥臂包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个;基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端;在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第一变换器桥臂的输出端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第二二极管串联组件中的偶数电位节点连接;m的取值范围为大于2的整数。An m-level topological structure containing the above basic unit, the topological structure includes a second converter bridge arm, a second diode series assembly, a second bus capacitor series assembly and a second DC voltage source; the second bus capacitor The series component is composed of m-1 bus capacitors connected in series, and the second bus capacitor series component is connected in parallel to both ends of the second DC voltage source, and the DC power is divided into m potential nodes, and the first to m potentials are located in the second bus capacitor series The connection point of the components, and the first potential is located at the positive pole of the second DC voltage source, and the mth potential is located at the negative pole of the second DC voltage source; the second diode series assembly includes 2m diodes, in the second diode series assembly The odd-numbered nodes of the second busbar capacitance series components are connected in turn to the 1st~m potential nodes; the second converter bridge arm includes m level layers, the first level layer contains a basic unit, and the mth level layer Contains m basic units, and the number of basic units contained in each level layer gradually increases by 1 as the number of layers increases; the basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in series and antiparallel to the insulated On both sides of the gate bipolar transistor, the first terminal and the second terminal are drawn on both sides of the insulated gate bipolar transistor, and the third terminal is drawn between the two diodes; in each level layer, the basic unit The first terminal of the basic unit is connected to the third terminal of a basic unit located in the next level layer, and the second terminal of the basic unit is connected to the third terminal of another basic unit located in the next level layer , the third terminal of the basic unit is connected to the first or second terminal of the basic unit in the previous level layer; the third terminal of the basic unit in the first level layer is connected to the first converter The output end of the bridge arm is connected; the first terminal and the second connection of the basic unit located at the mth level layer are respectively connected to the even-numbered potential nodes in the second diode series assembly; the value range of m is greater than 2 an integer of .
一种含有上述的基本单元的m电平拓扑结构,该拓扑结构包括第三变换器桥臂、第三二极管串联组件、第三母线电容串联组件和第三直流电压源;第三母线电容串联组件由m-1个母线电容串联组成,第三母线电容串联组件并联于第三直流电压源的两端,将直流电源分出m种电位节点,第1至m电位位于第三母线电容串联组件的连接点,且第1电位位于第三直流电压源的正极,第m电位位于第三直流电压源的负极;第三二极管串联组件包括2m-4个二极管,位于第三二极管串联组件中的奇数节点与第三母线电容串联组件中的第2~m-1电位节点依次连接;第三变换器桥臂包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个;所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端;在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第三变换器桥臂的输出端连接;位于第m个电平层的第一个基本单元的第一接线端和第三直流电压源的正极连接,位于第m个电平层的第m个基本单元的第二接线端和第三直流电压源的负极连接,位于第m个电平层的第一个基本单元的第二接线端、第m个基本单元的第一接线端,以及第2~m-1个基本单元的第一接线端和第二接线分别与第三二极管串联组件中的偶数电位节点连接;m的取值范围为大于2的整数。An m-level topological structure containing the above basic unit, the topological structure includes a third converter bridge arm, a third diode series assembly, a third bus capacitor series assembly and a third DC voltage source; the third bus capacitor The series component is composed of m-1 bus capacitors connected in series. The third bus capacitor series component is connected in parallel to both ends of the third DC voltage source, and the DC power is divided into m potential nodes. The first to m potentials are located in the third bus capacitor series connection. The connection point of the component, and the first potential is located at the positive pole of the third DC voltage source, and the mth potential is located at the negative pole of the third DC voltage source; the third diode series assembly includes 2m-4 diodes, located at the third diode The odd-numbered nodes in the series components are sequentially connected to the 2nd~m-1 potential nodes in the third bus capacitor series components; the third converter bridge arm includes m level layers, and the first level layer contains a basic unit, The mth level layer contains m basic units, and the number of basic units contained in each level layer gradually increases by one as the number of layers increases; the basic unit includes an insulated gate bipolar transistor and two diodes, and the two After two diodes are connected in series, they are antiparallel connected to both sides of the insulated gate bipolar transistor, the first terminal and the second terminal are drawn out on both sides of the insulated gate bipolar transistor, and the third terminal is drawn between the two diodes; In each level layer, the first terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer, and the second terminal of the basic unit is connected to another terminal in the next level layer. The third terminal of a basic unit is connected, the third terminal of the basic unit is connected to the first terminal or the second terminal of the basic unit in the previous level layer; the basic unit in the first level layer The third terminal is connected to the output terminal of the third converter bridge arm; the first terminal of the first basic unit located at the mth level layer is connected to the positive pole of the third DC voltage source, located at the mth level The second terminal of the mth basic unit of the layer is connected to the negative pole of the third DC voltage source, the second terminal of the first basic unit of the mth level layer, the first connection of the mth basic unit terminals, and the first terminal and the second connection of the 2nd to m-1 basic units are respectively connected to the even-numbered potential nodes in the third diode series assembly; the value range of m is an integer greater than 2.
一种含有上述的基本单元的m电平拓扑结构,该拓扑结构包括第四变换器桥臂、第四二极管串联组件、第四母线电容串联组件和第四直流电压源;第四母线电容串联组件由m-1个母线电容串联组成,第四母线电容串联组件并联于第四直流电压源的两端,将直流电源分出m种电位节点,第1至m电位位于第四母线电容串联组件的连接点,且第1电位位于第四直流电压源的正极,第m电位位于第四直流电压源的负极;第四二极管串联组件包括2m个二极管,第四二极管串联组件中的奇数节点与第四母线电容串联组件的第1~m电位节点依次连接;第四变换器桥臂包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个,且第3至m-1个电平层中的第2至k-1的基本单元中的绝缘栅双极型晶体管被移除,k表示所在的电平层层数;基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端;在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第四变换器桥臂的输出端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第四二极管串联组件中的偶数电位节点连接;m的取值范围为大于2的整数。An m-level topological structure containing the above basic unit, the topological structure includes a fourth converter bridge arm, a fourth diode series assembly, a fourth bus capacitor series assembly and a fourth DC voltage source; the fourth bus capacitor The series component is composed of m-1 bus capacitors connected in series, the fourth bus capacitor series component is connected in parallel to both ends of the fourth DC voltage source, and the DC power is divided into m potential nodes, and the 1st to m potentials are located in the fourth bus capacitor series The connection point of the components, and the first potential is located at the positive pole of the fourth DC voltage source, and the mth potential is located at the negative pole of the fourth DC voltage source; the fourth diode series assembly includes 2m diodes, and in the fourth diode series assembly The odd-numbered nodes of the fourth busbar capacitance series component are connected in turn to the 1st~m potential nodes; the fourth converter bridge arm includes m level layers, the first level layer contains a basic unit, and the mth level layer Contains m basic units, the number of basic units contained in each level layer gradually increases by 1 as the number of layers increases, and the 2nd to k-1 basic units in the 3rd to m-1 level layers The insulated gate bipolar transistor is removed, and k represents the number of level layers; the basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in parallel to the two insulated gate bipolar transistors in series. On the side of the IGBT, the first terminal and the second terminal are drawn on both sides of the IGBT, and the third terminal is drawn between the two diodes; in each level layer, the first terminal of the basic unit and the The third terminal of a basic unit located in the next level layer is connected, the second terminal of the basic unit is connected with the third terminal of another basic unit located in the next level layer, and the third terminal of the basic unit The terminal is connected to the first terminal or the second terminal of the basic unit located in the upper level layer; the third terminal of the basic unit located in the first level layer is connected to the output terminal of the fourth converter bridge arm ; The first connection terminal and the second connection of the basic unit located in the mth level layer are respectively connected to the even-numbered potential nodes in the fourth diode series assembly; the value range of m is an integer greater than 2.
一种含有上述的基本单元的m电平拓扑结构,该拓扑结构包括第五变换器桥臂、第五二极管串联组件、第五母线电容串联组件和第五直流电压源;第五母线电容串联组件由m-1个母线电容串联组成,第五母线电容串联组件并联于第五直流电压源的两端,将直流电源分出m种电位节点,第1至m电位位于第五母线电容串联组件的连接点,且第1电位位于第五直流电压源的正极,第m电位位于第五直流电压源的负极;第五二极管串联组件包括2m个二极管,第五二极管串联组件中的奇数节点与第五母线电容串联组件的第1~m电位节点依次连接;第五变换器桥臂包括m-1个电平层,第1和2个电平层为两电平基本单元,第3个电平层包含3个基本单元,第m个电平层包含m个基本单元,从第4~m个电平层中,每个电平层中包含的基本单元数量随层数增加逐渐增加1个;所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端;所述的两电平基本单元包括两个绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至两个串联的绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端,并将串联二极管的中间连接点与串联绝缘栅双极型晶体管的中间连接点连接;两电平基本单元的第一接线端与第3个电平层的第1基本单元的第三接线端连接,两电平基本单元的第二接线端与第3个电平层的第2基本单元的第三接线端连接,两电平基本单元的第三接线端与第3个电平层的第3基本单元的第三接线端连接;变换器桥臂的输出端两电平基本单元的第三接线端引出;在第4至m个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第五二极管串联组件中的偶数电位节点连接;m的取值范围为大于2的整数。An m-level topology structure containing the above-mentioned basic unit, the topology structure includes a fifth converter bridge arm, a fifth diode series assembly, a fifth bus capacitor series assembly, and a fifth DC voltage source; the fifth bus capacitor The series component is composed of m-1 bus capacitors connected in series, the fifth bus capacitor series component is connected in parallel to both ends of the fifth DC voltage source, and the DC power is divided into m potential nodes, and the first to m potentials are located in the fifth bus capacitor series The connection point of the component, and the first potential is located at the positive pole of the fifth DC voltage source, and the mth potential is located at the negative pole of the fifth DC voltage source; the fifth diode series assembly includes 2m diodes, and in the fifth diode series assembly The odd-numbered nodes of the fifth bus capacitor series components are connected in turn to the 1st~m potential nodes; the fifth converter bridge arm includes m-1 level layers, and the first and second level layers are two-level basic units. The third level layer contains 3 basic units, and the mth level layer contains m basic units. From the 4th to m level layers, the number of basic units contained in each level layer increases with the number of layers Gradually increase by 1; the basic unit includes an IGBT and two diodes, the two diodes are connected in series and antiparallel to both sides of the IGBT, and are drawn out on both sides of the IGBT The first connection terminal and the second connection terminal lead out the third connection terminal between the two diodes; the two-level basic unit includes two insulated gate bipolar transistors and two diodes, and the two diodes are connected in series to reverse connected in parallel to both sides of the two insulated gate bipolar transistors in series, the first terminal and the second terminal are drawn out on both sides of the insulated gate bipolar transistor, the third terminal is drawn between the two diodes, and the The middle connection point of the series diode is connected to the middle connection point of the series insulated gate bipolar transistor; the first terminal of the two-level basic unit is connected to the third terminal of the first basic unit of the third level layer, and the two The second terminal of the level basic unit is connected to the third terminal of the second basic unit of the third level layer, and the third terminal of the two-level basic unit is connected to the third basic unit of the third level layer The third terminal of the converter bridge arm is connected to the third terminal of the two-level basic unit; in the 4th to m level layers, the first terminal of the basic unit is located at the next level The third terminal of a basic unit in the layer is connected, the second terminal of the basic unit is connected to the third terminal of another basic unit in the next level layer, the third terminal of the basic unit is connected to the The first connection terminal or the second connection terminal of the basic unit in a level layer is connected; Potential node connection; the value range of m is an integer greater than 2.
有益效果:与现有技术相比,本实用新型具有以下有益效果:Beneficial effects: compared with the prior art, the utility model has the following beneficial effects:
1、由于本实用新型采用绝缘栅双极型晶体管和双反并联二极管作为基本组成单元,构成电流的双向流通路径,具备功率的双向传输能力。1. Since the utility model adopts an insulated gate bipolar transistor and a double anti-parallel diode as basic components, it constitutes a bidirectional current flow path and has bidirectional power transmission capability.
2、本实用新型中的新型简化二极管箝位型三电平变换器拓扑结构开关器件少,并具备传统三电平同样的性能,具有比传统两电平变换器拓扑结构更低的输出电流THD。2. The new simplified diode-clamped three-level converter topology in the utility model has fewer switching devices, and has the same performance as the traditional three-level converter, and has a lower output current THD than the traditional two-level converter topology .
3、本实用新型中由新型简化二极管箝位型三电平变换器拓扑结构演变而成的新型有源箝位型三电平变换器拓扑结构具备均衡功率损耗分布能力,降低恶劣工况对系统的不利影响,提升系统利用率和最大输出容量。3. In this utility model, the topology structure of the novel active clamp type three-level converter evolved from the topology structure of the new simplified diode clamp type three-level converter has the ability to balance the distribution of power loss, reducing the impact of harsh working conditions on the system adverse effects, improve system utilization and maximum output capacity.
4、本实用新型中的通用型多电平变换器拓扑结构仅由基本单元、串联二极管组件、串联母线电容组件、直流电源构成,拓扑结构简单,扩展性能好,模块化程度高。4. The topology of the general-purpose multilevel converter in the utility model is only composed of a basic unit, a series diode assembly, a series bus capacitor assembly, and a DC power supply. The topology is simple, the expansion performance is good, and the degree of modularization is high.
5、本实用新型中的通用型多电平变换器拓扑结构具备系统自冗余性,可以用于功率损耗分布的均衡和故障后的容错处理。在能够实现同样功能的多电平变换器拓扑结构中,该拓扑结构采用更少的开关器件。5. The general-purpose multilevel converter topology of the present invention has system self-redundancy, and can be used for equalizing power loss distribution and fault-tolerant processing after a fault. In the multilevel converter topology that can achieve the same function, the topology uses fewer switching devices.
6、本实用新型中的通用型多电平变换器拓扑结构还可以通过优化进一步减少开关器件和二极管个数,降低成本和系统复杂性。6. The general-purpose multilevel converter topology of the present invention can further reduce the number of switching devices and diodes through optimization, reducing cost and system complexity.
附图说明Description of drawings
图1是本实用新型中基本单元的结构示意图。Fig. 1 is the structural representation of basic unit in the utility model.
图2是本实用新型提出的第一种三电平拓扑结构的结构示意图。Fig. 2 is a structural schematic diagram of the first three-level topology proposed by the present invention.
图3是本实用新型提出的第一种三电平拓扑结构中,P电平时的电流路径示意图。FIG. 3 is a schematic diagram of the current path at P level in the first three-level topology proposed by the present invention.
图4是本实用新型提出的第一种三电平拓扑结构中,O电平时的电流路径示意图。的结构示意图。FIG. 4 is a schematic diagram of the current path at O level in the first three-level topology proposed by the present invention. Schematic diagram of the structure.
图5是本实用新型提出的第一种三电平拓扑结构中,N电平时的电流路径示意图。的结构示意图。FIG. 5 is a schematic diagram of the current path at N level in the first three-level topology proposed by the present invention. Schematic diagram of the structure.
图6是本实用新型提出的第二种三电平拓扑结构的结构示意图。FIG. 6 is a schematic structural diagram of the second three-level topology proposed by the present invention.
图7是本实用新型提出的第三种三电平拓扑结构的结构示意图。FIG. 7 is a schematic structural diagram of the third three-level topology proposed by the present invention.
图8是本实用新型提出的第二种三电平拓扑结构中,输出O电平时的电流路径示意图。FIG. 8 is a schematic diagram of the current path when outputting O level in the second three-level topology proposed by the present invention.
图9是本实用新型提出的第三种三电平拓扑结构中,输出O电平时的电流路径示意图。FIG. 9 is a schematic diagram of the current path when outputting O level in the third three-level topology proposed by the present invention.
图10是本实用新型第一种三电平拓扑结构基于层叠双载波的调制方法图。FIG. 10 is a diagram of the modulation method based on the stacked dual carrier of the first three-level topology of the present invention.
图11是本实用新型的第一种m电平变换器拓扑结构的示意图。FIG. 11 is a schematic diagram of the first m-level converter topology of the present invention.
图12是本实用新型的第二种m电平变换器拓扑结构的示意图。FIG. 12 is a schematic diagram of the second m-level converter topology of the present invention.
图13是本实用新型的第三种m电平变换器拓扑结构的示意图。FIG. 13 is a schematic diagram of the third m-level converter topology of the present invention.
图14是本实用新型的第四种m电平变换器拓扑结构的示意图。FIG. 14 is a schematic diagram of the fourth m-level converter topology of the present invention.
图15是本实用新型第一种m电平变换器拓扑结构中,P+电平时的电流路径示意图。FIG. 15 is a schematic diagram of the current path at P+ level in the topology of the first m-level converter of the present invention.
图16是本实用新型第一种m电平变换器拓扑结构中,P-电平时的电流路径示意图。FIG. 16 is a schematic diagram of the current path at P-level in the topology of the first m-level converter of the present invention.
图17是本实用新型第一种m电平变换器拓扑结构中,N+电平时的电流路径示意图。FIG. 17 is a schematic diagram of the current path at N+ level in the topology of the first m-level converter of the present invention.
图18是本实用新型第一种m电平变换器拓扑结构中,N-电平时的电流路径示意图。FIG. 18 is a schematic diagram of the current path at N-level in the topology of the first m-level converter of the present invention.
图19是本实用新型第一种m电平变换器拓扑结构中,O1电平时的电流路径示意图。FIG. 19 is a schematic diagram of the current path at the O1 level in the topology of the first m-level converter of the present invention.
图20是本实用新型第一种m电平变换器拓扑结构中,O2电平时的电流路径示意图。FIG. 20 is a schematic diagram of the current path at the O2 level in the topology of the first m-level converter of the present invention.
图21是本实用新型第一种m电平变换器拓扑结构基于层叠双载波的第一种调制方法图。Fig. 21 is a diagram of the first modulation method based on the stacked dual-carrier topology of the first m-level converter of the present invention.
图22是本实用新型第一种m电平变换器拓扑结构基于层叠双载波的第二种调制方法图。Fig. 22 is a diagram of the second modulation method based on the stacked dual-carrier topology of the first m-level converter of the present invention.
具体实施方式Detailed ways
下面结合具体实例对本实用新型进行详细说明。以下实例将有助于本领域的技术人员进一步理解本实用新型,但不以任何形式限制本实用新型。应当指出的是,对本领域的普通技术人员来说,在不脱离本实用新型构思的前提下,还可以做出若干变形和改进。这些都属于本实用新型的保护范围。The utility model is described in detail below in conjunction with specific examples. The following examples will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present utility model. These all belong to the protection domain of the present utility model.
参照图1,本实用新型的用于多电平变换器的基本单元,包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧和两个二极管之间引出三个接线端。Referring to Fig. 1, the basic unit used for the multilevel converter of the present invention includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in series and antiparallel to both sides of the insulated gate bipolar transistor. Three terminals are drawn out from both sides of the insulated gate bipolar transistor and between the two diodes.
该基本单元的工作过程是:当该基本单元及与其第一接线端相连的基本单元中的绝缘栅双极型晶体管都导通时,来自与其第一接线端相连单元的电流将从第一接线端流入绝缘栅双极型晶体管,经过下方的二级管流出第三接线端形成电流的正向路径;电流从第三接线端流入上方的二极管,并由第一接线端流入与其第一接线端相连的单元,形成电流的反向路径。同理,当该基本单元及与其第二接线端相连的基本单元中的绝缘栅双极型晶体管都导通时,电流将在第二三接线端间形成电流的双向路径。另外,如果第三接线端无电流流入流出时,该基本单元可以退化成现有结构的基本单元,在第一二接线端间形成电流的双向路径。相对于现有结构的基本单元中的单一电流路径,该基本单元具备三种电流路径,更易实现多电平输出。The working process of the basic unit is: when the basic unit and the IGBTs in the basic unit connected to its first terminal are all turned on, the current from the unit connected to its first terminal will flow from the first terminal The terminal flows into the insulated gate bipolar transistor, and flows out of the third terminal through the lower diode to form a forward path of current; the current flows from the third terminal into the upper diode, and flows from the first terminal into its first terminal Connected cells form a reverse path for current flow. Similarly, when both the basic unit and the IGBT in the basic unit connected to the second terminal are turned on, the current will form a bidirectional path between the second and third terminals. In addition, if there is no current flowing in and out of the third terminal, the basic unit can degenerate into a basic unit of the existing structure, forming a bidirectional path of current between the first and second terminals. Compared with the single current path in the basic unit of the existing structure, the basic unit has three kinds of current paths, and it is easier to realize multi-level output.
参照图2,本实用新型的第一种三电平拓扑结构,包括第一直流电压源11、母线电容组件12和第一变换器桥臂13。母线电容组件12包括两个串联的母线电容,母线电容组件12并联到第一直流电压源11的两端,第一直流电压源11由母线电容组件12分出P电位、O电位和N电位三种电位,其中,O电位位于两个母线电容的中间,P电位位于直流电压源11的正极,N电位位于直流电压源12的负极;变换器桥臂13包括P电平单元14、O电平单元15和N电平单元16,所述的P电平单元14、O电平单元15和N电平单元16分别采用基本单元结构构成,该基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧设有第一接线端和第二接线端,两个二极管之间设有第三接线端。O电平单元15的第一接线端和P电平单元14的第三接线端连接,O电平单元15的第二接线端和N电平单元16的第三接线端连接,O电平单元15的第三接线端和O电位连接;P电平单元14的第一接线端和P电位连接,P电平单元14的第二接线端和N电平单元16的第一接线端连接,N电平单元16的第二接线端和N电位连接;第一变换器桥臂13的输出端由P电平单元14的第二接线端和N电平单元16的第一接线端连接处引出。Referring to FIG. 2 , the first three-level topology of the present invention includes a first DC voltage source 11 , a bus capacitor assembly 12 and a first converter bridge arm 13 . The bus capacitor assembly 12 includes two bus capacitors connected in series. The bus capacitor assembly 12 is connected in parallel to the two ends of the first DC voltage source 11. The first DC voltage source 11 is divided into P potential, O potential and N potential by the bus capacitor assembly 12. Among them, the O potential is located in the middle of the two bus capacitors, the P potential is located at the positive pole of the DC voltage source 11, and the N potential is located at the negative pole of the DC voltage source 12; the converter bridge arm 13 includes a P level unit 14, an O level unit The unit 15 and the N level unit 16, the P level unit 14, the O level unit 15 and the N level unit 16 respectively adopt a basic unit structure, and the basic unit includes an insulated gate bipolar transistor and two diodes , two diodes are connected in series and antiparallel to both sides of the IGBT, a first terminal and a second terminal are provided on both sides of the IGBT, and a third terminal is provided between the two diodes end. The first terminal of the O level unit 15 is connected to the third terminal of the P level unit 14, the second terminal of the O level unit 15 is connected to the third terminal of the N level unit 16, and the O level unit The third terminal of 15 is connected to O potential; the first terminal of P level unit 14 is connected to P potential, the second terminal of P level unit 14 is connected to the first terminal of N level unit 16, N The second terminal of the level unit 16 is connected to the N potential; the output terminal of the first converter bridge arm 13 is drawn from the connection between the second terminal of the P level unit 14 and the first terminal of the N level unit 16 .
参照图3—图5,上述三电平拓扑结构的工作过程是:如图3所示,当P电平单元中的绝缘栅双极型晶体管S2导通时,电流将在其第一二接线端间形成双向路径,桥臂输出电位因此将等于P电位。如图4所示,当O电平单元中的绝缘栅双极型晶体管S1导通时,电流将在其第三接线端与桥臂输出端间形成双向路径,桥臂输出电位因此将等于O电位。如图5所示,当N电平单元中的绝缘栅双极型晶体管S3导通时,电流将在其第一二接线端间形成双向路径,桥臂输出电位因此将等于N电位。通过控制S1、S2、S3的不同开关状态可以使桥臂输出具有三种不同的电位状态。该在减少功率器件数量的同时,实现了三电平的基本功能,降低了输出电流的谐波畸变率,提高了等效开关频率。Referring to Figure 3-Figure 5, the working process of the above-mentioned three-level topology is as follows: as shown in Figure 3, when the IGBT S2 in the P-level unit is turned on, the current will flow through its first and second wirings. A bidirectional path is formed between the terminals, and the output potential of the bridge arm will therefore be equal to the P potential. As shown in Figure 4, when the insulated gate bipolar transistor S1 in the O-level unit is turned on, the current will form a bidirectional path between its third terminal and the output terminal of the bridge arm, and the output potential of the bridge arm will therefore be equal to O potential. As shown in FIG. 5 , when the IGBT S3 in the N-level unit is turned on, the current will form a bidirectional path between its first and second terminals, and the output potential of the bridge arm will therefore be equal to the N potential. By controlling the different switching states of S1, S2, and S3, the output of the bridge arm can have three different potential states. While reducing the number of power devices, the three-level basic function is realized, the harmonic distortion rate of the output current is reduced, and the equivalent switching frequency is increased.
第一种三电平拓扑结构的层叠双载波调制方法如图10所示。将调制波信号43与上下层叠的上载波信号41和下载波信号42两个载波信号进行比较。当调制波信号43大于上载波信号41时,控制S2导通。当调制波信号43小于下载波信号42时,控制S3导通。S1的状态由S2、S3的状态经或非门得到。所有器件遵循“先关断后导通”的原则设置死区,在实施中可以采用上升沿延时的方法来实现死区功能。The first stacked dual-carrier modulation method with a three-level topology is shown in FIG. 10 . The modulated wave signal 43 is compared with the two carrier signals of the upper and lower carrier signals 41 and 42 . When the modulated wave signal 43 is greater than the upper carrier signal 41, the control S2 is turned on. When the modulating wave signal 43 is smaller than the downloading wave signal 42, the control S3 is turned on. The state of S1 is obtained by the state of S2 and S3 through the NOR gate. All devices follow the principle of "turn off first and then turn on" to set the dead zone. In the implementation, the rising edge delay method can be used to realize the dead zone function.
参照图6,本实用新型提供的第二种三电平拓扑结构,与第一种三电平拓扑结构相同,所不同的是:所述的O电平单元15还包括一个绝缘栅双极型晶体管;两个绝缘栅双极型晶体管串联,形成第一绝缘栅双极型晶体管组件17,O电平单元15中的两个二极管串联后反向并联至第一绝缘栅双极型晶体管组件17的两侧,在第一绝缘栅双极型晶体管组件17两侧引出第一接线端和第二接线端,两个二极管之间引出第三接线端,两个绝缘栅双极型晶体管之间引出第四接线端;O电平单元15的第四接线端和第一变换器桥臂13的输出端连接。Referring to Fig. 6, the second three-level topological structure provided by the utility model is the same as the first three-level topological structure, the difference is that the O level unit 15 also includes an insulated gate bipolar Transistor: two insulated gate bipolar transistors are connected in series to form a first insulated gate bipolar transistor assembly 17, and the two diodes in the O-level unit 15 are connected in series and antiparallel to the first insulated gate bipolar transistor assembly 17 On both sides of the first insulated gate bipolar transistor assembly 17, the first terminal and the second terminal are drawn out, the third terminal is drawn between the two diodes, and the second terminal is drawn between the two insulated gate bipolar transistors. Fourth connection terminal: The fourth connection terminal of the O level unit 15 is connected to the output terminal of the first converter bridge arm 13 .
结合图8,第二种三电平拓扑结构的工作过程是:当第一绝缘栅双极型晶体管组件17中的两只绝缘栅双极型晶体管S1H、S1L导通时,电流将在其第二、四接线端间形成双向路径,由于桥臂输出端与其第二接线端相连,桥臂输出电位将等于O电位。与第一种三电平拓扑结构相比,该结构在输出O电平时,电流将不再经过P、N电平单元器件,因此降低了P、N电平单元器件的导通与开关损耗,损耗分布更加均匀。8, the working process of the second three-level topology is: when the two IGBTs S1 H and S1 L in the first IGBT assembly 17 are turned on, the current will be at A bidirectional path is formed between the second and fourth terminals. Since the output terminal of the bridge arm is connected to the second terminal, the output potential of the bridge arm will be equal to O potential. Compared with the first three-level topology structure, when this structure outputs O level, the current will no longer pass through the P and N level unit devices, thus reducing the conduction and switching losses of the P and N level unit devices. Loss distribution is more even.
参照图7,本实用新型提供的第三种三电平拓扑结构,与第一种三电平拓扑结构相同,所不同的是:所述的O电平单元15还包括一个绝缘栅双极型晶体管;两个绝缘栅双极型晶体管串联,形成第二绝缘栅双极型晶体管组件18,O电平单元15中的两个二极管串联后反向并联至第二绝缘栅双极型晶体管组件18的两侧,在第二绝缘栅双极型晶体管组件18两侧引出第一接线端和第二接线端,两个二极管之间引出第三接线端,两个绝缘栅双极型晶体管之间引出第四接线端;O电平单元15的第四接线端和O电位连接。Referring to Fig. 7, the third three-level topological structure provided by the utility model is the same as the first three-level topological structure, the difference is that the O level unit 15 also includes an insulated gate bipolar Transistor: two insulated gate bipolar transistors are connected in series to form a second insulated gate bipolar transistor assembly 18, and the two diodes in the O-level unit 15 are connected in series and antiparallel to the second insulated gate bipolar transistor assembly 18 On both sides of the second insulated gate bipolar transistor assembly 18, the first terminal and the second terminal are drawn out, the third terminal is drawn between the two diodes, and the second terminal is drawn between the two insulated gate bipolar transistors. Fourth terminal; O level The fourth terminal of the unit 15 is connected to the O potential.
结合图9,第三种三电平拓扑结构的工作过程是:当第二绝缘栅双极型晶体管组件18中的两只绝缘栅双极型晶体管S1H、S1L导通时,电流将在其第二接线端与桥臂输出端间形成双向路径,桥臂输出电位将等于O电位。与第一种三电平拓扑结构相比,该结构在输出O电平时,电流将不再经过O电平单元中的二极管器件,因此降低了O电平单元器件的导通与反向恢复损耗,在变换器处于低压输出时,这将使损耗分布更加均匀。9, the working process of the third three-level topology is: when the two IGBTs S1 H and S1 L in the second IGBT assembly 18 are turned on, the current will be at A bidirectional path is formed between the second terminal and the output terminal of the bridge arm, and the output potential of the bridge arm will be equal to O potential. Compared with the first three-level topology, when this structure outputs O level, the current will no longer pass through the diode device in the O level unit, thus reducing the conduction and reverse recovery loss of the O level unit device , which will make the losses more evenly distributed when the converter is at low output voltage.
参见图11,本实用新型提供的第一种m电平拓扑结构,包括第二变换器桥臂501、第二二极管串联组件502、第二母线电容串联组件503和第二直流电压源504;第二母线电容串联组件503由m-1个母线电容串联组成,第二母线电容串联组件503并联于第二直流电压源504的两端,将直流电源分出m种电位节点,第1至m电位位于第二母线电容串联组件503的连接点,且第1电位位于第二直流电压源504的正极,第m电位位于第二直流电压源504的负极;第二二极管串联组件502包括2m个二极管,第二二极管串联组件502中的奇数节点与第二母线电容串联组件503的第1~m电位节点依次连接;第二变换器桥臂501包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个。所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端。在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第一变换器桥臂501的输出端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第二二极管串联组件502中的偶数电位节点连接;m的取值范围为大于2的整数。Referring to Fig. 11, the first m-level topology provided by the present invention includes a second converter bridge arm 501, a second diode series assembly 502, a second bus capacitor series assembly 503 and a second DC voltage source 504 ; The second bus capacitor series component 503 is composed of m-1 bus capacitors in series, the second bus capacitor series component 503 is connected in parallel to both ends of the second DC voltage source 504, and the DC power is divided into m potential nodes, the first to The m potential is located at the connection point of the second bus capacitor series assembly 503, and the first potential is located at the positive pole of the second DC voltage source 504, and the mth potential is located at the negative pole of the second DC voltage source 504; the second diode series assembly 502 includes 2m diodes, the odd-numbered nodes in the second diode series component 502 are sequentially connected to the 1st to m potential nodes of the second bus capacitor series component 503; the second converter bridge arm 501 includes m level layers, the 1st The first level layer contains one basic unit, the mth level layer contains m basic units, and the number of basic units contained in each level layer gradually increases by one as the number of layers increases. The basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in antiparallel to both sides of the insulated gate bipolar transistor in series, and the first terminal and the The second connection terminal leads out the third connection terminal between the two diodes. In each level layer, the first terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer, and the second terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer. The third terminal of another basic unit is connected, and the third terminal of the basic unit is connected to the first or second terminal of the basic unit in the previous level layer; the basic unit located in the first level layer The third connection end of the first converter bridge arm 501 is connected to the output end of the first converter bridge arm 501; Potential node connection; the value range of m is an integer greater than 2.
上述m电平拓扑结构的工作过程是:以三电平为例(m=3),如图15所示,当拓扑结构中的绝缘栅双极型晶体管S1、S2、S4导通时,电流由第一电位节点经过二极管串联组件(502)的第一二极管流进第三电平层第一基本单元的第一接线端,接着,电流依次流出第三电平层第一基本单元的第三接线端并流入第二电平层第一基本单元的第一接线端,电流流出第二电平层第一基本单元的第三接线端并流入第一电平层第一基本单元的第一接线端。最后,电流由第一电平层第一基本单元的第三接线端流出,形成了电流的正向路径。如图16所示,当电流流入第一电平层第一基本单元的第三接线端时,电流将依次经过第一电平层第一基本单元的第一接线端、第二电平层第一基本单元的第一接线端、第三电平层第一基本单元的第二接线端流经二极管串联组件502流入第一电位,形成电流的反向路径。因此当绝缘栅双极型晶体管S1、S2、S4导通时,桥臂输出电位等于第一电位。同理,如图17-18所示,当绝缘栅双极型晶体管S1、S3、S6导通时,桥臂输出电位等于第三电位。如图19所示,当绝缘栅双极型晶体管S2、S3、S5导通时,桥臂输出电位等于第二电位。如图20所示,当绝缘栅双极型晶体管S1、S5导通时,桥臂输出电位等于第二电位。该结构简洁紧凑,使用的器件数量少,无箝位器件、独立电源及飞跨电容,并具有两种输出第二电位的方式,可以用于解决损耗不均衡问题及故障状态下的容错问题。另外该结构采用模块化设计,可以降低安装和维护中的成本问题。The working process of the above-mentioned m-level topology is: taking three-level as an example (m=3), as shown in Figure 15, when the IGBTs S1, S2, and S4 in the topology are turned on, the current The first diode of the diode series assembly (502) from the first potential node flows into the first terminal of the first basic unit of the third level layer, and then, the current flows out of the first basic unit of the third level layer in sequence The third terminal flows into the first terminal of the first basic unit of the second level layer, and the current flows out of the third terminal of the first basic unit of the second level layer and flows into the first terminal of the first basic unit of the first level layer. A terminal. Finally, the current flows out from the third terminal of the first basic unit of the first level layer, forming a forward path of the current. As shown in Figure 16, when the current flows into the third terminal of the first basic unit of the first level layer, the current will pass through the first terminal of the first basic unit of the first level layer, the first terminal of the first basic unit of the second level layer, and the second terminal of the second level layer. The first terminal of a basic unit and the second terminal of the first basic unit of the third level flow through the diode series component 502 and flow into the first potential, forming a reverse path of current. Therefore, when the IGBTs S1 , S2 , and S4 are turned on, the output potential of the bridge arm is equal to the first potential. Similarly, as shown in FIGS. 17-18 , when the IGBTs S1 , S3 , and S6 are turned on, the output potential of the bridge arm is equal to the third potential. As shown in FIG. 19 , when the IGBTs S2 , S3 , and S5 are turned on, the output potential of the bridge arm is equal to the second potential. As shown in FIG. 20 , when the IGBTs S1 and S5 are turned on, the output potential of the bridge arm is equal to the second potential. The structure is simple and compact, the number of components used is small, there is no clamping device, independent power supply and flying capacitor, and there are two ways to output the second potential, which can be used to solve the problem of unbalanced loss and fault tolerance under fault conditions. In addition, the structure adopts a modular design, which can reduce the cost of installation and maintenance.
参见图12,第二种m电平拓扑结构,包括第三变换器桥臂601、第三二极管串联组件602、第三母线电容串联组件603和第三直流电压源604;第三母线电容串联组件603由m-1个母线电容串联组成,第三母线电容串联组件603并联于第三直流电压源604的两端,将直流电源分出m种电位节点,第1至m电位位于第三母线电容串联组件603的连接点,且第1电位位于第三直流电压源604的正极,第m电位位于第三直流电压源604的负极;第三二极管串联组件602包括2m-4个二极管,位于第三二极管串联组件602中的奇数节点与第三母线电容串联组件503中的第2~m-1电位节点依次连接;Referring to Fig. 12, the second m-level topology structure includes a third converter bridge arm 601, a third diode series component 602, a third bus capacitor series component 603, and a third DC voltage source 604; the third bus capacitor The series component 603 is composed of m-1 busbar capacitors connected in series. The third busbar capacitor series component 603 is connected in parallel to both ends of the third DC voltage source 604, and divides the DC power supply into m kinds of potential nodes. The first to m potentials are located in the third The connection point of the bus capacitor series assembly 603, and the first potential is located at the positive pole of the third DC voltage source 604, and the mth potential is located at the negative pole of the third DC voltage source 604; the third diode series assembly 602 includes 2m-4 diodes , the odd-numbered nodes in the third diode series assembly 602 are sequentially connected to the 2nd~m-1 potential nodes in the third bus capacitor series assembly 503;
第三变换器桥臂601包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个。所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端。在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第三变换器桥臂601的输出端连接;位于第m个电平层的第一个基本单元的第一接线端和第三直流电压源604的正极连接,位于第m个电平层的第m个基本单元的第二接线端和第三直流电压源604的负极连接,位于第m个电平层的第一个基本单元的第二接线端、第m个基本单元的第一接线端,以及第2~m-1个基本单元的第一接线端和第二接线分别与第三二极管串联组件602中的偶数电位节点连接。m的取值范围为大于2的整数。The third converter bridge arm 601 includes m level layers, the first level layer contains one basic unit, the mth level layer contains m basic units, and the number of basic units contained in each level layer varies with the layer The number increases gradually by 1. The basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in antiparallel to both sides of the insulated gate bipolar transistor in series, and the first terminal and the The second connection terminal leads out the third connection terminal between the two diodes. In each level layer, the first terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer, and the second terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer. The third terminal of another basic unit is connected, and the third terminal of the basic unit is connected to the first or second terminal of the basic unit in the previous level layer; the basic unit located in the first level layer The third connection terminal of the third converter bridge arm 601 is connected to the output terminal of the third converter bridge arm 601; the first connection terminal of the first basic unit located in the mth level layer is connected to the positive pole of the third DC voltage source 604, and is located in the mth level layer. The second terminal of the mth basic unit of the first level layer is connected to the negative pole of the third DC voltage source 604, and is located at the second terminal of the first basic unit of the mth level layer, the mth basic unit The first terminal of the , and the first terminal and the second connection of the 2nd to m−1 basic units are respectively connected to the even-numbered potential nodes in the third diode series assembly 602 . The value range of m is an integer greater than 2.
上述第二种m电平拓扑结构的工作过程是:与第一种m电平拓扑结构工作过程类似,控制变换器桥臂中的绝缘栅双极型晶体管的开关状态,可以使桥臂输出相应电位。与第一种m电平拓扑结构不同的是,当桥臂输出第一电位时,电流不再经过串联二极管组件502的第一、二二极管,而直接由第m电平层第一基本单元的第一接线端流入或流出第一电位。同理,当桥臂输出第一电位时,电流不再经过串联二极管组件502的第2m-1、2m二极管,而直接由第m电平层的第m基本单元第二接线端流入或流出第m电位。该拓扑结构进一步减少了器件数量,并保持了第一种结构的所有功能,同样可用于解决损耗均衡问题和故障下的容错问题。与第一种m电平拓扑结构不同,第二种m电平拓扑结构中的串联二极管组件中的最外侧的四个二极管被移去,母线电容串联组件的最外侧直接和变换器桥臂第m电平层最外侧基本构造单元相连接。The working process of the above-mentioned second m-level topology structure is: similar to the working process of the first m-level topology structure, controlling the switch state of the IGBT in the bridge arm of the converter can make the output of the bridge arm corresponding potential. Different from the first m-level topology structure, when the bridge arm outputs the first potential, the current no longer passes through the first and second diodes of the series diode assembly 502, but directly flows from the first basic unit of the m-th level layer. The first terminal flows into or out of a first potential. Similarly, when the bridge arm outputs the first potential, the current no longer passes through the 2m-1, 2m-th diodes of the series diode assembly 502, but directly flows into or out of the second terminal of the m-th basic unit of the m-th level layer. m potential. This topology further reduces the number of components, and maintains all the functions of the first structure, and can also be used to solve the problem of wear leveling and fault tolerance under faults. Different from the first m-level topology, the four outermost diodes in the series diode assembly in the second m-level topology are removed, and the outermost of the bus capacitor series assembly is directly connected to the first bridge arm of the converter. The outermost basic structural units of the m-level layer are connected.
参见图13,第三种m电平拓扑结构,包括第四变换器桥臂701、第四二极管串联组件702、第四母线电容串联组件703和第四直流电压源704;第四母线电容串联组件703由m-1个母线电容串联组成,第四母线电容串联组件703并联于第四直流电压源704的两端,将直流电源分出m种电位节点,第1至m电位位于第四母线电容串联组件703的连接点,且第1电位位于第四直流电压源704的正极,第m电位位于第四直流电压源704的负极;第四二极管串联组件702包括2m个二极管,第四二极管串联组件702中的奇数节点与第四母线电容串联组件703的第1~m电位节点依次连接;第四变换器桥臂701包括m个电平层,第1个电平层包含一个基本单元,第m个电平层包含m个基本单元,每个电平层中包含的基本单元数量随层数增加逐渐增加1个,且第3至m-1个电平层中的第2至k-1的基本单元中的绝缘栅双极型晶体管被移除,k表示所在的电平层层数。所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端。在每个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第1个电平层的基本单元的第三接线端和第四变换器桥臂701的输出端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第四二极管串联组件702中的偶数电位节点连接。m的取值范围为大于3的整数。Referring to FIG. 13, the third m-level topology structure includes a fourth converter bridge arm 701, a fourth diode series assembly 702, a fourth bus capacitor series assembly 703, and a fourth DC voltage source 704; the fourth bus capacitor The series component 703 is composed of m-1 busbar capacitors connected in series. The fourth busbar capacitor series component 703 is connected in parallel to both ends of the fourth DC voltage source 704, and divides the DC power supply into m kinds of potential nodes. The first to m potentials are located in the fourth The connection point of the bus capacitor series assembly 703, and the first potential is located at the positive pole of the fourth DC voltage source 704, and the mth potential is located at the negative pole of the fourth DC voltage source 704; the fourth diode series assembly 702 includes 2m diodes, and the mth potential is located at the negative pole of the fourth DC voltage source 704; The odd-numbered nodes in the four-diode series assembly 702 are sequentially connected to the 1st~m potential nodes of the fourth bus capacitor series assembly 703; the fourth converter bridge arm 701 includes m level layers, and the first level layer includes A basic unit, the mth level layer contains m basic units, the number of basic units contained in each level layer gradually increases by 1 as the number of layers increases, and the 3rd to m-1th level layers The insulated gate bipolar transistors in the basic units from 2 to k-1 are removed, and k represents the number of level layers where they are located. The basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in antiparallel to both sides of the insulated gate bipolar transistor in series, and the first terminal and the The second connection terminal leads out the third connection terminal between the two diodes. In each level layer, the first terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer, and the second terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer. The third terminal of another basic unit is connected, and the third terminal of the basic unit is connected to the first or second terminal of the basic unit in the previous level layer; the basic unit located in the first level layer The third connection end of the fourth converter bridge arm 701 is connected to the output end of the fourth converter bridge arm 701; Potential node connections. The value range of m is an integer greater than 3.
上述第三种m电平拓扑结构的工作过程是:与第一种m电平拓扑结构工作过程类似,控制变换器桥臂中的绝缘栅双极型晶体管的开关状态,可以使桥臂输出相应电位。与第一种m电平拓扑结构不同的是,该结构输出中间电位的方式唯一。该拓扑结构采用器件数量最少,在降低成本的同时可以实现m电平的最基本要求。由于器件数量的减少,该结构将不再具备损耗均衡功能及故障下的容错功能。该结构中变换器桥臂的内侧绝缘栅双极型晶体管(S5、S8、S9)被移去。这种结构将不具有损耗均衡功能。The working process of the above-mentioned third m-level topology structure is: similar to the working process of the first m-level topology structure, controlling the switch state of the IGBT in the bridge arm of the converter can make the output of the bridge arm corresponding potential. Different from the first m-level topology, this structure has a unique way of outputting the intermediate potential. The topological structure adopts the least number of devices, and can realize the most basic requirement of m-level while reducing the cost. Due to the reduction in the number of components, the structure will no longer have the function of wear leveling and fault tolerance under fault. In this structure the inner IGBTs (S5, S8, S9) of the converter legs are removed. This structure will not have wear leveling function.
参见图14,第四种m电平拓扑结构,包括第五变换器桥臂801、第五二极管串联组件802、第五母线电容串联组件803和第五直流电压源804;第五母线电容串联组件803由m-1个母线电容串联组成,第五母线电容串联组件803并联于第五直流电压源804的两端,将直流电源分出m种电位节点,第1至m电位位于第五母线电容串联组件803的连接点,且第1电位位于第五直流电压源804的正极,第m电位位于第五直流电压源804的负极;第五二极管串联组件802包括2m个二极管,第五二极管串联组件802中的奇数节点与第五母线电容串联组件803的第1~m电位节点依次连接;第五变换器桥臂801包括m-1个电平层,第1和2个电平层为两电平基本单元81,第3个电平层包含3个基本单元,第m个电平层包含m个基本单元,从第4—m个电平层中,每个电平层中包含的基本单元数量随层数增加逐渐增加1个。所述的基本单元包括绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端。所述的两电平基本单元81包括两个绝缘栅双极型晶体管和两个二极管,两个二极管串联后反向并联至两个串联的绝缘栅双极型晶体管两侧,在绝缘栅双极型晶体管两侧引出第一接线端和第二接线端,在两个二极管之间引出第三接线端,并将串联二极管的中间连接点与串联绝缘栅双极型晶体管的中间连接点连接。两电平基本单元81的第一接线端与第3个电平层的第1基本单元的第三接线端连接,两电平基本单元81的第二接线端与第3个电平层的第2基本单元的第三接线端连接,两电平基本单元81的第三接线端与第3个电平层的第3基本单元的第三接线端连接;变换器桥臂501的输出端两电平基本单元81的第三接线端引出。在第4至m个电平层中,基本单元的第一接线端和位于下一电平层中的一个基本单元的第三接线端连接,基本单元的第二接线端和位于下一电平层中的另一个基本单元的第三接线端连接,基本单元的第三接线端和位于上一电平层中基本单元的第一接线端或者第二接线端连接;位于第m个电平层的基本单元的第一接线端和第二接线分别与第五二极管串联组件802中的偶数电位节点连接。m的取值范围为大于2的整数。Referring to Fig. 14, the fourth m-level topology structure includes the fifth converter bridge arm 801, the fifth diode series component 802, the fifth bus capacitor series component 803 and the fifth DC voltage source 804; the fifth bus capacitor The series component 803 is composed of m-1 bus capacitors connected in series. The fifth bus capacitor series component 803 is connected in parallel to both ends of the fifth DC voltage source 804, and divides the DC power supply into m potential nodes. The first to m potentials are located at the fifth The connection point of the bus capacitor series component 803, and the first potential is located at the positive pole of the fifth DC voltage source 804, and the mth potential is located at the negative pole of the fifth DC voltage source 804; the fifth diode series component 802 includes 2m diodes, and the The odd-numbered nodes in the five-diode series component 802 are sequentially connected to the 1st~m potential nodes of the fifth bus capacitor series component 803; the fifth converter bridge arm 801 includes m-1 level layers, the first and second The level layer is a two-level basic unit 81, the third level layer contains 3 basic units, the m level layer contains m basic units, and from the 4th to m level layers, each level The number of basic units contained in a layer gradually increases by 1 as the number of layers increases. The basic unit includes an insulated gate bipolar transistor and two diodes, and the two diodes are connected in antiparallel to both sides of the insulated gate bipolar transistor in series, and the first terminal and the The second connection terminal leads out the third connection terminal between the two diodes. The two-level basic unit 81 includes two insulated gate bipolar transistors and two diodes, and the two diodes are connected in antiparallel to both sides of the two insulated gate bipolar transistors in series. The first terminal and the second terminal are drawn from both sides of the type transistor, the third terminal is drawn between the two diodes, and the middle connection point of the series diode is connected with the middle connection point of the series insulated gate bipolar transistor. The first terminal of the two-level basic unit 81 is connected to the third terminal of the first basic unit of the third level layer, and the second terminal of the two-level basic unit 81 is connected to the third terminal of the third level layer. 2. The third terminal of the basic unit is connected, and the third terminal of the two-level basic unit 81 is connected to the third terminal of the third basic unit of the third level layer; The third terminal of the flat basic unit 81 leads out. In the 4th to m level layers, the first terminal of the basic unit is connected to the third terminal of a basic unit in the next level layer, and the second terminal of the basic unit is connected to the second terminal of the basic unit in the next level. The third terminal of another basic unit in the layer is connected, and the third terminal of the basic unit is connected to the first or second terminal of the basic unit in the previous level layer; located in the mth level layer The first connection terminal and the second connection of the basic unit are respectively connected to the even-numbered potential nodes in the fifth diode series assembly 802 . The value range of m is an integer greater than 2.
上述第四种m电平拓扑结构的工作过程是:与第一种m电平拓扑结构工作过程类似,控制变换器桥臂中的绝缘栅双极型晶体管的开关状态,可以使桥臂输出相应电位。与第一种m电平拓扑结构不同的是,在电流由第三电平层流入第二电平层时,电流将经过传统单元结构81形成电流的正向路径。同时,当电流由输出端流入桥臂时,电流将经过传统单元结构81流入第三电平层,形成电流的反向路径。该拓扑结构减少了绝缘栅双极型晶体管器件的数量,在降低成本和简化控制的同时保留了第一种结构的所有功能,同样可用于解决损耗均衡问题和故障下的容错问题。该结构中的“金字塔”型变换器桥臂501中的绝缘栅双极型晶体管(S1)被移去,并将第二层基本构造单元替换成普通的“IGBT+反并联二极管”单元。这种结构损耗均衡功能将有所降低。The working process of the fourth m-level topology above is: similar to the working process of the first m-level topology, controlling the switch state of the IGBT in the bridge arm of the converter can make the output of the bridge arm corresponding potential. Different from the first m-level topology structure, when the current flows from the third level layer to the second level layer, the current will pass through the traditional cell structure 81 to form a forward path of the current. At the same time, when the current flows into the bridge arm from the output terminal, the current will flow into the third level layer through the traditional unit structure 81, forming a reverse path of the current. This topology reduces the number of IGBT devices, and retains all the functions of the first structure while reducing costs and simplifying control, and can also be used to solve the problem of wear leveling and fault tolerance under faults. In this structure, the insulated gate bipolar transistor (S1) in the bridge arm 501 of the "pyramid" type converter is removed, and the basic structural unit of the second layer is replaced with an ordinary "IGBT+antiparallel diode" unit. This fabric wear-leveling functionality will be reduced.
图21和图22给出了第一种m电平拓扑结构变换器在以两种不同方式输出O电平时的层叠双载波调制策略:(1)如图21所示,在第一种工作方式下,将调制波信号1203与上下层叠的上载波信号1201和下载波信号1202两个载波信号进行比较。当调制波信号1203大于上载波信号1201时,控制绝缘栅双极型晶体管S4导通、S3关断。当调制波信号1203小于下载波信号1202时,控制S6导通、S2关断。S1的状态由S2、S3的状态取异或得到,S5与S1互补导通。绝缘栅双极型晶体管S1—S6按照表1所示开关状态(“1”表示导通,“0”表示关断)输出相应电平。(2)如图22所示,在第二种工作方式下,将调制波信号1206与上下层叠的上载波信号1204和下载波信号1205两个载波信号进行比较。当调制波信号1206大于上载波信号1204时,控制S2、S4导通。当调制波信号1206小于下载波信号1205时,控制S3、S6导通。S5的状态由S2、S3的状态取或非得到,S1始终处于导通状态。绝缘栅双极型晶体管S1-S6按照表2所示开关状态输出相应电平。所有器件遵循“先关断后导通”的原则设置死区,在实施中可以采用上升沿延时的方法来实现死区功能。Figure 21 and Figure 22 show the stacked dual-carrier modulation strategy when the first m-level topology converter outputs O level in two different ways: (1) As shown in Figure 21, in the first working mode Next, the modulated wave signal 1203 is compared with the two carrier signals of the upper and lower carrier signals 1201 and 1202 . When the modulated wave signal 1203 is greater than the upper carrier signal 1201, the IGBT S4 is controlled to be turned on and S3 is turned off. When the modulating wave signal 1203 is smaller than the downloading wave signal 1202, control S6 to turn on and S2 to turn off. The state of S1 is obtained by taking the exclusive OR of the states of S2 and S3, and S5 and S1 are complementary to conduction. The insulated gate bipolar transistors S1-S6 output corresponding levels according to the switching states shown in Table 1 ("1" means on, "0" means off). (2) As shown in FIG. 22 , in the second working mode, the modulated wave signal 1206 is compared with two carrier signals, the upper and lower carrier signals 1204 and 1205 . When the modulated wave signal 1206 is greater than the upper carrier signal 1204, control S2 and S4 to be turned on. When the modulating wave signal 1206 is smaller than the downloading wave signal 1205, control S3 and S6 to be turned on. The state of S5 is obtained by NORing the states of S2 and S3, and S1 is always in the conducting state. The insulated gate bipolar transistors S1-S6 output corresponding levels according to the switching states shown in Table 2. All devices follow the principle of "turn off first and then turn on" to set the dead zone. In the implementation, the rising edge delay method can be used to realize the dead zone function.
表1第一种m电平拓扑结构在第一种工作方式下输出不同电平时的开关状态Table 1 Switching states of the first m-level topology when outputting different levels in the first working mode
表2第一种m电平拓扑结构在第二种工作方式下输出不同电平时的开关状态Table 2 Switching states of the first m-level topology when outputting different levels in the second working mode
以上对本实用新型的具体实施进行了描述。需要理解的是,本实用新型并不局限与上述特定实施方式,本领域技术人员可以在全力要求的范围内做出各种变形或修改,这并不影响本实用新型的实质内容。The specific implementation of the utility model has been described above. It should be understood that the utility model is not limited to the above-mentioned specific embodiments, and those skilled in the art can make various deformations or modifications within the scope of all requirements, which does not affect the essence of the utility model.
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CN104362878A (en) * | 2014-11-28 | 2015-02-18 | 东南大学 | Basic unit for multilevel converter, and three-level and m-level topological structures |
CN109167526A (en) * | 2018-08-24 | 2019-01-08 | 成都麦隆电气有限公司 | A kind of highly reliable high frequency efficient NPC tri-level circuit |
CN109378987A (en) * | 2018-12-30 | 2019-02-22 | 上能电气股份有限公司 | A kind of three-level topology circuit, single-phase inverter and three-phase inverter |
CN112366971A (en) * | 2020-11-02 | 2021-02-12 | 深圳市英威腾电气股份有限公司 | Three-level inversion topological structure, control method thereof, single-phase and three-phase inversion circuit |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104362878A (en) * | 2014-11-28 | 2015-02-18 | 东南大学 | Basic unit for multilevel converter, and three-level and m-level topological structures |
CN104362878B (en) * | 2014-11-28 | 2017-07-21 | 东南大学 | Elementary cell, three level and m level topological structures for multi-level converter |
CN109167526A (en) * | 2018-08-24 | 2019-01-08 | 成都麦隆电气有限公司 | A kind of highly reliable high frequency efficient NPC tri-level circuit |
CN109378987A (en) * | 2018-12-30 | 2019-02-22 | 上能电气股份有限公司 | A kind of three-level topology circuit, single-phase inverter and three-phase inverter |
CN112366971A (en) * | 2020-11-02 | 2021-02-12 | 深圳市英威腾电气股份有限公司 | Three-level inversion topological structure, control method thereof, single-phase and three-phase inversion circuit |
CN112366971B (en) * | 2020-11-02 | 2022-04-19 | 深圳市英威腾电气股份有限公司 | Three-level inversion topological structure, control method thereof, single-phase and three-phase inversion circuit |
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